CN217132915U - Glue aging testing device for laser - Google Patents
Glue aging testing device for laser Download PDFInfo
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- CN217132915U CN217132915U CN202123298549.8U CN202123298549U CN217132915U CN 217132915 U CN217132915 U CN 217132915U CN 202123298549 U CN202123298549 U CN 202123298549U CN 217132915 U CN217132915 U CN 217132915U
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Abstract
The utility model provides a glue aging testing device for laser, which comprises a cooling shell module, wherein at least one detection channel is arranged on the cooling shell module, a laser chip module and a glue module to be tested are sequentially arranged in each detection channel along the axial direction of the detection channel, and the laser chip module is positioned at one end of the detection channel; the glue module to be tested is configured to place glue to be tested, and the chip on the laser chip module can emit laser to irradiate the glue to be tested; the light absorption module is detachably arranged at the other end in the detection channel, the light absorption module can absorb heat generated by laser emitted by the chip, and the cooling shell module is configured to cool the light absorption module; the power detection module is configured to detect the power of laser generated by the chip, and/or the microscopic detection module is configured to detect the aging state of the glue to be detected. The glue aging testing device for the laser can verify various glues at one time, and greatly improves glue testing efficiency.
Description
Technical Field
The utility model belongs to the technical field of laser, especially, relate to a glue aging testing device for laser.
Background
Glue is indispensable in the production process of high-energy lasers, and for example, in the production process of one type of fiber laser, less glue is used, and more glue is used, so that the glue is used for dozens of types of fiber lasers. However, the absorption of laser light by each glue at different wavelengths is different for the glue itself. Because the laser has the characteristics of high energy and concentrated energy, the glue is easily burnt, and in the failure reason of the laser, most of the reasons are caused by the failure of the glue, and meanwhile, the volatilization of the glue also easily causes the failure of a laser chip, so when the glue is selected, the reliability of the glue must be strictly verified.
Due to the fact that the glue is various in types, particularly the reliability performance of the glue used for a long time is verified, if single test is conducted on each glue, the test period is long, and the process is complex. If the performance of the glue is tested by adopting automatic equipment, the cost of the equipment is too high and the burden is difficult.
Therefore, in order to solve the above problems, it is necessary to provide a glue aging test device for laser.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a glue aging testing device for laser, this glue aging testing device for laser can once only verify multiple glue, improves glue efficiency of software testing by a wide margin.
To achieve the purpose, the utility model adopts the following technical proposal:
provided is a glue aging test device for laser, including:
the cooling shell module is provided with at least one detection channel, a laser chip module and a glue module to be detected are sequentially arranged in each detection channel along the axial direction of the detection channel, and the laser chip module is positioned at one end of the detection channel;
the glue module to be tested is configured to place glue to be tested, and a chip on the laser chip module can emit laser to irradiate the glue to be tested;
a light absorption module detachably disposed at the other end in the detection channel, the light absorption module being capable of absorbing heat generated by laser light emitted from the chip, the cooling housing module being configured to cool the light absorption module;
the power detection module is configured to detect the power of the laser generated by the chip, and/or the microscopic detection module is configured to detect the aging state of the glue to be detected.
Preferably, the laser chip module includes:
the laser base is arranged at one end in the detection channel and is electrically connected with an external control circuit;
and the electronic chip board is arranged on the laser base and is electrically connected with the laser base, and the chip is arranged on the electronic chip board.
Preferably, the glue module to be tested comprises a glue tray detachably mounted on the laser chip module, and the glue to be tested is placed in the glue tray.
Preferably, the light absorption module comprises a light absorption block, the light absorption block is plugged at the other end of the detection channel, and the light absorption block is detachably connected with the detection channel.
Preferably, the power detection module comprises a PD light detection module disposed on a light absorption module, the PD light detection module is located between the light absorption module and the laser chip module, and the PD light detection module is configured to detect the power of the laser in real time;
and an optical attenuation module electrically connected with the PD optical detection module, wherein the optical attenuation module is configured to attenuate the intensity of the laser emitted by the laser chip module so as to protect the PD optical detection module.
Preferably, the power detection module comprises a power meter or a spectral power integrating sphere for detecting the laser power.
Preferably, the cooling housing module comprises a water-cooling housing, and the water-cooling housing is provided with a plurality of detection channels arranged in a matrix.
Preferably, the glue aging testing device for laser further comprises:
a thrustmeter module configured to measure an adhesive force between the glue to be measured and the glue tray after being irradiated by the laser.
Preferably, the microscopic detection module comprises a microscope arranged at one side of the cooling housing module, and the microscope is configured to detect the aging state of the glue to be detected after being irradiated by the laser.
Preferably, the microscopic detection module comprises a microscope arranged on one side of the cooling shell module and a CCD camera arranged on the microscope, and the CCD camera is configured to photograph the aging state of the glue to be detected under the observation of the microscope.
Compared with the prior art, the utility model discloses following beneficial effect has. The utility model discloses in, the laser of the chip transmission specific wavelength of the laser chip module in the inspection passage, under the laser environment of specific wavelength, shine predetermined time, the glue that awaits measuring receives laser to produce the ageing phenomenon that different degrees can appear after shining. The influence of the laser wavelength and the irradiation time on the reliability of the glue to be detected is obtained by detecting the aging state of the glue to be detected;
after the glue to be tested is volatilized under the irradiation of the laser, the generated volatile matter can be deposited on the chip, the power of the laser emitted by the chip is detected through the power detection module to obtain the power change, and then the influence degree of the glue to be tested on the performance of the chip is obtained;
the aging state of the glue to be tested during working under actual laser is simulated by the glue aging testing device for laser, so that the information for testing the reliability of the glue to be tested is obtained, and the damage to laser equipment caused by the failure of the glue to be tested in the actual use process is avoided;
the glue aging testing device for the laser is characterized in that a plurality of detection channels are arranged on the cooling shell module, one glue can be detected in each detection channel, the glue aging testing device for the laser can test the aging conditions of various glues at one time, and the detection efficiency is improved.
Drawings
The utility model discloses in:
fig. 1 is a schematic structural view of a first angle of the aging testing device for laser glue of the present invention;
fig. 2 is a schematic structural view of a second angle of the aging testing device for laser glue of the present invention;
fig. 3 is a schematic structural diagram of the laser chip module and the glue module to be tested in the present invention;
fig. 4 is a top view of the aging testing device for laser glue of the present invention;
fig. 5 is a schematic view of the structure of fig. 3 from direction a-a in the present invention;
fig. 6 is a schematic view of the structure in the direction B-B of fig. 3 according to the present invention.
Wherein, 1, cooling the shell module; 11. water-cooling the shell; 111. a water-cooled joint;
10. a detection channel; 12. a water-cooling channel;
2. a laser chip module; 21. a chip; 22. a laser base; 23. an electronic chip board; 24. a groove;
3. a glue module to be tested; 31. a glue tray;
4. a light absorbing module; 41. and a light absorption block.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description of the present invention and simplification of description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either mechanically or electrically. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the production process of high energy fiber laser, use multiple glue, for test glue after laser irradiation certain time, the performance of glue, the utility model discloses in designed a glue aging testing device for laser, this device can once only test multiple glue, improves efficiency of software testing.
Specifically, as shown in fig. 1 to 3, the glue aging testing device for laser includes a cooling housing module 1, a laser chip module 2, a glue module 3 to be tested, a light absorption module 4, a power detection module and/or a microscopic detection module, wherein the cooling housing module 1 is provided with at least one detection channel 10, a laser chip module 2 and the glue module 3 to be tested are sequentially installed in each detection channel 10 along an axial direction of the detection channel 10, and the laser chip module 2 is located at one end of the detection channel 10. The glue module to be tested 3 is configured to place the glue to be tested, and the chip 21 on the laser chip module 2 can emit laser to irradiate the glue to be tested. The light absorption module 4 is detachably disposed at the other end in the detection passage 10, the light absorption module 4 can absorb heat generated by laser light emitted from the chip 21, and the cooling housing module 1 is configured to cool the light absorption module 4. The power detection module is configured to detect the power of the laser light generated by the chip 21, and the microscopic detection module is configured to detect the aging state of the glue to be detected.
In this embodiment, the chip 21 of the laser chip module 2 in the detection channel 10 emits laser with a specific wavelength to irradiate the glue to be detected placed in the detection channel 10, and the irradiation duration is determined according to actual test requirements.
In a laser environment with a specific wavelength, after the glue to be tested is irradiated for a preset time, the glue to be tested generates aging phenomena with different degrees after being irradiated by laser. The aging state of the glue to be detected is detected through the microscopic detection module so as to obtain the influence of the laser with different wavelengths and irradiation time on the reliability of the glue to be detected.
During the process of irradiating the glue to be measured by the laser, the glue to be measured volatilizes, generates certain volatile matters, adheres to the chip 21, and seriously causes the chip 21 to lose efficacy or fall off. On the other hand, when the glue to be measured is applied to the laser to bond the lens, the lens is easy to fall off due to the failure of the glue to be measured, and the laser is seriously burnt and damaged. In order to solve the problem, the glue aging test device for laser also simultaneously tests the influence degree of the glue to be tested on the performance of the chip 21, under the irradiation of the laser, after volatile matters generated after the glue to be tested volatilize are deposited on the chip 21, the power of the laser irradiated by the chip 21 can be changed, therefore, the power of the laser emitted by the chip 21 is detected through the power detection module so as to obtain the power change, and further the influence degree of the glue to be tested on the performance of the chip 21 is obtained.
The aging state of the glue to be tested in the working process under actual laser is simulated by the glue aging testing device for laser, so that the information for testing the reliability of the glue to be tested is obtained, and the damage to laser equipment caused by the failure of the glue to be tested in the actual use process is avoided.
In the embodiment, the plurality of detection channels 10 are arranged on the cooling shell module 1, one glue can be detected in each detection channel 10, the glue aging testing device for laser can test aging conditions of various glues at one time, and the detection efficiency is improved.
In addition, the laser chip module 2 and the glue module 3 to be tested are arranged in the detection channel 10, so that irradiated laser is gathered in the detection channel 10 and cannot be irradiated outwards, and personal injury to testers is avoided.
Among the glue aging testing device for laser, the laser that extinction module 4 absorbed chip 21 transmission turns into the heat, takes away the heat through cooling housing module 1, guarantees among the test procedure, and the temperature of test passage 10 keeps invariable basically, prevents among the test procedure, burns out laser chip subassembly 2 because of the high temperature, avoids causing the interference to the test result of the glue that awaits measuring simultaneously.
The glue aging testing device for the laser only comprises a power detection module, wherein the specific position of the power detection module is adjusted according to actual needs.
When the influence of the glue to be detected on the chip 21 needs to be detected, after laser irradiation is carried out for a preset time, the light absorption module 4 is taken away, laser is emitted from the detection channel 10, the power of the laser is measured and recorded by the power detection module, the power is compared with a reference group (the glue to be detected is not placed in the glue tray, and the chip 21 generates the same laser environment as the reference group), and the influence degree of the glue to be detected on the performance of the chip 21 under the laser with the specific wavelength is judged by comparing the change of the laser power. The power detection module can be used for rapidly and efficiently detecting results, and the detection efficiency is improved.
Specifically, in this embodiment, the position of the laser chip module 2 in the detection channel 10 is fixed, after the glue to be detected is irradiated by the laser for a predetermined time, the light absorption module 4 is taken away, the power detection module moves to the detection channel 10, the power of the laser emitted by the chip 21 is detected, the power detection module detects the glue to be detected once every predetermined time by using the detected power change, and the above steps are repeated, so as to determine the degree of influence of the glue to be detected on the performance of the chip 21.
The glue aging testing device for the laser only comprises a microscopic detection module arranged on one side of the cooling shell module 1. After the glue to be detected is irradiated by laser for a certain time, the light absorption module 4 is taken away, the glue module 3 to be detected and the glue to be detected are moved to the microscopic detection module, the microscopic detection module is utilized to observe the state of the glue, and if the glue to be detected is cracked, discolored or not, the aging state of the glue to be detected is detected, so that the reliability of the glue to be detected is obtained.
The glue aging testing device for the laser comprises a power detection module and a microscopic detection module arranged on one side of the cooling shell module 1, wherein the power detection module is configured to detect the power of the laser generated by the chip 21, and the microscopic detection module is configured to detect the aging state of the glue to be tested so as to acquire the reliability of the glue to be tested. In this embodiment, when the power of the detection chip 21 changes, the laser chip module 2 remains stationary in the detection channel 10, and the power detection module moves to the detection channel 10 for detection, specifically, the relative positions of the microscopic detection module, the power detection module, and the cooling housing module 1 can be adjusted according to actual needs. The testing device can simultaneously test the influence of the glue to be tested on the performance of the chip 21 and test the reliability of the glue to be tested, thereby greatly improving the testing efficiency.
As shown in fig. 1 and fig. 3 to 6, the cooling housing module 1 includes a water-cooling housing 11, and a plurality of detection channels 10 arranged in a matrix are disposed on the water-cooling housing 11. Therefore, various glue to be detected can be detected at one time, the detection efficiency is improved, and laser generated by the laser chip module 2 is absorbed and converted into heat through the light absorption module 4 and is transmitted out through the water-cooling shell 11. Specifically, the water-cooling connector 111 is arranged on the water-cooling shell 11, the water-cooling channel 12 communicated with the water-cooling connector 111 is arranged inside the water-cooling shell 11, and the water-cooling connector 111 is communicated with an external water channel, so that heat of the light absorption module 4 can be taken away quickly through water cooling in the test process.
As for the specific structure of the laser chip module 2, as shown in fig. 3, the laser chip module 2 includes a laser base 22 and an electronic chip board 23, the laser base 22 is disposed at one end of the detection channel 10, and the laser base 22 is electrically connected to an external control circuit. The electronic chip board 23 is mounted on the laser base 22 and electrically connected to the laser base 22, and the chip 21 is mounted on the electronic chip board 23.
In this embodiment, the laser base 22 is electrically connected to an external control circuit, the electronic chip board 23 is electrically connected to the laser base 22, and the laser base 22 is used to electrically emit laser to the electronic chip board 23 and the chip 21, so that the glue to be detected is placed in the laser environment with a specific wavelength emitted by the chip 21, and after the glue to be detected is irradiated for a predetermined time, the power of the laser generated by the power detection module chip 2 is used to obtain the influence degree of the glue to be detected on the performance of the chip 21 through the variation value of the power. And simultaneously, detecting the aging state of the glue to be detected by using a microscopic detection module so as to acquire the reliability of the glue to be detected. So as to ensure that the glue to be tested is reasonably used in the laser and reduce the condition that the chip 21 is invalid or damaged due to the glue in the using process.
Specifically, the power detection module includes a PD light detection module disposed on the light absorption module 4, the PD light detection module is located between the light absorption module 4 and the laser chip module 2, the PD light detection module is configured to detect the power of the laser in real time, and a light attenuation module electrically connected to the PD light detection module, and the light attenuation module is configured to attenuate the intensity of the laser emitted by the laser chip module 2 to protect the PD light detection module.
The light attenuation module is used for weakening the intensity of the light irradiated to the PD light detection module so as to prevent the PD light detection module from being burnt or damaged. The PD light detection module installed on the light absorption module 4 detects the power of the laser generated by the chip 21 in real time or detects once at a certain time interval, the PD light detection module transmits the detected information to an external control circuit, and the influence degree of the adhesive glue to be detected on the performance of the chip 21 is obtained after the information is processed.
In other embodiments, the power detection module may further include a power meter or a spectral power integrating sphere, and the power meter or the spectral power integrating sphere is used for detecting the power of the laser emitted by the chip 21 in real time. After the glue to be tested is irradiated by the laser for a preset time, the light absorption module 4 is taken away, the power of the laser irradiated by the chip 21 is detected and recorded by using a power meter or a spectral power integrating sphere, so as to obtain the influence degree of the glue to be tested on the performance of the chip 21.
When testing the reliability of the glue to be tested, as shown in fig. 2 and fig. 3, the glue module 3 to be tested includes a glue tray 31 detachably mounted on the laser chip module 2, and the glue to be tested is placed in the glue tray 31. The glue tray 31 is arranged on the laser chip module 2, so that the glue tray and the laser chip module can be conveniently installed in the detection channel 10, the space is saved, and the overlarge size of the glue aging testing device for laser is avoided. Glue tray 31 and laser chip module 2 demountable installation are convenient for get fast and are put glue tray 31, and the short-term test further improves detection efficiency.
Specifically, glue tray 31 detachably sets up on laser base 22, has seted up recess 24 on laser base 22, and glue tray 31 is placed in recess 24, and the fixed glue tray 31 of being convenient for on the one hand prevents that the glue that awaits measuring from appearing spilling in the test procedure, and on the other hand saves installation space, avoids detecting channel 10's oversize, leads to whole testing arrangement structure size too big.
For the specific structure of the microscopic detection module, preferably, the microscopic detection module comprises a microscope disposed on one side of the water-cooled housing 11, and the microscope is configured to detect the aging state of the glue to be detected after being irradiated by the laser.
When detecting the glue to be detected which is irradiated by the laser for a certain time, the glue tray 31 and the glue to be detected are placed under a microscope together, whether the glue to be detected cracks, changes color and other phenomena are observed, and the influence of the wavelength and irradiation duration of the laser on the reliability of the glue to be detected is obtained by observing the aging state of the glue to be detected. And if the glue to be detected turns yellow, the glue to be detected is invalid.
In other embodiments, the micro-inspection module can further include a microscope disposed on one side of the water-cooled housing 11 and a CCD camera disposed on the microscope, and the CCD camera is configured to capture an aging state of the glue under observation by the microscope.
The glue tray 31 and the glue to be detected are placed under a microscope to observe the aging state of the glue to be detected, a CCD camera installed on the microscope shoots the aging state of the glue to be detected under the observation of the microscope, the CCD camera transmits the shot image to an external control circuit, information processing is carried out on the image to determine the aging state of the glue to be detected, and therefore reliability information of the glue to be detected under the irradiation of different wavelengths and different time lengths is obtained.
As shown in fig. 1, 4, and 6, the light absorption module 4 includes a light absorption block 41, the light absorption block 41 is plugged at the other end of the detection channel 10, and the light absorption block 41 is detachably connected to the detection channel 10.
Specifically, one end of the light absorption block 41 close to the laser chip module 2 is conical, so that the laser is prevented from being irradiated to the light absorption block 41 and then reflected to the laser chip module 2, and the temperature of the laser chip module 2 is prevented from being too high.
Preferably, the glue aging test device for laser further comprises a thrustor meter module configured to measure the adhesion force between the glue to be tested irradiated by the laser and the glue tray 31. The thrust gauge module is arranged on one side of the cooling shell module 1, and the positions of the thrust gauge module, the power detection module and the microscopic detection module can be adjusted according to the detection sequence. The adhesion force between the glue to be detected and the glue tray 31 is detected through the thrustor module, so that the adhesion force of the glue to be detected to the lens in the actual laser can be obtained. Specifically, after the glue to be tested is irradiated by the laser for a preset time, the glue tray 31 and the glue to be tested are moved to the position of the thrustor module, the magnitude of the force of the glue to be tested, which is separated from the glue tray 31, is tested by using the thrustor module, and then the adhesion force of the glue to be tested when the glue is actually bonded to a chip or a lens is obtained.
In this embodiment, glue aging testing device for laser belongs to experiment class frock, and the quantity of test can not be huge, consequently, for reducing test cost, above-mentioned thrustor meter module is the thrustor meter, utilizes the thrustor meter to detect the adhesion force between glue and the glue tray 31 that awaits measuring, and is convenient simple, the at utmost reduce cost.
In order to realize automatic operation, the glue aging test device for laser in the embodiment further includes an XYZ movement module, where the XYZ movement module can reciprocate linearly along the X, Y, Z three directions, and can clamp the glue tray 31 and make the glue to be tested reciprocate among the detection channel 10, the microscopic detection module, and the thrustometer module. Meanwhile, the power detection module can be clamped to the channel to be detected 10.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. The utility model provides a glue aging testing device for laser which characterized in that includes:
the cooling shell module (1) is provided with at least one detection channel (10), a laser chip module (2) and a glue module (3) to be detected are sequentially installed in each detection channel (10) along the axial direction of the detection channel (10), and the laser chip module (2) is located at one end of the detection channel (10);
the glue module (3) to be tested is configured to place glue to be tested, and a chip (21) on the laser chip module (2) can emit laser to irradiate the glue to be tested;
a light absorption module (4) detachably disposed at the other end within the detection channel (10), the light absorption module (4) being capable of absorbing heat generated by the laser light emitted from the chip (21), the cooling housing module (1) being configured to cool the light absorption module (4);
a power detection module configured to detect the power of the laser light generated by the chip (21) and/or a microscopic detection module configured to detect the aging state of the glue to be tested.
2. Glue aging testing device for laser according to claim 1, characterized in that the laser chip module (2) comprises:
the laser base (22) is arranged at one end in the detection channel (10), and the laser base (22) is electrically connected with an external control circuit;
and the electronic chip board (23) is arranged on the laser base (22) and is electrically connected to the laser base (22), and the chip (21) is arranged on the electronic chip board (23).
3. Glue aging testing device for laser according to claim 1, characterized in that the glue module (3) to be tested comprises a glue tray (31) detachably mounted on the laser chip module (2), the glue to be tested being placed in the glue tray (31).
4. The glue aging testing device for the laser according to claim 1, characterized in that the light absorption module (4) comprises a light absorption block (41), the light absorption block (41) is plugged at the other end of the detection channel (10), and the light absorption block (41) is detachably connected with the detection channel (10).
5. The glue aging test device for laser according to claim 1, wherein the power detection module comprises a PD light detection module disposed on the light absorption module (4), the PD light detection module is located between the light absorption module (4) and the laser chip module (2), and the PD light detection module is configured to detect the power of the laser in real time;
and an optical attenuation module electrically connected with the PD optical detection module, wherein the optical attenuation module is configured to attenuate the intensity of the laser emitted by the laser chip module (2) so as to protect the PD optical detection module.
6. The apparatus for testing aging of laser glue according to claim 5, wherein the power detection module comprises a power meter or a spectral power integrating sphere for detecting laser power.
7. The aging testing device for the glue used for the laser as claimed in claim 1, wherein the cooling housing module (1) comprises a water-cooling housing (11), and a plurality of the detection channels (10) arranged in a matrix are arranged on the water-cooling housing (11).
8. The aging testing apparatus for laser glue according to claim 3, further comprising:
a thrustmeter module configured to measure the adhesion force between the glue to be measured after being irradiated by the laser and the glue tray (31).
9. The glue aging test device for laser according to claim 2, characterized in that the microscopic detection module comprises a microscope arranged at one side of the cooling housing module (1), the microscope being configured to detect the aging state of the glue to be tested after being irradiated by laser.
10. The glue aging test device for laser according to claim 2, characterized in that the microscopic detection module comprises a microscope arranged at one side of the cooling housing module (1) and a CCD camera arranged on the microscope, and the CCD camera is configured to photograph an aging state of the glue to be tested under observation of the microscope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123298549.8U CN217132915U (en) | 2021-12-24 | 2021-12-24 | Glue aging testing device for laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123298549.8U CN217132915U (en) | 2021-12-24 | 2021-12-24 | Glue aging testing device for laser |
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| CN217132915U true CN217132915U (en) | 2022-08-05 |
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| CN202123298549.8U Active CN217132915U (en) | 2021-12-24 | 2021-12-24 | Glue aging testing device for laser |
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2021
- 2021-12-24 CN CN202123298549.8U patent/CN217132915U/en active Active
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