CN217112725U

CN217112725U - Support big dipper RDSS module of many cards

Info

Publication number: CN217112725U
Application number: CN202220751667.5U
Authority: CN
Inventors: 李健
Original assignee: Chengdu Ashining Technology Co ltd
Current assignee: Chengdu Ashining Technology Co ltd
Priority date: 2022-04-02
Filing date: 2022-04-02
Publication date: 2022-08-02
Anticipated expiration: 2032-04-02

Abstract

The application discloses support big dipper RDSS module of many cards, including the box body of encapsulation, the box body comprises casing and the lid that covers each other and close the internal shield cavity to and install the PCB circuit board in shielding cavity, be connected with the first radio frequency interface that is used for received signal on the PCB circuit board, the second radio frequency interface that is used for the transmitted signal, the serial interface that is used for communication and power supply, and contain the baseband processor of a plurality of hard cards/soft cards; the first radio frequency interface and the second radio frequency interface are arranged on the side face of the box body and flush with the side face of the box body or are installed in an embedded mode. The utility model discloses have good dynamic performance, more receiving channel numbers have better compatibility to equipment such as miniaturized handheld device, mobile unit, shipborne equipment, civilian machine carried type to greatly increased the application breadth and the degree of depth of RDSS system.

Description

Support big dipper RDSS module of many cards

Technical Field

The utility model relates to a indicate satellite radio positioning system technical field, especially relate to big dipper RDSS module, specifically be a big dipper RDSS module that supports many cards.

Background

The Beidou Satellite Navigation system is divided into RNSS and RDSS, two services of RNSS and RDSS are simultaneously integrated in a Navigation Satellite and operation control application system of the Satellite Navigation system, the positioning service principles provided by the two Beidou systems are different, Beidou RDSS (radio Determination Satellite service) is Satellite radio measurement service, and Beidou RNSS (radio Navigation Satellite service) is Satellite radio Navigation service.

The RDSS positioning system is also called an active satellite positioning system, and the distance measurement and position calculation from a user to a satellite cannot be independently completed by the user, and must be completed by an external system through the response of the user. The method is characterized in that the user response is used for completing the positioning and the reporting of the user position to an external system, and the integration of the positioning and the communication can be realized, so that the positioning and the communication integration in the same system can be realized. At the same time, the user needs to respond to the service beam and transmit the observation data back to the central station for processing. Because the satellite and terrestrial equipment communication links are limited in bandwidth and capacity, and the inbound and outbound resources are limited, the frequency must be limited to differentiate between the user's needs and level of importance. For low-grade users, the service frequency is low, but when the low-grade users meet some special emergency situations, the service frequency cannot meet the actual requirements, the positioning communication frequency of the common civil card is 1 time per minute (76 bytes at each time), and therefore for the special emergency situations of the users or the situations needing large data volume, a Beidou RDSS miniaturization module capable of supporting multiple cards is designed, and the application range and depth of the RDSS system can be greatly increased.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem that a common civil card is limited by communication frequency, the Beidou RDSS module supporting multiple cards has better dynamic performance and more receiving channels, and has better compatibility aiming at miniaturized handheld equipment, vehicle-mounted equipment, shipborne equipment, civil airborne equipment and the like, so that the application range and depth of an RDSS system are greatly increased; the module is small in size, low in power consumption and easy to integrate, and the performance of the module meets the civil index requirement of the Beidou. The shielding cavity is independently packaged, the EMC performance is good, the testability and the maintainability are good, the device can be integrated into other electronic products in a portable mode, and meanwhile, the radio frequency output can be directly connected with a source antenna by adopting an MCX high-frequency connector.

In order to achieve the purpose, the technical scheme adopted by the application is as follows:

a big Dipper RDSS module supporting multiple cards comprises a packaged box body, wherein the box body consists of a shell and a cover body which are mutually covered and provided with an internal shielding cavity, and a PCB circuit board arranged in the shielding cavity, wherein the PCB circuit board is connected with a first radio frequency interface used for receiving signals, a second radio frequency interface used for transmitting signals, a serial interface used for communication and power supply, and a baseband processor containing a plurality of hard cards/soft cards; the first radio frequency interface and the second radio frequency interface are arranged on the side face of the box body and flush or embedded with the side face of the box body, and are arranged on the PCB for communication connection, the shell is provided with an avoiding port for accommodating the serial interface, and the end face of the serial interface is flush with the outer surface of the shell or is arranged at a position which is not higher than the outer surface of the shell by 2 mm.

In order to improve EMC performance, preferably, the casing is close to that lid one side is inwards sunken to form and is used for installing the shielded cavity of PCB circuit board, shielded cavity has the flange all around, at least one position of flange extends to shielded cavity central authorities and forms the barricade that is used for separating shielded cavity. As the casing of one of the major structure of box body, adopt similar strengthening rib, the median, keep apart the barricade, dig the square groove, the trompil groove, accurate trompil, large tracts of land ground connection, strengthen the heat dissipation district, multiple designs such as PCBA accurate molding groove can carry out the space mounted position subregion with the function of PCB circuit board, and simultaneously, as more preferred mode, can set up according to the structure of above-mentioned casing, further to the further subregion of the analog circuit part and the digital circuit part of PCB circuit board, if arrange the analog circuit part in one side of PCB board, the layout of digital circuit part is at the opposite side, avoid producing electromagnetic interference in the course of the work, promote EMC performance. Through setting up in the accurate function subregion of casing body coupling's barricade realization PCB circuit board in this application, realize possessing the isolation and shielding, further reduce mutual electromagnetic interference.

Preferably, the number of the retaining walls is two, and the retaining walls are respectively located at the position of the shell close to the opposite side edges of the first radio frequency interface and the second radio frequency interface and vertically extend inwards to form a first retaining wall and a second retaining wall respectively; the free ends of the first retaining wall and the second retaining wall are not connected with any retaining side; the shielding cavity is divided into a first mounting groove, a second mounting groove and a third mounting groove by the first retaining wall and the second retaining wall.

Preferably, the PCB circuit board comprises a baseband processor, a transceiver electrically connected with the baseband processor, and a low noise amplifier and a power amplifier electrically connected with the transceiver; the low noise amplifier is connected with the first radio frequency interface, and the power amplifier is connected with the second radio frequency interface.

In order to improve compatibility and reduce occupied space after installation, preferably, the first radio frequency interface and the second radio frequency interface adopt MCX-KYD 11, and the serial interface adopts a 25pin board-to-board connector.

In order to simultaneously take account of the overall dimension and the working performance of the module, preferably, the thickness of the PCB circuit board is 1.1mm ± 0.1mm, and the external dimension of the box body is 36mm × 42mm × 8 mm.

In order to improve the strength of the module against external force and provide reliable shielding performance, it is preferable that the box body is made of any one of aluminum alloy, magnesium alloy or stainless steel.

Has the advantages that:

the utility model has good dynamic performance, more receiving channels, better compatibility for miniaturized handheld equipment, vehicle-mounted equipment, ship-mounted equipment, civil vehicle-mounted equipment and other equipment, thereby greatly increasing the application range and depth of the RDSS system; the module is small in size, low in power consumption and easy to integrate, and the performance of the module meets the civil index requirement of the Beidou. The shielding cavity is independently packaged, the EMC performance is good, the testability and the maintainability are good, the device can be integrated into other electronic products in a portable mode, and meanwhile, the radio frequency output can be directly connected with a source antenna by adopting an MCX high-frequency connector.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.

Fig. 1 is an axonometric view of the structure of the utility model.

Fig. 2 is a directional visual isometric view of fig. 1.

Fig. 3 is an isometric view of the housing.

Fig. 4 is a top view of fig. 3.

Fig. 5 is an exploded view of the structure of the present invention.

Fig. 6 is an exploded view of another visual structure of fig. 5.

In the figure: 1-a shell; 11-avoidance port; 12-a first retaining wall; 13-a second retaining wall; 14-a first mounting groove; 15-a second mounting groove; 16-a third mounting groove; 2-a cover body; 3-a PCB circuit board; 31-a first radio frequency interface; 32-a second radio frequency interface; 33-serial interface; 4-a fastener.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it should be noted that if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship which is usually placed when the product of the application is used, the description is only for convenience and simplicity, and the indication or suggestion that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and thus, should not be construed as limiting the present application. Furthermore, the appearances of the terms "first," "second," and the like in the description herein are only used for distinguishing between similar elements and are not intended to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like when used in the description of the present application do not require that the components be absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it should also be noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" should be interpreted broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Example 1:

the Beidou RDSS module supporting multiple cards shown in the attached drawings 1-6 in the specification comprises a packaged box body, wherein the box body is composed of a shell body 1 and a cover body 2 which are mutually covered and provided with an internal shielding cavity, and a PCB 3 arranged in the shielding cavity, and the PCB 3 is connected with a first radio frequency interface 31 for receiving signals, a second radio frequency interface 32 for transmitting signals, a serial interface 33 for communication and power supply, and a baseband processor containing multiple hard cards/soft cards; first radio frequency interface 31 and second radio frequency interface 32 set up in the side of box body and flush or embedded installation with the box body side to and set up the serial interface 33 that is used for communication connection on PCB circuit board 3, seted up on casing 1 and held serial interface 33 dodges mouthful 11, the terminal surface of serial interface 33 flushes with the surface of casing 1 or is not higher than the position installation of casing 1 surface 2 mm.

The improvement of the present embodiment is mainly in the structural part, that is, the PCB 3 is subjected to three-dimensional shielding and packaging, so as to realize shielding of the whole PCB 3. In order to increase the shielding effect, the RDSS module is prevented from being subjected to electromagnetic interference of other associated electrical appliances in the working process, and meanwhile, the RDSS module is prevented from generating electromagnetic interference on other working components in the working process; the working component refers to an upstream and downstream electrical appliance or circuit unit electrically connected with the RDSS module in the embodiment. Further, the shielding cavity is arranged in the shell 1, so that different functional modules mounted on the PCB 3 can be separated and shielded, and the EMC performance inside the RDSS module is improved. The working principle of the RDSS module in this embodiment is not substantially different from that of the existing RDSS module in operation, and the RDSS module transmits/receives signals through a radio frequency antenna and then transmits and processes the signals through a baseband processor; the difference is that the conventional RDSS module is in a single card mode, that is, the communication frequency is 1 time per minute, the single communication is 76 bytes, and the communication data amount is obviously limited. In the embodiment, a multi-card setting is adopted, and a plurality of hard cards/soft cards are integrated into a baseband processor to realize multi-card cross linkage, so that the communication frequency is increased, and the information quantity transmitted in unit time is increased. For a hard card, as an optional mode of this embodiment, a plurality of hard card slots may be arranged in a shielding cavity in the housing 1 in an arrangement and stacking manner, but this mode is not a preferred scheme, and for miniaturization and integration of the module volume design, the problem of poor contact between physical components is avoided, and the soft card integration mode is more practical than a hard card. In the embodiment, SIM card information loaded by the hard card is written into the baseband processor, so that the problem of poor contact possibly caused by the hard card is fundamentally avoided, and the size of the hard card is smaller. It should be noted that, because the heat generated by the SIM card itself during operation is very small, the SIM card can be integrated in a stacked plastic package manner to replace a physical card slot, thereby achieving the technical effect of saving space.

In order to improve EMC performance, preferably, one side of the housing 1 close to the cover body 2 is recessed inwards to form a shielding cavity for mounting the PCB circuit board 3, the shielding cavity is provided with a retaining edge all around, and at least one position of the retaining edge extends towards the center of the shielding cavity to form a retaining wall for separating the shielding cavity. As the shell 1 which is one of the main structures of the box body, multiple designs such as similar reinforcing ribs, isolation belts, isolation retaining walls, square grooves, perforated grooves, accurate perforated holes, large-area grounding, reinforced heat dissipation areas, PCBA accurate shaping grooves and the like are adopted to partition the space installation positions of the functions of the PCB 3, and meanwhile, as a more preferable mode, the shell can be arranged according to the structure of the shell 1, further partitioning of an analog circuit part and a digital circuit part of the PCB 3 is realized, if the analog circuit part is arranged on one side of the PCB 3, the digital circuit part is distributed on the other side, electromagnetic interference generated in the working process is avoided, and the EMC performance is improved. Through setting up in the accurate function subregion of 1 body coupling's barricade realization PCB circuit board 3 of casing in this application, realize possessing the isolation and shielding, further reduce mutual electromagnetic interference. The first radio frequency interface 31 and the second radio frequency interface 32 are respectively connected to a receiving antenna and a transmitting antenna for implementing the receiving and transmitting of the RDSS module signal, and then communicate with other application modules through the serial interface 33, such as a voice acquisition module, a voice recognition broadcasting module, an integrated MCU module, and the like.

Example 2:

the embodiment is further optimized on the basis of embodiment 1, and as one of preferable setting schemes in the present application, in the present embodiment, the housing 1 is specifically thinned, the number of the retaining walls is two, the retaining walls are respectively located at positions of opposite side edges of the housing 1, which are close to the first radio frequency interface 31 and the second radio frequency interface 32, and vertically extend inward to form a first retaining wall 12 and a second retaining wall 13 respectively; the free ends of the first retaining wall 12 and the second retaining wall 13 are not connected with any retaining edge; the first retaining wall 12 and the second retaining wall 13 divide the shielding cavity into a first mounting groove 14, a second mounting groove 15 and a third mounting groove 16. The PCB circuit board 3 comprises a baseband processor, a transceiver electrically connected with the baseband processor, and a low noise amplifier and a power amplifier electrically connected with the transceiver; the low noise amplifier is connected to a first radio frequency interface 31 and the power amplifier is connected to a second radio frequency interface 32. As shown in fig. 4 and 5, the PCB circuit board 3 is located at the position of the low noise amplifier connected to the first rf interface 31 and installed in the first mounting groove 14, the PCB circuit board 3 is located at the position of the power amplifier connected to the second rf interface 32 and installed in the second mounting groove 15, the baseband processor is installed in the third mounting groove 16 between the first mounting groove 14 and the second mounting groove 15, and the first retaining wall 12 and the second retaining wall 13 can achieve the working interference between different functional modules on the PCB circuit board 3, thereby achieving a better shielding effect and meeting higher EMC design requirements.

In this embodiment, in order to improve compatibility and reduce occupied space after installation, the first radio frequency interface 31 and the second radio frequency interface 32 adopt MCX-KYD 11, and the serial interface 33 adopts a 25pin board-to-board connector. In order to simultaneously take account of the overall dimension and the working performance of the module, preferably, the thickness of the PCB circuit board 3 is 1.1mm ± 0.1mm, and the external dimension of the case is 36mm × 42mm × 8 mm. In order to improve the external force resistance of the module and provide reliable shielding performance, in this embodiment, the box body is made of any one of aluminum alloy, magnesium alloy or stainless steel.

It should be noted that the above embodiment is only a representative setting manner of the present application, and other adaptive designs may be performed on the housing 1, and different PCB circuit boards 3 may have different shape designs and functional unit layouts, and those skilled in the art may adaptively increase or decrease the number of the retaining walls, change the length of the retaining walls, the shape, and other parameters, so as to better adapt to the design of the PCB circuit board 3, implement EMC optimization, and change the position models of the first radio frequency interface 31 and the second radio frequency interface 32, for example, to change to interfaces such as MMCX, SMA, SMP, and the like, if necessary; changing the position and the model design of the low-frequency connector, such as adopting other double-row connectors; the serial interface 33 is changed into a board-to-board connector or a module direct welding wire outlet mode. However, as long as the partition wall structure is mainly adopted to partition the shielding wall under the general inventive concept of the present application, the arrangement of the partition wall is substantially the same regardless of the kind of the partition wall, and the protection scope of the present application is included.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. The utility model provides a support big dipper RDSS module of many cards, includes the box body of encapsulation, its characterized in that: the box body consists of a shell (1) and a cover body (2) which are mutually covered and provided with internal shielding cavities, and a PCB (3) arranged in the shielding cavities, wherein the PCB (3) is connected with a first radio frequency interface (31) used for receiving signals, a second radio frequency interface (32) used for transmitting signals, a serial interface (33) used for communication and power supply, and a baseband processor containing a plurality of hard cards/soft cards; first radio frequency interface (31) and second radio frequency interface (32) set up in the side of box body and flush or embedded installation with the box body side to and set up serial interface (33) that are used for communication connection on PCB circuit board (3), set up on casing (1) and hold dodge mouth (11) of serial interface (33), the terminal surface of serial interface (33) flushes or is not higher than casing (1) surface 2 mm's position installation with the surface of casing (1).

2. The multi-card-supporting Beidou RDSS module according to claim 1, characterized in that: casing (1) is close to the inside sunken formation in lid (2) one side and is used for the installation the shielding cavity of PCB circuit board (3), shielding cavity has the flange all around, at least one position of flange extends to shielding cavity central authorities and forms and is used for shielding cavity divided barricade.

3. The multi-card-supporting Beidou RDSS module according to claim 2, characterized in that: the number of the retaining walls is two, the retaining walls are respectively positioned at the position, close to the opposite side edges of the first radio frequency interface (31) and the second radio frequency interface (32), of the shell (1) and vertically extend inwards to form a first retaining wall (12) and a second retaining wall (13); the free ends of the first retaining wall (12) and the second retaining wall (13) are not connected with any retaining side; the shielding cavity is divided into a first mounting groove (14), a second mounting groove (15) and a third mounting groove (16) by the first retaining wall (12) and the second retaining wall (13).

4. The multi-card-supporting Beidou RDSS module according to claim 3, characterized in that: the PCB circuit board (3) comprises a baseband processor, a transceiver electrically connected with the baseband processor, and a low noise amplifier and a power amplifier electrically connected with the transceiver; the low noise amplifier is connected with a first radio frequency interface (31), and the power amplifier is connected with a second radio frequency interface (32).

5. The multi-card-capable Beidou RDSS module according to any one of claims 1 to 4, characterized in that: the first radio frequency interface (31) and the second radio frequency interface (32) adopt MCX-KYD 11, and the serial interface (33) adopts a 25pin board-to-board connector.

6. The multi-card-capable Beidou RDSS module according to any one of claims 1 to 4, characterized in that: the thickness of the PCB circuit board (3) is 1.1mm +/-0.1 mm, and the external dimension of the box body is 36mm multiplied by 42mm multiplied by 8 mm.

7. The multi-card-supporting Beidou RDSS module according to claim 6, characterized in that: the box body is made of any one of aluminum alloy, magnesium alloy or stainless steel.