CN217117526U - Atomizing core and electronic atomization device - Google Patents
Atomizing core and electronic atomization device Download PDFInfo
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- CN217117526U CN217117526U CN202123241488.1U CN202123241488U CN217117526U CN 217117526 U CN217117526 U CN 217117526U CN 202123241488 U CN202123241488 U CN 202123241488U CN 217117526 U CN217117526 U CN 217117526U
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Abstract
The utility model relates to an atomizing core and electron atomizing device, the atomizing core includes: the base member is provided with the atomizing face, the atomizing face is used for atomizing liquid. And the liquid guide layer is attached to the atomizing surface and provided with an accommodating cavity. And the heating body is at least partially accommodated in the accommodating cavity and is superposed on the liquid guide layer. Therefore, through the liquid guiding effect of the liquid guiding layer, compared with the situation that the liquid on the atomizing surface reaches the heating body, the liquid in the liquid guiding layer can reach the heating body more easily, so that more liquid is attached to the heating body, on one hand, the atomizing amount of the heating body to the liquid is increased directly, on the other hand, the atomizing amount of the whole atomizing core to the liquid in unit time is increased, and the atomizing efficiency of the atomizing core is improved; on the other hand, the atomized liquid quantity is increased by directly absorbing the heat of the heating element, thereby improving the utilization rate of the heating element to the energy.
Description
Technical Field
The utility model relates to an electronic atomization technical field especially relates to an atomizing core and contain electronic atomization device of this atomizing core.
Background
The atomizing core usually includes base member and heat-generating body, and the base member can be cached and transmit liquid, and the heat-generating body is attached to the atomizing face of base member, acts on through the transmission of base member to liquid for all attached to have liquid on atomizing face and the heat-generating body. When the heating element generates heat, the liquid on the atomization surface and the heating element absorbs the heat and is atomized to form aerosol which can be sucked by a user. However, for the traditional atomizing core, the amount of liquid directly attached to the heating element is small, so that the atomizing amount of the atomizing core to the liquid in unit time is small, and the atomizing efficiency of the atomizing core is finally influenced.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem how to improve the atomizing efficiency of atomizing core.
An atomizing cartridge comprising:
the liquid atomizing device comprises a base body and a liquid atomizing device, wherein the base body is provided with an atomizing surface which is used for atomizing liquid;
the liquid guide layer is attached to the atomizing surface and provided with an accommodating cavity; and
and the heating body is at least partially accommodated in the accommodating cavity and is superposed on the liquid guide layer.
In one embodiment, the liquid guide layer is provided with an attaching surface connected with the atomizing surface, the accommodating cavity is formed in the attaching surface, and the surface of the heating body facing the base body is flush with the attaching surface.
In one embodiment, the liquid guide layer further has an exposed surface facing opposite to the attaching surface, the accommodating cavity penetrates through the exposed surface, and the surface of the heating element facing away from the base body is flush with the exposed surface.
In one of them embodiment, the drainage layer has attached face and the exposure face that the orientation is opposite, attached face with the atomizing face is connected, the holding chamber is seted up on the exposure face, the surface that the heat-generating body set up dorsad the base member with the exposure face parallel and level.
In one embodiment, the liquid guide layer covers a part or all of the atomization surface.
In one embodiment, for the orthographic projection of the heating element in the thickness direction of the substrate, the orthographic projection is entirely positioned on the liquid guide layer or is surrounded within the coverage of the liquid guide layer.
In one embodiment, the liquid guide layer is made of porous glass or porous ceramic material.
In one embodiment, the liquid-conducting layer is formed by a casting, printing or spraying process.
In one embodiment, the heating element is formed by printing, evaporation or sputtering.
An electronic atomization device comprises the atomization core of any one of the above.
The utility model discloses a technical effect of an embodiment is: the heating element is embedded in the liquid guiding layer, because the liquid guiding layer is internally provided with the accommodating cavity and the heating element is at least partially accommodated in the accommodating cavity. Therefore, through the liquid guiding effect of the liquid guiding layer, compared with the situation that the liquid on the atomizing surface reaches the heating body, the liquid in the liquid guiding layer can reach the heating body more easily, so that more liquid is attached to the heating body, on one hand, the atomizing amount of the heating body to the liquid is increased directly, on the other hand, the atomizing amount of the whole atomizing core to the liquid in unit time is increased, and the atomizing efficiency of the atomizing core is improved; on the other hand, the atomized liquid quantity is increased by directly absorbing the heat of the heating element, thereby improving the utilization rate of the heating element to the energy. On the other hand, more liquid can form a liquid film with larger thickness, the isolation energy of the liquid film to the gas is enhanced, the heating body is prevented from being oxidized due to the contact with the gas, and the service life of the heating body is prolonged.
Drawings
FIG. 1 is a schematic sectional plan view of an atomizing core according to a first embodiment;
FIG. 2 is a schematic sectional plan view of an atomizing core according to a second embodiment;
FIG. 3 is a schematic sectional plan view of an atomizing core according to a third embodiment;
FIG. 4 is a schematic sectional plan view of an atomizing core according to a fourth embodiment;
fig. 5 is a schematic plan sectional view of an atomizing core according to a fifth embodiment.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Referring to fig. 1, an embodiment of the present invention provides an atomizing cartridge 10 for atomizing a liquid to form an aerosol for a user to inhale. The atomizing core 10 includes a base 100, a liquid guide layer 200, and a heat-generating body 300.
In some embodiments, the substrate 100 may have a substantially rectangular parallelepiped shape, the substrate 100 may be made of a porous ceramic material, and the substrate 100 may be formed by casting, injection molding, or dry pressing. The matrix 100 has good chemical stability, the melting point can reach more than 1000 ℃, the matrix can resist high temperature, and the matrix can not generate chemical reaction with liquid in a high-temperature environment, so that extra loss of the liquid caused by participation in the chemical reaction is avoided, the liquid is ensured to be completely used for atomization, and the utilization rate of the liquid is improved.
The matrix 100 made of porous ceramic material contains a large number of micropores therein and has a certain porosity, which is defined as the percentage of the volume of the pores in the object to the total volume of the material in a natural state. The porosity of the substrate 100 may be 50% to 60%, for example, the porosity may be 50%, 55%, 58%, or 60%. The cross-sectional dimension of the micro-pores is 1 μm to 100 μm, for example, the cross-sectional dimension of the micro-pores can be 1 μm, 10 μm, 50 μm or 100 μm, and when the micro-pores are circular holes, the cross-sectional dimension of the micro-pores is the diameter of the micro-pores. Because the matrix 100 has a certain porosity, so that the matrix 100 can form a capillary action, the matrix 100 has the atomizing surface 110, under the capillary action, the liquid contacting with the matrix 100 can be continuously transmitted to the atomizing surface 110 through the inside of the matrix 100, and the liquid on the atomizing surface 110 absorbs heat and generates atomization. Thus, the substrate 100 has a certain buffering and transport function for the liquid.
In some embodiments, liquid-guiding layer 200 may be substantially in the form of a membrane, and liquid-guiding layer 200 may be made of a porous ceramic or porous glass material, so that liquid-guiding layer 200 also has a certain porosity, thereby providing buffering and transmission functions for liquid. Liquid-conducting layer 200 may be formed using a casting, printing, or spraying process. The heating element 300 may have a substantially membrane-shaped structure, and the heating element 300 may be made of a metal material, so that the heating element 300 has a certain resistance, and when a current passes through the heating element 300, the heating element 300 converts the electric energy into heat energy. The heat generating body 300 may be formed by printing, evaporation, or sputtering. The liquid guiding layer 200 is opened with a receiving chamber 230, and the heating element 300 is at least partially received in the receiving chamber 230, or it can be understood that the heating element 300 is embedded in the liquid guiding layer 200, and the heating element 300 is stacked on the liquid guiding layer 200, so that the two are stacked and connected with each other.
The liquid guide layer 200 has an attachment surface 210 and an exposed surface 220, the attachment surface 210 and the exposed surface 220 are arranged at intervals in the thickness direction of the base 100, that is, the attachment surface 210 and the exposed surface 220 are two outer surfaces in the thickness direction of the liquid guide layer 200, so that the attachment surface 210 and the exposed surface 220 are opposite in orientation, and the attachment surface 210 is arranged toward the base 100, that is, the attachment surface 210 is arranged downward; and the exposed surface 220 is disposed away from the substrate 100, i.e., the exposed surface 220 is disposed upward. The attachment surface 210 may be directly superposed on the atomization surface 110, so that a connection between the attachment surface 210 and the atomization surface 110 is achieved. The two outer surfaces in the thickness direction of the heat-generating body 300 are referred to as an upper surface 310 and a lower surface 320, the upper surface 310 being disposed away from the base 100, and the lower surface 320 being disposed toward the base 100.
Referring to fig. 1, fig. 2 and fig. 3, in some embodiments, the receiving cavity 230 is formed on the attaching surface 210, that is, the receiving cavity 230 is formed by a portion of the attaching surface 210 recessed to a set depth toward the exposed surface 220. When the depression depth is less than the thickness of liquid-conducting layer 200 (see fig. 1 and 2), receiving cavity 230 is a blind cavity that cannot penetrate exposed surface 220; when the depression depth is equal to the thickness of the liquid-conductive layer 200 (see fig. 3), the receiving chamber 230 is a through chamber that can penetrate the exposed surface 220. When the heating element 300 is accommodated in the accommodating chamber 230, the heating element 300 may be entirely accommodated in the accommodating chamber 230, that is, the heating element 300 does not have a portion protruding out of the accommodating chamber 230. The lower surface 320 of the heating element 300 may be flush with the attachment surface 210, and the upper surface 310 of the heating element 300 may be flush with the exposed surface 220. Under the condition of the mutual parallel and level of the lower surface 320 of the heat-generating body 300 and the attaching surface 210 of the liquid guide layer 200, when the attaching surface 210 is connected with the atomizing surface 110, the lower surface 320 is directly attached to the atomizing surface 110, so that the heat-generating body 300 is directly contacted with the atomizing surface 110, the heat generated by the heat-generating body 300 can be directly transmitted to the atomizing surface 110, and the transmission of other intermediate media is not needed, so that the heat utilization rate of the heat-generating body 300 can be improved.
In the atomization process, the liquid on the atomization surface 110 and the liquid attached to the heating element 300 are atomized at the same time, specifically, the amount of liquid atomized on the atomization surface 110 per unit time is substantially constant, and when the amount of liquid that can be directly atomized by the heating element 300 increases, that is, when the amount of liquid directly attached to the heating element 300 increases, the amount of liquid atomized per unit time of the entire atomization core 10 increases. Secondly, the liquid on the atomization surface 110 is atomized by absorbing the heat conducted from the heating element 300 to the atomization surface 110, and the liquid on the heating element 300 is atomized by directly absorbing the heat conducted from the heating element 300. Therefore, when more heat is conducted through the atomizing surface 110 as the intermediate medium, the atomizing surface 110 absorbs a part of the heat, resulting in a low energy utilization rate of the heat-generating body 300. When more heat is directly conducted to the liquid without an intermediate medium, the energy utilization rate of the heat-generating body 300 increases.
If the mode in which the lower surface 320 of the heating element 300 is directly attached to the atomization surface 110 without providing the liquid guide layer 200 is adopted, the distance from the liquid surface of the liquid on the atomization surface 110 to the upper surface 310 is relatively long, so that the liquid is difficult to reach the upper surface 310 of the heating element 300, and the liquid attached to the upper surface 310 is small, that is, the thickness of the liquid film formed on the upper surface 310 by the liquid is small, it can be understood that the amount of the liquid which can directly contact the heating element 300 is small. Since the amount of the liquid attached to the heating element 300 is small, on one hand, the amount of the liquid directly atomized by the heating element 300 is small, so that the atomization amount of the liquid in the whole atomization core 10 per unit time is small, and the atomization efficiency of the atomization core 10 is low; on the other hand, the amount of liquid atomized by directly absorbing the heat of the heating element 300 is small, resulting in a low energy utilization rate of the heating element 300. On the other hand, the liquid film with a small thickness has a weak energy for isolating the gas, so that the heating element 300 is in contact with the gas to generate oxidation, thereby reducing the service life of the heating element 300.
In the atomizing core 10 of the above embodiment, since the heating element 300 is accommodated in the accommodating chamber 230 provided in the attachment surface 210, the liquid on the base 100 further penetrates into the liquid guide layer 200, and when the accommodating chamber 230 is a blind chamber, the maximum height of the liquid surface formed by the liquid in the liquid guide layer 200 is higher than the height of the upper surface 310; when the accommodating chamber 230 is a through chamber, the maximum height of the liquid level formed by the liquid in the liquid guiding layer 200 is equal to the height of the upper surface 310. No matter the maximum height of the liquid surface formed by the liquid in the liquid guide layer 200 is greater than or equal to the height of the upper surface 310, the liquid in the liquid guide layer 200 is easier to be conveyed to the heating element 300, so that more liquid adheres to the heating element 300, and the thickness of the liquid film formed on the upper surface 310 of the heating element 300 is larger. In view of the fact that the amount of liquid adhering to the heating element 300 is increased, on one hand, the amount of liquid directly atomized by the heating element 300 is increased, so that the amount of liquid atomized by the whole atomizing core 10 per unit time is increased, and the atomizing efficiency of the atomizing core 10 is improved; on the other hand, the amount of liquid atomized by directly absorbing the heat of the heating element 300 is increased, thereby improving the utilization rate of the energy of the heating element 300. On the other hand, the insulating energy of the liquid film with larger thickness to the gas is enhanced, the heating element 300 is prevented from being oxidized due to the contact with the gas, and the service life of the heating element 300 is prolonged. In the case where the accommodating chamber 230 is a blind chamber, a part of the liquid guide layer 200 directly covers the heating element 300, and thus the part of the liquid guide layer 200 can directly protect the heating element 300. Obviously, in view of the porosity of the liquid guide layer 200, in the case where the accommodating chamber 230 is a blind chamber, aerosol generated by atomization of the liquid attached to the heat generating body 300 may be discharged through the liquid guide layer 200.
Referring to fig. 4 and 5, in some embodiments, the receiving cavity 230 is formed on the exposed surface 220, that is, the receiving cavity 230 is formed by a portion of the exposed surface 220 being recessed toward the attaching surface 210 by a set depth. When the depression depth is less than the thickness of the liquid guide layer 200, the accommodating cavity 230 is a blind cavity that cannot penetrate through the attachment surface 210; when the depression depth is equal to the thickness of the liquid guide layer 200, the receiving cavity 230 is a through cavity capable of penetrating the attachment surface 210. When the heating element 300 is accommodated in the accommodating chamber 230, the heating element 300 may be entirely accommodated in the accommodating chamber 230, that is, the heating element 300 does not have a portion protruding out of the accommodating chamber 230. The upper surface 310 of the heating element 300 may be flush with the exposed surface 220, and of course, the upper surface 310 of the heating element 300 may be located outside the accommodating chamber 230 and protrude a certain height from the exposed surface 220.
Similarly, referring to the embodiment in which the accommodating chamber 230 is disposed on the attachment surface 210, for the embodiment in which the accommodating chamber 230 is disposed on the exposed surface 220, when the upper surface 310 of the heating element 300 is flush with the exposed surface 220, the maximum height of the liquid level formed by the liquid in the liquid guide layer 200 is equal to the height of the upper surface 310, so that the liquid in the liquid guide layer 200 is easier to be transported to the heating element 300, and thus more liquid adheres to the heating element 300, and the thickness of the liquid film formed by the upper surface 310 of the heating element 300 is larger. The atomization efficiency, the energy utilization rate and the service life of the atomization core 10 can be improved. Even if the upper surface 310 of the heating element 300 is located outside the accommodating chamber 230 and protrudes a certain height from the exposed surface 220, the maximum height of the liquid level formed by the liquid in the liquid guiding layer 200 is greater than the height of the liquid level formed by the liquid on the atomizing surface 110, so that the liquid in the liquid guiding layer 200 can reach the upper surface 310 more easily than the liquid on the atomizing surface 110 reaches the upper surface 310, so that more liquid adheres to the heating element 300, and the atomizing efficiency, the energy utilization rate and the service life of the atomizing core 10 can be improved to a certain extent.
In some embodiments, the liquid-conductive layer 200 covers a portion of the nebulizing surface 110, although the liquid-conductive layer 200 may cover the entire nebulizing surface 110. As for the orthographic projection of the heating body 300 in the thickness direction of the base body 100, when the accommodation chamber 230 is a blind chamber, the orthographic projection is entirely located on the liquid guide layer 200. When the accommodating chamber 230 is a through chamber, the orthographic projection is surrounded within the coverage of the liquid guide layer 200. In view of the fact that the orthographic projection is entirely located on the liquid guide layer 200 or is surrounded within the coverage area of the liquid guide layer 200, the liquid guide layer 200 surrounds the entire heating element 300 in the circumferential direction, so that the contact area between the heating element 300 and the liquid guide layer 200 is increased, more liquid in the liquid guide layer 200 is ensured to reach the heating element 300, and more liquid can be adhered to the heating element 300.
The utility model also provides an electronic atomization device, this electronic atomization device include battery and above-mentioned atomizing core 10, battery and heat-generating body 300 electric connection, when the battery supplies power to heat-generating body 300, heat-generating body 300 produces the heat for atomizing core 10 is seted up work and is atomized liquid. Because the electronic atomization device comprises the atomization core 10, the atomization efficiency, the energy utilization rate and the service life of the electronic atomization device can be improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. An atomizing core, comprising:
the liquid atomizing device comprises a base body and a liquid atomizing device, wherein the base body is provided with an atomizing surface which is used for atomizing liquid;
the liquid guide layer is attached to the atomizing surface and provided with an accommodating cavity; and
the heating body, at least part is acceptd the holding intracavity and the superpose be in on the drain layer.
2. The atomizing core of claim 1, wherein the liquid guide layer has an attachment surface connected with the atomizing surface, the accommodating chamber is provided on the attachment surface, and a surface of the heating element disposed toward the base is flush with the attachment surface.
3. The atomizing core according to claim 2, wherein the liquid guide layer further has an exposed surface facing opposite to the attachment surface, the accommodating chamber penetrates through the exposed surface, and a surface of the heating element facing away from the base is flush with the exposed surface.
4. The atomizing core of claim 1, characterized in that the drain layer has attached face and the exposure face of opposite orientation, attached face with the atomizing face is connected, the holding chamber is seted up on the exposure face, the surface that the heat-generating body set up dorsad the base member with the exposure face parallel and level.
5. The atomizing core of claim 1, wherein the liquid-conducting layer covers a portion or all of the atomizing surface.
6. The atomizing core according to claim 1, characterized in that, with respect to an orthographic projection of the heat-generating body in the thickness direction of the base, the orthographic projection is entirely located on the liquid-conductive layer or is surrounded within a coverage of the liquid-conductive layer.
7. The atomizing core of claim 1, wherein the liquid-conducting layer is made of porous glass or porous ceramic material.
8. The atomizing core of claim 1, wherein the liquid-conducting layer is formed using a casting, printing, or spraying process.
9. The atomizing core according to claim 1, characterized in that the heat-generating body is formed by a printing, evaporation or sputtering process.
10. An electronic atomisation device comprising an atomisation core according to any of the claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202123241488.1U CN217117526U (en) | 2021-12-22 | 2021-12-22 | Atomizing core and electronic atomization device |
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| CN202123241488.1U CN217117526U (en) | 2021-12-22 | 2021-12-22 | Atomizing core and electronic atomization device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024027365A1 (en) * | 2022-08-05 | 2024-02-08 | 深圳麦克韦尔科技有限公司 | Atomizing core and electronic atomization device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024027365A1 (en) * | 2022-08-05 | 2024-02-08 | 深圳麦克韦尔科技有限公司 | Atomizing core and electronic atomization device |
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