CN217104132U - Circulation filter device of electroplating box - Google Patents

Abstract

The utility model provides a circulation filter equipment of electroplating tank, including rose box and electroplating tank, circulation rose box sets up on electroplating tank, electroplating tank includes electroplating bath, backward flow case and more than one connecting box, and the backward flow case is connected between adjacent connecting box, the plating bath sets up in the top of backward flow case and connecting box, and the rose box sets up the one end at the backward flow case, be equipped with the opening between backward flow case and the rose box, be equipped with the inclined plane that extends the setting downwards to the rose box slope from the other end of backward flow case on the bottom in the backward flow case, the inclined plane extends to the opening part setting, is equipped with the backward flow passageway between plating bath and backward flow case, the backward flow passageway sets up with the highest point on inclined plane correspondingly; by the structure, the situation that part of electrolyzed water is not smoothly flowed to the filter box and is always remained in the return tank, so that excessive impurities are accumulated in the return tank and the efficiency of circular flow of the electrolyzed water is finally influenced can be prevented.

Description

Circulation filter device of electroplating box

Technical Field

The utility model relates to an electroplating device loop filter technical field, concretely relates to electroplating box's loop filter.

Background

The copper electroplating process refers to the deposition of metallic copper by electrolytic methods on electroless copper layers to provide sufficient conductivity/thickness and to prevent thermal and mechanical defects in the conductive circuit. The principle of electroplating is that electroplating solution is added into an electroplating bath, a circuit board is used as a cathode, an anode is additionally arranged, and certain process adjustment is performed after electrification, so that a copper layer is attached to the circuit board.

Anodic oxidation, electrochemical oxidation of metal or alloy, and formation of an oxide film on the metal product (anode) by the action of the applied current under the corresponding electrolysis water and specific process conditions.

In the electroplating process, the electrolytic water is easy to generate impurities to cause poor electroplating quality, so that the electrolytic water needs to be continuously filtered during electroplating to ensure that the impurities of the electrolytic water are not excessive during electroplating.

Disclosure of Invention

The utility model provides a circulation filter equipment of electroplating box, through the utility model discloses a device for the filtration efficiency of electrolysis water is higher, makes the circulation flow of electrolysis water more smooth.

In order to achieve the above purpose, the technical scheme of the utility model is that: a filtering device of an electroplating box comprises a filtering box and the electroplating box, wherein the circulating filtering box is arranged on the electroplating box, the electroplating box comprises an electroplating tank, a backflow box and more than one connecting box, the backflow box is connected between adjacent connecting boxes, the electroplating box is arranged above the backflow box and the connecting boxes, the filtering box is arranged at one end of the backflow box, an opening is formed between the backflow box and the filtering box, an inclined plane which obliquely and downwardly extends from the other end of the backflow box to the filtering box is arranged at the bottom in the backflow box, the inclined plane extends to the opening, a backflow channel is arranged between the electroplating tank and the backflow box, and the backflow channel is arranged corresponding to the highest position of the inclined plane; and a filtering circulating pump is arranged on the filtering tank.

In the electroplating process, the electrolyzed water of the electroplating bath flows into the return tank from the return channel and then flows into the filter tank from the opening, and finally flows back to the electroplating bath after being filtered by the filtering circulating pump to realize the circulating action of the electrolyzed water, the electrolyzed water is filtered in the circulating process under the action of the filtering circulating pump, so that the electrolyzed water is ensured not to generate excessive impurities, when the electrolyzed water flows into the return tank, because the inclined surface is arranged in the return tank, the electrolyzed water falls from the highest position of the inclined surface under the action of the inclined surface in the circulating process of the electrolyzed water, and then the electrolyzed water can naturally flow downwards, so that the electrolyzed water in the return tank can smoothly flow to the filter tank, and the situation that partial electrolyzed water is always remained in the return tank due to the fact that the partial electrolyzed water cannot smoothly flow to the filter tank is prevented, and then excessive impurities are accumulated in the return tank is prevented, ultimately affecting the efficiency of the circulating flow of the electrolyzed water.

Furthermore, more than one through hole is arranged on two sides of the backflow box, connecting holes corresponding to the through holes are arranged on the connecting box, and the through holes are connected with the connecting holes through connecting pipelines. From this setting, link together the return-flow tank through the connecting box, can be when the unable normal cycle of electrolysis water of return-flow tank, electrolysis water inflow connecting box prevents that electrolysis water from overflowing.

Furthermore, a constant temperature device is arranged at the opening and extends into the reflux box, and the temperature of the electrolyzed water is controlled by the constant temperature device, so that the electrolyzed water is prevented from being overcooled or overheated in the electroplating process.

Furthermore, a water supply pump is arranged in the filter tank and extends into the return tank through a water supply pipe, so that the electrolytic water is consumed during electroplating, and the electrolytic water can be replenished at any time through the arrangement of the water supply pump.

Furthermore, an end cover is arranged at the top end of the filter box, and the condition of electrolyzed water in the filter box can be opened and checked at any time by arranging the end cover.

Furthermore, a circulating pipeline is arranged on the filtering and circulating pump, the circulating pipeline extends into the electroplating bath and is arranged, and electrolytic water is filtered by the filtering and circulating pump and then flows back to the electroplating bath through a circulating channel to realize the circulating action of the electrolytic water.

Drawings

Fig. 1 is a schematic view of the internal structure of the circulation filtering device of the present invention.

Fig. 2 is a schematic position diagram of the thermostat of the circulating filter device according to the present invention.

Fig. 3 is a schematic view of the connection between the return box and the connection box of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1 to 3, a circulation filtering device of an electroplating tank includes a filtering tank 1 and an electroplating tank 2, wherein the filtering tank 1 is disposed on the electroplating tank 2, the electroplating tank 2 includes an electroplating tank 21, a return tank 3 and more than one connecting tank 4, the return tank 3 is connected between adjacent connecting tanks 4, the electroplating tank 21 is disposed above the return tank 3 and the connecting tank 4, the filtering tank 1 is disposed at one end of the return tank 3, an opening 11 is disposed between the return tank 3 and the filtering tank 1, an inclined plane 10 extending downward from the other end of the return tank 3 to the filtering tank 1 is disposed at the bottom in the return tank 3, the inclined plane 10 extends to the opening 11, a return passage 22 is disposed between the electroplating tank 21 and the return tank 3, and the return passage 22 is disposed corresponding to the highest position of the inclined plane 10; a filtering circulating pump 5 is arranged on the filtering tank 1, a circulating pipeline 51 is arranged on the filtering circulating pump 5, and the circulating pipeline 51 extends into the electroplating bath 21; according to the arrangement, through the arrangement of the filtering and circulating pump, the electrolyzed water flows back to the electroplating bath through the circulating channel after being filtered by the filtering and circulating pump, so that the circulating action of the electrolyzed water is realized. In this embodiment, a plating apparatus for performing a plating operation on a metal product is placed in the plating tank, and in particular, the prior art will not be described below.

In the electroplating process, water of the electroplating bath flows into the return tank 3 from the return passage 22 and then flows into the filter tank 1 from the opening 11, and finally flows back to the electroplating bath 21 through the circulation passage 51 after being filtered by the filter circulation pump 5 to realize the circulation action of the electrolyzed water, the electrolyzed water is filtered in the circulation process through the function of the filter circulation pump 5, so that the electrolyzed water is prevented from generating excessive impurities, when the electrolyzed water flows into the return tank 3, because the inclined surface 10 is arranged in the return tank 3, in the circulation process of the electrolyzed water, the electrolyzed water falls from the highest position of the inclined surface 10 through the function of the inclined surface 10, and then the electrolyzed water can naturally flow downwards, so that the electrolyzed water in the return tank 3 can smoothly flow to the filter tank 1, and the situation that part of the electrolyzed water cannot smoothly flow to the filter tank 1 to cause the part of the electrolyzed water to be always remained in the return tank 3 is prevented, thereby causing excessive accumulation of impurities in the return tank 3 and eventually affecting the efficiency of the circulation flow of the electrolyzed water.

As shown in fig. 3, at least one through hole 31 is provided at both sides of the return tank 3, a connection hole 41 corresponding to the through hole 31 is provided at the connection tank 4, and the through hole 31 and the connection hole 41 are connected to each other by a connection pipe 30. With this arrangement, the return tanks 3 are connected together by the connecting tank 4, and when the electrolyzed water in the return tanks 3 cannot be circulated normally, the electrolyzed water flows into the connecting tank 4, thereby preventing the electrolyzed water from overflowing.

As shown in fig. 2, a thermostatic device 6 is arranged at the opening 11, the thermostatic device 6 extends into the return tank 3, and the electrolytic water is subjected to temperature control through the thermostatic device 6, so that the electrolytic water is prevented from being overcooled or overheated in the electroplating process. In the present embodiment, the thermostat is a common device for controlling temperature variation, specifically, the prior art, and will not be described in detail below.

A water supply pump 7 is further provided in the filter tank 1, and the water supply pump 7 is extended into the return-only tank 3 through a water supply pipe (not shown), so that the electrolytic water is consumed during electroplating, and the electrolytic water can be replenished at any time through the arrangement of the water supply pump 7.

An end cover 8 is arranged at the top end of the filter box 1, and the condition of electrolyzed water in the filter box 1 can be opened and checked at any time by arranging the end cover 8.

Claims (6)

1. The utility model provides a circulation filter equipment of electroplating tank, includes rose box and electroplating tank, the rose box sets up on electroplating tank, its characterized in that: the electroplating tank comprises an electroplating tank, a backflow tank and more than one connecting tank, the backflow tank is connected between adjacent connecting tanks, the electroplating tank is arranged above the backflow tank and the connecting tanks, the filter tank is arranged at one end of the backflow tank, an opening is formed between the backflow tank and the filter tank, an inclined plane which is obliquely and downwardly extended from the other end of the backflow tank to the filter tank is arranged at the bottom in the backflow tank, the inclined plane is extended to the opening, a backflow channel is arranged between the electroplating tank and the backflow tank, and the backflow channel is arranged corresponding to the highest position of the inclined plane; and a filtering circulating pump is arranged on the filtering tank.

2. A circulating filter device of a plating tank as set forth in claim 1, wherein: more than one through hole is arranged on two sides of the backflow box, connecting holes corresponding to the through holes are arranged on the connecting box, and the through holes are mutually connected with the connecting holes through connecting pipelines.

3. A circulating filter device of a plating tank as set forth in claim 1, wherein: a constant temperature device is arranged at the opening and extends into the reflux box.

4. A circulating filter device of a plating tank as set forth in claim 1, wherein: and a water supply pump is also arranged in the filter tank and extends into the return tank through a water supply pipe.

5. A circulating filter device of a plating tank according to claim 4, characterized in that: an end cover is arranged at the top end of the filter box.

6. A circulating filter device of a plating tank as set forth in claim 1, wherein: and a circulating pipeline is arranged on the filtering circulating pump and extends into the electroplating bath.

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