CN217085623U

CN217085623U - Electronic equipment frame

Info

Publication number: CN217085623U
Application number: CN202220666656.7U
Authority: CN
Inventors: 刘壁鑫
Original assignee: Fulian Yuzhan Technology Shenzhen Co Ltd
Current assignee: Fulian Yuzhan Technology Shenzhen Co Ltd
Priority date: 2022-03-24
Filing date: 2022-03-24
Publication date: 2022-07-29
Anticipated expiration: 2032-03-24

Abstract

The utility model provides an electronic equipment frame, including a first part and a second part, the first part is connected in the inboard of second part, has seted up the first groove of moulding plastics on the second part, and the concave second groove of moulding plastics that is equipped with of the position that the first part corresponds the first groove of moulding plastics, and the second is moulded plastics the groove and is linked together with the first groove of moulding plastics, and the lateral wall in the first groove of moulding plastics is all concave to be equipped with the spread groove, and electronic equipment frame still includes injection moulding in the first groove of moulding plastics, spread groove and second filler of moulding plastics the inslot. The first groove of moulding plastics is seted up through on the second part to foretell electronic equipment frame, the concave second groove of moulding plastics that is equipped with in the position that the first part corresponds the first groove of moulding plastics, and the first groove lateral wall of moulding plastics all is concave to be equipped with the spread groove, first groove of moulding plastics, the second is moulded plastics the groove and the spread groove and is moulded plastics the plastic and form the filling member after, can prevent effectively that the filling member is not hard up, and can not take place great change through the thickness of a plurality of CNC processing procedure processing back spread groove department filling member, can not appear collapsing gluey problem.

Description

Electronic equipment frame

Technical Field

The utility model relates to a frame processing technology field, especially an electronic equipment frame.

Background

At present, the frame of some electronic devices is manufactured by metal and plastic molding processes. The frame is formed by connecting two plates, a gap is arranged on one plate, and a connecting groove communicated with the gap is arranged at the joint of the two plates, so that the gap and the connecting groove are subjected to injection molding, and the plastic and the frame are precisely combined. But the frame after moulding plastics still needs to process through a plurality of CNC processing procedures, because the spread groove is more shallow, subsequent processing can make the plastic of spread groove department thinner, and the structure of plastic part is comparatively fragile, under the circumstances of repeated machining, chemical corrosion, very easily appears collapsing gluey problem, not only influences the outward appearance of frame, collapses the deformation that appears after gluey in addition or protruding assembly that directly can influence the frame.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is desirable to provide a bezel of an electronic device to solve the problem that the plastic portion of the conventional bezel is prone to glue collapse.

The embodiment of the utility model provides an electronic equipment frame, including a first part and a second part, the first part is connected in the inboard of second part, seted up first injection molding groove on the second part, the position that the first part corresponds the first injection molding groove is concave to be equipped with the second injection molding groove, and second injection molding groove and first injection molding groove are linked together, the lateral wall of first injection molding groove all is concave to be equipped with the spread groove; the electronic equipment frame further comprises a filling piece which is injection molded in the first injection molding groove, the connecting groove and the second injection molding groove.

In some embodiments, the connecting groove includes a first connecting portion recessed in a side wall of the first injection molding groove, and a second connecting portion recessed in a wall surface of the first connecting portion and extending through the second part toward an inner side surface of the first part.

In some embodiments, the first connection portion includes a first cambered groove bottom and two first cambered groove walls connected to each other, the two first cambered groove walls are disposed on two opposite sides of the first cambered groove bottom, and the second connection portion is recessed in the first cambered groove bottom.

In some embodiments, two of the first arc chute walls are symmetrically disposed about the second connection portion.

In some embodiments, the extending direction of the second connection portion is perpendicular to the wall surface of the connection groove.

In some embodiments, the second injection molding groove has the same width as the first injection molding groove, and the second injection molding groove includes an inclined groove bottom and two second planar groove walls connected to each other, and the two second planar groove walls are disposed on two opposite sides of the inclined groove bottom and respectively connected to two side walls of the first injection molding groove.

In some embodiments, the inclined groove bottom has an included angle ranging from 68 ° to 72 ° with a plane of an end edge of the first member perpendicular to an inner side wall of the second member.

In some embodiments, the second injection molding groove has a farthest distance from the surface of the first component to the second component in a range of 0.5cm to 0.65 cm.

In some embodiments, the side wall of the first injection molding groove is further provided with first fixing grooves in a concave manner, the first fixing grooves and the connecting grooves are arranged at intervals in a direction perpendicular to the first component, and a second fixing groove is arranged on the other surface of the first component at a position corresponding to the first fixing groove.

In some embodiments, the filling member is adapted to the shape of the first injection molding groove, the second injection molding groove, the first fixing groove and the second fixing groove, and is disposed in the first injection molding groove, the second injection molding groove, the first fixing groove and the second fixing groove.

Foretell electronic equipment frame is through having seted up the first groove of moulding plastics on the second part, the concave second groove of moulding plastics that is equipped with in the position that the first part corresponds the first groove of moulding plastics, and the first groove lateral wall of moulding plastics all is equipped with the spread groove, the first groove of moulding plastics, the second is moulded plastics the groove and the spread groove and is moulded plastics the plastic and form the filler after, the plastic of spread groove department can strengthen the cohesion of plastic and frame, can prevent effectively that the filler is not hard up, and the thickness of the filler of spread groove department can not take place great change after a plurality of CNC processing procedures processing, the problem that can not appear collapsing gluey.

Drawings

Fig. 1 is a schematic perspective view of a bezel of an electronic device according to an embodiment of the present disclosure.

Fig. 2 is an enlarged structural view of the first and second injection grooves of fig. 1.

Fig. 3 is an exploded schematic view of a bezel of an electronic device according to an embodiment of the present disclosure.

Fig. 4 is an enlarged view of the packing of fig. 3 at another angle.

Description of the main elements

Electronic device bezel 100

First part 10

End edge 11

Edge 21

Second injection molding groove 12

Inclined trough bottom 122

Second planar slot wall 124

Upper surface 126

Second fixing groove 14

Second part 20

First injection molding groove 22

Connecting groove 24

First connection portion 242

First cambered groove bottom 2422

First cambered groove wall 2424

Second connecting portion 244

Second cambered groove bottom 2442

First planar slot wall 2444

First fixing groove 26

Filling element 30

Main body 31

First boss 32

Second convex portion 33

First projection 34

Second projection 35

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

The embodiments of the present application will be further described with reference to the drawings attached to the specification.

Referring to fig. 1, an embodiment of the present invention provides a frame 100 of an electronic device, which can avoid poor appearance and assembly risk caused by glue collapse of thin glue on an important assembly surface, and can satisfy waterproof requirements of customers, wherein the electronic device includes but is not limited to a mobile phone, a tablet, a car recorder, an electronic book, an MP4, and other devices. The electronic device bezel 100 includes a first section 10 and a second section 20.

The first part 10 is connected to the inner side of the second part 20, the second part 20 is provided with a first injection molding groove 22, the first injection molding groove 22 extends from the edge 21 of the second part 20 to the end edge 11 connected with the first part 10, and the side wall of the first injection molding groove 22 is provided with a connecting groove 24 in a concave manner.

In one embodiment, the first member 10 and the second member 20 are both frame structures, and the first member 10 is disposed on the inner side surface of the second member 20. The second part 20 is provided with a plurality of first injection moulded slots 22 and corresponding attachment slots 24 along its circumferential direction.

Thus, after the first injection molding groove 22 and the connecting groove 24 are used for injection molding plastic to form the filling member 30, the bonding force between the filling member 30 (shown in fig. 3) and the electronic device frame 100 can be ensured, the filling member 30 can be effectively prevented from loosening, and the thickness of the filling member 30 at the connecting groove 24 cannot be greatly changed after being processed by a plurality of CNC processes, so that the problem of glue collapse cannot occur.

Referring to fig. 2, in some embodiments, the connecting groove 24 includes a first connecting portion 242 and a second connecting portion 244, the first connecting portion 242 is concavely disposed on a sidewall of the first injection groove 22, and the second connecting portion 244 is concavely disposed on a wall surface of the first connecting portion 242 and penetrates through an inner side surface of the second part 20 facing the first part 10, so as to facilitate molding and exhausting, and avoid a situation of insufficient plastic filling. So, inject plastics in first groove 22 and the connecting groove 24 of moulding plastics and form the packing 30 after, can guarantee the cohesion of packing 30 with electronic equipment frame 100 through first connecting portion 242 and the structural design of second connecting portion 244, can prevent that packing 30 is not hard up, and the second part 20 is better with packing 30's combination stability.

In some embodiments, first connection portion 242 includes a first slot bottom 2422 and two first slot walls 2424 connected, wherein the two first slot walls 2424 are disposed on opposite sides of first slot bottom 2422, and wherein second connection portion 244 is recessed within first slot bottom 2422. Therefore, the groove bottom and the groove wall of the first connecting portion 242 are both designed to be arc-surface structures, so that the injection molding structure of the first connecting portion 242 is full, and the glue pulling force of the filling member 30 can be further increased.

The second connecting portion 244 includes a second arc groove bottom 2442 and two first plane groove walls 2444 connected to each other, the two first plane groove walls 2444 are disposed on opposite sides of the second arc groove bottom 2442, and the second arc groove bottom 2442 and the two first plane groove walls 2444 are connected to the first arc groove bottom 2422. Thus, the groove bottom of the second connecting portion 244 is designed to be an arc-surface-shaped structure, so that the injection molding structure of the second connecting portion 244 is full, and the glue pulling force of the filling member 30 can be further increased.

In some embodiments, two first slot cambered surfaces 2424 are symmetrically arranged about the second connecting portion 244, that is, the second connecting portion 244 is recessed at the middle position of the first slot cambered surface 2422, so that the glue pulling force of the filling element 30 is consistent when the filling element is subjected to upward or downward force.

In some embodiments, the extending direction of the second connecting portion 244 is perpendicular to the wall surface of the connecting groove 24, so that the second connecting portion 244 can be processed more conveniently, and the connection stability of the partial filling member 30 corresponding to the second connecting portion 244 and the partial filling member 30 corresponding to the first connecting portion 242 can be ensured to be better.

In some embodiments, the first component 10 is recessed with a second injection groove 12 corresponding to the first injection groove 22, the second injection groove 12 is communicated with the first injection groove 22, and the second injection groove 12 has the same width as the first injection groove 22. Thus, by injecting plastic into the first injection groove 22 and the second injection groove 12 to form the filler 30, the bonding force between the filler 30 and the first and

second components

10 and 20 can be increased, and the filler 30 is prevented from falling off due to external impact. In this embodiment, the second injection molding groove 12 and the first injection molding groove 22 are arranged to have the same width and are communicated with each other, so that the second injection molding groove 12 is convenient to process, and a small gap between the first part 10 and the second part 20 is avoided due to the convenience, and further the problem of thin glue is avoided.

With continued reference to fig. 2, in some embodiments, the second injection molding groove 12 includes an inclined groove bottom 122 and two second planar groove walls 124 connected to each other, the two second planar groove walls 124 are disposed on two opposite sides of the inclined groove bottom 122 and are respectively connected to two side walls of the first injection molding groove 22, an included angle β between the inclined groove bottom 122 and a plane where the end edge 11 of the first component 10 is located is in a range of 68 ° to 72 °, and the plane where the end edge 11 of the first component 10 is located is perpendicular to an inner side wall of the second component 20. Therefore, the structure of the part of the filling part 30 formed after the injection molding of the second injection molding groove 12 can be ensured to be full, and the problem of thin glue can not occur. In the present exemplary embodiment, the angle β between the inclined groove base 122 and the plane of the end edge 11 of the first component 10 is preferably 70 °.

In some embodiments, the furthest distance d of the second injection molded groove 12 from the second component 20 at the surface of the first component 10 is in the range of 0.5cm to 0.65 cm. So, can guarantee the structural strength of second part, and also can guarantee that the second moulds plastics the plastic volume in groove 12 enough, and further guarantee the cohesion between filler 30 and first part 10, the second part 20, prevent that filler 30 from receiving external force to strike and droing. Illustratively, in the present embodiment, the farthest distance d of the second injection molding groove 12 from the second component 20 on the surface of the first component 10 is preferably 0.58 cm.

Referring to fig. 3, in some embodiments, the sidewall of the first injection molding groove 22 is further concavely provided with a first fixing groove 26, the first fixing groove 26 and the connecting groove 24 are spaced apart in the Z-axis direction, the other surface of the first member 10 is provided with a second fixing groove 14 at a position corresponding to the first fixing groove 26, and the second fixing groove 14 and the second injection molding groove 12 are spaced apart in the Z-axis direction. Thus, by injecting plastic into the first injection molding groove 22, the second injection molding groove 12, the first fixing groove 26 and the second fixing groove 14 to form the filling member 30, the bonding force between the filling member 30 and the first and

second members

10 and 20 can be further increased, and the requirements of the frame on the performances of falling resistance, tensile resistance and the like can be met.

Illustratively, in this embodiment, the groove structures on the first and

second components

10, 20 are machined with a 0 ° T-knife.

In some embodiments, referring to fig. 4, the electronic device bezel 100 further includes a filling member 30, the filling member 30 includes a main body 31, two first protruding portions 32, two second protruding portions 33, a first protruding portion 34, and a second protruding portion 35, and the main body 31 is an elongated shape corresponding to the shape and size of the first injection molding groove 22. The two first protruding portions 32 are respectively disposed on two opposite sides of the main body portion 31, and are respectively formed in the two first connecting portions 242 of the second component 20 by injection molding. A second protrusion 33 is disposed on a side of the first protrusion 32 away from the main body 31, and is formed in the second connecting portion 244 of the second component 20 by injection molding. The first protrusion 34 and the second protrusion 35 are disposed at an interval along the Z-axis direction on a side of the main body 31 close to the first component 10, and the first protrusion 34 is located above the second protrusion 35, wherein the first protrusion 34 is formed in the second injection groove 12 of the second component 20 by injection molding, and the second protrusion 35 is formed in the first fixing groove 26 of the second component 20 and the second fixing groove 14 of the first component 10 by injection molding. In this way, by forming the filling member 30 by injecting plastic into the first injection groove 22, the second injection groove 12, the first connection portion 242, the second connection portion 244, the first fixing groove 26, and the second fixing groove 14, the coupling force between the filling member 30 and the first and

second members

10 and 20 can be further increased, and the filling member 30 can be prevented from falling off by an external force.

Foretell electronic equipment frame 100 is through having seted up the first groove 22 of moulding plastics on second part 20, and the first groove 22 lateral wall of moulding plastics all is concave to be equipped with connecting groove 24, mould plastics the plastic at the first groove 22 of moulding plastics and connecting groove 24 and form filler 30 after, the plastic of connecting groove 24 department can strengthen the cohesion of plastic and electronic equipment frame 100, can prevent effectively that filler 30 is not hard up, and through a plurality of CNC processing procedures processing back connecting groove 24 department filler 30's thickness can not take place great change, the problem of collapsing to glue can not appear.

The utility model discloses a move the T groove structure to the lateral wall of second part 20 on completely to whole processing is in place at 0, can optimize and simplify the structural feature of multi-angle and complicacy by a relatively large margin, reduces the processing degree of difficulty, makes structure and size all obtain guaranteeing relatively easily. Compared with the current electronic equipment frame, the structure of each region formed after injection molding in the groove is full, the occurrence of glue collapse during processing is effectively avoided, the problem of 'stubborn' of glue collapse existing in the past is effectively improved, and the design can meet the requirements of related ORT (on Reliability testing) testing performance while the requirement of waterproof grade design is guaranteed.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims

1. An electronic device frame is characterized by comprising a first part and a second part, wherein the first part is connected with the inner side of the second part,

the second part is provided with a first injection molding groove, the position of the first part corresponding to the first injection molding groove is concavely provided with a second injection molding groove, the second injection molding groove is communicated with the first injection molding groove, and the side wall of the first injection molding groove is concavely provided with a connecting groove;

the electronic equipment frame further comprises a filling piece which is injection molded in the first injection molding groove, the connecting groove and the second injection molding groove.

2. The electronic device bezel of claim 1,

the connecting groove comprises a first connecting portion and a second connecting portion, the first connecting portion is concavely arranged on the side wall of the first injection molding groove, the second connecting portion is concavely arranged on the wall surface of the first connecting portion and penetrates through the inner side surface of the first component towards the second component.

3. The electronic device bezel of claim 2, wherein the first connection portion comprises a first cambered groove bottom and two first cambered groove walls connected, the two first cambered groove walls being disposed on opposite sides of the first cambered groove bottom, the second connection portion being recessed in the first cambered groove bottom.

4. The electronic device bezel of claim 3,

the two first cambered surface groove walls are symmetrically arranged relative to the second connecting part.

5. The electronic device bezel of claim 2,

the extending direction of the second connecting part is perpendicular to the wall surface of the connecting groove.

6. The electronic device bezel of claim 1,

the second mould plastics the groove with the first groove width of moulding plastics is the same, the second groove of moulding plastics is including the slope tank bottom and two second plane cell walls that are connected, two the second plane cell wall is located the relative both sides in slope tank bottom, and respectively with two lateral walls in the first groove of moulding plastics are connected.

7. The electronic device bezel of claim 6,

the included angle range between the inclined groove bottom and the plane where the end edge of the first component is located is 68-72 degrees, and the plane where the end edge of the first component is located is perpendicular to the inner side wall of the second component.

8. The electronic device bezel of claim 6,

the farthest distance of the second injection molding groove from the surface of the first component to the second component ranges from 0.5cm to 0.65 cm.

9. The electronic device bezel of claim 6, wherein the sidewalls of the first molding groove are each further recessed with a first fixing groove, the first fixing groove and the connecting groove are spaced apart in a direction perpendicular to the first component, and a second fixing groove is formed on the other surface of the first component at a position corresponding to the first fixing groove.

10. The electronic device bezel of claim 9, wherein the filler is adapted to the shape of the first molding groove, the second molding groove, the first fixing groove and the second fixing groove and is disposed in the first molding groove, the second molding groove, the first fixing groove and the second fixing groove.