CN217114416U - Silicon wafer transfer system - Google Patents

Abstract

The application provides a silicon wafer transfer system, and belongs to the field of solar cell preparation. The silicon wafer transfer system comprises a transfer device, a cleaning fabric and a cleaning plate; the transfer device is provided with a plurality of grooves for accommodating silicon wafers; the cleaning fabric is configured to cover and extend into the plurality of grooves; the cleaning plate is provided with a plurality of bulges which are correspondingly arranged with the grooves and used for pushing the cleaning fabric into the grooves, and the cleaning fabric is in slidable contact with the groove walls of the grooves. Through the silicon wafer transfer system, cleaning personnel can clean a plurality of grooves in the silicon wafer transfer device through one cleaning operation, so that the cleaning efficiency is improved, and the labor intensity is reduced; meanwhile, the condition of omission can be avoided, and the cleaning effect is guaranteed.

Description

Silicon wafer transfer system

Technical Field

The application relates to the field of solar cell preparation, in particular to a silicon wafer transfer system.

Background

In the prior art, a silicon wafer transfer device is easily polluted in the daily production process and needs to be cleaned regularly. At present, a cleaning mode of cleaning personnel is to use a single plastic card to wrap dust-free cloth stained with alcohol to wipe back and forth in a single groove of a silicon wafer transfer device until the dust-free cloth is cleaned up and then the next groove is wiped. The cleaning mode has low efficiency and high labor intensity; and because the number of grooves of the silicon wafer transfer device is large, the silicon wafer transfer device is not easy to distinguish, wiping omission is easily caused, and the overall cleaning effect is influenced.

SUMMERY OF THE UTILITY MODEL

The silicon wafer transfer system can realize the cleaning of a plurality of grooves in a silicon wafer transfer device through one cleaning operation, so that the cleaning efficiency is improved, and the labor intensity is reduced; meanwhile, the condition of omission can be avoided, and the cleaning effect is guaranteed.

The embodiment of the application is realized as follows:

the embodiment of the application provides a silicon wafer transfer system, which comprises a transfer device, a cleaning fabric and a cleaning plate.

The transfer device is provided with a plurality of grooves for accommodating silicon wafers; the cleaning fabric is configured to be capable of covering and being pushed into the plurality of grooves; the cleaning plate is provided with a plurality of bulges which are arranged corresponding to the grooves; the plurality of bulges are used for pushing the cleaning fabric into the plurality of grooves, and the cleaning fabric is in slidable contact with the groove walls of the grooves.

In the technical scheme, the transfer device is provided with a plurality of grooves, the cleaning plate is provided with a plurality of bulges corresponding to the grooves, and meanwhile, the cleaning fabric is arranged to cover the grooves and can extend into the corresponding grooves to clean under the driving of the cleaning piece, so that cleaning personnel can clean the grooves in the silicon wafer transfer device through one-time cleaning operation, the cleaning efficiency is improved, and the labor intensity is reduced; meanwhile, the condition of omission can be avoided, and the cleaning effect is guaranteed.

In some alternative embodiments, the cleaning fabric is an elastically deformable fabric; in the depth direction of the groove, the thickness of the cleaning fabric is L1, the distance between the top of the protrusion and the bottom of the groove when the protrusion is positioned in the groove is L2, and L1 is more than L2.

Among the above-mentioned technical scheme, the clearance surface fabric adopts the elastic deformation surface fabric to in the direction of depth of recess, thickness L1 with the clearance surface fabric sets up to be greater than the protruding distance L2 between the bottom of bellied top and recess when being located the recess, when carrying out the clearance operation, can guarantee that the clearance surface fabric is pressed from both sides steadily and establish between silicon chip transfer device and clearance board, make the clearance surface fabric can not take place to drop when the clearance, thereby effectively realize the clearance function.

In some alternative embodiments, the cleaning facing is attached to the cleaning plate and covers the plurality of protrusions.

Among the above-mentioned technical scheme, the clearance surface fabric links together with the clearance board for clearance surface fabric and clearance board constitute a whole, and the two keeps together under the removal and shelve the state, and it is all comparatively convenient in the use with the save process.

In some alternative embodiments, the cleaning facing is removably attached to the cleaning plate.

In the technical scheme, the detachable connection mode can replace corresponding components when part of the components are damaged or need to be cleaned, so that the cleaning effect is ensured; meanwhile, the phenomenon of resource waste caused by the fact that part of components are failed and the whole device cannot be used can be avoided.

In some optional embodiments, two ends of the cleaning fabric are respectively pressed on a first preset surface of the cleaning plate through pressing pieces, one side surface of the cleaning plate, which is provided with the protrusions, is a second preset surface, the first preset surface is a side surface opposite to the second preset surface, and the pressing pieces are detachably connected with the cleaning plate through first fasteners.

In the technical scheme, the pressing piece is matched with the first fastening piece, so that the cleaning function can be exerted when the cleaning fabric is connected to the cleaning plate; in addition, the two cooperation can realize that clearance surface fabric and clearance board can dismantle the function of connecting.

In some optional embodiments, the silicon wafer transfer system further comprises a connecting piece, the connecting piece is connected to a third preset surface of the cleaning plate, the third preset surface is perpendicular to the second preset surface, and the connecting piece is perpendicular to the extending direction of the protrusion; the connecting piece extends from the connecting position towards the side far away from the third preset surface.

In the technical scheme, the connecting piece is used for carrying out handheld, mechanical clamping or mechanical connection on the cleaning plate; in addition, the connecting piece is connected in the third preset surface of clearance board, and perpendicular and the connecting piece of bellied extending direction is extended from the junction towards the one side of keeping away from the third preset surface, and this setting form is convenient for carry out the cleaning operation.

In some alternative embodiments, the silicon wafer transfer system comprises two cleaning plates, and the connecting member comprises two connecting arms connected with each other, and each connecting arm is connected with one cleaning plate.

In the technical scheme, the silicon wafer transfer system is provided with the two cleaning plates, so that cleaning personnel can clean the silicon wafer transfer devices on two sides through one cleaning operation, and the cleaning efficiency is further improved; in addition, the connecting piece includes two interconnect's linking arm, and the form that sets up that every linking arm and a cleaning plate are connected can link together two cleaning plates, and two cleaning plates of being convenient for operate.

In some optional embodiments, the silicon wafer transfer system comprises two connecting pieces, the two connecting pieces are arranged side by side along the side-by-side distribution direction of the plurality of protrusions, and the grabbing piece is connected between the two connecting pieces.

In the technical scheme, the two connecting pieces are arranged, so that better stability can be provided for the connection of the two cleaning plates; in addition, through grabbing the piece with two connecting pieces fixed together, can directly carry out the cleaning operation through grabbing the piece, further improve the convenience of cleaning operation.

In some optional embodiments, each connecting arm is connected with the cleaning plate through a U-shaped structure, an opening of the U-shaped structure faces to the third preset surface, one end of the U-shaped structure close to the cleaning plate is provided with two connectors, the two connectors are arranged side by side along a plurality of convex side by side distribution directions, and the third preset surface is provided with a connecting groove for embedding the connectors.

Among the above-mentioned technical scheme, the U type structure provides the connector and the third and predetermines the spread groove on surface and peg graft, and it is convenient to connect, and in addition, the setting up of a plurality of connectors is guaranteed to connect more stably.

In some optional embodiments, the silicon wafer transfer system further comprises a driving device, wherein the driving device is in transmission connection with the connecting piece and is used for driving the cleaning plate to reciprocate along the extending direction of the groove.

Among the above-mentioned technical scheme, set up drive arrangement and be connected drive arrangement and connecting piece transmission, can realize the automatic clearance function of silicon chip transfer instrument to reduce the human input, practice thrift the human cost.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic partial working diagram of a silicon wafer transfer system according to an embodiment of the present disclosure;

fig. 2 is a first view of a silicon wafer transferring device of a silicon wafer transferring system according to an embodiment of the present disclosure;

FIG. 3 is a second view of a partial structure of a silicon wafer transfer system according to an embodiment of the present disclosure;

fig. 4 is a schematic partial structure diagram of a silicon wafer transfer system according to an embodiment of the present disclosure;

fig. 5 is a second view of a silicon wafer transfer system according to an embodiment of the present application.

Icon: 100-a silicon wafer transfer system; 110-a transfer device; 111-grooves; 112-bottom of the groove; 113-cell wall; 120-cleaning the fabric; 130-cleaning plate; 131-protrusions; 132-the top of the protrusion; 133-a first preset surface; 134-a second preset surface; 135-a third predetermined surface; 136-a compression member; 137-a first fastener; 138-a connecting trough; 140-a connector; 141-a connecting arm; 142-U-shaped structure; 143-a connector; 144-a second fastener; 145-grasping member; 150-a drive device;

a-the depth direction of the groove; b-the direction of extension of the grooves; c-the direction of extension of the projections; d-the side-by-side distribution direction of the protrusions.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it is to be noted that the terms "upper", "lower", "vertical", "inside", "outside", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally laid out when products of the application are used, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or vertical, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The inventor researches and discovers that in the prior art, the cleaning mode of the silicon wafer transfer device 110 has the defects of low efficiency and high labor intensity; and because the number of the grooves 111 in the silicon wafer transfer device 110 is large, the grooves are not easy to distinguish, and the wiping omission is easily caused, so that the overall cleaning effect is influenced.

The inventor also researches and discovers that the existing cleaning tool is improved based on the plurality of grooves 111 in the silicon wafer transfer device 110, so that the cleaning efficiency can be improved, and the labor intensity can be reduced; meanwhile, the condition of omission can be avoided, and the cleaning effect is guaranteed.

It should be noted that, in the drawings of the present application, the first view is a right side axial view of the silicon wafer transfer device 110; the second view is a right oblique view of the silicon wafer transfer device 110.

Referring to fig. 1 and 2, an embodiment of the present application provides a silicon wafer transfer system 100, which includes a transfer device 110, a cleaning fabric 120, and a cleaning plate 130.

The transfer device 110 has a plurality of grooves 111 for accommodating silicon wafers; the cleaning fabric 120 is configured to be able to cover and be pushed into the plurality of grooves 111; the cleaning plate 130 has a plurality of protrusions 131 disposed corresponding to the plurality of grooves 111; the plurality of protrusions 131 are used to push the cleaning fabric 120 into the plurality of grooves 111 and to make the cleaning fabric 120 slidably contact with the groove walls 113 of the grooves 111.

In the application, the transfer device 110 is provided with a plurality of grooves 111, the cleaning plate 130 is provided with a plurality of protrusions 131 corresponding to the plurality of grooves 111, and meanwhile, the cleaning fabric 120 is arranged to cover the plurality of grooves 111 and can extend into the corresponding plurality of grooves 111 to be cleaned under the driving of a cleaning piece, so that cleaning personnel can clean the plurality of grooves 111 in the silicon wafer transfer device 110 through one cleaning operation, thereby improving the cleaning efficiency and reducing the labor intensity; meanwhile, the condition of omission can be avoided, and the cleaning effect is guaranteed.

To facilitate understanding of the technical solution, the operation principle of the silicon wafer transfer system 100 is described herein. The cleaning fabric 120 is set to be large enough to cover the grooves 111 in the transfer device 110, then the silicon wafer transfer device 110 is placed on a cleaning platform or a trolley, the handheld cleaning plate 130 is aligned with the opening of the transfer device 110, the cleaning fabric 120 is driven by the cleaning plate 130 to extend into the corresponding groove 111, certain acting force is given to the cleaning plate 130 in the extending direction b of the groove and the cleaning plate is dragged back and forth, and the groove wall 113 of the groove 111 is smooth, so that the cleaning fabric 120 can reciprocate in the groove 111 along the extending direction b of the groove under the driving of the cleaning plate 130, and the cleaning of the grooves 111 is realized.

It will be appreciated that, in order to complete the cleaning operation as quickly as possible, the number of the protrusions 131 in the cleaning plate 130 may be set to correspond to the number of the grooves 111, and the setting is such that all the grooves 111 can be cleaned at one time.

On the basis, when the silicon wafer transferring system 100 normally performs the cleaning function, the material of the groove wall 113 of the groove 111 of the transferring device 110 is required, so that the material of the transferring device 110 can be regulated.

As an example, the material of the transfer device 110 may be any one of PVC, PVDF and PP, and it should be understood that the specific material of the transfer device 110 is not limited as long as the material is smooth and can enable the cleaning fabric 120 and the tank wall 113 to slide.

It should be noted that the arrangement manner of the cleaning fabric 120 in the silicon wafer transferring system 100 is not limited, the transferring device 110 and the cleaning plate 130 may have a connection relationship with the cleaning fabric 120, and the two may not be connected with the cleaning fabric 120.

In some possible embodiments, the cleaning fabric 120 may be disposed between the transfer device 110 and the cleaning plate 130, and the cleaning fabric 120 is not connected to both the transfer device 110 and the cleaning plate 130.

As an example, the cleaning fabric 120 is an elastically deformable fabric; in the depth direction a of the groove, the thickness of the cleaning fabric 120 is L1, the distance between the top 132 of the protrusion and the bottom 112 of the groove when the protrusion 131 is positioned in the groove 111 is L2, and L1 is more than L2.

In this embodiment, the cleaning fabric 120 is made of an elastic deformation fabric, and in the depth direction a of the groove, the thickness L1 of the cleaning fabric 120 is set to be greater than the distance L2 between the top 132 of the protrusion and the bottom 112 of the groove when the protrusion 131 is located in the groove 111, so that when the cleaning operation is performed, the cleaning fabric 120 can be stably clamped between the silicon wafer transfer device 110 and the cleaning plate 130, the cleaning fabric 120 cannot fall off when being cleaned, and the cleaning function is effectively realized.

It should be noted that when the cleaning fabric 120 is disposed between the silicon wafer transferring device 110 and the cleaning plate 130, the cleaning fabric 120 having elastic deformation has two states, and when the cleaning fabric 120 is in the first state, the cleaning fabric 120 is pressed by the bottom 112 of the groove and the top 132 of the protrusion; when the cleaning material 120 is in the second condition, the cleaning material 120 is released by the bottom 112 of the recess and the top 132 of the projection. When the cleaning fabric 120 is in the first state, the cleaning fabric is pressed by the bottom 112 of the groove and the top 132 of the protrusion, so that the cleaning fabric does not fall off; meanwhile, the surface of the bulge 131 of the cleaning plate 130 is rough, the groove wall 113 of the groove 111 is smooth, and the roughness of the surface of the cleaning fabric 120 and the surface of the bulge 131 are larger than that of the surface of the cleaning fabric 120 and the surface of the groove wall 113, so that the cleaning fabric 120 can be ensured to perform a normal cleaning function.

The working principle of the silicon wafer transfer system 100 when the cleaning fabric 120 is disposed according to this embodiment will be explained in detail herein for better understanding. The one end that will clear up surface fabric 120 and be close to transfer device 110 opening compresses tightly earlier in the recess 111 of transfer device 110 through clearance board 130, then gives clearance board 130 certain effort in the extending direction b of recess until clearance surface fabric 120 compresses tightly completely between the bellied top 132 of the two and the bottom 112 of recess, then drags back and forth, clearance surface fabric 120 just can make reciprocating motion along the extending direction b of recess in recess 111 under the drive of clearance board 130 to the realization is to the clearance of a plurality of recesses 111.

It can be understood that, because the material of the surface of the protrusion 131 of the cleaning plate 130 is required in this arrangement, the material of the cleaning plate 130 can be adjusted.

As an example, the cleaning plate 130 may be made of any one of PVC, PVDF and PP, the surface of the protrusion 131 may be rough or smooth, and when the surface of the protrusion 131 is smooth, the surface of the protrusion may be subjected to sand blasting to form a rough surface; it can be understood that as long as the roughness of the surface of the cleaning fabric 120 and the surface of the protrusion 131 can be greater than the roughness of the surface of the cleaning fabric 120 and the surface of the groove wall 113, the cleaning fabric 131 can be driven by the cleaning plate 130 to reciprocate in the groove 111, and the cleaning function is realized.

On the basis, the arrangement of the protrusion 131 and the groove 111 can be optimized for better cleaning function.

As an example, the top 132 of the protrusion is a straight angle and perpendicular to the sidewall of the protrusion 131, and the top of the sidewall between any two grooves 111 is shaped like a circular arc.

In this embodiment, the top 132 of the protrusion is set to be a flat angle, so that the cleaning fabric 120 can contact with the bottom of the groove 111 as much as possible, and the cleaning effect is improved; the straight angle and the vertical side wall of the protrusion 131 can increase the friction coefficient between the cleaning fabric 120 and the cleaning plate 130, and the cleaning fabric 120 can be better driven to move. In addition, the top of the side wall between any two grooves 111 is arc-shaped, so that the friction coefficient between the cleaning fabric 120 and the transfer device 110 can be reduced, the cleaning fabric 120 can better move in the grooves 111, and the cleaning fabric 120 can be protected.

In other possible embodiments, the cleaning fabric 120 may also be provided in a form connected to the cleaning plate 130.

As an example, the cleaning fabric 120 is connected to the cleaning plate 130 and covers the plurality of protrusions 131.

In the embodiment, the cleaning fabric 120 and the cleaning plate 130 are connected together, so that the cleaning fabric 120 and the cleaning plate 130 form a whole, the cleaning fabric and the cleaning plate are kept together in a moving and laying state, and the use and the storage are both convenient.

It should be noted that when the cleaning fabric 120 is disposed in this manner, there is no particular requirement on whether the cleaning fabric 120 itself can be elastically deformed, the roughness of the surface of the cleaning fabric 120 contacting the protrusions 131, and whether the groove walls 113 of the grooves 111 are smooth.

On this basis, the specific material of the cleaning fabric 120 is not limited, and may be any one of dust-free cloth, dust-free paper, polyester cloth, and nylon cloth.

The working principle of the silicon wafer transfer system 100 when the cleaning fabric 120 is disposed according to this embodiment will be explained in detail herein for better understanding. The cleaning plate 130 connected with the cleaning fabric 120 is aligned with the opening of the transfer device 110, then a certain acting force is applied to the cleaning plate 130 in the extending direction b of the groove, and the cleaning fabric 120 is connected to the cleaning plate 130, so that the cleaning fabric can directly extend into the groove 111 under the driving of the cleaning plate 130 and can reciprocate in the groove 111 along the extending direction b of the groove, and the cleaning of the plurality of grooves 111 is realized.

It is understood that the specific connection form of the cleaning fabric 120 and the cleaning plate 130 is not limited, and the connection form may be a detachable connection; in other embodiments, the connection may also be a fixed connection.

As an example, the cleaning fabric 120 is removably attached to the cleaning plate 130.

In the embodiment, the detachable connection mode can be used for detaching and replacing corresponding components when part of the components are damaged or need to be cleaned, so that the cleaning effect is ensured; meanwhile, the phenomenon of resource waste caused by the fact that part of components are failed and the whole device cannot be used can be avoided.

On this basis, the specific mode of detachable connection is not limited as long as the detachable function can be realized.

Referring to fig. 3, as an example, two ends of the cleaning fabric 120 are respectively pressed against a first preset surface 133 of the cleaning plate 130 by a pressing member 136, a side surface of the cleaning plate 130 on which the protrusion 131 is provided is a second preset surface 134, the first preset surface 133 is a side surface opposite to the second preset surface 134, and the pressing member 136 is detachably connected to the cleaning plate 130 by a first fastening member 137.

In this embodiment, the cooperation of the pressing member 136 and the first fastening member 137 enables the cleaning fabric 120 to perform a cleaning function when being connected to the cleaning plate 130; in addition, the cleaning fabric 120 and the cleaning plate 130 can be detachably connected by matching the two.

It should be noted that the specific arrangement form of the pressing member 136 is not limited, and one pressing member 136 may be provided, and in other possible embodiments, a plurality of pressing members 136 may also be provided according to actual needs; in addition, the three-dimensional configuration of the pressing member 136 is not particularly limited, and may be any one of a rectangular parallelepiped, a cube, and a cylinder. It is understood that the cleaning fabric 120 may be attached to the cleaning plate 130.

As an example, the pressing member 136 is provided as an integral rectangular parallelepiped pressing plate.

It can be understood that the setting direction of the pressing member 136 can be adjusted in consideration of the fixing effect of the pressing member 136 on the cleaning fabric 120.

As an example, the pressing piece 136 is provided in a direction in which the plurality of protrusions 131 are distributed side by side.

In this embodiment, the contact area between the pressing member 136 and the cleaning fabric 120 is larger, and a better fixing effect can be achieved.

On this basis, the specific arrangement form of the first fastening member 137 is not limited, and the first fastening member 137 may be in the form of a screw, and in other possible embodiments, the first fastening member 137 may also be in the form of a snap, a latch, and the like.

As an example, the first fastener 137 is provided as a screw.

It should be noted that the structure of the silicon wafer transfer system 100 may be optimized to facilitate the cleaning operation.

As an example, the silicon wafer transferring system 100 further includes a connecting member 140, the connecting member 140 is connected to a third predetermined surface 135 of the cleaning plate 130, the third predetermined surface 135 is perpendicular to the second predetermined surface 134, and the connecting member 140 is perpendicular to the extending direction c of the protrusion; the connection member 140 extends from the connection point toward a side away from the third preset surface 135.

In this embodiment, the silicon wafer transfer system 100 is additionally provided with a connecting member 140 for holding, mechanically clamping or mechanically connecting the cleaning plate 130; furthermore, the connecting member 140 is connected to the third predetermined surface 135 of the cleaning plate 130, and extends perpendicular to the extending direction c of the protrusion and the connecting member 140 extends from the connection portion toward a side away from the third predetermined surface 135, which is convenient for the cleaning operation.

It will be appreciated that the number of cleaning plates 130 may be adjusted to further improve cleaning efficiency.

As an example, the silicon wafer transfer system 100 includes two cleaning plates 130, and the connecting member 140 includes two connecting arms 141 connected to each other, and each connecting arm 141 is connected to one cleaning plate 130.

In this embodiment, the silicon wafer transfer system 100 is provided with two cleaning plates 130, so that a cleaning worker can clean the silicon wafer transfer devices 110 on two sides through one cleaning operation, and the cleaning efficiency is further improved; in addition, the connecting member 140 includes two connecting arms 141 connected to each other, and each connecting arm 141 is connected to one cleaning plate 130 in such a manner that the two cleaning plates 130 can be connected together to facilitate the operation of the two cleaning plates 130.

Referring to fig. 3, as an example, the silicon wafer transferring system 100 includes two connecting members 140, the two connecting members 140 are disposed side by side along a side distribution direction d of the plurality of protrusions, and a grasping member 145 is connected between the two connecting members 140.

In this embodiment, two connectors 140 are provided to enable two cleaning plates 130 to be connected together; in addition, the two connecting members 140 are fixed together by the grasping member 145, and the cleaning operation can be directly performed by the grasping member 145, thereby further improving the convenience of the cleaning operation.

It is understood that the specific arrangement of the grabbing member 145 is not limited, and may be disposed in the middle of the two connecting members 140, or may be disposed at a position to the left or right. In addition, the three-dimensional configuration of the connecting member 140 is not particularly limited, and may be a cylinder or a rectangular parallelepiped.

As an example, the grasping member 145 is provided at the middle of the two connection members 140, and has a cylindrical spatial configuration.

In this embodiment, when the grasping member 145 is disposed in the middle, the connecting member 140 and the connecting plate are integrally in a left-right symmetrical state, which makes the cleaning easier in hand holding, and the three-dimensional configuration of the cylinder is convenient for hand holding.

On the basis, in order to increase the stability of the whole silicon wafer transfer system 100 and enable the silicon wafer transfer system to better exert the cleaning function, the form of the connecting piece 140 can be optimized.

Referring to fig. 5, as an example, each connecting arm 141 is connected to the cleaning plate 130 through a U-shaped structure 142, an opening of the U-shaped structure 142 faces the third predetermined surface 135, and one end of the U-shaped structure 142 close to the cleaning plate 130 has two connecting heads 143, the two connecting heads 143 are arranged side by side along a side distribution direction d of the plurality of protrusions, and the third predetermined surface 135 is provided with a connecting groove 138 for embedding the connecting heads 143.

In this embodiment, the U-shaped structure 142 provides the connection heads 143 to be inserted into the connection grooves 138 of the third predetermined surface 135, so that the connection is convenient, and the connection is more stable due to the arrangement of the plurality of connection heads 143.

It should be noted that the connecting arm 141 and the cleaning plate 130 are not limited to the U-shaped structure 142, but may be in the form of a screw connection or a direct welding.

It is understood that the specific distribution direction of the two connection heads 143 on the third preset surface 135 is not particularly limited, and may be set to be along the direction d in which the plurality of protrusions are distributed side by side, that is, in the case of upper and lower distribution; in other possible embodiments, the direction perpendicular to the direction d of the side-by-side distribution of the plurality of protrusions, i.e. the left and right distribution, may also be provided.

As an example, two connection heads 143 are disposed to be distributed side by side along a direction d in which the plurality of protrusions are distributed side by side.

On the basis, in order to further enhance the connection stability of the U-shaped structure 142 and the cleaning plate 130, the connection form can be further optimized.

As an example, each U-shaped structure 142 is fastened away from the connection head 143 of the other U-shaped structure 142 by a second fastener 144.

In this embodiment, the second fastening member 144 is provided to further enhance the stability of the connection between the U-shaped structure 142 and the cleaning plate 130.

It should be noted that the specific form of the second fastening member 144 is not limited, and the second fastening member 144 may be in the form of a screw, and in other possible embodiments, the second fastening member 144 may also be in the form of a snap, a latch, etc.

As an example, the second fastener 144 is provided as a screw.

It is understood that, when the silicon wafer transfer system 100 is provided with two cleaning plates 130, the arrangement of the connection members 140 may also be adjusted based on the convenience of the cleaning operation.

It should be noted that, in order to further save the labor cost, the silicon wafer transfer system 100 may be further optimized.

Referring to fig. 4, as an example, the silicon wafer transferring system 100 further includes a driving device 150, and the driving device 150 is in transmission connection with the connecting member 140 and is used for driving the cleaning plate 130 to reciprocate along the extending direction b of the groove.

In this embodiment, the driving device 150 is arranged and the driving device 150 is in transmission connection with the connecting member 140, so that the automatic cleaning function of the silicon wafer transfer tool can be realized, the manpower input is reduced, and the manpower cost is saved.

It should be noted that the specific form of the transmission connection is not limited, and the transmission connection can be provided in the form of a telescopic cylinder, and can also be provided in the form of hydraulic control. It will be appreciated that it is sufficient if the link 140 connected thereto is enabled to drive the cleaning plate 130 to reciprocate in the extending direction b of the groove.

For the sake of easy understanding of the working principle of automatic cleaning, the detailed description is made herein. Firstly, the transfer device 110 is erected in the clamping mechanism, then the cleaning plate 130 with the driving device 150 is aligned to the opening of the transfer device 110, and then the cleaning fabric 120 can reciprocate in the groove 111 along the extending direction b of the groove under the driving of the driving device 150, so that the plurality of grooves 111 can be cleaned.

In summary, the embodiment of the present application provides a silicon wafer transfer system 100, and a cleaning worker can clean a plurality of grooves 111 in a silicon wafer transfer device 110 through one cleaning operation, so as to improve cleaning efficiency and reduce labor intensity; meanwhile, the condition of omission can be avoided, and the cleaning effect is guaranteed.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A silicon wafer transfer system is characterized by comprising:

the transfer device is provided with a plurality of grooves for accommodating silicon wafers;

a cleaning fabric configured to be capable of covering and being pushed into the plurality of grooves; and

the cleaning plate is provided with a plurality of bulges which are correspondingly arranged with the grooves; the plurality of protrusions are used for pushing the cleaning fabric into the plurality of grooves, and the cleaning fabric is in slidable contact with the groove walls of the grooves.

2. The silicon wafer transfer system of claim 1, wherein the cleaning fabric is an elastically deformable fabric; in the depth direction of the groove, the thickness of the cleaning fabric is L1, the distance between the top of the protrusion and the bottom of the groove when the protrusion is positioned in the groove is L2, and the L1 is larger than the L2.

3. The silicon wafer transfer system of claim 1, wherein the cleaning fabric is attached to the cleaning plate and covers the plurality of protrusions.

4. The silicon wafer transfer system of claim 3, wherein the cleaning fabric is removably attached to the cleaning plate.

5. The silicon wafer transfer system of claim 4, wherein two ends of the cleaning fabric are respectively pressed against a first preset surface of the cleaning plate through pressing pieces, a side surface of the cleaning plate, on which the protrusions are arranged, is a second preset surface, the first preset surface is a side surface opposite to the second preset surface, and the pressing pieces are detachably connected with the cleaning plate through first fastening pieces.

6. The silicon wafer transfer system of claim 5, further comprising a connector, wherein the connector is connected to a third predetermined surface of the cleaning plate, the third predetermined surface is perpendicular to the second predetermined surface, and the connector is perpendicular to the extending direction of the protrusion; the connecting piece extends from the connecting position towards the side far away from the third preset surface.

7. The silicon wafer transfer system of claim 6, wherein the silicon wafer transfer system comprises two cleaning plates, and the connecting member comprises two connecting arms connected with each other, and each connecting arm is connected with one cleaning plate.

8. The silicon wafer transfer system of claim 7, wherein the silicon wafer transfer system comprises two of the connecting members, the two connecting members are arranged side by side along a plurality of the protrusions in a side-by-side distribution direction, and a grabbing member is connected between the two connecting members.

9. The silicon wafer transferring system of claim 8, wherein each of the connecting arms is connected to the cleaning plate through a U-shaped structure, an opening of the U-shaped structure faces the third predetermined surface, and one end of the U-shaped structure close to the cleaning plate has two connectors, the two connectors are arranged side by side along a plurality of convex side by side distribution directions, and the third predetermined surface is provided with a connecting groove for embedding the connectors.

10. The silicon wafer transfer system of claim 6, further comprising a driving device, wherein the driving device is in transmission connection with the connecting member and is used for driving the cleaning plate to reciprocate along the extending direction of the groove.

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