CN217096072U - Reflow soldering machine for integrated circuit packaging - Google Patents
Reflow soldering machine for integrated circuit packaging Download PDFInfo
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- CN217096072U CN217096072U CN202220308127.XU CN202220308127U CN217096072U CN 217096072 U CN217096072 U CN 217096072U CN 202220308127 U CN202220308127 U CN 202220308127U CN 217096072 U CN217096072 U CN 217096072U
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- bin
- fixedly connected
- reflow soldering
- soldering machine
- storehouse
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Abstract
The utility model relates to a reflow soldering machine is used in integrated circuit encapsulation, including supporting the storehouse, the outside fixed mounting who supports the storehouse has the reflow soldering machine main part, the outside fixedly connected with supporting leg of supporting the storehouse, the inboard fixed mounting who supports the storehouse has the processing assembly, the processing assembly includes one end and the fan that supports the inside wall fixed connection in storehouse, the inside wall fixedly connected with supporting shoe that supports the storehouse, the inside swing joint of supporting shoe has one end to run through and extend to the active carbon plate who supports the storehouse outside, the inside wall fixedly connected with installation piece that supports the storehouse. This integrated circuit encapsulation is with reflow soldering machine adsorbs the dust of reflow soldering machine main part inside to supporting in the storehouse through the fan that starts, makes the dust blockked by the filter plate, and the dust after blockking, then can be fallen to play ash pipe department by the electric putter drive brush fixture block brush that starts and drop to reach the effect of the clearance dust of being convenient for.
Description
Technical Field
The utility model relates to a reflow soldering machine technical field specifically is a reflow soldering machine is used in integrated circuit encapsulation.
Background
Reflow soldering machines, also known as reflow soldering machines or "reflow ovens," are devices that reliably join surface mount components and PCB pads together through solder paste alloys by providing a heated environment that melts the solder paste.
The conventional reflow soldering machine is inconvenient for collecting and processing generated dust when an integrated circuit is packaged, so that the manual cleaning is needed, the workload of workers is increased, and the accumulated dust can influence the normal operation of the reflow soldering machine, so that the problem is solved by the reflow soldering machine for packaging the integrated circuit.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a reflow soldering machine is used in integrated circuit encapsulation possesses the advantage such as the clearance dust of being convenient for, has solved the problem of the clearance dust of being not convenient for.
In order to achieve the above object, the utility model provides a following technical scheme: a reflow soldering machine for integrated circuit packaging comprises a supporting bin, wherein a main body of the reflow soldering machine is fixedly installed on the outer side of the supporting bin, supporting legs are fixedly connected to the outer side of the supporting bin, and a processing assembly is fixedly installed on the inner side of the supporting bin;
the treatment component comprises a fan with one end fixedly connected with the inner side wall of the supporting bin, the inner side wall of the supporting bin is fixedly connected with a supporting block, the inside of the supporting block is movably connected with an activated carbon plate with one end penetrating and extending to the outer side of the supporting bin, the inner side wall of the supporting bin is fixedly connected with an installation block, the inside of the installation block is movably connected with a filter plate with one end penetrating and extending to the outer side of the supporting bin, the inner side wall of the supporting bin is fixedly connected with an electric push rod, the outer side of the electric push rod is fixedly connected with a telescopic rod, the outer side of the telescopic rod is fixedly connected with a brush block, an extrusion spring is fixedly connected between the brush block and the outer side of the telescopic rod, the inner side wall of the supporting bin is fixedly provided with a rotating component, the outer side of the supporting bin is fixedly connected with an ash discharge pipe, and the front sides of the filter plate and the activated carbon plate are both fixedly connected with limiting blocks, the front of supporting the storehouse is rotated and is connected with quantity and runs through and extend to the turning block in two stopper outsides respectively for two and one end.
Furthermore, a rectangular through hole is formed in the front side wall of the inner cavity of the supporting bin, the specification of the rectangular through hole is matched with that of the activated carbon plate, a through hole is formed in the front side wall of the inner cavity of the supporting bin, the specification of the through hole is matched with that of the filter plate, and sealing rubber strips are fixedly connected to the outer sides of the filter plate and the activated carbon plate.
Further, the telescopic link comprises a sleeve bin and a slide bar sliding in the sleeve bin, the slide bar is T-shaped, the T-shaped end of the slide bar is positioned on the inner side of the sleeve bin, and the other end of the slide bar extends through and extends to the outer side of the sleeve bin and the outer side of the brush block to be fixedly connected.
Furthermore, ash through holes are formed in the top wall of the inner cavity of the supporting bin and the bottom wall of the inner cavity of the main body of the reflow soldering machine, and an air inlet is formed in the outer side of the main body of the reflow soldering machine.
Furthermore, a limiting groove is formed in the outer side of the limiting block, and the specification of the limiting groove is matched with that of the rotating block.
Furthermore, the rotating assembly comprises a mounting hole formed in one end of the rotating assembly and used for supporting the inner side wall of the bin, a baffle plate located on the supporting bin is hinged to the inner side of the mounting hole, a fixing block is fixedly connected to the outer side of the supporting bin, and a connecting spring is fixedly connected between the fixing block and the outer side of the baffle plate.
Further, the air outlet has been seted up to the left side wall that supports the storehouse inner chamber, the ash hole of one end and ash pipe intercommunication is seted up to the diapire that supports the storehouse inner chamber, both sides are the slope form around the ash hole, the outside fixed mounting of ash pipe has the valve.
Compared with the prior art, the technical scheme of the application has the following beneficial effects:
1. this integrated circuit encapsulation is with reflow soldering machine adsorbs the dust of reflow soldering machine main part inside to supporting in the storehouse through the fan that starts, makes the dust blockked by the filter plate, and the dust after blockking, then can be fallen to play ash pipe department by the electric putter drive brush fixture block brush that starts and drop to reach the effect of the clearance dust of being convenient for.
2. This integrated circuit encapsulation is with reflow soldering machine, through rotatory turning block and stopper separation back, can come to stimulate filter plate and active carbon board through the stopper and clear up or change, and be convenient for staff jack-up through promoting the baffle and clear up the inside accumulational dust in support storehouse.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the structure of the treating assembly of the present invention;
fig. 3 is a front view of the supporting bin structure of the present invention.
In the figure: the device comprises a support bin 1, support legs 2, a processing assembly 3, a fan 31, a support block 32, a telescopic rod 33, an electric push rod 34, a rotating assembly 35, a fixed block 351, a connecting spring 352, a mounting hole 353, a baffle 354, an ash discharge pipe 36, an extrusion spring 37, a brush block 38, a filter plate 39, a mounting block 310, an activated carbon plate 311, a rotating block 312, a limiting block 313 and a reflow soldering machine main body 4.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, a reflow soldering machine for packaging an integrated circuit in this embodiment includes a supporting bin 1, a main body 4 of the reflow soldering machine is fixedly installed at an outer side of the supporting bin 1, supporting legs 2 are fixedly connected to an outer side of the supporting bin 1, and a processing assembly 3 is fixedly installed at an inner side of the supporting bin 1.
In this embodiment, handle the produced dust in the reflow soldering machine main part 4 through being located the inside processing assembly 3 in support storehouse 1, reduce staff's work load to and reduce the inside accumulational dust of reflow soldering machine main part 4.
Referring to fig. 2-3, in the present embodiment, the processing assembly 3 includes a fan 31 having one end fixedly connected to the inner sidewall of the supporting bin 1, the inner sidewall of the supporting bin 1 is fixedly connected to a supporting block 32, the supporting block 32 is movably connected to an activated carbon plate 311 having one end penetrating and extending to the outside of the supporting bin 1, the inner sidewall of the supporting bin 1 is fixedly connected to an installation block 310, the installation block 310 and the supporting block 32 are U-shaped, the installation block 310 is movably connected to a filtering plate 39 having one end penetrating and extending to the outside of the supporting bin 1, the inside of the filtering plate 39 is fixedly connected to a filter screen, the inner sidewall of the supporting bin 1 is fixedly connected to an electric push rod 34, the outside of the electric push rod 34 is fixedly connected to a telescopic rod 33, the outside of the telescopic rod 33 is fixedly connected to a brush block 38, an extrusion spring 37 is fixedly connected between the brush block 38 and the outside of the telescopic rod 33, and the inner sidewall of the supporting bin 1 is fixedly installed with a rotating assembly 35, the outer side of the support bin 1 is fixedly connected with an ash outlet pipe 36, the front surfaces of the filter plates 39 and the activated carbon plates 311 are fixedly connected with limit blocks 313, and the front surface of the support bin 1 is rotatably connected with two rotating blocks 312, wherein one end of each rotating block is penetrated through and extends to the outer sides of the two limit blocks 313.
In this embodiment, after the started fan 31 adsorbs the dust inside the reflow soldering machine main body 4 to the supporting bin 1, the dust can be blocked by the filter plate 39, and then the electric push rod 34 is started to drive the brush block 38 to move, so as to clean the blocked dust.
Wherein, the front side wall of the inner cavity of the supporting bin 1 is provided with a rectangular through hole, the specification of the rectangular through hole is matched with that of the activated carbon plate 311, the front side wall of the inner cavity of the supporting bin 1 is provided with a through hole, the specification of the through hole is matched with that of the filter plate 39, and the outer sides of the filter plate 39 and the activated carbon plate 311 are fixedly connected with sealing rubber strips.
In addition, the telescopic rod 33 is composed of a sleeve bin and a slide rod sliding in the sleeve bin, the slide rod is T-shaped, the T-shaped end of the slide rod is positioned at the inner side of the sleeve bin, and the other end of the slide rod extends through and extends to the outer side of the sleeve bin to be fixedly connected with the outer side of the brush block 38, so that the slide rod can slide in the sleeve bin.
Secondly, the roof of the inner chamber of the support bin 1 and the bottom wall of the inner chamber of the reflow soldering machine main body 4 are both provided with dust through holes, and the outer side of the reflow soldering machine main body 4 is provided with an air inlet to form a loop.
Then, the outside of the limiting block 313 is provided with a limiting groove, and the specification of the limiting groove is matched with that of the rotating block 312, so that the filter plate 39 and the activated carbon plate 311 can be conveniently fixed or detached by workers.
Next, the rotating assembly 35 includes that one end is opened up and is supported mounting hole 353 on the inboard wall of storehouse 1, and the inboard of mounting hole 353 is articulated to have and is located the baffle 354 that supports on the storehouse 1, supports the outside fixedly connected with fixed block 351 of storehouse 1, and fixedly connected with connecting spring 352 between the outside of fixed block 351 and baffle 354 makes things convenient for the staff to promote baffle 354 clearance support storehouse 1 regularly.
Finally, the left side wall of the inner cavity of the supporting bin 1 is provided with an air outlet, the bottom wall of the inner cavity of the supporting bin 1 is provided with an ash outlet, one end of the ash outlet is communicated with the ash outlet pipe 36, the front side and the rear side of the ash outlet are inclined, and the outer side of the ash outlet pipe 36 is fixedly provided with a valve.
The working principle of the above embodiment is as follows:
after the fan 31 is started, the dust in the main body 4 of the reflow soldering machine can be adsorbed into the supporting bin 1 through the dust through holes on the supporting bin 1 and the main body 4 of the reflow soldering machine, and the dust adsorbed into the supporting bin 1 can be blocked by the filter screen on the filter plate 39, then the started electric push rod 34 drives the brush block 38 to move left and right through the telescopic rod 33, the extruded connecting spring 37 can always push the brush block 38 to be attached to the filter plate 39, so that the dust can be brushed to the upper part of the dust outlet pipe 36, then the valve on the dust outlet pipe 36 is opened, the dust can fall out of the dust outlet pipe 36 along the dust outlet on the supporting bin 1, the electric push rod 34 which is reset after cleaning can drive the brush block 38 to stay above the filter plate 39, and an operator can clean the dust remained in the supporting bin 1 by regularly pushing the baffle 354, and after the dust is separated from the limit block 313 through rotating the rotating block 312, the filter plate 39 and the activated carbon plate 311 are drawn to clean or replace, when the filter plate 39 is replaced, the electric push rod 34 can be started to drive the brush block 38 to the upper part of the right mounting block 310, so that the effect of cleaning dust conveniently is achieved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A reflow soldering machine for integrated circuit packaging comprises a supporting bin (1), and is characterized in that: a reflow soldering machine main body (4) is fixedly installed on the outer side of the supporting bin (1), the supporting legs (2) are fixedly connected to the outer side of the supporting bin (1), and a processing assembly (3) is fixedly installed on the inner side of the supporting bin (1);
the treatment component (3) comprises a fan (31) with one end fixedly connected with the inner side wall of the support bin (1), the inner side wall of the support bin (1) is fixedly connected with a support block (32), the inner part of the support block (32) is movably connected with an activated carbon plate (311) with one end penetrating through and extending to the outer side of the support bin (1), the inner side wall of the support bin (1) is fixedly connected with an installation block (310), the inner part of the installation block (310) is movably connected with a filter plate (39) with one end penetrating through and extending to the outer side of the support bin (1), the inner side wall of the support bin (1) is fixedly connected with an electric push rod (34), the outer side of the electric push rod (34) is fixedly connected with a telescopic rod (33), the outer side of the telescopic rod (33) is fixedly connected with a brush block (38), and an extrusion spring (37) is fixedly connected between the brush block (38) and the outer side of the telescopic rod (33), the utility model discloses a filter house, including support storehouse (1), the inside wall fixed mounting who supports storehouse (1) has runner assembly (35), the outside fixedly connected with ash pipe (36) of support storehouse (1), the equal fixedly connected with stopper (313) in front of filter plate (39) and activated carbon plate (311), the front rotation that supports storehouse (1) is connected with quantity and runs through and extend to turning block (312) in two stopper (313) outsides respectively for two and one end.
2. The reflow soldering machine for integrated circuit packages according to claim 1, wherein: the filter plate is characterized in that a rectangular through hole is formed in the front side wall of the inner cavity of the supporting bin (1), the specification of the rectangular through hole is matched with that of the activated carbon plate (311), a through hole is formed in the front side wall of the inner cavity of the supporting bin (1), the specification of the through hole is matched with that of the filter plate (39), and sealing rubber strips are fixedly connected to the outer sides of the filter plate (39) and the activated carbon plate (311).
3. The reflow soldering machine for integrated circuit packages according to claim 1, wherein: the telescopic link (33) comprises a sleeve bin and a sliding rod sliding in the sleeve bin, the sliding rod is T-shaped, the T-shaped end of the sliding rod is positioned on the inner side of the sleeve bin, and the other end of the sliding rod extends through and extends to the outer side of the sleeve bin and the outer side of the brush block (38) to be fixedly connected.
4. The reflow soldering machine for integrated circuit packages according to claim 1, wherein: the dust through holes are formed in the top wall of the inner cavity of the supporting bin (1) and the bottom wall of the inner cavity of the reflow soldering machine main body (4), and the air inlet is formed in the outer side of the reflow soldering machine main body (4).
5. The reflow soldering machine for integrated circuit packages according to claim 1, wherein: the outer side of the limiting block (313) is provided with a limiting groove, and the specification of the limiting groove is matched with that of the rotating block (312).
6. The reflow soldering machine for integrated circuit packages according to claim 1, wherein: the rotating assembly (35) comprises a mounting hole (353) with one end arranged on the inner side wall of the supporting bin (1), a baffle (354) located on the supporting bin (1) is hinged to the inner side of the mounting hole (353), a fixing block (351) is fixedly connected to the outer side of the supporting bin (1), and a connecting spring (352) is fixedly connected between the fixing block (351) and the outer side of the baffle (354).
7. The reflow soldering machine for integrated circuit packages according to claim 1, wherein: the air outlet has been seted up to the left side wall that supports storehouse (1) inner chamber, the ash hole of one end and ash pipe (36) intercommunication is seted up to the diapire that supports storehouse (1) inner chamber, both sides are the slope form around the ash hole, the outside fixed mounting of ash pipe (36) has the valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220308127.XU CN217096072U (en) | 2022-02-16 | 2022-02-16 | Reflow soldering machine for integrated circuit packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220308127.XU CN217096072U (en) | 2022-02-16 | 2022-02-16 | Reflow soldering machine for integrated circuit packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217096072U true CN217096072U (en) | 2022-08-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220308127.XU Active CN217096072U (en) | 2022-02-16 | 2022-02-16 | Reflow soldering machine for integrated circuit packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217096072U (en) |
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2022
- 2022-02-16 CN CN202220308127.XU patent/CN217096072U/en active Active
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