CN217086533U

CN217086533U - Storage chip's leveling device in advance

Info

Publication number: CN217086533U
Application number: CN202220399210.2U
Authority: CN
Inventors: 吴清平
Original assignee: Chengdu Liyuan Single Chip Microcomputer Technology Co ltd
Current assignee: Chengdu Liyuan Single Chip Microcomputer Technology Co ltd
Priority date: 2022-02-25
Filing date: 2022-02-25
Publication date: 2022-07-29
Anticipated expiration: 2032-02-25

Abstract

The utility model relates to a storage chip technical processing technical field discloses a storage chip's leveling device in advance, comprises an operation bench, the top fixedly connected with frame of operation panel, set up two the same screw holes in the frame, two equal screwed connection has the threaded rod in the threaded hole, the bottom of threaded rod is provided with the clamp plate, fixedly connected with telescopic link between clamp plate and the frame, the outside cover of telescopic link is equipped with first spring. The utility model discloses a flattening groove is placed the chip, then twists the threaded rod and promote briquetting and chip contact, then observe the pressure of control briquetting that the pressure display screen can be accurate to the chip, adjust the temperature of the accurate control hot plate of temperature adjustment switch simultaneously, further improvement different chips are at the effect of flattening to can make a round trip the flattening to two chips, thereby can carry out the flattening to the chip in succession, the efficiency of further improvement chip flattening, it is comparatively practical, be fit for extensively promoting and using.

Description

Storage chip's leveling device in advance

Technical Field

The utility model relates to a storage chip technical processing technical field specifically is a storage chip's leveling device in advance.

Background

After traditional memory chip product compression molding, warpage phenomenon can appear through natural cooling, seriously influences the processing of follow-up product to need carry out the level and smooth of product, generally through placing the product the oven toasts, be heated, then utilize flat board or iron plate to exert pressure in the one side of product through the manual work, make the product keep leveling.

In the prior patent (publication number: CN201721806262.2), a pre-leveling device for a memory chip replaces the traditional manual pre-leveling process by the design of a containing groove and a projection, so that the product is heated and pre-leveled, the labor cost is reduced, the production efficiency of the product is greatly improved, and the reject ratio of the product is reduced.

In the process of implementing the present invention, the inventor finds that at least the following problems exist in the prior art and are not solved: because the different applied pressures of different chips during the flattening can obtain better flattening effect, and the pressing pressure of the existing bump pressing which can not be accurately controlled, the effect of different chips in the flattening is poor, and therefore, the pre-flattening device of the memory chip is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a storage chip's leveling device in advance has solved the problem that proposes in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: a pre-leveling device of a storage chip comprises an operation table, wherein the top of the operation table is fixedly connected with a frame, the frame is provided with two same threaded holes, threaded rods are spirally connected in the two threaded holes, the bottom of each threaded rod is provided with a pressing plate, a telescopic rod is fixedly connected between the pressing plate and the frame, the outer side of the telescopic rod is sleeved with a first spring, the bottom of the pressing plate is provided with a pressing block, the bottom of the pressing block is provided with a pressure sensor, the left side and the right side of the top of the operation table are provided with leveling grooves, heating plates are arranged in the leveling grooves, the top of the frame is provided with a pressure display screen, the left end of the operation table is provided with a temperature regulating switch, the left end of the operation table is provided with a controller, the output end of the pressure sensor is electrically connected with the input end of the controller through a wire, the output end of the controller is electrically connected with the input end of the pressure display screen through a wire, the output end of the temperature adjusting switch is electrically connected with the input end of the heating plate through a wire.

As an embodiment of the present invention, the second spring is installed to the inner chamber bottom of the leveling groove, the top fixedly connected with heat insulating board of second spring, the hot plate is installed on the heat insulating board.

As a preferred embodiment of the present invention, the top of the pressing plate is provided with a notch, and the threaded rod is inserted into the notch.

As a preferred embodiment of the utility model, the bottom of the operation platform is provided with a non-slip mat.

As a preferred embodiment of the present invention, a hand-held rod is installed on the top of the threaded rod.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model relates to a storage chip's leveling device in advance, through the threaded rod, the screw hole, pressing plates, the briquetting, pressure sensor, the telescopic link, first spring, the leveling groove, the switch adjusts the temperature, the setting of pressure display screen and hot plate, the leveling inslot is arranged in with the chip, then twist the threaded rod and promote briquetting and chip contact, then observe the control briquetting that pressure display screen can be accurate to the pressure of chip, adjust the temperature of the accurate control hot plate of switch that adjusts the temperature simultaneously, further improvement different chips are at the effect of flattening, and can make a round trip to the flattening of two chips, thereby can carry out the flattening to the chip in succession, the efficiency of further improvement chip flattening.

2. The utility model relates to a storage chip's flattening device in advance through the setting of second spring to the upside in flattening groove is promoted automatically to the chip after the flattening, thereby the convenience is taken the chip, and the heat insulating board can reduce the heat transmission of hot plate and influence the life of second spring on the second spring simultaneously.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a front view of a pre-leveling apparatus for a memory chip according to the present invention;

fig. 2 is a top view of the pressing plate of the pre-leveling device of the memory chip of the present invention.

In the figure: 1. an operation table; 2. a frame; 3. a telescopic rod; 4. a first spring; 5. pressing a plate; 6. briquetting; 7. a pressure sensor; 8. a controller; 9. a non-slip mat; 10. a second spring; 11. a heat insulation plate; 12. leveling the groove; 13. heating plates; 14. a temperature adjusting switch; 15. a pressure display screen; 16. a hand-held wand; 17. a threaded rod; 18. a threaded hole; 19. a notch.

Detailed Description

Referring to fig. 1-2, the present invention provides a technical solution: a pre-leveling device for a memory chip comprises an operation table 1, wherein the top of the operation table 1 is fixedly connected with a frame 2, the frame 2 is provided with two same threaded holes 18, threaded rods 17 are spirally connected in the two threaded holes 18, a pressing plate 5 is arranged at the bottom of the threaded rod 17, an expansion rod 3 is fixedly connected between the pressing plate 5 and the frame 2, a first spring 4 is sleeved outside the expansion rod 3, a pressing block 6 is arranged at the bottom of the pressing plate 5, a pressure sensor 7 is arranged at the bottom of the pressing block 6, leveling grooves 12 are respectively arranged at the left side and the right side of the top of the operation table 1, heating plates 13 are arranged in the leveling grooves 12, a pressure display screen 15 is arranged at the top of the frame 2, a temperature regulating switch 14 is arranged at the left end of the operation table 1, a controller 8 is arranged at the left end of the operation table 1, and the output end of the pressure sensor 7 is electrically connected with the input end of the controller 8 through a wire, the output end of the controller 8 is electrically connected with the input end of the pressure display screen 15 through a lead, the output end of the temperature adjusting switch 14 is electrically connected with the input end of the heating plate 13 through a conducting wire, the chip is arranged in the leveling groove 12 through the arrangement of the threaded rod 17, the threaded hole 18, the pressing plate 5, the pressing block 6, the pressure sensor 7, the telescopic rod 3, the first spring 4, the leveling groove 12, the temperature adjusting switch 14, the pressure display screen 15 and the heating plate 13, then the threaded rod 17 is screwed to push the pressing block 6 to contact with the chip, then the pressure of the pressing block 6 on the chip can be accurately controlled by observing the pressure display screen 15, meanwhile, the temperature of the heating plate 13 is accurately controlled by adjusting the temperature adjusting switch 14, the leveling effect of different chips is further improved, and can make a round trip the flattening to two chips to can carry out the flattening to the chip in succession, further improvement chip flattening's efficiency.

In this embodiment (please refer to fig. 1), the second spring 10 is installed at the bottom end of the inner cavity of the leveling groove 12, the heat insulating plate 11 is fixedly connected to the top of the second spring 10, the heating plate 13 is installed on the heat insulating plate 11, and the leveled chip is automatically pushed to the upper side of the leveling groove 12 through the arrangement of the second spring 10, so that the chip is conveniently taken out, and meanwhile, the heat insulating plate 11 can reduce the influence on the heat transmission of the heating plate 13 to the second spring 10 on the service life of the second spring 10.

In this embodiment (see fig. 2), a notch 19 is formed in the top of the pressing plate 5, the threaded rod 17 is inserted into the notch 19, and the threaded rod 17 is inserted into the notch 19 to increase the contact stability between the threaded rod 17 and the pressing plate 5.

In this embodiment (please refer to fig. 1), the bottom of the console 1 is installed with a non-slip pad 9, and the placing stability of the console 1 is increased by the non-slip pad 9.

In this embodiment (see fig. 1), a hand-held rod 16 is installed on the top of the threaded rod 17, and the threaded rod 17 is conveniently screwed by the hand-held rod 16.

It should be noted that the utility model relates to a pre-leveling device for memory chips, which comprises an operation table 1, a frame 2, an expansion link 3, a spring 4, a pressing plate 5, a pressing block 6, a pressure sensor 7, a controller 8, a non-slip mat 9, a spring 10, a heat insulation board 11, a leveling groove 12, a heating plate 13, a temperature adjusting switch 14, a pressure display screen 15, a hand-held rod 16, a threaded rod 17, a threaded hole 18 and a notch 19, wherein the components are all universal standard components or components known by technicians in the field, the structure and principle of the pre-leveling device can be known by technical manuals or conventional experimental methods, when the pre-leveling device works, firstly, the stability of the operation table 1 is increased by the non-slip mat 9, then the chip is arranged in the leveling groove 12, then the threaded rod 17 is twisted to push the pressing block 6 to contact with the chip, the threaded rod 17 is inserted into the notch 19 to increase the stability of the contact of the threaded rod 17 and the pressing plate 5, then observe the pressure of control briquetting 6 that pressure display screen 15 can be accurate to the chip, adjust the temperature of the accurate control hot plate 13 of the switch 14 that adjusts the temperature simultaneously, further different chips of improvement are at the effect of flattening, and can make a round trip the flattening to two chips, thereby can carry out the flattening to the chip in succession, further efficiency of improvement chip flattening, after the flattening, the upside that the second spring promoted flattening groove 12 with the chip is automatic behind briquetting 6 break away from the chip, thereby conveniently take the chip, heat insulating board 11 can reduce the heat transmission of hot plate 13 and influence the life of second spring 10 on the second spring 10 simultaneously.

Claims

1. A pre-leveling device for a memory chip, comprising an operation table (1), characterized in that: the top of the operating table (1) is fixedly connected with a rack (2), two same threaded holes (18) are formed in the rack (2), threaded rods (17) are spirally connected in the two threaded holes (18), a pressing plate (5) is arranged at the bottom of the threaded rods (17), a telescopic rod (3) is fixedly connected between the pressing plate (5) and the rack (2), a first spring (4) is sleeved on the outer side of the telescopic rod (3), a pressing block (6) is installed at the bottom of the pressing plate (5), a pressure sensor (7) is installed at the bottom of the pressing block (6), leveling grooves (12) are formed in the left side and the right side of the top of the operating table (1), heating plates (13) are arranged in the leveling grooves (12), a pressure display screen (15) is installed at the top of the rack (2), and a temperature adjusting switch (14) is installed at the left end of the operating table (1), controller (8) are installed to the left end of operation panel (1), the input electric connection of wire and controller (8) is passed through to the output of pressure sensor (7), the input electric connection of wire and pressure display screen (15) is passed through to the output of controller (8), the input electric connection of wire and hot plate (13) is passed through to the output of temperature regulating switch (14).

2. The pre-leveling device of a memory chip as claimed in claim 1, wherein: the improved energy-saving heating device is characterized in that a second spring (10) is installed at the bottom end of an inner cavity of the leveling groove (12), a heat insulation plate (11) is fixedly connected to the top of the second spring (10), and the heating plate (13) is installed on the heat insulation plate (11).

3. The pre-leveling device of a memory chip as claimed in claim 1, wherein: the top of the pressing plate (5) is provided with a notch (19), and the threaded rod (17) is inserted into the notch (19).

4. The pre-leveling device of a memory chip as claimed in claim 1, wherein: and the bottom of the operating platform (1) is provided with an anti-skid pad (9).

5. The pre-leveling device of a memory chip as claimed in claim 1, wherein: and a handheld rod (16) is arranged at the top of the threaded rod (17).