CN217160357U - FPC electromagnetic wave absorption film - Google Patents
FPC electromagnetic wave absorption film Download PDFInfo
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- CN217160357U CN217160357U CN202121676162.9U CN202121676162U CN217160357U CN 217160357 U CN217160357 U CN 217160357U CN 202121676162 U CN202121676162 U CN 202121676162U CN 217160357 U CN217160357 U CN 217160357U
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Abstract
The utility model discloses a FPC electromagnetic wave absorption membrane, including the transcription membrane, the epimembranal insulating layer that is equipped with of transcription, be equipped with the electromagnetic wave absorbed layer on the insulating layer, be equipped with on the electromagnetic wave absorbed layer and inhale ripples conductive adhesive layer, it is equipped with the protective layer on the ripples conductive adhesive layer to inhale, the utility model discloses can absorb the electromagnetic wave energy of projecting the membrane surface, it can be applied to and can absorb the electromagnetic radiation who reveals in the electronic equipment, can reach elimination electromagnetic interference's purpose, give the inside clean signal space of equipment.
Description
Technical Field
The utility model relates to an electromagnetic shield technical field especially relates to a FPC electromagnetic wave absorption membrane.
Background
With the development of modern science and technology, various digital and high-frequency electronic and electrical equipment radiate a large amount of electromagnetic waves with different wavelengths and frequencies to the space during working. The environmental impact of electromagnetic radiation is increasing. The electromagnetic interference generated by electromagnetic radiation not only affects the performance of electronic products, but also the electromagnetic pollution caused by the electromagnetic interference can cause serious harm to human beings and other organisms. The airplane and airplane flight are mistakenly started because the airplane and airplane flight cannot take off due to electromagnetic wave interference; in hospitals and mobile phones, the normal operation of various electronic medical instruments is often interfered. Therefore, international organization for the treatment of electromagnetic pollution has proposed a series of technical regulations requiring electronic products to comply with strict susceptibility and emission guidelines.
The existing electromagnetic wave shielding products isolate the electromagnetic wave by a reflection method, so that the electromagnetic wave cannot be diffused to the external space to interfere the work of other parts or equipment, but the electromagnetic wave reflected back by the method cannot disappear, but can be continuously reflected inside, and further the reliability of signals is influenced.
Disclosure of Invention
The utility model provides a FPC electromagnetic wave absorption membrane to not enough among the prior art to solve prior art problem.
In order to solve the technical problem, the utility model discloses a following technical scheme can solve:
the FPC electromagnetic wave absorption film comprises a transfer film body, wherein an insulating layer is arranged on the transfer film body, an electromagnetic wave absorption layer is arranged on the insulating layer, a wave-absorbing conductive adhesive layer is arranged on the electromagnetic wave absorption layer, and a protective layer is arranged on the wave-absorbing conductive adhesive layer.
Preferably, the insulating layer comprises insulating ink or high-temperature-resistant insulating resin, the insulating layer is coated or laminated on the transfer film, and the insulating layer is a peelable film with the thickness of 3-10 um.
Preferably, the electromagnetic wave absorption layer comprises an electromagnetic wave absorption material, resin and an auxiliary agent, the electromagnetic wave absorption layer is coated on the insulating layer, and the thickness of the electromagnetic wave absorption layer is 0.1-3 um.
Preferably, the electromagnetic wave absorption layer comprises an electromagnetic wave absorption material, the electromagnetic wave absorption layer is deposited on the insulating layer, and the thickness of the electromagnetic wave absorption layer is 0.1-3 um.
Preferably, the wave-absorbing conductive adhesive layer comprises an electromagnetic absorption material, a conductive material, resin and an auxiliary agent, the wave-absorbing conductive adhesive layer is coated on the electromagnetic absorption layer, and the thickness of the wave-absorbing conductive adhesive layer is 2-20 um.
Preferably, the transfer film is a release film or a high-temperature-resistant film.
Preferably, the protective layer is a release film or a high-temperature-resistant film.
Preferably, be equipped with electrically conductive shielding layer between insulating layer and the electromagnetic wave absorbing layer, electrically conductive shielding layer includes metal material, electrically conductive shielding layer deposits on the insulating layer, electrically conductive shielding layer's thickness is 0.1-3 um.
Preferably, the electromagnetic wave absorption layer comprises an electromagnetic wave absorption material, resin and an auxiliary agent, the electromagnetic wave absorption layer is coated on the conductive shielding layer, and the thickness of the electromagnetic wave absorption layer is 0.1-3 um.
Preferably, the electromagnetic wave absorption layer comprises an electromagnetic wave absorption material, the electromagnetic wave absorption layer is deposited on the conductive shielding layer, and the thickness of the electromagnetic wave absorption layer is 0.1-3 um.
The utility model has the advantages that:
the utility model discloses can absorb the electromagnetic wave energy of projecting on membrane surface, it can absorb the electromagnetic radiation who reveals in being applied to electronic equipment, can reach elimination electromagnetic interference's purpose, gives the inside clean signal space of equipment, the utility model relates to a rationally, accord with the market demand, be fit for promoting.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be discussed below, it is obvious that the technical solutions described in conjunction with the drawings are only some embodiments of the present invention, and for those skilled in the art, other embodiments and drawings can be obtained according to the embodiments shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
fig. 2 is a schematic structural diagram of the second embodiment of the present invention.
Detailed Description
The technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments described in the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts are within the protection scope of the present disclosure.
The first embodiment is as follows:
as shown in fig. 1, an FPC electromagnetic wave absorption film includes a transfer film 1, an insulating layer 2 is disposed on the transfer film 1, an electromagnetic wave absorption layer 4 is disposed on the insulating layer 2, a wave-absorbing conductive adhesive layer 5 is disposed on the electromagnetic wave absorption layer 4, a protective layer 6 is disposed on the wave-absorbing conductive adhesive layer 5, the insulating layer 2 includes insulating ink or high temperature resistant insulating resin, the insulating layer 2 is coated or laminated on the transfer film 1, the insulating layer 2 is a peelable film having a thickness of 3-10um, the electromagnetic wave absorption layer 4 includes an electromagnetic wave absorption material, resin and an additive, the electromagnetic wave absorption layer 4 is coated on the insulating layer 2, the thickness of the electromagnetic wave absorption layer 4 is 0.1-3um, the electromagnetic wave absorption layer 4 includes an electromagnetic wave absorption material, the electromagnetic wave absorption layer 4 is deposited on the insulating layer 2, the thickness of the electromagnetic wave absorption layer 4 is 0.1-3um, it includes electromagnetic absorption material, conducting material, resin and auxiliary agent to inhale wave conductive adhesive layer 5, inhale wave conductive adhesive layer 5 and scribble on electromagnetic absorption layer 4, it is 2-20um to inhale wave conductive adhesive layer 5 thickness, transcription membrane 1 is from type membrane or high temperature resistant film, protective layer 6 is from type membrane or high temperature resistant film.
When in implementation, the transfer film 1 is a release film or a high-temperature resistant film, firstly, insulating ink or high-temperature resistant insulating resin is coated or sprayed on the transfer film 1 to prepare a strippable insulating layer 2 with the thickness of 3-10um, then materials such as an electromagnetic wave absorbing material, resin and an auxiliary agent are uniformly mixed according to a specific mixture ratio, then a precise coating process is used for coating 0.1-3um on the insulating layer 2 to prepare an electromagnetic wave absorbing layer 4, the electromagnetic wave absorbing layer 4 can also deposit the electromagnetic wave absorbing material with the thickness of 0.1-3um on the insulating layer 2 by the methods such as magnetron sputtering, vacuum evaporation or ion plating of the electromagnetic wave absorbing material, then the materials such as the electromagnetic wave absorbing material, a conductive material, resin and an auxiliary agent are uniformly mixed according to the specific mixture ratio, and then a precise coating process is used for coating 2-20um on the electromagnetic wave absorbing layer 4 to prepare a wave absorbing conductive adhesive layer 5, and finally, the protective layer 6 is adhered to the wave-absorbing conductive adhesive layer 5, wherein the wave-absorbing conductive adhesive layer 5 has the functions of absorbing electromagnetic waves and conducting electricity, the electromagnetic wave absorption layer 4 has the function of absorbing the electromagnetic waves, the protective layer 6 plays a role of protecting the wave-absorbing conductive adhesive layer 5, and the FPC electromagnetic wave absorption film can absorb the electromagnetic wave energy projected to the surface of the film, so that the aim of eliminating electromagnetic interference is fulfilled.
Example two:
as shown in fig. 2, the difference between the second embodiment and the first embodiment is that a conductive shielding layer 3 is disposed between the insulating layer 2 and the electromagnetic wave absorbing layer 4, the conductive shielding layer 3 includes a metal material, the conductive shielding layer 3 is deposited on the insulating layer 2, the thickness of the conductive shielding layer 3 is 0.1-3um, the electromagnetic wave absorbing layer 4 includes an electromagnetic wave absorbing material, a resin and an auxiliary agent, the electromagnetic wave absorbing layer 4 is coated on the conductive shielding layer 3, the thickness of the electromagnetic wave absorbing layer 4 is 0.1-3um, the electromagnetic wave absorbing layer 4 includes an electromagnetic wave absorbing material, the electromagnetic wave absorbing layer 4 is deposited on the conductive shielding layer 3, and the thickness of the electromagnetic wave absorbing layer 4 is 0.1-3 um.
When the method is implemented, firstly, one or more conductive shielding layers 3 with the total thickness of 0.1-3um are deposited on the insulating layer 2 by using one or more methods such as magnetron sputtering, vacuum evaporation, ion plating or electroplating on metals or alloys such as gold, silver, copper, nickel, tin, aluminum and the like, then, the materials such as electromagnetic wave absorbing materials, resin, auxiliary agents and the like are uniformly mixed according to a specific mixture ratio, and then, the electromagnetic wave absorbing layers 4 are prepared by coating 0.1-3um on the conductive shielding layers 3 by using a precise coating process, and the electromagnetic wave absorbing materials 4 can also be deposited on the conductive shielding layers 3 by using the methods such as magnetron sputtering, vacuum evaporation or ion plating on the electromagnetic wave absorbing materials with the thickness of 0.1-3um, wherein the conductive shielding layers 3 have the functions of conductivity and shielding.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive. The scope of the invention is indicated by the appended claims, rather than the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. The FPC electromagnetic wave absorption film is characterized by comprising a transfer film (1), wherein an insulating layer (2) is arranged on the transfer film (1), an electromagnetic wave absorption layer (4) is arranged on the insulating layer (2), a wave-absorbing conductive adhesive layer (5) is arranged on the electromagnetic wave absorption layer (4), and a protective layer (6) is arranged on the wave-absorbing conductive adhesive layer (5).
2. The FPC electromagnetic wave absorption film according to claim 1, wherein the insulating layer (2) comprises insulating ink or high temperature resistant insulating resin, the insulating layer (2) is coated or laminated on the transfer film (1), and the insulating layer (2) is a peelable film with a thickness of 3-10 μm.
3. The FPC electromagnetic wave absorption film according to claim 1, wherein the electromagnetic wave absorption layer (4) comprises an electromagnetic wave absorption material, the electromagnetic wave absorption layer (4) is deposited on the insulation layer (2), and the thickness of the electromagnetic wave absorption layer (4) is 0.1-3 um.
4. The FPC electromagnetic wave absorption film according to claim 1, wherein the transfer film (1) is a release film or a high temperature resistant thin film.
5. The FPC electromagnetic wave absorption film according to claim 1, wherein the protection layer (6) is a release film or a high temperature resistant thin film.
6. The FPC electromagnetic wave absorption film according to claim 1, wherein a conductive shielding layer (3) is disposed between the insulating layer (2) and the electromagnetic wave absorption layer (4), the conductive shielding layer (3) comprises a metal material, the conductive shielding layer (3) is deposited on the insulating layer (2), and the thickness of the conductive shielding layer (3) is 0.1-3 um.
7. The FPC electromagnetic wave absorption film according to claim 6, wherein the electromagnetic wave absorption layer (4) comprises an electromagnetic wave absorption material, the electromagnetic wave absorption layer (4) is deposited on the conductive shielding layer (3), and the thickness of the electromagnetic wave absorption layer (4) is 0.1-3 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121676162.9U CN217160357U (en) | 2021-07-22 | 2021-07-22 | FPC electromagnetic wave absorption film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121676162.9U CN217160357U (en) | 2021-07-22 | 2021-07-22 | FPC electromagnetic wave absorption film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217160357U true CN217160357U (en) | 2022-08-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121676162.9U Active CN217160357U (en) | 2021-07-22 | 2021-07-22 | FPC electromagnetic wave absorption film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217160357U (en) |
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2021
- 2021-07-22 CN CN202121676162.9U patent/CN217160357U/en active Active
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Address after: 215000 1 1 Cao Feng Road, Xu Kou Town, Wuzhong District, Suzhou, Jiangsu. Patentee after: Suzhou New Guangyi Electronics Co.,Ltd. Address before: 215000 1 1 Cao Feng Road, Xu Kou Town, Wuzhong District, Suzhou, Jiangsu. Patentee before: SUZHOU XINGUANGYI ELECTRONICS Co.,Ltd. |