CN217165524U

CN217165524U - Efficient wafer cleaning machine

Info

Publication number: CN217165524U
Application number: CN202220989480.9U
Authority: CN
Inventors: 吴伟; 佘刚; 钱伟
Original assignee: Anhui Fulede Changjiang Semiconductor Material Co ltd
Current assignee: Anhui Fulede Changjiang Semiconductor Material Co ltd
Priority date: 2022-04-24
Filing date: 2022-04-24
Publication date: 2022-08-12
Anticipated expiration: 2032-04-24

Abstract

The utility model relates to a high-efficiency wafer cleaning machine, which belongs to the technical field of wafer cleaning and comprises an equipment body, wherein the equipment body comprises a rotary bracket, an annular cleaning device and a drying device, the interior of the equipment body is divided into two areas side by side, two openings are arranged in the same direction of the two areas, the annular cleaning device and the drying device are respectively arranged, the rotary bracket is vertically connected with the upper inner surface and the lower inner surface of the equipment body between the annular cleaning device and the drying device in a rotating way, the rotary bracket comprises a first motor, a main support frame, a transverse bracket and a wafer placing frame, the main support frame is vertically and rotatably connected with the upper inner surface and the lower inner surface of the equipment body, one end of the main support frame, which is connected with the upper surface of the equipment body, penetrates through and extends out of the equipment body and is fixedly connected with the output end of the first motor, one end of the transverse bracket is vertically and fixedly connected with the side wall of the main support frame, and the transverse bracket is parallel with the ground, the other end is clamped with the wafer placing frame. The beneficial effects of the utility model are that wash a large amount of wafers with the efficient.

Description

Efficient wafer cleaning machine

Technical Field

The utility model relates to a wafer field of cleaning specifically says to a high-efficient wafer cleaning machine.

Background

In the manufacturing process of a semiconductor integrated circuit, wafer cleaning is one of the commonly used processes, cleaning is carried out by cleaning solution in sequence, and drying is carried out finally.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a to solve the problem that proposes among the above-mentioned background art.

The technical scheme of the utility model is that: the equipment body includes runing rest, annular belt cleaning device and drying device, the inside equipartition of equipment body is two regions side by side, has seted up two openings in two regional equidirectionals, is equipped with respectively annular belt cleaning device and drying device are provided with internal surface about the perpendicular to equipment body and rotate the runing rest of being connected rather than between annular belt cleaning device and drying device, and the runing rest includes that first motor, main tributary strut, transverse support, wafer put the frame, the main tributary strut rotates perpendicularly to be connected internal surface about the equipment body, wherein main tributary strut one end runs through and extends the equipment body, with first motor output fixed connection, the perpendicular fixed connection of transverse support one end is at the lateral wall of main tributary strut and transverse support and parallel with ground, the other end with the wafer is put the frame and is carried out the joint.

Further, the wafer placing frame comprises a wafer limiting frame, a movable side wall, a supporting seat and a side wall limiting frame, wherein the movable side wall is placed in opposite directions, one end of the movable side wall is fixedly connected with the downward end of the supporting seat, the other end of the supporting seat is fixedly connected to the wafer limiting frame, the supporting seat is rotated through a middle rotating shaft, and the side wall limiting frame is arranged at one end, away from the supporting seat, of the movable side wall.

Further, the lateral wall limiting frame comprises a connecting support and a sliding groove, one end of the connecting support is hinged to the movable lateral wall, the sliding groove is formed in the lateral wall of the wafer limiting frame, the other end of the connecting support is limited in the sliding groove, and the sliding groove is provided with a plurality of position clamping grooves.

Further, annular belt cleaning device includes second motor, first gear, second gear, wastewater collection groove, vaporific shower nozzle and input water pipe, the input water pipe runs through equipment body lateral wall, the output of input water pipe perpendicularly downwards with vaporific shower nozzle rotates to be connected, and is fixed at the perpendicular decurrent lateral wall of input water pipe the second motor, at the output fixed connection of second motor the second gear is connected the one end fixed connection of input water pipe at vaporific shower nozzle first gear, first gear and second gear mesh mutually, is equipped with directly under vaporific shower nozzle wastewater collection groove.

Furthermore, the drying device comprises a plurality of heating resistance wires and fans, the heating resistance wires are fixedly connected to the side wall of the equipment body, and the fans are fixedly connected to the side of the heating resistance wires.

The utility model discloses an improve and provide a high-efficient wafer cleaning machine here, compare with prior art, have following improvement and advantage:

one is as follows: the utility model discloses the frame is put to the wafer adjusts the angle that opens of lateral wall for can not harm the wafer when snatching the wafer.

The second step is as follows: the utility model discloses annular belt cleaning device washs the wafer of putting more comprehensively through the angle of difference.

Drawings

The invention is further explained below with reference to the figures and examples:

fig. 1 is a front sectional view of the present invention;

FIG. 2 is a perspective view of the annular cleaning device of the present invention;

FIG. 3 is a perspective view of the lateral bracket of the present invention;

fig. 4 is a perspective view of the wafer placing rack of the present invention;

fig. 5 is a schematic structural view of a wafer placing rack a of the present invention;

fig. 6 is a schematic view of a structure of a wafer placing frame B of the present invention.

Description of reference numerals:

1. an apparatus body; 2. rotating the bracket; 3. an annular cleaning device; 4. a drying device; 5. a first motor; 6. a main supporting frame; 7. a transverse support; 8. a wafer placing frame; 9. a wafer limiting frame; 10. moving the side wall; 11. a supporting seat; 12. a side wall limiting frame; 13. connecting a bracket; 14. a chute; 15. a second motor; 16. a first gear; 17. a second gear; 18. a wastewater collection tank; 19. a mist spray head; 20. an input water pipe; 21. heating resistance wires; 22. a fan.

Detailed Description

The present invention will be described in detail with reference to fig. 1 to 6, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model provides a high-efficiency wafer cleaning machine through the improvement, as shown in fig. 1-6, the equipment body 1 comprises a rotary bracket 2, an annular cleaning device 3 and a drying device 4, the inside of the equipment body 1 is divided into two areas side by side, two openings are arranged in the same direction of the two areas, the annular cleaning device 3 and the drying device 4 are respectively arranged, the rotary bracket 2 which is perpendicular to the upper and lower inner surfaces of the equipment body 1 and is rotationally connected with the upper and lower inner surfaces of the equipment body 1 is arranged between the annular cleaning device 3 and the drying device 4, the rotary bracket 2 comprises a first motor 5, a main support frame 6, a transverse support 7 and a wafer placing frame 8, the main support frame 6 is vertically rotationally connected with the upper and lower inner surfaces of the equipment body 1, wherein one end of the main support frame 6 penetrates through and extends out the equipment body 1 to be fixedly connected with the output end of the first motor 5, one end of the transverse support 7 is vertically and fixedly connected to the side wall of the main support frame 6, the transverse support 7 is parallel to the ground, and the other end of the transverse support is clamped with the wafer placing frame 8.

Specifically, the wafer placing frame 8 comprises a wafer limiting frame 9, a movable side wall 10, a supporting seat 11 and a side wall limiting frame 12, wherein the movable side wall 10 is placed oppositely, the downward end of the movable side wall 10 is fixedly connected with one end of the supporting seat 11, the other end of the supporting seat 11 is fixedly connected onto the wafer limiting frame 9, the supporting seat 11 rotates through a middle rotating shaft, one end of the supporting seat 11 is far away from the movable side wall 10, the side wall limiting frame 12 is arranged, and the composition relation of the wafer placing frame 8 is introduced.

Specifically, the side wall limiting frame 12 comprises a connecting support 13 and a sliding groove 14, one end of the connecting support 13 is hinged to the movable side wall 10, the sliding groove 14 is formed in the side wall of the wafer limiting frame 9, the other end of the connecting support 13 is limited in the sliding groove 14, and the sliding groove 14 is provided with a plurality of position clamping grooves.

Specifically, annular cleaning device 3 includes second motor 15, first gear 16, second gear 17, wastewater collection groove 18, vaporific shower nozzle 19 and input water pipe 20, input water pipe 20 runs through equipment body 1 lateral wall, input water pipe 20 the output perpendicular downwards with vaporific shower nozzle 19 rotates and connects, and is fixed at input water pipe 20 perpendicular decurrent lateral wall second motor 15, at second motor 15's output fixed connection second gear 17 connects input water pipe 20's one end fixed connection at vaporific shower nozzle 19 first gear 16, first gear 16 meshes with second gear 17 mutually, is equipped with directly under vaporific shower nozzle 19 wastewater collection groove 18.

Specifically, the drying device 4 includes a plurality of heating resistance wires 21 and fans 22, the side walls of the device body 1 are fixedly connected to the plurality of heating resistance wires 21, and the sides of the heating resistance wires 21 are fixedly connected to the plurality of fans 22.

The working principle is as follows: firstly, the output end of a first motor 5 needs to be manually controlled to drive a main support frame 6, one end of a transverse support frame 7, which is far away from the main support frame 6, extends out of an equipment body 1, an installed wafer placing frame 8 needs to be manually placed into the transverse support frame 7, the first motor 5 is started to rotate the wafer placing frame 8 in the transverse support frame 7 to the position below a mist spray nozzle 19 of an annular cleaning device 3, a second motor 15 is started to rotate, the second motor 15 enables the mist spray nozzle 19 to rotate through a first gear 16 and a second gear 17 to spray wafers, the wastewater after spraying flows into a wastewater collection tank 18, the first motor 5 is started to rotate again, the wafer placing frame 8 in the transverse support frame 7 is rotated into a drying device 4 at the side to be dried, a heating resistance wire 21 in the drying device 4 provides a heat source, and a fan 22 accelerates the circulation of airflow, the drying speed of the wafer is accelerated, the first motor 5 is started again to rotate the main support frame 6 after drying, the wafer placing frame 8 is rotated out of the equipment body 1, and one-time wafer cleaning and drying are completed.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A high-efficiency wafer cleaning machine is characterized in that: the equipment body (1) comprises a rotary support (2), an annular cleaning device (3) and a drying device (4), the inside of the equipment body (1) is divided into two areas side by side, two openings are formed in the two areas in the same direction, the annular cleaning device (3) and the drying device (4) are respectively arranged, the rotary support (2) which is perpendicular to the upper inner surface and the lower inner surface of the equipment body (1) and is rotatably connected with the upper inner surface and the lower inner surface is arranged between the annular cleaning device (3) and the drying device (4), the rotary support (2) comprises a first motor (5), a main support frame (6), a transverse support (7) and a wafer placing frame (8), the main support frame (6) is vertically and rotatably connected with the upper inner surface and the lower inner surface of the equipment body (1), one end of the main support frame (6) penetrates through and extends out of the equipment body (1) and is fixedly connected with the output end of the first motor (5), one end of the transverse support (7) is vertically and fixedly connected to the side wall of the main support frame (6), the transverse support (7) is parallel to the ground, and the other end of the transverse support is clamped with the wafer placing frame (8).

2. A high efficiency wafer cleaning machine as claimed in claim 1, wherein: wafer is put frame (8) and is included spacing (9), removal lateral wall (10), supporting seat (11) and the spacing (12) of lateral wall, two remove lateral wall (10) and put in opposite directions, remove the decurrent one end fixed connection of lateral wall (10) the one end of supporting seat (11), the other end fixed connection of supporting seat (11) is on spacing (9) of wafer, and supporting seat (11) rotate through middle rotation axis, keep away from the one end of supporting seat (11) in removal lateral wall (10), are equipped with spacing (12) of lateral wall.

3. A high efficiency wafer cleaning machine as claimed in claim 2, wherein: the side wall limiting frame (12) comprises a connecting support (13) and a sliding groove (14), one end of the connecting support (13) is hinged to the movable side wall (10), the sliding groove (14) is formed in the side wall of the wafer limiting frame (9), the other end of the connecting support (13) is limited in the sliding groove (14), and the sliding groove (14) is provided with a plurality of position clamping grooves.

4. A high efficiency wafer cleaning machine as claimed in claim 1, wherein: annular cleaning device (3) include second motor (15), first gear (16), second gear (17), waste water collecting vat (18), fog shower nozzle (19) and input water pipe (20), input water pipe (20) run through equipment body (1) lateral wall, the output of input water pipe (20) perpendicularly downwards with fog shower nozzle (19) rotate and connect, and the lateral wall is fixed perpendicularly downwards at input water pipe (20) second motor (15), at the output fixed connection of second motor (15) second gear (17), the one end fixed connection of connecting input water pipe (20) in fog shower nozzle (19) first gear (16), first gear (16) mesh with second gear (17) mutually, are equipped with under fog shower nozzle (19) waste water collecting vat (18).

5. A high efficiency wafer cleaning machine as claimed in claim 1, wherein: the drying device (4) comprises heating resistance wires (21) and fans (22), the side walls of the equipment body (1) are fixedly connected with the heating resistance wires (21), and the sides of the heating resistance wires (21) are fixedly connected with the fans (22).