CN213878428U - Electronic device - Google Patents

Abstract

The application discloses electronic equipment includes: the device comprises a middle frame, a functional device and a signal transmission line; the inner side of the middle frame is provided with a sunken step structure, and the step structure is provided with a first grounding part; the functional device is arranged in the middle frame and close to the step structure, a protruding structure is arranged at the position of the functional device corresponding to the first grounding part, and a grounding groove is formed between the protruding structure and the step structure; the signal transmission line is provided with a second grounding part which is embedded in the grounding groove and is electrically connected with the first grounding part. The embodiment of the application can improve the processing efficiency of the middle frame, improve the grounding reliability of the signal transmission line, and can also increase the layout space of the functional device and improve the performance of the functional device.

Description

Electronic device

Technical Field

The application belongs to the technical field of communication, and particularly relates to an electronic device.

Background

With the development of communication technology, more and more antennas are arranged in electronic devices such as mobile phones and tablet computers. The number of signal transmission lines as a kind of transmission lines for transmitting antenna signals is increasing, and the role thereof is also becoming more important.

In the correlation technique, can be provided with the ground ring on the signal transmission line, can set up the ground connection draw-in groove on the center, through with ground ring joint in the ground connection draw-in groove, can realize switching on of signal transmission line and center to, can realize signal transmission line's ground connection.

In the process of implementing the present application, the applicant finds that at least the following problems exist in the prior art: the diameter of a cutter for machining the grounding clamping groove is small, so that the machining time of the grounding clamping groove is long easily, and the machining efficiency of the middle frame is low; in addition, the accuracy of the grounding card slot is difficult to control, so that poor grounding of the signal transmission line is easily caused. In addition, because the functional device inside the electronic equipment needs to avoid the space of the grounding card slot, the layout space of the functional device needs to be reduced, and the performance of the functional device is easily influenced.

Content of application

The present application aims to provide an electronic device, which at least solves one of the problems that the processing efficiency of a middle frame is low, the grounding of a signal transmission line is poor, the layout space of a functional device needs to be reduced, and the performance of the functional device is easily affected.

In order to solve the technical problem, the present application is implemented as follows:

an embodiment of the present application provides an electronic device, including: the device comprises a middle frame, a functional device and a signal transmission line; wherein the content of the first and second substances,

a sunken step structure is arranged on the inner side of the middle frame, and a first grounding part is arranged on the step structure;

the functional device is arranged in the middle frame and close to the step structure, a protruding structure is arranged at the position of the functional device corresponding to the first grounding part, and a grounding groove is formed between the protruding structure and the step structure;

the signal transmission line is provided with a second grounding part which is embedded in the grounding groove and is electrically connected with the first grounding part.

According to the electronic equipment provided by the embodiment of the application, the sunken step structure is arranged on the inner side of the middle frame, the first grounding part is arranged on the step structure, and the protruding structure is arranged on the functional device in the middle frame at the position corresponding to the first grounding part, so that the grounding groove can be formed between the protruding structure and the step structure. The second grounding part on the signal transmission line is embedded in the grounding groove, so that the signal transmission line can be grounded. Therefore, the design that the grounding clamping groove is arranged on the middle frame can be avoided, and the processing efficiency of the middle frame is improved. In addition, since the precision of the step structure is easy to control, the connection between the second grounding part and the grounding groove formed between the step structure and the protruding structure is reliable, and therefore, the grounding reliability of the signal transmission line can be improved. In addition, due to the fact that the design that the grounding clamping groove is arranged on the middle frame is avoided, the functional device does not need to avoid the space of the grounding clamping groove, and therefore the layout space of the functional device can be enlarged, and the performance of the functional device is improved.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic diagram of an electronic device according to the prior art;

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;

fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present application (without a signal transmission line mounted);

fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present application (where a signal transmission line is installed);

FIG. 5 is one of the cross-sectional views taken along line B-B of FIG. 4;

FIG. 6 is a second sectional view taken along line B-B of FIG. 4;

FIG. 7 is a cross-sectional view taken along line C-C of FIG. 3;

fig. 8 is a schematic structural diagram of another electronic device according to an embodiment of the present application (without a signal transmission line mounted);

FIG. 9 is a cross-sectional view taken along line D-D of FIG. 8;

fig. 10 is a schematic structural view of another electronic device according to the embodiment of the present application (where a signal transmission line is installed);

FIG. 11 is a schematic structural diagram of a functional device according to an embodiment of the present application;

fig. 12 is a schematic structural diagram of a metal insert according to an embodiment of the present application.

Reference numerals: 10-middle frame, 100-grounding card slot, 101-step structure, 1011-step side wall, 1012-step bottom wall, 11-functional device, 111-projection structure, 1111-projection, 1112-elastic arm, 1113-clamping wall, 1114-metal insert, 12-signal transmission line, 121-second grounding part and 13-grounding slot.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Referring to fig. 1, a schematic structural diagram of an electronic device in the related art is shown, and referring to fig. 2, a cross-sectional view taken along a line a-a in fig. 1 is shown. As shown in fig. 1 and 2, a grounding card slot 100 is disposed on the middle frame 10 of the electronic device, a second grounding portion 121 is disposed on the signal transmission line 12, and the second grounding portion 121 is clamped in the grounding card slot 100, so that the signal transmission line 12 can be conducted with the middle frame 10, and the signal transmission line 12 is grounded.

In the prior art, since the size of the ground card slot 100 is small and the width thereof is usually less than 0.65mm, the diameter of the tool for machining the ground card slot 100 is correspondingly small. For example, in practical applications, a milling cutter with a diameter of 0.60mm is usually used to machine the ground card slot 100 on the middle frame 10. Because the diameter of the tool for processing the grounding slot 100 is small, the processing time of the grounding slot 100 is easily long, and the processing efficiency of the middle frame 10 is low. Moreover, the diameter of the tool for machining the grounding card slot 100 is small, the machining size deviation is large, the precision of the grounding card slot 100 is difficult to control, and the size of the grounding card slot 100 is easy to be smaller or larger. When the size of the ground card slot 100 is small, the assembly of the signal transmission line 12 is difficult, and when the size of the ground card slot 100 is large, the ground fault of the signal transmission line 12 is likely to occur.

Moreover, since the functional device 11 is disposed in the middle frame 10, the functional device 11 needs to avoid the space of the ground card slot 100, and the layout space of the functional device 11 needs to be reduced, which may easily affect the performance of the functional device 11.

Referring to fig. 3, a schematic structural diagram of an electronic device according to an embodiment of the present application (no signal transmission line is mounted), referring to fig. 4, a schematic structural diagram of an electronic device according to an embodiment of the present application (signal transmission line is mounted), referring to fig. 5, one of cross-sectional views taken along line B-B in fig. 4 is shown, and referring to fig. 6, a second cross-sectional view taken along line B-B in fig. 4 is shown. The electronic device may specifically include: a middle frame 10, a functional device 11 and a signal transmission line 12; wherein the content of the first and second substances,

a sunken step structure 101 is arranged on the inner side of the middle frame 10, and a first grounding part is arranged on the step structure 101;

the functional device 11 is arranged in the middle frame 10 and close to the step structure 101, the functional device 11 is provided with a protruding structure 111 at a position corresponding to the first grounding part, and a grounding groove 13 is formed between the protruding structure 111 and the step structure;

the signal transmission line 12 is provided with a second grounding part 121, and the second grounding part 121 is embedded in the grounding slot 13 and electrically connected with the first grounding part.

In the embodiment of the present application, a sunken step structure 101 is disposed on the inner side of the middle frame 10, the step structure 101 is provided with a first ground portion, and a protruding structure 111 is disposed on the functional device 11 in the middle frame 10 at a position corresponding to the first ground portion, so that a ground slot 13 can be formed between the protruding structure 111 and the step structure 101. The second grounding part 121 on the signal transmission line 12 is embedded in the grounding groove 13, so that the signal transmission line 12 can be grounded. Therefore, the design of arranging the grounding clamping groove 100 on the middle frame 10 can be avoided, and the processing efficiency of the middle frame 10 is improved. In addition, since the accuracy of the stepped structure 101 is easily controlled, the connection between the ground groove 13 formed between the stepped structure 101 and the protruding structure 111 and the second ground portion 121 is also reliable, and therefore, the ground reliability of the signal transmission line 12 can be improved. In addition, because the design of arranging the grounding card slot 100 on the middle frame 10 is avoided, the functional device 11 does not need to avoid the space of the grounding card slot 100, so that the layout space of the functional device 11 can be increased, and the performance of the functional device 11 is improved.

Specifically, the middle frame 10 may be a structural body of the electronic device, and the functional device 11, the display screen, the rear shell, and the like of the electronic device may be mounted on the middle frame 10. The middle frame 10 may include a plurality of frames, and the plurality of frames may surround to form at least one accommodation space, and the functional device 11, the signal transmission line 12, and the like may be disposed in the accommodation space.

In the embodiment of the present application, the inner side of the middle frame 10 may specifically be a side of the frame close to the accommodating space, and the step structure 101 may be disposed on the inner side of the middle frame 10. Since the stepped structure 101 has an open structure, it can be machined with a large-diameter tool. In practical applications, since the diameter of the tool for machining the step structure 101 is larger, the machining time of the step structure 101 is shorter, and accordingly, the machining efficiency of the middle frame 10 can be higher. Moreover, since the diameter of the tool for machining the stepped structure 101 is large, the deviation of the machining dimension of the stepped structure 101 is small, and the precision of the stepped structure 101 is easy to control. Accordingly, the dimensional accuracy of the ground groove 13 formed between the stepped structure 101 and the projecting structure 111 is high, and the connection between the ground groove 13 and the second ground portion 121 is also reliable, so that the ground reliability of the signal transmission line 12 can be improved.

In this embodiment, the functional device 11 may be at least one of a shielding cover, a speaker box, and a circuit board cover plate. Due to the fact that the design that the grounding clamping groove 100 is arranged on the middle frame 10 is avoided, the functional device 11 does not need to avoid the space of the grounding clamping groove 100, and therefore the layout space of the functional device 11 can be enlarged, and the performance of the functional device 11 is improved.

For example, under the condition that functional device 11 is the loudspeaker box, because the loudspeaker box need not to dodge the design of ground connection draw-in groove 100, the volume of loudspeaker box can be designed great, like this, just can improve the play sound effect of loudspeaker box, promote user's tone quality and experience.

In this embodiment, the signal transmission line 12 may be a coaxial line, an electronic line, or other transmission line capable of transmitting an antenna signal, and the specific type of the signal transmission line 12 may not be limited in this embodiment.

Alternatively, the protrusion structure 111 may protrude toward the step structure 101, and the protrusion structure 111 is an elastic structure. Thus, when the protruding structure 111 and the step structure 101 are engaged with the second ground portion 121 together, the protruding structure 111 can be elastically deformed by a proper amount to adapt to the shape of the second ground portion 121, and the fault tolerance is good. Even in the case where a large amount of interference occurs between the second ground portion 121 and the ground groove 13, reliable connection therebetween can be achieved by elastic deformation of the projection structure 111, and reliable grounding of the signal transmission line 12 is achieved.

Referring to fig. 7, which shows a cross-sectional view taken along line C-C of fig. 3, the projection structure 111 may include a plurality of projections 1111 spaced apart from each other, as shown in fig. 7. Specifically, since the projection structure 111 is provided with a plurality of projections 1111 arranged at intervals, a gap exists between two adjacent projections 1111. In this way, the protruding portion 1111 can be easily elastically deformed, so that the elastic deformation amount and the fault tolerance of the entire protruding structure 111 can be improved, and further, the connection reliability between the second ground connection portion 121 and the ground groove 13 can be improved.

In some alternative implementations of the present application, the protrusion 1111 is a plastic protrusion. For example, the plastic protrusion may be made of plastic with elastic characteristics, such as silicon rubber, etc., so as to facilitate the elastic deformation of the protrusion 1111.

Alternatively, the ground groove 13 and the second ground portion 121 may be interference-fitted. In practical applications, the width of the ground groove 13 formed between the protruding structure 111 and the step structure 101 may be larger than the diameter of the second ground portion 121. When the second ground connection portion 121 needs to be embedded in the ground groove 13, the second ground connection portion 121 can be embedded in the ground groove 13 by elastic deformation of the protruding portion 1111, so that interference fit between the ground groove 13 and the second ground connection portion 121 is realized, and connection reliability between the ground groove 13 and the second ground connection portion 121 is improved.

In some optional implementations of the present application, the housing of the functional device 11 is a plastic housing, the protrusion 1111 is disposed on the sidewall of the plastic housing, and the protrusion 1111 and the plastic housing are an integrally formed structure. In practical application, the plastic housing and the protrusion 1111 may be formed by an integral injection molding process, so as to avoid forming the protrusion 1111 on the functional device 11 by an additional processing process, and improve the processing efficiency of the functional device 11.

Referring to fig. 8, a schematic structural diagram of another electronic device according to an embodiment of the present application (no signal transmission line is mounted), referring to fig. 9, a cross-sectional view taken along line D-D in fig. 8 is shown, and referring to fig. 10, a schematic structural diagram of another electronic device according to an embodiment of the present application (signal transmission line mounted) is shown. As shown in fig. 8 to 10, the protruding structure 111 is a metal claw, and the metal claw includes an elastic arm 1112 and a clamping wall 1113 connected in sequence, and the clamping wall 1113 is close to the step structure 101 and forms a grounding slot 13 with the step structure 101.

In practical applications, the clamping wall 1113 may be spaced apart from the sidewall of the step structure 101 to form a grounding groove 13 for clamping the grounding ring second grounding portion 121 together with the step structure 101. In the process of clamping the grounding ring second grounding portion 121, the elastic arm 1112 can be elastically deformed to adjust the distance between the clamping wall 1113 and the sidewall of the step structure 101, so that the fault tolerance is good. Even under the condition that the second grounding part 121 of the grounding ring has a large interference amount with the grounding slot 13, the second grounding part 121 of the grounding ring can still be reliably clamped between the clamping wall 1113 and the side wall of the stepped structure 101 through the elastic deformation of the elastic arm 1112, and the signal transmission line 12 can be reliably grounded.

Referring to fig. 11, a schematic structural diagram of a functional device according to an embodiment of the present application is shown, and a metal insert 1114 is disposed on the functional device 11. Referring to fig. 12, a schematic structural diagram of a metal insert according to an embodiment of the present application is shown, and as shown in fig. 12, the metal jaws and the metal insert 1114 are in an integral structure.

In practical application, the metal insert 1114 on the functional device 11 may be used to enhance the strength of the whole device, and the metal insert 1114 and the metal jaws may be formed by one-step processing through bending or stamping, so as to avoid forming the metal jaws on the functional device 11 through an additional processing process, thereby improving the processing efficiency of the functional device 11.

In other alternative embodiments of the present application, the step structure 101 may include a step sidewall 1011 and a step bottom wall 1012 connected to each other, and the ground connection portion first ground connection portion is disposed on the step sidewall 1011. Since the step sidewall 1011 and the protruding structure 111 can directly sandwich the ground ring second ground portion 121, the reliability of connection between the ground ring second ground portion 121 and the ground portion first ground portion can be improved by disposing the ground portion first ground portion on the step sidewall 1011, and further, the reliable grounding of the signal transmission line 12 can be realized.

Specifically, the first grounding portion may be a metal structure exposed on the middle frame 10. In practical applications, a cutting tool may be used to cut the middle frame 10 to expose a portion of the metal on the middle frame 10 to form the first grounding portion, and the grounding of the signal transmission line 12 may be achieved when the first grounding portion is electrically connected to the second grounding portion 121 of the grounding ring on the signal transmission line 12.

Specifically, the second ground portion 121 may be a ground ring clamped outside the signal transmission line 12, or may be a structure reserved on the signal transmission line 12 for grounding.

According to the electronic equipment of the embodiment of the application, the sunken step structure is arranged on the inner side of the middle frame, the first grounding part of the grounding part is arranged on the step structure, and the protruding structure is arranged on the functional device in the middle frame and corresponds to the first grounding part of the grounding part, so that the grounding groove can be formed between the protruding structure and the step structure. The second grounding part of the grounding ring on the signal transmission line is embedded in the grounding groove, so that the signal transmission line can be grounded. Therefore, the design that the grounding clamping groove is arranged on the middle frame can be avoided, and the processing efficiency of the middle frame is improved. In addition, because the precision of the step structure is easy to control, the connection between the grounding groove formed between the step structure and the protruding structure and the second grounding part of the grounding ring is also reliable, and therefore the grounding reliability of the signal transmission line can be improved. In addition, due to the fact that the design that the grounding clamping groove is arranged on the middle frame is avoided, the functional device does not need to avoid the space of the grounding clamping groove, and therefore the layout space of the functional device can be enlarged, and the performance of the functional device is improved.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. An electronic device, comprising: the device comprises a middle frame, a functional device and a signal transmission line; wherein the content of the first and second substances,

a sunken step structure is arranged on the inner side of the middle frame, and a first grounding part is arranged on the step structure;

the functional device is arranged in the middle frame and close to the step structure, a protruding structure is arranged at the position of the functional device corresponding to the first grounding part, and a grounding groove is formed by the protruding structure and the step structure;

the signal transmission line is provided with a second grounding part which is embedded in the grounding groove and is electrically connected with the first grounding part.

2. The electronic device of claim 1, wherein the protruding structure is a resilient structure.

3. The electronic device of claim 2, wherein the protruding structure comprises a plurality of spaced apart protruding portions.

4. The electronic device of claim 3, wherein the protrusion is a plastic protrusion.

5. The electronic device of claim 4, wherein the ground slot is in an interference fit with the second ground portion.

6. The electronic device according to claim 4, wherein the housing of the functional device is a plastic housing, the protrusion is disposed on a sidewall of the plastic housing, and the protrusion and the plastic housing are integrally formed.

7. The electronic device of claim 2, wherein the protruding structure is a metal claw, the metal claw comprises an elastic arm and a clamping wall, the elastic arm and the clamping wall are sequentially connected, the clamping wall is close to the step structure, and the clamping wall and the step structure form the grounding groove.

8. The electronic device of claim 7, wherein a metal insert is disposed on the functional device, and the metal claw and the metal insert are integrally formed.

9. The electronic device of claim 1, wherein the step structure comprises a step sidewall and a step bottom wall connected to each other, and the first ground portion is disposed on the step sidewall.

10. The electronic device according to any one of claims 1 to 9, characterized in that the functional means comprises: at least one of a shield cover, a horn box, and a circuit board cover.

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