CN217134343U

CN217134343U - Self-overturning mounting device for processing semiconductor photoelectric device

Info

Publication number: CN217134343U
Application number: CN202220856606.5U
Authority: CN
Inventors: 邓孟中; 袁纪文
Original assignee: Yangzhou Gangxin Photoelectric Technology Co ltd
Current assignee: Yangzhou Gangxin Photoelectric Technology Co ltd
Priority date: 2022-04-13
Filing date: 2022-04-13
Publication date: 2022-08-05
Anticipated expiration: 2032-04-13

Abstract

The utility model discloses a self-overturning mounting device for processing semiconductor photoelectric devices, which belongs to the technical field of semiconductor processing and comprises a base, a supporting plate, a top plate and a control panel, wherein the top of the base is provided with a mounting groove, the supporting plate is fixedly connected with the front side and the rear side of the top of the base through bolts, the top plate is fixedly connected between the right sides of the tops of the two supporting plates through bolts, the control panel is embedded at the front side of the right side of the front side wall of the supporting plate, four corners of the bottom of an inner cavity of the mounting groove are provided with moving grooves, the inner cavity of the moving grooves is connected with an electric slider in a sliding way, the self-overturning mounting device for processing semiconductor photoelectric devices has reasonable structural design, can fix the positioning and fixing precision of the semiconductor photoelectric devices, avoid the occurrence of mounting deviation, improve the mounting quality and can carry out mounting processing on two sides of the semiconductor photoelectric devices at one time, time and labor are saved, and meanwhile, the mounting efficiency is improved.

Description

Self-overturning mounting device for processing semiconductor photoelectric device

Technical Field

The utility model relates to a semiconductor processing technology field specifically is semiconductor photoelectric device processing is with pasting the dress device from overturning.

Background

The semiconductor packaging refers to a process of processing a tested wafer according to product model and functional requirements to obtain an independent chip, wherein the mounting of a semiconductor is a technological process in reflow soldering, the reflow soldering is also called reflow soldering, is a soldering technology developed along with the appearance of miniaturized electronic products, and is mainly applied to the soldering of various surface-mounted components, and the solder of the soldering technology is solder paste.

The existing semiconductor needs a plurality of semiconductors to be fixed in the mounting process, mounting is carried out after fixing is completed, however, the precision is low when fixing is carried out through manual work, the semiconductor mounting is caused to have deviation, the mounting quality is reduced, the semiconductor needs to be turned over in the mounting process, the two sides of the semiconductor can be processed only through secondary mounting in the existing semiconductor mounting, time and labor are wasted, the efficiency is low, and therefore the self-overturning mounting device for processing the semiconductor photoelectric device is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a processing of semiconductor photoelectric device is with pasting dress device from overturning, it needs many semiconductors to fix at the in-process of pasting dress to have proposed current semiconductor in solving above-mentioned background art, pasting dress after the fixed completion, nevertheless precision when fixing is fixed through the manual work is lower, lead to the semiconductor to paste dress the deviation appearing, the quality that leads to pasting dress reduces, and need carry out the turn-over at the in-process of pasting dress to the semiconductor, current semiconductor is pasted dress and need carry out the secondary and paste dress and just can process the two sides of semiconductor, waste time and energy and the lower problem of efficiency.

In order to achieve the above object, the utility model provides a following technical scheme: processing of semiconductor photoelectric device is with pasting dress device from upset, including base, backup pad, roof and control panel, it has the dress groove of subsides to open at the top of base, the backup pad passes through bolt fixed connection and is in both sides around the top of base, the roof passes through bolt fixed connection and is in two between the top right side of backup pad, control panel inlays in the front side the preceding lateral wall right side of backup pad, the inner chamber bottom four corners of pasting the dress groove is opened there is the shifting chute, the inner chamber sliding connection of shifting chute has electronic slider, two in the left side between the top of electronic slider and two on the right side fixedly connected with locating plate between the top of electronic slider.

Preferably, two transversely open the inside wall of backup pad has first spout, two the inner chamber sliding connection of first spout has first electronic slide, two fixedly connected with connecting plate between the bottom of first electronic slide drives the connecting plate through electronic slide and removes in first spout, is favorable to realizing moving about of connecting plate.

Preferably, both sides left side is rotated around the bottom of connecting plate and is connected with the linking arm, two the top of linking arm is rotated and is connected with flexible post, two the end of flexible post is rotated and is connected the bottom of connecting plate is through the flexible post of spring extrusion that is equipped with in the flexible post, is favorable to the flexible post to contradict the linking arm application of force downwards.

Preferably, two it is connected with the compression roller to rotate between the end of linking arm, the lateral wall of compression roller bonds and has rubber protection pad, and the rubber protection pad that is equipped with through the compression roller outside can be favorable to the compression roller to cause the damage to the semiconductor.

Preferably, the bottom front and back both sides of roof have transversely opened the second spout, two the inner chamber sliding connection of second spout has the electronic slide of second, two the bottom fixedly connected with electric lift rod of the electronic slide of second, two the bottom fixedly connected with electric rotary table of electric lift rod is favorable to the electronic slide of second to drive electric lift rod and remove.

Preferably, two fixedly connected with bracing piece, two between electric turntable's the inside wall left and right sides fixedly connected with mounting panel, two between the inside wall left and right sides of bracing piece both sides fixedly connected with electric putter around the inside wall of mounting panel is favorable to electric putter to drive splint and carries out the centre gripping to the semiconductor.

Preferably, the left side is two electric putter and right side is two fixedly connected with splint between electric putter's the end, two the inside wall of splint bonds has the slipmat, and the slipmat that bonds through the splint inboard is favorable to protecting it when the centre gripping semiconductor.

Compared with the prior art, the beneficial effects of the utility model are that:

1. this semiconductor photoelectric device processing is with pasting dress device from upset, through placing the semiconductor photoelectric device who processes and pasting the inslot, through starting electronic slider, drive the relative operation of locating plate simultaneously through two electronic sliders in left side and two electronic sliders in right side, it is tight to fix a position semiconductor photoelectric device through the locating plate, it is fixed through carrying out the automatic positioning to semiconductor photoelectric device to fix a position the precision by semiconductor photoelectric device, avoid pasting the dress deviation appearing, improve the quality of pasting the dress.

2. This semiconductor photoelectric device processing is with pasting dress device from upset, it descends to drive electric rotary table through electric lift rod, it carries out the centre gripping to drive the semiconductor photoelectric device that splint will paste the dress inslot through electric putter, electric lift rod resets, it hundred eighty degrees to drive the upset of semiconductor photoelectric device through electric rotary table, carry out the turn-over to semiconductor photoelectric device, rethread electric lift rod drives semiconductor photoelectric device and descends, it pastes dress processing to place to paste the dress inslot, thereby can once only carry out the subsides dress processing of two sides to semiconductor photoelectric device, labour saving and time saving has also improved the efficiency of pasting the dress in the time.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic sectional view of the front view of the present invention;

FIG. 3 is a schematic right sectional view of the present invention;

fig. 4 is an enlarged schematic view of a portion a in fig. 2 according to the present invention.

In the figure: 100. a base; 110. mounting a groove; 120. a moving groove; 130. an electric slider; 131. positioning a plate; 200. a support plate; 210. a first chute; 220. a first electrically powered carriage; 230. a connecting plate; 231. a connecting arm; 232. a telescopic column; 233. a compression roller; 300. a top plate; 310. a second chute; 320. a second electric slide; 330. an electric lifting rod; 340. an electric turntable; 350. a support bar; 351. mounting a plate; 352. an electric push rod; 353. a splint; 400. a control panel.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model provides a processing of semiconductor photoelectric device is with pasting dress device from upset, please refer to fig. 1, fig. 2, fig. 3 and fig. 4, the on-line screen storage device comprises a base 100, backup pad 200, roof 300 and control panel 400, open at base 100's top has the dress groove 110 of subsides, both sides around the top of backup pad 200 are passed through bolt fixed connection to backup pad 200, roof 300 passes through bolt fixed connection between the top right side of two backup pads 200, control panel 400 inlays the preceding lateral wall right side at front backup pad 200, the inner chamber bottom four corners of dress groove 110 is opened there is shifting chute 120, the inner chamber sliding connection of shifting chute 120 has electric slider 130, fixedly connected with locating plate 131 between the top of two electric slider 130 in left side and between the top of two electric slider 130 in right side.

Specifically, the processed semiconductor photoelectric device is placed in the mounting groove 110, the electric sliding blocks 130 are started, the two electric sliding blocks 130 on the left side and the two electric sliding blocks 130 on the right side simultaneously drive the positioning plate 131 to move relatively, the semiconductor photoelectric device is positioned and clamped by the positioning plate 131, and the semiconductor photoelectric device is automatically positioned and fixed.

Referring to fig. 1, 2 and 3, first sliding grooves 210 are transversely formed in inner side walls of two supporting plates 200, first electric sliding seats 220 are slidably connected to inner cavities of the two first sliding grooves 210, connecting plates 230 are fixedly connected between bottoms of the two first electric sliding seats 220, connecting arms 231 are rotatably connected to left sides of front and back sides of bottoms of the connecting plates 230, telescopic columns 232 are rotatably connected to tops of the two connecting arms 231, tail ends of the two telescopic columns 232 are rotatably connected to the bottoms of the connecting plates 230, press rollers 233 are rotatably connected between tail ends of the two connecting arms 231, and rubber protection pads are bonded to outer side walls of the press rollers 233.

Specifically, the first electric slide 220 drives the connecting plate 230 to move in the first sliding groove 210, the connecting plate 230 drives the connecting arm 231 to move, the compression roller 233 between the tail ends of the connecting arm 231 rolls, the connecting arm 231 is extruded through the telescopic column 232, and the processed semiconductor photoelectric device is pressed through the compression roller 233.

Referring to fig. 2, 3 and 4, the front and rear sides of the bottom of the top plate 300 are transversely provided with second sliding grooves 310, inner cavities of the two second sliding grooves 310 are slidably connected with second electric sliding seats 320, the bottom ends of the two second electric sliding seats 320 are fixedly connected with electric lifting rods 330, the bottom ends of the two electric lifting rods 330 are fixedly connected with electric rotating discs 340, supporting rods 350 are fixedly connected between the inner side walls of the two electric rotating discs 340, mounting plates 351 are fixedly connected between the left and right sides of the inner side walls of the two supporting rods 350, electric push rods 352 are fixedly connected with the front and rear sides of the inner side walls of the two mounting plates 351, clamping plates 353 are fixedly connected between the tail ends of the two electric push rods 352 on the left side and the two electric push rods 352 on the right side, and anti-slip pads are bonded on the inner side walls of the two clamping plates 353.

Specifically, the electric lifting rod 330 is driven by the second electric sliding seat 320 to move in the second sliding groove 310, so that the semiconductor photoelectric device can be loaded and unloaded, meanwhile, the electric lifting rod 330 drives the electric rotating disc 340 to descend, the electric pushing rod 352 drives the clamping plate 353 to clamp the semiconductor photoelectric device in the mounting groove 110, the electric lifting rod 330 resets, the electric rotating disc 340 drives the semiconductor photoelectric device to overturn by one hundred eighty degrees, the semiconductor photoelectric device is turned over, the semiconductor photoelectric device is driven by the electric lifting rod 330 to descend, the semiconductor photoelectric device is placed in the mounting groove 110 to be mounted and processed, and the two sides of the semiconductor photoelectric device can be processed at one time.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the description of such combinations is not exhaustive in the present specification only for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

1. The processing of semiconductor photoelectric device is with pasting the device from overturning, its characterized in that: including base (100), backup pad (200), roof (300) and control panel (400), it has subsides dress groove (110) to open at the top of base (100), backup pad (200) pass through bolt fixed connection in both sides around the top of base (100), roof (300) pass through bolt fixed connection two between the top right side of backup pad (200), control panel (400) are inlayed in the front side the preceding lateral wall right side of backup pad (200), it has shifting chute (120) to open in the inner chamber bottom four corners of subsides dress groove (110), the inner chamber sliding connection of shifting chute (120) has electronic slider (130), and two on the left side between the top of electronic slider (130) and two on the right side fixedly connected with locating plate (131) between the top of electronic slider (130).

2. The self-flipping mounting device for semiconductor optoelectronic device processing as claimed in claim 1, wherein: two the inside wall of backup pad (200) transversely opens has first spout (210), two the inner chamber sliding connection of first spout (210) has first electronic slide (220), two fixedly connected with connecting plate (230) between the bottom of first electronic slide (220).

3. The self-flipping mounting device for semiconductor optoelectronic device processing as claimed in claim 2, wherein: the left sides of both sides are rotated around the bottom of connecting plate (230) and are connected with connecting arm (231), two the top of connecting arm (231) is rotated and is connected with flexible post (232), two the end of flexible post (232) is rotated and is connected the bottom of connecting plate (230).

4. The self-overturning mounting device for processing the semiconductor photoelectric device as claimed in claim 3, wherein: the pressing roller (233) is rotatably connected between the tail ends of the two connecting arms (231), and a rubber protective pad is bonded on the outer side wall of the pressing roller (233).

5. The self-flipping mounting device for semiconductor optoelectronic device processing as claimed in claim 1, wherein: the bottom front and back both sides of roof (300) transversely open there are second spout (310), two the inner chamber sliding connection of second spout (310) has second electronic slide (320), two the bottom fixedly connected with electric lift pole (330) of second electronic slide (320), two the bottom fixedly connected with electric rotary table (340) of electric lift pole (330).

6. The self-overturning mounting device for processing the semiconductor photoelectric device as claimed in claim 5, wherein: two fixedly connected with bracing piece (350) between the inside wall of electric turntable (340), two fixedly connected with mounting panel (351) between the inside wall left and right sides of bracing piece (350), two both sides fixedly connected with electric putter (352) around the inside wall of mounting panel (351).

7. The self-overturning mounting device for processing the semiconductor photoelectric device as claimed in claim 6, wherein: a clamping plate (353) is fixedly connected between the tail ends of the two electric push rods (352) on the left side and the tail ends of the two electric push rods (352) on the right side, and anti-slip pads are adhered to the inner side walls of the two clamping plates (353).