CN217097163U

CN217097163U - Burnishing device is used in production of monocrystalline silicon polished wafer

Info

Publication number: CN217097163U
Application number: CN202220059767.1U
Authority: CN
Inventors: 李长坤; 谢永奕
Original assignee: Guangdong Sifeng Semiconductor Co ltd
Current assignee: Guangdong Sifeng Semiconductor Co ltd
Priority date: 2022-01-11
Filing date: 2022-01-11
Publication date: 2022-08-02
Anticipated expiration: 2032-01-11

Abstract

The utility model relates to a burnishing device is used in monocrystalline silicon polished wafer production, comprises a workbench, the bottom fixedly connected with motor of workstation, the output shaft fixedly connected with of motor are located the blowing board of inner chamber of the body, be provided with the centre gripping subassembly on the blowing board, the centre gripping subassembly includes the mounting panel of fixed mounting in blowing board upper surface, and the inboard swing joint of mounting panel has the turning block, and the outside swing joint of turning block has the grip block, two fixedly connected with fixed axle between the grip block, the inboard threaded connection of fixed axle has one end and blowing board swing joint's threaded rod, the outside fixedly connected with catch bar of turning block, the last fixed surface of blowing board is connected with the connecting block. This burnishing device is used in monocrystalline silicon polished wafer production through having set up the centre gripping subassembly, makes its user can carry out the centre gripping to the machined part through promoting the handle, can adjust the height of centre gripping through the threaded rod, makes it carry out the centre gripping in the face of the machined part of different thickness.

Description

Burnishing device is used in production of monocrystalline silicon polished wafer

Technical Field

The utility model relates to a monocrystalline silicon polished wafer processing technology field specifically is a burnishing device is used in monocrystalline silicon polished wafer production.

Background

The polishing sheet is prepared by mixing nano-scale silicon dioxide particles with a high-efficiency adhesive, uniformly coating the mixture on the surface of a polyester film, and drying and curing the mixture.

At present, a plurality of devices for polishing the monocrystalline silicon polishing piece are available in the market, but the existing polishing device is unstable in fixing a workpiece and complicated in clamping.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a burnishing device is used in monocrystalline silicon polished wafer production possesses quick centre gripping, adjusts advantages such as according to thickness, has solved fixed unstability, and the centre gripping is also more loaded down with trivial details problem moreover.

In order to achieve the above object, the utility model provides a following technical scheme: a polishing device for producing a monocrystalline silicon polishing piece comprises a workbench, wherein the upper surface of the workbench is fixedly connected with an organism, an electric push rod is fixedly arranged on the top wall of the inner cavity of the machine body, a polishing disc is fixedly connected at the telescopic shaft of the electric push rod, the bottom of the workbench is fixedly connected with a motor, an output shaft of the motor is fixedly connected with a discharging plate positioned in the inner cavity of the machine body, the discharging plate is provided with a clamping assembly, the clamping assembly comprises a mounting plate fixedly mounted on the upper surface of the discharging plate, the inner side of the mounting plate is movably connected with a rotating block, the outer side of the rotating block is movably connected with two clamping plates, a fixed shaft is fixedly connected between the two clamping plates, the inner side of the fixed shaft is in threaded connection with a threaded rod, one end of the threaded rod is movably connected with the discharging plate, the outside fixedly connected with catch bar of turning block, the last fixed surface of blowing board is connected with the connecting block.

Furthermore, the upper surface of the workbench is provided with a guide rail, and the guide rail is in a round shape.

Further, the electric push rod is located in the middle of the machine body and corresponds to the motor.

Furthermore, the bottom fixedly connected with quantity of blowing board is the sliding block of two, and the inside swing joint of sliding block has the ball with the guide rail contact.

Further, the quantity of mounting panel is two, and is the symmetric distribution, the spout has been seted up to the upper surface of mounting panel.

Further, the top fixedly connected with handle of threaded rod, the bottom of threaded rod is connected with the blowing board through the bearing.

Compared with the prior art, the technical scheme of the application has the following beneficial effects:

this burnishing device is used in monocrystalline silicon polished wafer production through having set up the centre gripping subassembly, makes its user can carry out the centre gripping to the machined part through promoting the handle, can adjust the height of centre gripping through the threaded rod, makes it carry out the centre gripping in the face of the machined part of different thickness.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic view of the structure clamping assembly of the present invention.

In the figure: 1 workbench, 11 guide rails, 2 machine bodies, 3 electric push rods, 4 polishing discs, 5 motors, 6 discharging plates, 61 sliding blocks, 62 balls, 7 clamping components, 71 mounting plates, 711 sliding grooves, 72 rotating blocks, 73 clamping plates, 74 fixed shafts, 75 threaded rods, 751 handles, 76 push rods and 77 connecting blocks.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the polishing apparatus for producing polished monocrystalline silicon slices in this embodiment includes a workbench 1, a guide rail 11 is disposed on an upper surface of the workbench 1, the guide rail 11 is in a "circular" shape, a machine body 2 is fixedly connected to the upper surface of the workbench 1, an electric push rod 3 is fixedly mounted on a top wall of an inner cavity of the machine body 2, a polishing disc 4 is fixedly connected to a telescopic shaft of the electric push rod 3, a motor 5 is fixedly connected to a bottom of the workbench 1, the motor 5 penetrates through the workbench 1 and the machine body 2 and extends to the inside, the electric push rod 3 is located at a middle position of the machine body 2 and corresponds to the motor 5, a discharge plate 6 located in the inner cavity of the machine body 2 is fixedly connected to an output shaft of the motor 5, two sliding blocks 61 are fixedly connected to the bottom of the discharge plate 6, the bottom of the sliding blocks 61 is concave, a ball 62 in contact with the guide rail 11 is movably connected to the inside of the sliding blocks 61, the material placing plate 6 is provided with a clamping assembly 7.

In this embodiment, the clamping assembly 7 includes a mounting plate 71 fixedly mounted on the upper surface of the material placing plate 6, the mounting plate 71 is provided with two mounting plates 71, the mounting plates 71 are symmetrically distributed, the upper surface of the mounting plate 71 is provided with a sliding groove 711, the inner side of the mounting plate 71 is movably connected with a rotating block 72, the rotating block 72 is positioned at the inner side of the sliding groove 711, the outer side of the rotating block 72 is movably connected with two clamping plates 73, a fixed shaft 74 is fixedly connected between the two clamping plates 73, the middle position of the fixed shaft 74 is provided with a threaded hole, the inner side of the fixed shaft 74 is in threaded connection with a threaded rod 75, one end of the threaded rod is movably connected with the material placing plate 6, the threaded rod 75 is positioned at the inner side of the threaded hole, the top of the threaded rod 75 is fixedly connected with a handle 751, the bottom end of the threaded rod 75 is connected with the material placing plate 6 through a bearing, the outer side of the rotating block 72 is fixedly connected with a pushing rod 76, the upper surface of the material placing plate 6 is fixedly connected with a connecting block 77, the top end of the connecting block 77 is concave and is clamped with the push rod 76.

It should be noted that, the above-mentioned is a clamping assembly, and the user can rapidly clamp the workpiece by the cooperation of the clamping plate 73 and the fixed shaft 74.

The working principle of the embodiment is as follows:

when a user polishes the monocrystalline silicon polished wafer, the workpiece is placed on the discharging plate 6, the pushing rod 76 is lifted upwards to be separated from the connecting block 77, the threaded rod 75 is rotated through the handle 751, the threaded rod 75 is rotated, the fixing shaft 74 and the clamping plate 73 are synchronously driven to descend, the front end of the clamping plate 73 is in contact with the workpiece, then the pushing rod 76 is pressed downwards to be clamped with the connecting block 77 to finish fixing, the workpiece cannot loosen in the processing process, and the effect of rapid clamping is achieved.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a burnishing device is used in monocrystalline silicon polished wafer production, includes workstation (1), its characterized in that: the upper surface of the workbench (1) is fixedly connected with a machine body (2), the top wall of the inner cavity of the machine body (2) is fixedly provided with an electric push rod (3), a telescopic shaft of the electric push rod (3) is fixedly connected with a polishing disc (4), the bottom of the workbench (1) is fixedly connected with a motor (5), an output shaft of the motor (5) is fixedly connected with a material discharging plate (6) positioned in the inner cavity of the machine body (2), and a clamping assembly (7) is arranged on the material discharging plate (6);

centre gripping subassembly (7) are including mounting panel (71) of fixed mounting in blowing board (6) upper surface, and the inboard swing joint of mounting panel (71) has turning block (72), and the outside swing joint of turning block (72) has grip block (73) that quantity is two, two fixedly connected with fixed axle (74) between grip block (73), the inboard threaded connection of fixed axle (74) has one end and blowing board (6) swing joint's threaded rod (75), the outside fixedly connected with catch bar (76) of turning block (72), the last fixed surface of blowing board (6) is connected with connecting block (77).

2. The polishing apparatus for producing a polished silicon wafer for single crystal silicon as set forth in claim 1, wherein: the upper surface of the workbench (1) is provided with a guide rail (11), and the guide rail (11) is round.

3. The polishing apparatus for producing a polished silicon wafer for single crystal silicon as set forth in claim 1, wherein: the electric push rod (3) is positioned in the middle of the machine body (2) and corresponds to the motor (5).

4. The polishing apparatus for producing a polished silicon wafer for single crystal silicon as set forth in claim 1, wherein: the bottom of the material discharging plate (6) is fixedly connected with two sliding blocks (61), and the inside of each sliding block (61) is movably connected with a ball (62) which is in contact with the guide rail (11).

5. The polishing apparatus for producing a polished silicon wafer for single crystal silicon as set forth in claim 1, wherein: the quantity of mounting panel (71) is two, and is the symmetric distribution, spout (711) have been seted up to the upper surface of mounting panel (71).

6. The polishing apparatus for producing a polished silicon wafer for single crystal silicon as set forth in claim 1, wherein: the top of the threaded rod (75) is fixedly connected with a handle (751), and the bottom end of the threaded rod (75) is connected with the discharging plate (6) through a bearing.