CN217120939U

CN217120939U - Mixing and grading equipment for photovoltaic solar silicon wafers

Info

Publication number: CN217120939U
Application number: CN202220515392.5U
Authority: CN
Inventors: 陈春芙; 苏金财
Original assignee: Changzhou Kelongwei Intelligent Technology Co ltd
Current assignee: Changzhou Kelongwei Intelligent Technology Co ltd
Priority date: 2022-03-10
Filing date: 2022-03-10
Publication date: 2022-08-05
Anticipated expiration: 2032-03-10

Abstract

The utility model discloses a mixing and grading device for photovoltaic solar silicon wafers, which comprises a pair of mixing and placing plate-dividing machines, wherein a mixing and placing module and a mixing and caching and placing module are arranged right above a silicon wafer conveying component in each group of mixing and placing plate-dividing machines, and the mixing and caching and placing module is positioned at the front side of the mixing and placing module; one end of each group of mixed wafer placing modules extends out of the inner side edge of the silicon wafer conveying component where each group of mixed wafer placing modules is located and then extends to the position above the opposite silicon wafer conveying component; one end of each group of mixed buffer storage piece placing modules stretches out of the inner side edge of the silicon wafer conveying assembly where each group of mixed buffer storage piece placing modules is arranged and then is suspended above the buffer storage belt line conveying assembly, and each group of buffer storage belt line conveying assembly penetrates through the lower portion of each group of mixed buffer storage piece placing modules. The utility model discloses can put the silicon chip classification of the same grade on the piece board separator with two sets of mixings and put in same grade magazine, realize mixing the stepping, increased the categorised grade quantity of silicon chip, subtract the weak point and put piece board separator length, improve stepping efficiency, the cost is reduced.

Description

Mixing and grading equipment for photovoltaic solar silicon wafers

Technical Field

The utility model belongs to photovoltaic solar silicon chip sorting facilities field particularly, relates to a mixed stepping equipment of photovoltaic solar silicon chip.

Background

In the process of preparing the photovoltaic solar silicon wafer, a silicon wafer grading process is one of important steps. The stepped transmission mechanism adopted by the existing sintering furnace has the following defects:

1. the left-to-right plate separating machine and the right-to-left plate separating machine cannot classify the silicon wafers with the same grade into a material box;

2. the silicon wafer is graded more, the longer the machine is made, the larger the size is made, and the cost is increased;

3. silicon wafers are of the same grade and are not easily sorted together.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem that prior art exists, the utility model aims at providing a mixed stepping equipment of photovoltaic solar energy silicon chip has improved the silicon chip and has selected separately the efficiency of grade efficiency and improvement silicon chip selection grade unloading under the condition that shortens equipment.

In order to achieve the technical purpose and effect, the utility model discloses a following technical scheme realizes:

a mixing and grading device for photovoltaic solar silicon wafers comprises a pair of mutually symmetrical mixing and placing plate dividing machines, wherein a group of mixing and placing modules and a group of mixing and caching and placing modules are erected right above a silicon wafer conveying assembly in each group of mixing and placing plate dividing machines, and the mixing and caching and placing modules are positioned on the front sides of the mixing and placing modules; one end of each group of the mixed wafer placing modules extends out of the inner side edge of the silicon wafer conveying assembly where the mixed wafer placing modules are located and then extends to the position above the silicon wafer conveying assembly in the opposite mixed wafer placing and separating machine; simultaneously, every group mix the buffer memory and put the one end of piece module and all stretch out the back from place separately silicon chip conveying component's inboard side and establish directly over a set of buffer memory belt line conveying component, and every group buffer memory belt line conveying component all follows mix and put the piece module and pass directly under.

Further, the buffer belt line conveying assembly, the mixed buffer piece placing module and the mixed piece placing module are all located in the middle of the mixed piece placing and separating machine, and the buffer belt line conveying assemblies are symmetrical to each other and are parallel to the silicon wafer conveying assembly in the front and back direction.

Further, the buffer belt line conveying assembly comprises a conveying support plate, the upper end surface of the conveying support plate is fixedly connected with two groups of mutually symmetrical support rails through a support frame, one end of each group of support rails is respectively provided with a connecting plate, a double-shaft stepping motor is arranged between the inner surfaces of the two groups of connecting plates, two groups of output shafts of the double-shaft stepping motor respectively penetrate out of the outer surfaces of the corresponding connecting plates, two groups of output shafts of the double-shaft stepping motor are respectively sleeved with a driving wheel, the outer surfaces of two groups of connecting plates and the other ends of two groups of supporting rails are respectively provided with a driven wheel, the outer surfaces of the driving wheel and the driven wheels positioned on the same side are respectively sleeved with a conveying belt, the outer surfaces of two groups of connecting plates are respectively provided with a rubber sleeve driving wheel, and the outer surfaces of the rubber sleeve driving wheels are connected with the outer surfaces of the conveying belts; the middle parts of the two groups of supporting tracks are respectively provided with an adjusting wheel through corresponding supporting seats; a plurality of groups of cache proximity sensors are uniformly arranged on one group of the supporting tracks through corresponding supporting seats, and all the cache proximity sensors are positioned between the two groups of the supporting tracks; the lower end face of the conveying support plate is evenly provided with a plurality of corner connectors.

Further, the mixed cache sheet placing module and the mixed sheet placing module both comprise a sheet placing support plate, the upper end and the lower end of the sheet placing support plate are bent inwards, a plurality of groups of photoelectric switches are arranged on the lower bending surface of the sheet placing support plate, a driving motor is arranged on the rear surface of the left end of the sheet placing support plate, an output shaft of the driving motor penetrates out of the front end surface of the sheet placing support plate, a first synchronizing wheel is sleeved on the output shaft of the driving motor, a second synchronizing wheel is arranged on the front surface of the right end of the sheet placing support plate, a synchronous belt is sleeved on the outer surfaces of the first synchronizing wheel and the second synchronizing wheel, a support column penetrates through a bearing in the second synchronizing wheel, a square plate is arranged on the rear end surface of the support column, long round holes are uniformly formed in the square plate, and the square plate is fixed on the rear surface of the sheet placing support plate through the long round holes and locking bolts, a positioning block is arranged on the rear surface of the sheet placing support plate positioned on one side of the square plate, a positioning bolt for propping against the surface of one side of the square plate is arranged in the positioning block in a penetrating way, a guide rail is arranged on the inner surface of the sheet placing support plate positioned between the first synchronizing wheel and the second synchronizing wheel, two limiting columns for limiting the moving position of a slide block of the guide rail are respectively arranged at the left end and the right end of the guide rail, a connecting block is fixedly connected with the front surface of the slide block of the guide rail, the lower end surface of the connecting block is fixedly connected with the synchronizing belt through a clamping plate, the front surface of the connecting block is connected with a vertically arranged sucker fixing plate, a photoelectric switch blocking piece used for being matched with the photoelectric switch is arranged on the rear surface of the sucker fixing plate, and a sucker component for adsorbing a silicon wafer is also arranged on the sucker fixing plate, the sucking disc subassembly is last to be provided with one through the supporting seat that corresponds and to put piece proximity sensor, it still is provided with a tank chain subassembly and a plurality of module fixed plate on the rear surface of piece backup pad to put, the front side of putting the piece backup pad still is provided with the safety cover.

Furthermore, the sucking disc assembly comprises a sucking disc for sucking a silicon wafer, an electromagnetic valve for controlling the sucking disc to work and a pressure regulating valve for controlling the air pressure in the sucking disc assembly, and the wafer placing proximity sensor is arranged on the sucking disc through a corresponding supporting seat; the sucker is arranged at the lower end of the sucker fixing plate through a corresponding supporting seat; the electromagnetic valve is arranged on the front surface of the sucker fixing plate; the pressure regulating valve is arranged on the rear surface of the sucker fixing plate.

Further, mix the buffer and put the piece module with mix and all set up 3 groups photoelectric switch on putting the piece module.

Further, the mixed wafer placing and separating machine comprises a rack, and the silicon wafer conveying assembly is arranged on one side of the rack; an independent grading material box area and a mixed grading material box area are arranged in the rack on one side of the silicon wafer conveying assembly; the buffer belt line conveying assembly, the mixed buffer sheet releasing module and the mixed sheet releasing module are positioned between the independent grading material box area and the mixed grading material box area; a plurality of groups of blanking modules are arranged right above the independent grading material box area and the mixed grading material box area, and the blanking modules are all arranged on the rack; a trolley conveying module is arranged right below the independent grading material box area and the mixed grading material box area; the silicon wafer conveying assembly is provided with two groups of clamping plate aligning assemblies, one group of the clamping plate aligning assemblies are arranged at the initial position of the silicon wafer conveying assembly, and the other group of the clamping plate aligning assemblies are arranged on the silicon wafer conveying assembly between the mixing and placing module and the mixing and grading material box area.

Furthermore, 12 rows of independent grading material box areas are arranged, 4 material boxes are arranged in each row, 17 rows of mixed grading material box areas are arranged, 4 material boxes are arranged in each row, and RFID chips are installed below all the material boxes.

Furthermore, the trolley conveying module comprises a conveying track and a trolley assembly which is arranged on the conveying track and can move along the X direction and the Y direction of the conveying track.

Furthermore, the hybrid grading equipment for the photovoltaic solar silicon wafer further comprises a touch screen display for displaying the working state of the equipment and controlling the equipment.

The utility model has the advantages as follows:

the utility model discloses a piece module is put in the mixture, piece module and buffer belt line conveying assembly are put in with two sets of mixings piece board separator parallelly connected to can put the light classification of silicon chip of the same grade on the piece board separator with two sets of mixings and put in same grade magazine, realize mixing the stepping, not only increased the categorised grade quantity of silicon chip, subtract the weak point moreover and put piece board separator length, improved stepping efficiency, the cost is reduced.

The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings. The detailed description of the present invention is given by the following examples and the accompanying drawings.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation to the invention. In the drawings:

FIG. 1 is a top view of the overall structure of the present invention;

FIG. 2 is a schematic structural view of the buffer belt line conveying assembly of the present invention;

FIG. 3 is a schematic structural view of the hybrid buffer module and the hybrid film-placing module of the present invention;

FIG. 4 is a schematic structural view of a second synchronizing wheel supporting and adjusting device of the present invention;

FIG. 5 is a schematic view of the structure of the sucking disc fixing plate and the sucking disc assembly of the present invention;

FIG. 6 is a top view of the hybrid sheet feeding and separating machine of the present invention;

FIG. 7 is a schematic view of the structure of the trolley conveying module of the present invention;

fig. 8 is a schematic structural view of the clamping plate aligning assembly of the present invention.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

It should be noted that all the directional indicators (such as upper, lower, left, right, front, back, upper end, lower end, top, bottom … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

Referring to fig. 1, the mixing and grading equipment for photovoltaic solar silicon wafers comprises a pair of symmetrical mixing and placing plate-dividing machines 1, wherein a group of mixing and placing modules 4 and a group of mixing and caching and placing modules 3 are erected right above a silicon wafer conveying assembly 102 in each group of mixing and placing plate-dividing machines 1, and the mixing and caching and placing modules 3 are positioned on the front sides of the mixing and placing modules 4; one end of each group of the mixed wafer placing modules 4 extends out of the inner side edge of the silicon wafer conveying component 102 where the mixed wafer placing modules are located and then extends to the position above the silicon wafer conveying component 102 in the mixed wafer placing plate dividing machine 1 opposite to the mixed wafer placing modules; meanwhile, one end of each group of the mixed cache chip-placing module 3 extends out of the inner side edge of the silicon wafer conveying component 102 at the position of the mixed cache chip-placing module and then is suspended over a group of cache belt line conveying components 2, and each group of the cache belt line conveying components 2 passes through the mixed chip-placing module 4. During work, the cache belt line conveying assembly 2 is used for caching silicon wafers, the hybrid cache placing module 3 is used for conveying the silicon wafers to the cache belt line conveying assembly 2, and the hybrid placing module 4 is used for conveying the silicon wafers from the silicon wafer conveying assembly 102 in one group of hybrid placing and separating machine 1 to the silicon wafer conveying assembly 102 in the other group of hybrid placing and separating machine 1.

Further, the cache belt line conveying assembly 2, the mixed cache sheet placing module 3 and the mixed sheet placing module 4 are all located in the middle of the mixed sheet placing and separating machine 1, and the cache belt line conveying assembly 2 is symmetrical to each other and is parallel to the silicon wafer conveying assembly 102 in the front-back direction.

Referring to fig. 2, further, the buffer belt line conveying assembly 2 includes a conveying support plate 201, two sets of symmetrical support rails 203 are fixedly connected to an upper end surface of the conveying support plate 201 through a support frame 202, the support rails 203 are aluminum profiles, one end of each of the two sets of support rails 203 is provided with a connecting plate 204, a biaxial stepping motor 205 is installed between inner surfaces of the two sets of connecting plates 204, two sets of output shafts of the biaxial stepping motor 205 respectively penetrate through outer surfaces of the corresponding connecting plates 204, two sets of output shafts of the biaxial stepping motor 205 are respectively sleeved with a driving wheel 206, outer surfaces of the two sets of connecting plates 204 and the other end of each of the two sets of support rails 203 are respectively provided with a driven wheel 207, and a conveying belt 208 is sleeved on the driving wheel 206 and the outer surfaces of the two sets of driven wheels 207 which are located on the same side, the outer surfaces of the two groups of connecting plates 204 are respectively provided with a rubber sleeve driving wheel 209, and the outer surface of the rubber sleeve driving wheel 209 is connected with the outer surface of the conveying belt 208; the middle parts of the two groups of supporting tracks 203 are respectively provided with an adjusting wheel 210 through a corresponding supporting seat, and the adjusting wheels are used for adjusting the tightness of the conveying belt 208 and preventing the conveying belt from sliding off the driving wheel 206 and the driven wheel 207; a plurality of groups of buffer proximity sensors 211 are uniformly arranged on one group of the support tracks 203 through corresponding support seats, and all the buffer proximity sensors 211 are positioned between the two groups of the support tracks 203; the lower end face of the conveying supporting plate 201 is uniformly provided with a plurality of corner connectors 212, the corner connectors 212 are used for fixing the buffer belt line conveying assembly 2 on the corresponding side wall of the mixed plate placing and separating machine 1, and during use, 3 groups of buffer proximity sensors 211 and the corner connectors 212 are arranged.

Referring to fig. 3-4, further, each of the hybrid cache sheet placing module 3 and the hybrid sheet placing module 4 includes a sheet placing support plate 401 having upper and lower ends bent inward by 90 degrees, a plurality of sets of photoelectric switches 402 are disposed on a lower bending surface of the sheet placing support plate 401, a driving motor 403 is disposed on a rear surface of a left end of the sheet placing support plate 401, an output shaft of the driving motor 403 penetrates out from a front end surface of the sheet placing support plate 401, a first synchronizing wheel 404 is sleeved on the output shaft of the driving motor 403, a second synchronizing wheel 405 is disposed on a front surface of a right end of the sheet placing support plate 401, a synchronizing belt 406 is sleeved on outer surfaces of the first synchronizing wheel 404 and the second synchronizing wheel 405, a support column 407 penetrates through a bearing in the second synchronizing wheel 405, a square plate 408 is disposed on a rear end surface of the

support column

407, and 4 oblong holes 409 are uniformly disposed on the square plate 408, the square plate 408 is fixed on the rear surface of the sheet placing support plate 401 through the oblong hole 409 and the locking bolt, the rear surface of the sheet placing support plate 401 on one side of the square plate 408 is provided with the positioning block 410, the positioning block 410 is internally provided with the positioning bolt 411 for abutting against the surface on one side of the square plate 408 in a penetrating manner, when the synchronous belt 406 is installed, the locking bolt for locking the square plate 408 is unscrewed, so that the square plate 408 moves towards the first synchronous wheel 404 through the oblong hole 409 to reduce the distance between the first synchronous wheel 404 and the second synchronous wheel 405, the synchronous belt 406 is respectively sleeved on the first synchronous wheel 404 and the second synchronous wheel 405, the positioning bolt 411 is rotated to abut against the surface on one side of the square plate 408, and the square plate 408 is pushed to move towards the direction far away from the first synchronous wheel 404, knowing that the synchronous belt 406 is tensioned between the first synchronous wheel 404 and the second synchronous wheel 405, and then locking bolts on the square plate 408 are locked, a guide rail 412 is arranged on the inner surface of the sheet placing support plate 401 between the first synchronous wheel 404 and the second synchronous wheel 405, two limit posts 413 for limiting the moving position of a slide block of the guide rail 412 are respectively arranged at the left end and the right end of the guide rail 412, a connecting block 414 is fixedly connected to the front surface of the slide block of the guide rail 412, the lower end surface of the connecting block 414 is fixedly connected with the synchronous belt 406 through a clamping plate 415, a vertically arranged suction cup fixing plate 416 is connected to the front surface of the connecting block 414, a photoelectric switch blocking sheet used for matching with the photoelectric switch 402 is arranged on the rear surface of the suction cup fixing plate 416, and a suction cup component 417 for sucking silicon wafers is further arranged on the suction cup fixing plate 416, sucking disc subassembly 417 is last to be provided with one through the supporting seat that corresponds and to be used for detecting the piece proximity sensor 418 of putting of silicon chip position, it is used for with still to be provided with a tank chain subassembly 419 and a plurality of piece on the rear surface of piece backup pad 401 mix the buffer and put piece module 3 with it installs to mix to put piece module 4 mix module fixed plate 420 on the piece trigger 1 of putting, it still is provided with the safety cover to put the front side of piece backup pad 401.

Referring to fig. 5, further, the suction cup assembly 417 includes a suction cup 4171 for sucking silicon wafers, an electromagnetic valve 4172 for controlling the operation of the suction cup 4171, and a pressure regulating valve 4173 for controlling the air pressure in the suction cup assembly 417, and the sheet placing proximity sensor 418 is disposed on the suction cup 4171 through a corresponding support seat; the sucker 4171 is arranged at the lower end of the sucker fixing plate 416 through a corresponding supporting seat; the electromagnetic valve 4172 is disposed on the front surface of the suction cup fixing plate 416; the pressure regulating valve 4173 is provided on the rear surface of the suction cup fixing plate 416.

Further, mix the buffer memory put piece module 3 with mix and all set up 3 groups photoelectric switch 402 on putting piece module 4, during the installation, mix the buffer memory put piece module 3 with mix and put the position that piece module 4 left and right ends was installed the same, mix the buffer memory put piece module 3 with mix and put 4 middle parts of piece module and put the position difference.

Referring to fig. 6, further, the hybrid sheet feeding and separating machine 1 includes a frame 101, and the silicon wafer conveying assembly 102 for conveying silicon wafers is disposed on one side of the frame 101; an independent grading material box area 103 and a mixed grading material box area 104 for placing silicon wafers of different grades are arranged in the rack 101 on one side of the silicon wafer conveying assembly 102; the buffer belt line conveying component 2, the mixed buffer sheet-placing module 3 and the mixed sheet-placing module 4 are positioned between the independent grading material box area 103 and the mixed grading material box area 104; a plurality of groups of blanking modules 105 for sucking and placing silicon wafers of different grades on the silicon wafer conveying assembly 102 into corresponding material boxes are arranged right above the independent grading material box area 103 and the mixed grading material box area 104, and the blanking modules 105 are all arranged on the rack 101; a trolley conveying module for conveying the material boxes is arranged right below the independent grading material box area 103 and the mixed grading material box area 104; the silicon wafer conveying assembly 102 is provided with two groups of clamping plate aligning assemblies 106 used for clamping silicon wafers to the center of a conveying belt on the silicon wafer conveying assembly 102, one group of the clamping plate aligning assemblies 106 is arranged at the initial position of the silicon wafer conveying assembly 102, the other group of the clamping plate aligning assemblies 106 is arranged on the silicon wafer conveying assembly 102 between the mixing and placing module 4 and the mixing and grading magazine area 104, and when the silicon wafer conveying assembly is used, the blanking module 105 is totally provided with 27 groups.

Further, 12 rows of independent grading material box areas 103 are arranged, 4 material boxes are arranged in each row, 17 rows of mixed grading material box areas 104 are arranged, 4 material boxes are arranged in each row, and RFID chips are installed below all the material boxes and used for identifying different grades of silicon wafers.

Referring to fig. 7, further, the trolley conveying module comprises a conveying rail 107 and a trolley assembly 108 which is arranged on the conveying rail 107 and can move along the conveying rail 107X and Y directions, and the trolley assembly 108 is used for replacing a full material box with an empty material box and delivering the full material box to a downstream machine.

The utility model discloses a theory of operation as follows:

when the silicon wafer aligning and conveying device works, silicon wafers are sequentially placed on the silicon wafer conveying assemblies 102 in the two sets of mixed wafer placing and separating machines 1, the silicon wafers are conveyed forwards by the silicon wafer conveying assemblies 102, and the silicon wafers are clamped to the centers of conveying belts in the silicon wafer conveying assemblies 102 through the clamping plate aligning assemblies 106 so as to prevent the silicon wafers from deviating; after passing through the clamping plate alignment assembly 106, the silicon wafers are continuously conveyed forwards, and the blanking module 105 conveys the silicon wafers of different grades to corresponding material boxes in the independent grading material box area 103; the rest silicon wafers are continuously conveyed forwards, the rest silicon wafers are shunted at the moment, wherein the silicon wafers with the same grade as the silicon wafers in the mixing grading material box area 104 in the group of mixing, placing and separating machine 1 are continuously conveyed forwards, the silicon wafers with different grades are conveyed into corresponding material boxes in the mixing grading material box area 104 through the blanking module 105, other silicon wafers with the same grade as the material boxes in the mixing grading material box area 104 in the opposite mixing, placing and separating machine 1 are conveyed to the silicon wafer conveying assembly 102 in the opposite mixing, placing and separating machine 1 through the mixing and placing module 4 and are continuously conveyed forwards, the silicon wafers conveyed by the blanking module 105 are conveyed into corresponding material boxes in the mixing grading material box area 104, and the classification of the silicon wafers is completed.

When the silicon chip is shunting, when a plurality of silicon chips with the same grade of magazine in the mixed stepping magazine area 104 in the mixed tablet splitting machine 1 that puts of face appear in succession, mix and put piece module 4 and can't in time send the silicon chip to the silicon chip transport module 102 in the mixed tablet splitting machine 1 that faces on, mix this moment and put piece module 3 and will send the silicon chip to cache belt line transport module 2 earlier and carry out the cache, and carry to the below of mixing piece module 4 of putting, then wait for to mix and put piece module 4 and send it to the silicon chip transport module 102 in the mixed tablet splitting machine 1 that faces on.

When the independent grading material box area 103 or the mixed grading material box area 104 is filled with material boxes, the trolley conveying module firstly lowers full material boxes in the independent grading material box area 103 or the mixed grading material box area 104 onto the trolley assembly 108, then packs empty material boxes to corresponding positions of the independent grading material box area 103 or the mixed grading material box area 104, and then the trolley assembly 108 conveys the full material boxes to a downstream machine along the conveying track 107.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a mixed stepping equipment of photovoltaic solar energy silicon chip which characterized in that: the silicon wafer feeding and separating device comprises a pair of symmetrical mixing and placing plate separating machines (1), wherein a group of mixing and placing modules (4) and a group of mixing cache and placing modules (3) are erected right above a silicon wafer conveying assembly (102) in each group of mixing and placing plate separating machines (1), and the mixing cache and placing modules (3) are positioned on the front sides of the mixing and placing modules (4); one end of each group of the mixed wafer placing modules (4) extends out of the inner side edge of the silicon wafer conveying component (102) where the mixed wafer placing modules are located and then extends to the position above the silicon wafer conveying component (102) in the opposite mixed wafer placing plate dividing machine (1); meanwhile, one end of each group of the mixed cache chip placing module (3) extends out of the inner side edge of the silicon wafer conveying assembly (102) where the mixed cache chip placing module is located, and then is suspended over one group of cache belt line conveying assemblies (2), and each group of the cache belt line conveying assemblies (2) passes through the mixed chip placing module (4) under the mixed cache chip placing module.

2. The mixing and grading device for the photovoltaic solar silicon wafer as claimed in claim 1, wherein: the buffer belt line conveying assembly (2), the mixed buffer piece placing module (3) and the mixed piece placing module (4) are all located in the middle of the mixed piece placing plate dividing machine (1), and the buffer belt line conveying assembly (2) is symmetrical to each other and is parallel to the silicon wafer conveying assembly (102) in the front-back direction.

3. The mixing and grading device for the photovoltaic solar silicon wafer as claimed in claim 1, wherein: the buffer belt line conveying assembly (2) comprises a conveying supporting plate (201), the upper end face of the conveying supporting plate (201) is fixedly connected with two groups of symmetrical supporting rails (203) through a supporting frame (202), one end of each of the two groups of supporting rails (203) is provided with a connecting plate (204), a double-shaft stepping motor (205) is installed between the inner surfaces of the two groups of connecting plates (204), two groups of output shafts of the double-shaft stepping motor (205) penetrate out of the outer surfaces of the corresponding connecting plates (204), a driving wheel (206) is sleeved on each of the two groups of output shafts of the double-shaft stepping motor (205), a driven wheel (207) is arranged on each of the outer surfaces of the two groups of connecting plates (204) and the other end of each of the two groups of supporting rails (203), a conveying belt (208) is sleeved on each of the driving wheel (206) and the outer surfaces of the two groups of driven wheels (207) which are positioned on the same side, the outer surfaces of the two groups of connecting plates (204) are respectively provided with a rubber sleeve driving wheel (209), and the outer surface of each rubber sleeve driving wheel (209) is connected with the outer surface of the conveying belt (208); the middle parts of the two groups of supporting tracks (203) are respectively provided with an adjusting wheel (210) through corresponding supporting seats; a plurality of groups of buffer memory proximity sensors (211) are uniformly arranged on one group of the support tracks (203) through corresponding support seats, and all the buffer memory proximity sensors (211) are positioned between the two groups of the support tracks (203); the lower end face of the conveying support plate (201) is uniformly provided with a plurality of corner connectors (212).

4. The mixing and grading device for the photovoltaic solar silicon wafer as claimed in claim 1, wherein: the mixed cache chip-placing module (3) and the mixed chip-placing module (4) both comprise a chip-placing support plate (401) with the upper end and the lower end bent inwards by 90 degrees, a plurality of groups of photoelectric switches (402) are arranged on the lower bending surface of the chip-placing support plate (401), a driving motor (403) is arranged on the rear surface of the left end of the chip-placing support plate (401), an output shaft of the driving motor (403) penetrates out of the front end surface of the chip-placing support plate (401), a first synchronizing wheel (404) is sleeved on the output shaft of the driving motor (403), a second synchronizing wheel (405) is arranged on the front surface of the right end of the chip-placing support plate (401), a synchronous belt (406) is sleeved on the outer surfaces of the first synchronizing wheel (404) and the second synchronizing wheel (405), and a support column (407) penetrates through a bearing in the second synchronizing wheel (405), a square plate (408) is arranged on the rear end face of the supporting column (407), 4 long round holes (409) are uniformly formed in the square plate (408), the square plate (408) is fixed on the rear surface of the sheet placing supporting plate (401) through the long round holes (409) and locking bolts, a positioning block (410) is arranged on the rear surface of the sheet placing supporting plate (401) on one side of the square plate (408), a positioning bolt (411) penetrates through the positioning block (410), a guide rail (412) is arranged on the inner surface of the sheet placing supporting plate (401) between the first synchronizing wheel (404) and the second synchronizing wheel (405), two limiting columns (413) used for limiting the moving position of the slide block of the guide rail (412) are respectively arranged at the left end and the right end of the guide rail (412), and a connecting block (414) is fixedly connected to the front surface of the slide block of the guide rail (412), the lower terminal surface of connecting block (414) pass through cardboard (415) with hold-in range (406) fixed connection, the front surface of connecting block (414) is connected with sucking disc fixed plate (416) of a vertical setting, be provided with one on the rear surface of sucking disc fixed plate (416) be used for with photoelectric switch (402) cooperation uses the photoelectric switch separation blade, still be provided with sucking disc subassembly (417) that are used for adsorbing the silicon chip on sucking disc fixed plate (416), sucking disc subassembly (417) are gone up and are provided with one through the supporting seat that corresponds and put piece proximity sensor (418), it still is provided with a tank chain subassembly (419) and a plurality of module group fixed plate (420) on the rear surface of piece backup pad (401) to put, the front side of putting piece backup pad (401) still is provided with the safety cover.

5. The mixing and grading device for the photovoltaic solar silicon wafer as claimed in claim 4, wherein: the sucking disc assembly (417) comprises a sucking disc (4171) for sucking a silicon wafer, an electromagnetic valve (4172) for controlling the work of the sucking disc (4171) and a pressure regulating valve (4173) for controlling the air pressure in the sucking disc assembly (417), and the plate placing proximity sensor (418) is arranged on the sucking disc (4171) through a corresponding supporting seat; the sucker (4171) is arranged at the lower end of the sucker fixing plate (416) through a corresponding supporting seat; the electromagnetic valve (4172) is arranged on the front surface of the sucker fixing plate (416); the pressure regulating valve (4173) is provided on the rear surface of the suction cup fixing plate (416).

6. The mixing and grading device for the photovoltaic solar silicon wafer as claimed in claim 4, wherein: mix the buffer memory and put piece module (3) with mix and put all set up 3 groups photoelectric switch (402) on piece module (4).

7. The mixing and grading device for the photovoltaic solar silicon wafer as claimed in claim 1, wherein: the mixed wafer placing and separating machine (1) comprises a rack (101), and one side of the rack (101) is provided with the silicon wafer conveying assembly (102); an independent grading material box area (103) and a mixing grading material box area (104) are arranged in the rack (101) on one side of the silicon wafer conveying assembly (102); the buffer belt line conveying assembly (2), the mixed buffer sheet releasing module (3) and the mixed sheet releasing module (4) are positioned between the independent grading material box area (103) and the mixed grading material box area (104); a plurality of groups of blanking modules (105) are arranged right above the independent gear material box area (103) and the mixed gear material box area (104), and the blanking modules (105) are all arranged on the rack (101); a trolley conveying module is arranged right below the independent gear material box area (103) and the mixed gear material box area (104); two groups of clamping plate aligning assemblies (106) are arranged on the silicon wafer conveying assembly (102), one group of clamping plate aligning assemblies (106) are arranged at the initial position of the silicon wafer conveying assembly (102), and the other group of clamping plate aligning assemblies (106) are arranged on the silicon wafer conveying assembly (102) between the mixing and placing module (4) and the mixing and grading magazine area (104).

8. The mixing and grading device for the photovoltaic solar silicon wafer as claimed in claim 7, wherein: the RFID chip packaging box is characterized in that 12 rows of independent grading material box areas (103) are arranged, 4 material boxes are arranged in each row, 17 rows of mixed grading material box areas (104) are arranged, 4 material boxes are arranged in each row, and RFID chips are installed below all the material boxes.

9. The mixing and grading device for the photovoltaic solar silicon wafer as claimed in claim 7, wherein: the trolley conveying module comprises a conveying rail (107) and a trolley assembly (108) which is arranged on the conveying rail (107) and can move along the X direction and the Y direction of the conveying rail (107).

10. The mixing and grading device for the photovoltaic solar silicon wafer as claimed in claim 1, wherein: the mixing grading equipment for the photovoltaic solar silicon wafers further comprises a touch screen display used for displaying the working state of the equipment and controlling the equipment.