CN217037700U

CN217037700U - Four-chip SMD packaging lead frame

Info

Publication number: CN217037700U
Application number: CN202220760871.3U
Authority: CN
Inventors: 奚志成
Original assignee: Dongguan Haihe Technology Co ltd
Current assignee: Dongguan Haihe Technology Co ltd
Priority date: 2022-04-02
Filing date: 2022-04-02
Publication date: 2022-07-22
Anticipated expiration: 2032-04-02

Abstract

The utility model relates to the technical field of lead frames and discloses a four-chip surface-mounted packaging lead frame which comprises a U-shaped shell, wherein a fixing mechanism is fixedly connected to the inner bottom of the U-shaped shell, a lead frame body is arranged at the top of the fixing mechanism, and a protection mechanism is fixedly connected to the top of the U-shaped shell. This SMD encapsulation lead frame of four chips, through setting up protection mechanism, when meetting rainy weather, the lid can prevent that the rainwater from entering into the inside cable of lead frame body, prevent that the cable from leading to the phenomenon of short circuit because of intaking, play the effect of protection to the inside cable of lead frame body, through setting up fixed establishment, remove to the direction that is close to each other through two T templates, and two sliding plates slide to the direction that is close to each other, thereby realize the fixed effect to the lead frame body, can prevent the lead frame body when using, the phenomenon that rocks appears, the lead frame body can normally work has been ensured.

Description

Four-chip SMD packaging lead frame

Technical Field

The utility model relates to the technical field of lead frames, in particular to a four-chip surface mount type packaging lead frame.

Background

Cable is a generic term for optical cables, electrical cables, and the like. The cable has a plurality of purposes, is mainly used for controlling installation, connecting equipment, transmitting electric power and other multiple functions, is a common and indispensable object in daily life, and is manufactured by using special production equipment with the process characteristics of the industry so as to adapt to the structure and performance requirements of cable products and meet the requirements of continuous production with large length and high speed as possible, thereby forming a special equipment series for manufacturing the cable. Such as extruder series, wire drawing machine series, stranding machine series, lapping machine series and the like, the manufacturing process of the electric wire and the electric cable and the development of special equipment are closely related and mutually promoted. The development and improvement of the manufacturing process of the electric wire and the electric cable are promoted, and the product quality and the production efficiency of the electric cable are improved.

The cable is when using, can use SMD lead frame usually, and current SMD lead frame can only encapsulate three chips, can't realize four chip mountings, user's of not being convenient for use, and simultaneously when overcast and rainy weather, SMD lead frame does not possess waterproof function, leads to the phenomenon that inside cable intake caused the short circuit very easily, and current SMD lead frame is fixed firm inadequately, produces not hard up phenomenon easily, user's of not being convenient for use.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a four-chip surface mount package lead frame to solve the problems set forth in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a SMD encapsulation lead frame of four chips, includes U type casing, bottom fixedly connected with fixed establishment in the U type casing, the fixed establishment top is provided with the lead frame body, U type casing top fixedly connected with protection mechanism.

The protection mechanism comprises a cover body, the cover body is arranged at the top of the U-shaped shell, second grooves are formed in two sides of the bottom of the cover body, the U-shaped shell is connected in the second grooves in a clamped mode, first grooves are formed in two sides of the cover body, clamping blocks are connected in the first grooves in a clamped mode, and a positioning plate is fixedly connected to the left side of each clamping block.

Preferably, locating plate bottom fixedly connected with threaded rod, the equal fixedly connected with connecting plate in U type casing both sides top plays and the effect of support the threaded rod through the locating plate that sets up.

Preferably, a sliding groove is formed in the connecting plate, the threaded rod is connected in the sliding groove in a sliding mode, a locking nut is connected to the bottom of the threaded rod in a threaded mode, and the threaded rod can be positioned through the locking nut.

Preferably, the equal fixedly connected with connecting rod in lid bottom both sides, the equal fixedly connected with in the inside both sides top of U type casing is solid fixed ring, the connecting rod is pegged graft in solid fixed ring, under the mutually supporting of connecting rod and solid fixed ring, further plays the effect of location to the lid.

Preferably, fixed establishment includes the bolt, bolt threaded connection is in U type casing both sides, the bolt right side is rotated and is connected with the grip block, two centre gripping has the T template between the grip block, through the bolt that sets up, can drive the grip block and remove.

Preferably, the bottom of the T-shaped plate is fixedly connected with a first spring, the bottom of the first spring is fixedly connected with a sliding plate, the sliding plate is connected to the inner bottom of the U-shaped shell in a sliding mode, and the sliding plate plays a role in buffering the lead frame body through the arranged first spring.

Preferably, the bottom sliding connection has the bracing piece in the U type casing, bracing piece top hinge articulates there is the backup pad, the backup pad top is provided with the lead frame body, fixedly connected with second spring in the middle of the backup pad bottom, second spring fixed connection is in the middle of the bottom in the U type casing, through the backup pad that sets up, plays the effect of support to the lead frame body.

Compared with the prior art, the utility model provides a four-chip surface mount type packaging lead frame, which has the following beneficial effects:

1. this SMD encapsulation lead frame of four chips, through setting up protection mechanism, through rotating lock nut, make lock nut hug closely the connection connecting plate bottom, can reach the purpose to the screw rod location, and then realize the purpose to the lid location, when meetting rainy weather, in the lid can prevent that the rainwater from entering into the inside cable of lead frame body, prevent that the cable from leading to the phenomenon of short circuit because of intaking, play the effect of protection to the inside cable of lead frame body.

2. This SMD encapsulation lead frame of four chips through setting up fixed establishment, removes to the direction that is close to each other through two T templates, and two sliding plates slide to the direction that is close to each other to the realization can prevent the phenomenon that the lead frame body rocks when using to the fixed effect of lead frame body, has guaranteed that the lead frame body can normally work.

3. This SMD encapsulation lead frame of four chips can realize encapsulating four chips machine, has saved space and cost, has improved the practicality of this device.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive labor:

FIG. 1 is a schematic view of the present invention;

FIG. 2 is a schematic cross-sectional view of the entire structure of the present invention;

FIG. 3 is a schematic cross-sectional view of a protection mechanism according to the present invention;

fig. 4 is a top view of a lead frame body.

In the figure: 1. a U-shaped housing; 2. a protection mechanism; 21. a clamping block; 22. a threaded rod; 23. locking the nut; 24. a first groove; 25. positioning a plate; 26. a connecting plate; 27. a cover body; 28. a second groove; 29. a connecting rod; 201. a fixing ring; 3. a fixing mechanism; 31. a clamping plate; 32. a T-shaped plate; 33. a bolt; 34. a first spring; 35. a sliding plate; 36. a support plate; 37. a second spring; 38. a support bar; 4. a lead frame body.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a four SMD encapsulation lead frames of chip, includes U type casing 1, bottom fixedly connected with fixed establishment 3 in U type casing 1, and fixed establishment 3 tops are provided with

lead frame body

4, and 1 top fixedly connected with protection mechanism 2 of U type casing.

The protection mechanism 2 comprises a cover body 27, the cover body 27 is arranged at the top of the U-shaped shell 1, the two sides of the bottom of the cover body 27 are respectively provided with a second groove 28, the U-shaped shell 1 is clamped in the second grooves 28, the two sides of the cover body 27 are respectively provided with a first groove 24, the first grooves 24 are internally clamped with a clamping block 21, the left side of the clamping block 21 is fixedly connected with a positioning plate 25, the bottom of the positioning plate 25 is fixedly connected with a threaded rod 22, the tops of the two sides of the U-shaped shell 1 are respectively and fixedly connected with a connecting plate 26, the threaded rod 22 is supported and supported by the arranged positioning plate 25, a sliding groove is formed in the connecting plate 26, the threaded rod 22 is slidably connected in the sliding groove, the bottom of the threaded rod 22 is in threaded connection with a locking nut 23, the locking nut 23 is arranged, the positioning effect can be realized on the threaded rod 22, the two sides of the bottom of the cover body 27 are respectively and fixedly connected with a connecting rod 29, and the tops of the two sides in the U-shaped shell 1 are respectively and fixedly connected with a fixing ring 201, the connecting rod 29 is inserted into the fixing ring 201, and under the mutual matching of the connecting rod 29 and the fixing ring 201, the cover 27 is further positioned.

The fixing mechanism 3 comprises a bolt 33, the bolt 33 is connected with two sides of the U-shaped shell 1 in a threaded manner, the right side of the bolt 33 is rotatably connected with a clamping plate 31, a T-shaped plate 32 is clamped between the two clamping plates 31 and can drive the clamping plate 31 to move through the arranged bolt 33, the bottom of the T-shaped plate 32 is fixedly connected with a first spring 34, the bottom of the first spring 34 is fixedly connected with a sliding plate 35, the sliding plate 35 is slidably connected with the bottom in the U-shaped shell 1 and plays a role in buffering the lead frame body 4 through the arranged bolt 33, the bottom in the U-shaped shell 1 is slidably connected with a supporting rod 38, the top of the supporting rod 38 is hinged with a supporting plate 36, the top of the supporting plate 36 is provided with the lead frame body 4, the middle of the bottom of the supporting plate 36 is fixedly connected with a second spring 37, the second spring 37 is fixedly connected with the middle of the bottom in the U-shaped shell 1, through the arranged supporting plate 36, and plays a role of supporting the lead frame body 4.

In the actual operation process, when the device is used, firstly, the lead frame body 4 is prevented from being arranged on the tops of the supporting plate 36 and the T-shaped plate 32, the supporting plate 36 and the T-shaped plate 32 can move downwards along the vertical direction under the action of the gravity of the lead frame body 4, meanwhile, the two supporting rods 38 slide towards the mutually approaching direction, the second spring 37 and the first spring 34 are in a compressed state, after the lead frame body 4 is placed, the two bolts 33 can drive the two clamping plates 31 to move towards the mutually approaching direction and drive the two T-shaped plates 32 to move towards the mutually approaching direction by rotating the two bolts 33, and the two sliding plates 35 slide towards the mutually approaching direction, so that the fixing effect on the lead frame body 4 is realized, and the phenomenon of shaking of the lead frame body 4 in the use process can be prevented;

after the lead frame body 4 is fixed, and through placing the lid 27 at the top of the U-shaped shell 1, the connecting rods 29 on both sides of the bottom of the lid 27 can be inserted into the fixing rings 201, and through sliding the two threaded rods 22 in the directions close to each other, when the fixture block 21 enters the first groove 24 formed in the surface of the lid 27, the threaded rods 22 stop rotating, and through pressing the positioning plate 25 with hands, the fixture block 21 is prevented from being separated from the first groove 24, and the locking nut 23 is rotated, so that the locking nut 23 is tightly attached to the bottom of the connecting plate 26, the purpose of positioning the threaded rods 22 can be achieved, and the purpose of positioning the lid 27 is further achieved.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising", without further limitation, means that the element so defined is not excluded from the group consisting of additional identical elements in the process, method, article, or apparatus that comprises the element.

Claims

1. The utility model provides a SMD encapsulation lead frame of four chips, includes U type casing (1), its characterized in that: the bottom in the U-shaped shell (1) is fixedly connected with a fixing mechanism (3), the top of the fixing mechanism (3) is provided with a lead frame body (4), and the top of the U-shaped shell (1) is fixedly connected with a protection mechanism (2);

protection mechanism (2) are including lid (27), lid (27) set up in U type casing (1) top, second recess (28) have all been seted up to lid (27) bottom both sides, the joint has U type casing (1) in second recess (28), first recess (24) have all been seted up to lid (27) both sides, the joint has fixture block (21) in first recess (24), fixture block (21) left side fixedly connected with locating plate (25).

2. The four-chip surface mount package lead frame according to claim 1, wherein: the bottom of the positioning plate (25) is fixedly connected with a threaded rod (22), and the tops of two sides of the U-shaped shell (1) are fixedly connected with connecting plates (26).

3. The four-chip surface mount package lead frame according to claim 2, wherein: a sliding groove is formed in the connecting plate (26), the threaded rod (22) is connected in the sliding groove in a sliding mode, and the bottom of the threaded rod (22) is connected with a locking nut (23) in a threaded mode.

4. The four-chip surface mount package lead frame according to claim 1, wherein: the improved U-shaped shell is characterized in that connecting rods (29) are fixedly connected to two sides of the bottom of the shell body (27), fixing rings (201) are fixedly connected to the tops of two sides in the U-shaped shell body (1), and the connecting rods (29) are inserted into the fixing rings (201).

5. The four-chip surface mount package lead frame according to claim 1, wherein: fixed establishment (3) are including bolt (33), bolt (33) threaded connection is in U type casing (1) both sides, bolt (33) right side is rotated and is connected with grip block (31), two centre gripping has T template (32) between grip block (31).

6. The four-chip surface mount package lead frame according to claim 5, wherein: the bottom of the T-shaped plate (32) is fixedly connected with a first spring (34), the bottom of the first spring (34) is fixedly connected with a sliding plate (35), and the sliding plate (35) is slidably connected to the bottom in the U-shaped shell (1).

7. The four-chip SMD package lead frame according to claim 1, wherein: bottom sliding connection has bracing piece (38) in U type casing (1), bracing piece (38) top hinge articulates there is backup pad (36), backup pad (36) top is provided with lead frame body (4), fixedly connected with second spring (37) in the middle of backup pad (36) bottom, second spring (37) fixed connection is in the middle of the bottom in U type casing (1).