CN217044466U - Conductive copper foil mechanism - Google Patents
Conductive copper foil mechanism Download PDFInfo
- Publication number
- CN217044466U CN217044466U CN202220883983.8U CN202220883983U CN217044466U CN 217044466 U CN217044466 U CN 217044466U CN 202220883983 U CN202220883983 U CN 202220883983U CN 217044466 U CN217044466 U CN 217044466U
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- copper foil
- overlap joint
- joint portion
- hard
- soft
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Abstract
The utility model relates to a conductive copper foil mechanism, it includes the hard copper foil body and the soft copper foil body, the one end of the hard copper foil body is provided with hard copper foil overlap joint portion, the one end of the soft copper foil body is provided with soft copper foil overlap joint portion, hard copper foil overlap joint portion is in the same place with soft copper foil overlap joint portion overlap joint, all be provided with the riveting hole in hard copper foil overlap joint portion and the soft copper foil overlap joint portion, riveting hole position in the hard copper foil overlap joint portion with riveting hole position in the soft copper foil overlap joint portion is corresponding, riveting hole on hard copper foil overlap joint portion and the soft copper foil overlap joint portion is downthehole to be used for with rivet that hard copper foil overlap joint portion and soft copper foil overlap joint portion are in the same place. The conductive copper foil mechanism combines the hard copper foil and the soft copper foil together for use, and the combination of the hard copper foil and the soft copper foil is firm.
Description
Technical Field
The utility model relates to a conductive copper foil mechanism.
Background
The copper foil can be used as a conductive material, and meanwhile, some copper foils also have a shielding effect. The copper foil can be divided into a hard copper foil and a soft copper foil according to the difference of hardness, the hard copper foil is generally used for shielding and heat conduction, the soft copper foil is mostly used for conduction, the properties of the hard copper foil and the soft copper foil can be used simultaneously in some products, the combination of the hard copper foil and the soft copper foil is needed, and how to conveniently connect the hard copper foil and the soft copper foil together needs to be considered.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a conductive copper foil mechanism, this conductive copper foil mechanism use stereoplasm copper foil and soft copper foil combination together, and the combination of stereoplasm copper foil and soft copper foil is firm.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a conductive copper foil mechanism, includes the hard copper foil body and the soft copper foil body, the one end of the hard copper foil body is provided with hard copper foil overlap joint portion, the one end of the soft copper foil body is provided with soft copper foil overlap joint portion, hard copper foil overlap joint portion is in the same place with soft copper foil overlap joint portion overlap joint, all be provided with the riveting hole on hard copper foil overlap joint portion and the soft copper foil overlap joint portion, riveting hole position on the hard copper foil overlap joint portion with the riveting hole position on the soft copper foil overlap joint portion is corresponding, it is used for with to have in the riveting hole on hard copper foil overlap joint portion and the soft copper foil overlap joint portion the rivet that hard copper foil overlap joint portion and soft copper foil overlap joint portion riveted together.
Preferably, the hard copper foil overlapping part is in a notch shape, the soft copper foil overlapping part is in a step shape, and the hard copper foil overlapping part is matched with the soft copper foil overlapping part.
Preferably, the hard copper foil body includes the integrated last mounting panel that sets up and the lower folded plate of bending downwards, it is perpendicular with lower folded plate to go up the mounting panel.
Preferably, the lower flap is provided with a first mounting hole.
Preferably, the soft copper foil body comprises a connecting plate part and a bent plate part, and the connecting plate part is perpendicular to the bent plate part.
Preferably, a second mounting hole is formed in the flap portion.
Preferably, the upper surface of going up the mounting panel after the overlap joint is the upper surface parallel and level with the linking plate portion, the overlap joint after the lower surface of going up the mounting panel is the lower surface parallel and level with the linking plate portion.
Compared with the prior art, the beneficial effects of the utility model are as follows: the conductive copper foil mechanism combines the hard copper foil and the soft copper foil together for use, the hard copper foil and the soft copper foil are riveted together through the rivet, the combination of the hard copper foil and the soft copper foil is firm, and the combination surface is smooth.
Drawings
Fig. 1 is an exploded view of the conductive copper foil mechanism of the present invention;
fig. 2 is a schematic structural view of the assembled state of the conductive copper foil mechanism of the present invention.
Reference numerals are as follows: 1. a hard copper foil body; 2. an upper mounting plate; 3. folding the plate; 4. riveting holes; 5. a hard copper foil lap joint; 6. a first mounting hole; 7. a soft copper foil body; 8. a connecting plate portion; 9. a hinge plate portion; 10. a second mounting hole; 11. a soft copper foil lap joint part; 12. and (4) riveting.
Detailed Description
The technical solution of the present invention will be further explained with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1-2, the present invention provides a conductive copper foil mechanism, comprising a hard copper foil body 1 and a soft copper foil body 7, wherein one end of the hard copper foil body 1 is provided with a hard copper foil overlapping part 5, one end of the soft copper foil body 7 is provided with a soft copper foil overlapping part 11, the hard copper foil overlapping part 5 overlaps with the soft copper foil overlapping part 11, both the hard copper foil overlapping part 5 and the soft copper foil overlapping part 11 are provided with riveting holes 4, the riveting hole position on the hard copper foil overlapping part 5 corresponds to the riveting hole position on the soft copper foil overlapping part 11, the riveting holes on the hard copper foil overlapping part 5 and the soft copper foil overlapping part 11 are provided with rivets 12 for riveting the hard copper foil overlapping part 5 and the soft copper foil overlapping part 11 together, and the rivets 12 on the hard copper foil overlapping part 5 and the soft copper foil overlapping part 11 by a riveting machine, thereby riveting the hard copper foil overlapping part 5 and the soft copper foil overlapping part 11 together, the formed copper foil mechanism has the performances of a hard copper foil and a soft copper foil, and the hard copper foil and the soft copper foil are firmly combined and are convenient to combine and operate.
Preferably, the hard copper foil lap 5 is notch-shaped, the soft copper foil lap 11 is step-shaped, and the hard copper foil lap 5 is matched with the soft copper foil lap 11 in shape.
Preferably, the hard copper foil body 1 includes the last mounting panel 2 and the lower folded plate 3 of bending downwards that the integration set up, it is perpendicular with lower folded plate 3 to go up mounting panel 2, be provided with first mounting hole 6 on the lower folded plate 3, can conveniently install the hard copper foil body 1 on corresponding product.
Preferably, the soft copper foil body 7 comprises a connecting plate portion 8 and a bent plate portion 9, the connecting plate portion 8 is perpendicular to the bent plate portion 9, a second mounting hole 10 is formed in the bent plate portion 9, and the second mounting hole 10 is used for mounting the soft copper foil body 7 on a corresponding product.
Preferably, the upper surface of the overlapped upper mounting plate 2 is flush with the upper surface of the connecting plate part 8, and the lower surface of the overlapped upper mounting plate 2 is flush with the lower surface of the connecting plate part 8, so that the joint surface of the hard copper foil body 1 and the soft copper foil body 7 is flat.
The above embodiments are merely some preferred embodiments of the present invention, and those skilled in the art can make various alternative modifications and combinations to the above embodiments based on the technical solution of the present invention and the related teachings of the above embodiments.
Claims (7)
1. The utility model provides a conductive copper foil mechanism, includes the hard copper foil body and the soft copper foil body, its characterized in that: the one end of the hard copper foil body is provided with hard copper foil overlap joint portion, the one end of the soft copper foil body is provided with soft copper foil overlap joint portion, hard copper foil overlap joint portion is in the same place with soft copper foil overlap joint portion, all be provided with the riveting hole on hard copper foil overlap joint portion and the soft copper foil overlap joint portion, riveting hole position on the hard copper foil overlap joint portion with riveting hole position on the soft copper foil overlap joint portion is corresponding, it is used for with to have in the riveting hole on hard copper foil overlap joint portion and the soft copper foil overlap joint portion riveting rivet in the same place.
2. The conductive copper foil mechanism of claim 1, wherein: the hard copper foil lapping part is in a notch shape, the soft copper foil lapping part is in a step shape, and the hard copper foil lapping part is matched with the soft copper foil lapping part.
3. The conductive copper foil structure of claim 1, wherein: the hard copper foil body is including the last mounting panel that the integration set up and the lower folded plate of bending downwards, it is perpendicular with lower folded plate to go up the mounting panel.
4. The conductive copper foil structure of claim 3, wherein: the lower folded plate is provided with a first mounting hole.
5. The conductive copper foil structure of claim 4, wherein: the soft copper foil body comprises a connecting plate part and a turning plate part, and the connecting plate part is perpendicular to the turning plate part.
6. The conductive copper foil structure of claim 5, wherein: and a second mounting hole is formed in the bent plate part.
7. The conductive copper foil mechanism of claim 5, wherein: after the overlap joint go up the upper surface of mounting panel and the upper surface parallel and level of connection board portion, after the overlap joint go up the lower surface of mounting panel and the lower surface parallel and level of connection board portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202220883983.8U CN217044466U (en) | 2022-04-15 | 2022-04-15 | Conductive copper foil mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202220883983.8U CN217044466U (en) | 2022-04-15 | 2022-04-15 | Conductive copper foil mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
CN217044466U true CN217044466U (en) | 2022-07-26 |
Family
ID=82473556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202220883983.8U Active CN217044466U (en) | 2022-04-15 | 2022-04-15 | Conductive copper foil mechanism |
Country Status (1)
Country | Link |
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CN (1) | CN217044466U (en) |
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2022
- 2022-04-15 CN CN202220883983.8U patent/CN217044466U/en active Active
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