CN217114351U - Laser scanning positioning device for wafer box - Google Patents
Laser scanning positioning device for wafer box Download PDFInfo
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- CN217114351U CN217114351U CN202220916351.7U CN202220916351U CN217114351U CN 217114351 U CN217114351 U CN 217114351U CN 202220916351 U CN202220916351 U CN 202220916351U CN 217114351 U CN217114351 U CN 217114351U
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Abstract
The utility model relates to a wafer box laser scanning positioner, including the frame, be provided with material pushing limiting mechanism and light path mechanism in the frame, material pushing limiting mechanism sets up in the position that is close to the centre in the frame of negative direction one side along the X axle, and light path mechanism installs on the back of frame. The utility model relates to a wafer box laser scanning positioner carries out the laser scanning location through light path mechanism, judges the wafer skew back and pushes away the material processing through pushing away material stop gear, reduces the influence that the wafer skew caused.
Description
Technical Field
The utility model relates to a wafer processing correlation technique field especially relates to a wafer box laser scanning positioner.
Background
A wafer is a very expensive product and must be protected from damage during the placement process. The wafer cassette is a common device for holding wafers and sapphire in the industry. Wafers in the wafer box may shift during the processing, and the shifted wafers may have a certain adverse effect on the subsequent processing.
In view of the above-mentioned defects, the present designer is actively making research and innovation to create a laser scanning and positioning device for a wafer cassette, so that the device has industrial application value.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problem, the present invention provides a laser scanning positioning device for a wafer cassette.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a laser scanning positioning device for a wafer box comprises a machine frame, wherein a material pushing limiting mechanism and a light path mechanism are arranged on the machine frame, the material pushing limiting mechanism is arranged at a position, close to the middle, on the machine frame on one side along the X-axis negative direction, the light path mechanism is arranged on the back surface of the machine frame, the light path mechanism comprises a laser, a first half lens, a second half lens, a first reflecting mirror, a second reflecting mirror, a first receiver, a second receiver and a third receiver, the laser, the first half lens, the second half lens and the first reflecting mirror are sequentially arranged on the back surface of one side of the machine frame along the X-axis negative direction along the Y-axis positive direction, the first receiver and the second receiver are sequentially arranged on the back surface of one side of the machine frame along the X-axis positive direction along the Y-axis negative direction, a second reflecting mirror is arranged on the back surface of the machine frame on one side close to the first reflecting mirror and along the X-axis positive direction, the third receiver is positioned on the back surface of the machine frame on one side of the second reflecting mirror along the Y-axis negative direction, the second receiver is positioned on the back of the frame on one side of the positive X-axis direction of the first half lens.
As a further improvement of the utility model, pushing equipment is including pushing away material motor, turning block, pivot and spacing ejector pad, pushes away the material motor and passes through the motor support mounting in the frame front, pushes away the material motor and is connected with the turning block through lead screw and screw-nut along the drive end of Y axle positive direction one side, and the turning block is connected with the pivot, and the pivot is passed through the bearing and is installed in the frame, and the bottom of pivot is connected with spacing ejector pad through the connecting rod, and spacing ejector pad is located the back of frame.
As a further improvement, the rotating block is provided with an induction sheet, and the rotating block is provided with a sensor matched with the induction sheet along the frame on one side of the positive direction of the Y axis.
As a further improvement, the bottom outside of the laser, the first half lens, the second half lens and the first reflector is provided with a light screen.
Borrow by above-mentioned scheme, the utility model discloses at least, have following advantage:
the utility model relates to a wafer box laser scanning positioner carries out the laser scanning location through light path mechanism, judges that the wafer squints the back and pushes away the material processing through pushing away material stop gear, reduces the influence that the wafer skew caused.
The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a front side of a laser scanning positioning device for a wafer cassette according to the present invention;
FIG. 2 is a schematic view of the backside of FIG. 1;
FIG. 3 is a schematic view of the structure of FIG. 2 with the mask removed;
FIG. 4 is a schematic structural view of the material pushing and limiting mechanism in FIG. 1;
fig. 5 is a schematic diagram of the optical path of the present invention.
In the drawings, the meanings of the reference numerals are as follows.
1 rack 2 pushing limiting mechanism
3 light shield 4 first receptor
5 second receiver 6 laser
7 a first half lens 8 a second half lens
9 first mirror 10 second mirror
11 pushing motor 12 motor support
13 feed screw nut 14 turning block
15 induction sheet 16 rotating shaft
17 connecting rod 18 limit push block
19 bearing 20 sensor
21 third receiver a optical path
Detailed Description
The following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
In order to make the technical solution of the present invention better understood, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by the person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
As shown in figures 1 to 5 of the drawings,
a laser scanning positioning device for a wafer box comprises a machine frame 1, wherein a material pushing limiting mechanism 2 and an optical path mechanism are arranged on the machine frame 1, the material pushing limiting mechanism 2 is arranged at a position, close to the middle, on the machine frame 1 on one side along the negative direction of an X axis, the optical path mechanism is arranged on the back surface of the machine frame 1, and comprises a laser 6, a first half lens 7, a second half lens 8, a first reflecting mirror 9, a second reflecting mirror 10, a first receiver 4, a second receiver 5 and a third receiver 21, the laser 6, the first half lens 7, the second half lens 8 and the first reflecting mirror 9 are sequentially arranged on the back surface of one side along the negative direction of the X axis of the machine frame 1 along the positive direction of the Y axis, the first receiver 4 and the second receiver 5 are sequentially arranged on the back surface of one side along the positive direction of the X axis of the machine frame 1 along the negative direction of the Y axis, the second reflecting mirror 10 is arranged close to the first reflecting mirror 9 and along the back surface of the machine frame 1 on one side along the positive direction of the X axis, the third receiver 21 is located on the back of the frame 1 on the side of the second mirror 10 along the negative direction of the Y-axis, and the second receiver 5 is located on the back of the frame 1 on the side of the first half lens 7 along the positive direction of the X-axis.
Preferably, the pushing mechanism 2 comprises a pushing motor 11, a rotating block 14, a rotating shaft 16 and a limiting push block 18, the pushing motor 11 is mounted on the front face of the rack 1 through a motor support 12, a driving end of the pushing motor 11 along one side of the positive direction of the Y axis is connected with the rotating block 14 through a lead screw and a lead screw nut 13, the rotating block 14 is connected with the rotating shaft 16, the rotating shaft 16 is mounted on the rack 1 through a bearing 19, the bottom of the rotating shaft 16 is connected with the limiting push block 18 through a connecting rod 17, and the limiting push block 18 is located on the back face of the rack 1.
Preferably, the rotating block 14 is further provided with a sensing piece 15, and the frame 1 on one side of the rotating block 14 along the positive direction of the Y axis is provided with a sensor 20 matched with the sensing piece 15.
Preferably, the light shielding plate 3 is arranged outside the bottom of the laser 6, the first half lens 7, the second half mirror 8 and the first reflective mirror 9.
The utility model relates to a laser scanning positioning device for a wafer box,
the laser 6 emits laser light, which is transmitted to the first receiver 4, the second receiver 5, and the third receiver 21 through the first half lens 7, the second half lens 8, the first reflecting mirror 9, and the second reflecting mirror 10.
After entering the first half lens 7, a part of the laser light emitted by the laser 6 is transmitted to the second receiver 5, the other part of the laser light enters the second half lens 8, a part of the laser light entering the second half lens 8 is transmitted to the first receiver 4, the other part of the laser light enters the first reflective mirror 9, and the first reflective mirror 9 transmits the laser light to the third receiver 21 through the action of the second reflective mirror 10.
The first receiver 4 and the second receiver 5 can confirm whether the wafer of the wafer box exists or not and the state of the wafer.
The third receiver 21 can confirm whether the wafer has a protruding cassette, and if the wafer protrudes from the cassette, an alarm will be issued.
As shown in fig. 5, a denotes an optical path structure.
The utility model relates to a wafer box laser scanning positioner carries out the laser scanning location through light path mechanism, judges the wafer skew back and pushes away the material processing through pushing away material stop gear, reduces the influence that the wafer skew caused.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly referring to the number of technical features being grined. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected: either mechanically or electrically: the terms may be directly connected or indirectly connected through an intermediate member, or may be a communication between two elements.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (4)
1. The laser scanning positioning device for the wafer box is characterized by comprising a rack (1), wherein a material pushing limiting mechanism (2) and an optical path mechanism are arranged on the rack (1), the material pushing limiting mechanism (2) is arranged on a position close to the middle of the rack (1) on one side of the X-axis negative direction, the optical path mechanism is arranged on the back of the rack (1), the optical path mechanism comprises a laser (6), a first half lens (7), a second half lens (8), a first reflector (9), a second reflector (10), a first receiver (4), a second receiver (5) and a third receiver (21), the laser (6), the first half lens (7), the second half lens (8) and the first reflector (9) are sequentially arranged on the back of the rack (1) on one side of the X-axis direction along the positive direction of the Y-axis, first receiver (4) and second receiver (5) set up in frame (1) along the back of X axle positive direction one side along the negative direction of Y axle in proper order, are close to first reflector (9) and are provided with second reflector (10) along the back of X axle positive direction one side frame (1), third receiver (21) are located second reflector (10) along the back of Y axle negative direction one side frame (1), second receiver (5) are located the back of first half lens (7) along X axle positive direction one side frame (1).
2. The laser scanning positioning device for the wafer box according to claim 1, wherein the pushing limiting mechanism (2) comprises a pushing motor (11), a rotating block (14), a rotating shaft (16) and a limiting push block (18), the pushing motor (11) is installed on the front face of the rack (1) through a motor support (12), the driving end of the pushing motor (11) along one side of the positive direction of the Y axis is connected with the rotating block (14) through a screw rod and a screw nut (13), the rotating block (14) is connected with the rotating shaft (16), the rotating shaft (16) is installed on the rack (1) through a bearing (19), the bottom of the rotating shaft (16) is connected with the limiting push block (18) through a connecting rod (17), and the limiting push block (18) is located on the back face of the rack (1).
3. The laser scanning and positioning device for the wafer box as claimed in claim 2, characterized in that the rotating block (14) is further provided with a sensing piece (15), and a sensor (20) matched with the sensing piece (15) is arranged on the rack (1) on one side of the rotating block (14) along the positive direction of the Y axis.
4. The laser scanning and positioning device for the wafer box as claimed in claim 1, characterized in that the shielding plate (3) is arranged outside the bottom of the laser (6), the first half lens (7), the second half lens (8) and the first reflective mirror (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220916351.7U CN217114351U (en) | 2022-04-20 | 2022-04-20 | Laser scanning positioning device for wafer box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220916351.7U CN217114351U (en) | 2022-04-20 | 2022-04-20 | Laser scanning positioning device for wafer box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217114351U true CN217114351U (en) | 2022-08-02 |
Family
ID=82583507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220916351.7U Active CN217114351U (en) | 2022-04-20 | 2022-04-20 | Laser scanning positioning device for wafer box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217114351U (en) |
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2022
- 2022-04-20 CN CN202220916351.7U patent/CN217114351U/en active Active
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