CN217134359U

CN217134359U - Chip overheating management module

Info

Publication number: CN217134359U
Application number: CN202220590118.4U
Authority: CN
Inventors: 艾育林
Original assignee: Jiangxi Wannianxin Microelectronics Co Ltd
Current assignee: Jiangxi Wannianxin Microelectronics Co Ltd
Priority date: 2022-03-17
Filing date: 2022-03-17
Publication date: 2022-08-05
Anticipated expiration: 2032-03-17

Abstract

The utility model relates to a thermal management module technical field is crossed to the chip specifically is a thermal management module is crossed to chip, including the device main part, the device main part includes the mainboard, mainboard both sides corner all is equipped with the installation ear, the mainboard top is equipped with the chip, the mainboard top is located chip one side and can carries out radiating thermal management module to the chip when being equipped with and supplying the chip to use, through the thermal management module that sets up, when can using the device, reduce the temperature on the chip, improve chip work efficiency, guarantee that the chip works under an optimal temperature to effectively promote the security of chip, usability and life-span.

Description

Chip overheating management module

Technical Field

The utility model relates to a thermal management module technical field is crossed to the chip specifically is a thermal management module is crossed to chip.

Background

A chip is an integrated circuit that is made up of a large number of transistors. Different chips have different integration scales, up to hundreds of millions; as small as tens or hundreds of transistors. The transistor has two states, on and off, denoted by 1, 0. The plurality of transistors generate a plurality of 1 and 0 signals that are set to specific functions (i.e., commands and data) to represent or process letters, numbers, colors, graphics, and the like. After the chip is powered on, a starting instruction is firstly generated to start the chip, and then new instructions and data are continuously received to complete the functions.

The existing chip has high temperature in the long-time use process, so that the working efficiency of the chip is reduced, and the service life of the chip is shortened.

Therefore, a chip over thermal management module is needed to solve the above problems in the background art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a thermal management module is crossed to chip to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a thermal management module is crossed to chip, includes the device main part, the device main part includes the mainboard, mainboard both sides corner all is equipped with the installation ear, the mainboard top is equipped with the chip, the mainboard top is located chip one side and can carries out radiating thermal management module to the chip when being equipped with and supplying the chip to use.

As the utility model discloses preferred scheme, the heat management module includes base, heat pipe, fan casing, fan, screw hole, top cap and dust screen, and the heat pipe is located fan casing one side, heat pipe and fan casing fixed connection, the base is located the heat pipe and keeps away from fan casing one end top, base and heat pipe fixed connection, the fan is located the fan casing top, the screw hole is seted up in four corners at fan casing top, the top cap is located the fan casing top, the dust screen is located the top cap top, dust screen and top cap fixed connection.

As the utility model discloses preferred scheme, inside heat pipe one end interlude air inlet fan casing, and heat pipe and fan casing bottom fixed connection.

As the utility model discloses preferred scheme, the heat pipe other end passes through base and chip top fixed connection.

As the utility model discloses preferred scheme, bolt fixed connection is passed through with the fan casing top to the top cap.

As the utility model discloses preferred scheme, the fan casing passes through mounting panel and mainboard top fixed connection, wherein mounting panel and fan casing fixed connection, and the bolt fastening is passed through with the mainboard top to the mounting panel.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses in, through the thermal management module that sets up, through the base with the heat pipe laminating on the chip surface for the heat pipe can dispel the heat with the heat transfer that the chip produced to the fan casing through the fan to the temperature on the heat pipe, when making the device use, reduces the temperature on the chip, improves chip work efficiency, guarantees that the chip works under an optimum temperature, thereby effectively promotes security, usability and the life-span of chip.

Drawings

FIG. 1 is an overall structure diagram of the present invention;

FIG. 2 is an overall structure diagram of the thermal management module of the present invention;

fig. 3 is an internal structure view of the fan cover of the present invention.

In the figure: 1. a device main body; 101. a main board; 102. mounting lugs; 103. a chip; 2. a thermal management module; 201. a base; 202. a heat conducting pipe; 203. a fan housing; 204. a fan; 205. a threaded hole; 206. a top cover; 207. a dust screen; 208. a bolt; 209. and (7) mounting the plate.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.

In order to facilitate understanding of the invention, the invention will be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which can be embodied in many different forms and are not limited to the embodiments described herein, but which are provided so as to render the disclosure of the invention more thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to fig. 1-3, the present invention provides a technical solution:

the utility model provides a thermal management module is crossed to chip, including device main part 1, device main part 1 includes mainboard 101, mainboard 101 both sides corner all is equipped with installation ear 102, mainboard 101 top is equipped with chip 103, mainboard 101 top is located chip 103 one side and is equipped with can supply the chip to carry out radiating thermal management module 2 to the chip when using, through the thermal management module 2 that sets up, when can making the device use, reduce the temperature on the chip, improve chip work efficiency, guarantee that the chip works under an optimal temperature, thereby effectively promote the security of chip, usability and life-span.

In an embodiment, referring to fig. 1, fig. 2 and fig. 3, the thermal management module 2 includes a base 201, a heat pipe 202, a fan cover 203, a fan 204, a threaded hole 205, a top cover 206 and a dust screen 207, wherein the heat pipe 202 is located at one side of the fan cover 203, the heat pipe 202 is fixedly connected to the fan cover 203, the base 201 is located at a top of one end of the heat pipe 202 away from the fan cover 203, the base 201 is fixedly connected to the heat pipe 202, the fan 204 is located at a top of the fan cover 203, the threaded hole 205 is opened at four corners of the top of the fan cover 203, the top cover 206 is located at the top of the fan cover 203, the dust screen 207 is located at the top of the top cover 206, the dust screen 207 is fixedly connected to the top cover 206, one end of the heat pipe 202 penetrates into the fan cover 203, the heat pipe 202 is fixedly connected to a bottom end of the fan cover 203, the other end of the heat pipe 202 is fixedly connected to a top of the chip 103 through the base 201, the top cover 206 is fixedly connected to the top of the fan cover 203 through a bolt 208, fan casing 203 passes through mounting panel 209 and mainboard 101 top fixed connection, wherein mounting panel 209 and fan casing 203 fixed connection, and mounting panel 209 passes through the bolt fastening with mainboard 101 top, through the thermal management module 2 that sets up, when can making the device use, reduce the temperature on the chip, improve chip work efficiency, guarantee that the chip works under an optimal temperature to effectively promote the security, the usability and the life-span of chip.

The working principle is as follows: during the use, install mainboard 101 on the device through installation ear 102, chip 103 is at the during operation, chip 103 self can produce the heat degree, laminate heat pipe 202 on chip 103 surface through base 201, make heat pipe 202 can be with the heat transfer to fan casing 203 that chip 103 produced, dispel the heat through the temperature of fan 204 on to the heat pipe, when making the device use, reduce the temperature on the chip, improve chip work efficiency, guarantee that the chip works under an optimal temperature, thereby effectively promote the security of chip, usability and life-span.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A chip overheating management module comprising a device body (1), characterized in that: the device main part (1) includes mainboard (101), mainboard (101) both sides corner all is equipped with installation ear (102), mainboard (101) top is equipped with chip (103), mainboard (101) top is located chip (103) one side and is equipped with thermal management module (2) that can carry out the heat dissipation to the chip when can supply the chip to use.

2. The die thermal management module of claim 1, wherein: the heat management module (2) comprises a base (201), a heat pipe (202), a fan cover (203), a fan (204), a threaded hole (205), a top cover (206) and a dustproof net (207), the heat pipe (202) is located on one side of the fan cover (203), the heat pipe (202) is fixedly connected with the fan cover (203), the base (201) is located at the top of the end, away from the fan cover (203), of the heat pipe (202), the base (201) is fixedly connected with the heat pipe (202), the fan (204) is located at the top of the fan cover (203), the threaded hole (205) is formed in four corners of the top of the fan cover (203), the top cover (206) is located at the top of the fan cover (203), the dustproof net (207) is located at the top of the top cover (206), and the dustproof net (207) is fixedly connected with the top cover (206).

3. The die thermal management module of claim 2, wherein: one end of the heat conducting pipe (202) penetrates into the fan cover (203), and the heat conducting pipe (202) is fixedly connected with the bottom end of the fan cover (203).

4. The die thermal management module of claim 2, wherein: the other end of the heat conducting pipe (202) is fixedly connected with the top of the chip (103) through the base (201).

5. The over-die thermal management module of claim 2, wherein: the top cover (206) is fixedly connected with the top of the fan cover (203) through a bolt (208).

6. The die thermal management module of claim 2, wherein: the fan cover (203) is fixedly connected with the top of the main board (101) through the mounting plate (209), wherein the mounting plate (209) is fixedly connected with the fan cover (203), and the mounting plate (209) is fixed with the top of the main board (101) through bolts.