CN217036019U

CN217036019U - Full-function tile laminated digital subarray based on air cooling

Info

Publication number: CN217036019U
Application number: CN202123416499.9U
Authority: CN
Inventors: 徐熹; 崔吉
Original assignee: Nanjing Tianlang Defense Technology Co ltd
Current assignee: Nanjing Tianlang Defense Technology Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-07-22
Anticipated expiration: 2031-12-31

Abstract

The invention discloses a full-function tile laminated digital subarray based on air cooling, which comprises a front-end T/R component, a sealing frame, a frequency conversion module layer and a comprehensive integrated module, wherein the first layer is the front-end T/R component, and an output port of the front-end T/R component is in blind-plugging interconnection with an antenna switching layer outside the subarray; the second layer is a frequency conversion module layer, and the input port of the front-end T/R component is in blind-mate interconnection with the input port of the frequency conversion module layer; the third layer is a comprehensive integrated module, a digital transceiving module and secondary power supply switching are integrated in the third layer, the intermediate frequency input port is connected with the inside of the comprehensive integrated module through an SMP radio frequency cable and then connected with the second layer of frequency conversion module layer through SMP-KK blind plugging, and the digital transceiving and secondary power supply are connected with the front end T/R component and the corresponding plug of the frequency conversion module layer through a floating J30 socket of the comprehensive integrated module in a blind plugging manner. The invention meets the telecommunication structure interconnection requirement of each functional module of the system through the three-dimensional stacking design, and improves the integration level and the expandability of the subarray system.

Description

Air cooling-based full-function tile laminated digital subarray

Technical Field

The invention relates to the technical field of active digital phased arrays, in particular to an air-cooling-based full-function tile laminated digital sub-array.

Background

The full-function digital sub-array is used as a basic function unit of an active antenna array surface, not only comprises a plurality of paths of T/R radio frequency channels, but also integrates a plurality of functions such as frequency conversion, digital receiving and transmitting, power supply conversion, wave control, monitoring and the like, and a single sub-array has all the functions of a radar front end and can be used as a minimum system. Therefore, the sub-array frame form is crucial to the performance of the whole active antenna array. Traditional digital subarray is mostly brick formula structure, and is relatively independent each other between each module, and later stage installation and maintenance are more convenient, but interface, cable are still more in this kind of framework to vertical degree of depth size is great, has increased the section thickness and the whole weight of whole battle array face, and simultaneously because the improvement of integrated level, the heat density is great, and the heat dissipation is mostly the water-cooling condition, and is relatively poor in the place adaptability that requires to the environmental control.

Disclosure of Invention

The invention discloses a full-function tile laminated digital sub-array based on air cooling, which solves the problems of vertical interconnection, heat dissipation and array surface maintenance among sub-array layers, and aims to solve the problems of low integration level and large size and assembly limitation caused by a heat dissipation mode of the traditional brick digital sub-array.

A full-function tile laminated digital subarray based on air cooling comprises three layers, wherein the first layer is a front end T/R assembly, the front end T/R assembly is a 16-channel independent module, and an output port of the front end T/R assembly is in blind plugging interconnection with a switching layer of a front surface antenna; the second layer is a frequency conversion module layer, and the input port of the front-end T/R component is in blind-mating interconnection with the RF input port of the frequency conversion module layer; the third layer is a comprehensive integrated module, a digital transceiver module and a secondary power supply switching are integrated in the comprehensive integrated module, a medium-frequency input port of the digital transceiver module is connected with the inside of the comprehensive integrated module through an SMP radio frequency cable and then connected with the second layer of frequency conversion module layer in a blind-plugging manner through an SMP-KK, and is connected with the front end T/R component and the corresponding plug of the frequency conversion module layer in a blind-plugging manner through a floating J30 socket of the comprehensive integrated module, and the secondary power supply switching provides control power supply for the frequency conversion module and the front end T/R component through a J30 socket; the frequency conversion module layer and the comprehensive integrated module are fixed in the sealing frame in a sealing mode, and the front end T/R assembly is fixedly connected with the sealing frame through a fixing hole in the surface of the front end T/R assembly.

Preferably, local oscillator and clock interfaces are integrated in the sealing frame, and local oscillator and clock switching is realized by means of SMP-KK and antenna switching layer opposite insertion, so that interlayer vertical interconnection is formed.

Preferably, the front-end T/R component integrates the functions of amplifying, phase-shifting and attenuating uplink and downlink radio frequency signals.

Preferably, the front end T/R assembly is further provided with a radiating fin, so that natural radiating under the working condition of small duty ratio and forced air cooling radiating under the working condition of large duty ratio are realized.

Preferably, the output port of the front end T/R component is an SMP-JHD connector, and the output port is in blind-mating interconnection with the antenna switching surface through SMP-KK.

Preferably, the frequency conversion module layer integrates a 4-channel frequency conversion module, and the 4-channel frequency conversion module has a common-board design.

Has the advantages that:

(1) the invention meets the telecommunication structure interconnection requirement of each functional module of the system through the three-dimensional stacking design, and improves the integration level and the expandability of the subarray system;

(2) the subarray of the invention adopts an air-cooled heat dissipation mode, so that the environmental control pressure is reduced, and the suitability of equipment is improved;

(3) the subarrays of the invention adopt a high-integration-level modular design, and different numbers of subarrays can form active array surfaces meeting different requirements through system integration, splicing, expansion and reconstruction, so that the practicability of the equipment is improved;

(4) the subarray of the invention adopts 64-channel integrated design, and can work in the open air environment by rain prevention;

(5) the functional modules in the subarray module are mutually independent and can be independently debugged and maintained. If the functional module breaks down, any subarray or any module in the subarray can be conveniently detached for maintenance or replacement, and therefore the maintainability of the equipment is improved.

Drawings

FIG. 1 is a schematic diagram of a subarray composition according to one embodiment of the present invention;

FIG. 2 is a diagram of a sealing frame adaptor connector according to an embodiment of the present invention;

FIG. 3 is a block diagram of a front end T/R component in accordance with one embodiment of the present invention;

fig. 4 is a schematic diagram of local oscillator power division blind-mate interconnection switching according to an embodiment of the present invention;

FIG. 5 is a diagram of a J30 controlled power switch according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of a design structure of a subarray heat dissipation fin according to one embodiment of the present invention;

fig. 7 is a diagram of external output connectors of the integrated submodule array according to an embodiment of the present invention.

Reference numerals are as follows: the system comprises a 1-front end T/R component, a 2-sealing frame, a 3-frequency conversion module layer, a 4-comprehensive integrated module, a 5-local oscillator and clock interface, a 6-front end T/R component control power supply J30 input port, a 7-front end T/R component output port, an 8-SMP-KK, a 9-J30 socket, a 10-radiating fin and an 11-comprehensive integrated module group external connector.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The invention discloses a full-function digital subarray of a tile-type subarray framework, wherein an active circuit plane is parallel to the aperture of a array surface, a layered stack structure is adopted, chips or circuits with the same functions in a plurality of channels are integrated on a plurality of tile layers which are placed in parallel, and finally a vertical interconnection structure is formed. The laminated structure is used as a new generation chip type structure, technologies such as a high-density integrated T/R component multifunctional special chip, a high-performance high-reliability radio frequency circuit and a control circuit are needed to be used as supports, problems in aspects such as interlayer vertical interconnection, heat dissipation and array surface maintenance are solved repeatedly, and finally each sub-array is a high-integration and extensible small phased array system.

With reference to fig. 1 to 7, the air-cooling-based full-function tile laminated digital sub-array is divided into three layers, and comprises a 64-channel front-end T/R assembly 1, a sealing frame 2, a frequency conversion module layer 3 and a comprehensive integrated module 4. And each two layers of modules are connected with each other by a floating microspur connector and a radio frequency interconnection connector for controlling power supply and radio frequency connection.

As shown in fig. 3(a) (b), the first layer is a front end T/R assembly 1, the front end T/R assembly 1 is 4 independent modules with 16 channels, and is connected with the sealing frame 2 through a fixing hole, and meanwhile, as shown in fig. 3(b) and fig. 6, the rear end of the front end T/R assembly 1 with the heat dissipation fins 10 can meet the requirements of natural heat dissipation of the modules under the working condition with small duty ratio and forced air cooling heat dissipation under the working condition with large duty ratio. An output port 7 of the front end T/R component of the 16 channels is an SMP-JHD connector, and the output port is connected with the antenna switching surface in a blind-mating mode through SMP-KK. The radio frequency input port of the front end T/R component 1 is in blind insertion with the RF input port of the frequency conversion module layer through SMP-KK, and the control power supply of the front end T/R component 1 passes through the input port 6 of the J30 power supply control port of the front end T/R component to penetrate through the frequency conversion module layer and the sealing frame 2 to be connected with the comprehensive integrated module 4.

The second layer is frequency conversion module layer 3, and frequency conversion module layer 3 has integrateed 4 passageway frequency conversion modules, and 4 passageway are board design altogether. The frequency conversion radio frequency input port penetrates through the sealing frame 2 from the T/R assembly input collection port through the SMP-KK8 to be in blind-plug interconnection with the T/R assembly input collection port, and is shown in figure 4. The frequency conversion module controls power supply to be connected with the comprehensive integrated module 4 in a blind-mate mode through a J30 socket 9.

The third layer is a comprehensive integrated module 4, a digital transceiver module and secondary power supply switching are integrated in the comprehensive integrated module 4, a medium-frequency input port of the digital transceiver module is connected with the inside of the comprehensive integrated module through an SMP radio frequency cable and then is connected with a frequency conversion module through SMP-KK blind plugging, power supply control is conducted through a floating J30 socket 9 assembled on a box body of the comprehensive integrated module, the floating J30 socket is connected with a front end T/R component and a corresponding plug of the frequency conversion module in blind plugging, and meanwhile the comprehensive integrated module receives an external control power supply signal or transmits a subarray signal to the rear end of an external connector 11 through the comprehensive integrated module. As shown in fig. 5.

The sealing frame 2 plays a role in sealing and fixing the frequency conversion module 3 and the comprehensive integrated module 4. Meanwhile, a local oscillator and clock interface 5 is integrated inside the sealing frame, and the local oscillator and the clock are switched after being plugged with the antenna switching layer through SMP-KK8, as shown in FIG. 2.

During the assembly of the subarray, independently fixing 4 16-channel T/R components to an antenna switching layer, installing a sealing frame, covering the 16-channel T/R components with the sealing frame, fixing the sealing frame to the antenna switching layer through fixing screws, and installing SMP-KK at the output end of the T/R component in place; and then the frequency conversion module and the T/R assembly are subjected to blind insertion and butt joint, and the frequency conversion module is installed on the sealing frame through the fixing hole after the butt joint is in place. And then installing the intermediate frequency SMP-KK at the output end of the frequency conversion module in place. And finally, connecting the integrated module opposite-plug surface control power supply plug, the radio frequency input socket, the T/R component control power supply J30 connector 9, the frequency conversion module intermediate frequency SMP-KK8 and the control power supply J30 socket 9 in place, and fixing the integrated module opposite-plug surface control power supply plug, the radio frequency input socket, the frequency conversion module intermediate frequency SMP-KK8 and the control power supply J30 socket with the sealing frame through fixing hole positions to form a full-function digital sub array.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a full function tile range upon range of digital subarray based on forced air cooling which characterized in that: the digital sub-array comprises three layers, wherein the first layer is a front end T/R assembly (1), the front end T/R assembly (1) is a 16-channel independent module, and an output port (7) of the front end T/R assembly is in blind insertion interconnection with a wavefront antenna switching layer; the second layer is a frequency conversion module layer (3), and an input port of the front-end T/R component (1) is in blind-mating interconnection with an RF input port of the frequency conversion module layer (3); the third layer is a comprehensive integrated module (4), a digital transceiver module and a secondary power supply switching are integrated in the comprehensive integrated module (4), a medium-frequency input port of the digital transceiver module is connected with the inside of the comprehensive integrated module (4) through an SMP-KK and then connected with the second layer of frequency conversion module layer (3) in a blind-plugging manner through an SMP-KK, and is connected with the front end T/R component (1) and the corresponding plug of the frequency conversion module layer (3) in a blind-plugging manner through a floating J30 socket (9) of the comprehensive integrated module (4), and the secondary power supply switching provides control power supply for the frequency conversion module and the front end T/R component through a J30 socket (9); the frequency conversion module layer (3) and the comprehensive integrated module (4) are hermetically fixed in the sealing framework (2), and the front-end T/R component (1) is fixedly connected with the sealing framework (2) through a fixing hole in the surface of the front-end T/R component.

2. The air-cooled based fully functional tile laminated digital subarray of claim 1, wherein: local oscillator and clock interfaces (5) are integrated in the sealing frame (2), and are oppositely inserted with the antenna switching layer through SMP-KK (8) to realize switching of the local oscillator and the clock, so that interlayer vertical interconnection is formed.

3. The air-cooled based full function tile overlay digital subarray of claim 2, wherein: the front-end T/R component (1) integrates the functions of amplification, phase shift and attenuation of uplink and downlink radio frequency signals.

4. The air-cooled based fully functional tile stacked digital sub-array of claim 1 or 3, wherein: the front-end T/R assembly (1) is further provided with radiating fins (10) to achieve natural radiating under a small duty ratio working condition and forced air cooling radiating under a large duty ratio working condition.

5. The air-cooled based fully functional tile laminated digital subarray of claim 4, wherein: the output port of the front end T/R component (1) is an SMP-JHD connector, and the output port is connected with the antenna switching surface in a blind-mating mode through an SMP-KK (8).

6. The air-cooled based fully functional tile laminated digital subarray of claim 5, wherein: and the frequency conversion module layer (3) integrates a 4-channel frequency conversion module, and the 4-channel frequency conversion module is designed in a common plate mode.