CN217033690U - Wafer surface detection machine - Google Patents
Wafer surface detection machine Download PDFInfo
- Publication number
- CN217033690U CN217033690U CN202220060740.4U CN202220060740U CN217033690U CN 217033690 U CN217033690 U CN 217033690U CN 202220060740 U CN202220060740 U CN 202220060740U CN 217033690 U CN217033690 U CN 217033690U
- Authority
- CN
- China
- Prior art keywords
- base
- fixed mounting
- wafer surface
- wafer
- platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model discloses a wafer surface detector in the technical field of wafer processing, which comprises a base, wherein a vertical beam is fixedly arranged at the top of the base, a cross beam is connected to the right side of the vertical beam in a sliding manner, a detector body is fixedly arranged at the bottom of the cross beam, a platform is fixedly arranged at the right side of the top of the base, and a negative pressure mechanism is arranged at the right side of an inner cavity of the base. The advantage of improving detection accuracy is achieved, and the method is very worthy of popularization.
Description
Technical Field
The utility model relates to the technical field of wafer processing, in particular to a wafer surface detector.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and doped into a silicon crystal seed crystal, then the silicon crystal seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, and a silicon crystal rod is ground, polished and sliced to form a silicon wafer, namely the wafer.
After the preliminary processing of wafer is accomplished, need carry out defect detection to its surface to ensure wafer quality, present detection mode is put the wafer on detecting the platform, then adopts the wafer detection machine to detect, and this kind of mode lacks the structure of protecting the wafer surface, and at the in-process that detects, the wafer surface adheres to dust or other impurity easily, and then influences the detection precision.
Based on this, the utility model designs a wafer surface detector to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a wafer surface inspection machine to solve the above problems.
In order to achieve the purpose, the utility model provides the following technical scheme: a wafer surface detector comprises a base, wherein a vertical beam is fixedly mounted at the top of the base, a cross beam is slidably connected to the right side of the vertical beam, a detector body is fixedly mounted at the bottom of the cross beam, and a platform is fixedly mounted on the right side of the top of the base;
the right side of the inner cavity of the base is provided with a negative pressure mechanism, and the left side of the inner cavity of the base is provided with a cleaning mechanism;
and a lifting mechanism is arranged in the vertical beam.
Preferably, the negative pressure mechanism comprises an air pump fixedly installed inside the base, an air inlet end of the air pump is communicated with a cylinder, the top of the cylinder extends into the platform, and an air hole is formed in the top of the cylinder.
Preferably, clearance mechanism includes the fan, fan fixed mounting is in the left side of base inner chamber, the exhaust end intercommunication of fan has the conveyer pipe, the other end of conveyer pipe runs through the outside of base, the both sides of conveyer pipe all communicate there is the hose, the other end fixed mounting of hose has hollow slab, hollow slab's bottom fixed mounting has splint, one side intercommunication of hollow slab has the nozzle.
Preferably, the equal fixed mounting in both sides of platform inner chamber has the slide bar, the sliding surface of slide bar is connected with the slider, the top of slider and the bottom fixed mounting of splint, the surface cover of slide bar is equipped with the spring, the one end and the slider fixed mounting of spring, the other end of spring and the inner wall fixed mounting of base.
Preferably, elevating system includes the motor, motor fixed mounting is in the inside of erecting the roof beam, the output shaft fixed mounting of motor has the lead screw, the top of lead screw is connected with the top rotation of erecting the roof beam inner chamber, the surperficial threaded connection of lead screw has the sleeve, the outside of erecting the roof beam is run through to telescopic right side, telescopic right side and the left side fixed mounting of crossbeam.
Preferably, the top of the cylinder is fixedly provided with a rubber protection pad, and the top of the rubber protection pad is flush with the top of the platform.
Compared with the prior art, the utility model has the beneficial effects that: the wafer is firmly adsorbed on the platform through the negative pressure mechanism, the clamping plate is arranged to further fix the wafer in an auxiliary mode, the phenomenon that the wafer moves and displaces in the detection process is avoided, in the detection process, the cleaning mechanism can continuously blow gas to the surface of the wafer, attachments on the surface of the wafer are blown away through the action of the airflow, the cleaning purpose is achieved, in addition, in the continuous detection process, floating ash is prevented from falling on the surface of the wafer, the advantage of improving the detection accuracy is achieved, and the wafer cleaning device is quite worthy of popularization.
Through the setting of slider and slide bar, can support splint, make its translation that can be stable, and can apply the effort of drawing close to two splint through the setting of spring, it is fixed to make two splint carry out the centre gripping to the wafer body, in order to prevent that the wafer from producing the displacement at the in-process that detects, setting through the rubber protection pad, frictional force when not only can promoting the wafer and place, can also form the protection to the wafer bottom, in order to avoid causing the damage to the wafer, can also promote the leakproofness between wafer and the gas pocket simultaneously, in order to increase the firm by adsorption degree of negative pressure mechanism.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a perspective view of the platform of the present invention;
FIG. 3 is an elevational, cross-sectional view of a vertical beam of the present invention;
FIG. 4 is a top sectional view of the platen of the present invention;
FIG. 5 is an enlarged view of a portion of FIG. 1.
In the drawings, the reference numbers indicate the following list of parts:
1. a base; 2. a vertical beam; 3. a cross beam; 4. a detector body; 5. a platform; 6. a negative pressure mechanism; 61. an air extractor; 62. a cylinder; 7. a cleaning mechanism; 71. a fan; 72. a delivery pipe; 73. a hose; 74. a hollow slab; 75. a splint; 76. a nozzle; 8. a lifting mechanism; 81. a motor; 82. a screw rod; 83. a sleeve; 9. a slide bar; 10. a slider; 11. a spring; 12. a rubber protective pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person skilled in the art without making creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
Example one
Referring to the drawings, the present invention provides a technical solution: a wafer surface detector comprises a base 1, wherein a vertical beam 2 is fixedly mounted at the top of the base 1, a cross beam 3 is slidably connected to the right side of the vertical beam 2, a detector body 4 is fixedly mounted at the bottom of the cross beam 3, and a platform 5 is fixedly mounted at the right side of the top of the base 1;
the right side of the inner cavity of the base 1 is provided with a negative pressure mechanism 6, and the left side of the inner cavity of the base 1 is provided with a cleaning mechanism 7;
the interior of the vertical beam 2 is provided with a lifting mechanism 8.
Specifically, the negative pressure mechanism 6 includes an air pump 61, the air pump 61 is fixedly installed inside the base 1, an air inlet end of the air pump 61 is communicated with a cylinder 62, a top of the cylinder 62 extends into the platform 5, an air hole is formed in the top of the cylinder 62, after the wafer is placed on the platform 5, the air pump 61 can pump air in the cylinder 62, and the wafer can be firmly adsorbed on the surface of the rubber protection pad 12 through the action of atmospheric pressure.
Specifically, the cleaning mechanism 7 includes a fan 71, the fan 71 is fixedly mounted on the left side of the inner cavity of the base 1, a delivery pipe 72 is communicated with an exhaust end of the fan 71, the other end of the delivery pipe 72 penetrates through the outside of the base 1, hoses 73 are communicated with two sides of the delivery pipe 72, a hollow plate 74 is fixedly mounted at the other end of each hose 73, a clamping plate 75 is fixedly mounted at the bottom of each hollow plate 74, a nozzle 76 is communicated with one side of each hollow plate 74, in the detection process, the fan 71 extracts outside air, the air is discharged into each hollow plate 74 through the delivery pipe 72 and the hoses 73, finally the air is sprayed out through the nozzles 76, impurities on the surface of the wafer are cleaned through the action of air flow, floating ash and the like can be prevented from falling on the surface of the wafer, and the detection accuracy is improved.
Concretely, elevating system 8 includes motor 81, motor 81 fixed mounting is in the inside of erecting roof beam 2, motor 81's output shaft fixed mounting has lead screw 82, the top of lead screw 82 is rotated with the top of erecting 2 inner chambers of roof beam and is connected, the surperficial threaded connection of lead screw 82 has sleeve 83, the outside of erecting roof beam 2 is run through to sleeve 83's right side, sleeve 83's right side and crossbeam 3's left side fixed mounting, motor 81's output shaft drives lead screw 82 rotatory, lead screw 82 can drive sleeve 83 at rotatory in-process and go up and down, sleeve 83 drives crossbeam 3 and goes up and down, crossbeam 3 drives detection machine body 4 and goes up and down, in order to satisfy the user demand of detection machine body 4.
Example two
The structure of this embodiment is basically the same as that of the embodiment, the difference lies in that, the equal fixed mounting in both sides of platform 5 inner chamber has slide bar 9, slide bar 9's surperficial sliding connection has slider 10, the top of slider 10 and the bottom fixed mounting of splint 75, the surface cover of slide bar 9 is equipped with spring 11, spring 11's one end and slider 10 fixed mounting, spring 11's the other end and the inner wall fixed mounting of base 1, through the setting of slider 10 and slide bar 9, can support splint 75, make its translation that can stabilize, and can exert the effort of drawing close to two splint 75 through the setting of spring 11, make two splint 75 can carry out the centre gripping fixedly to the wafer body, in order to prevent that the wafer from producing the displacement at the in-process that detects.
EXAMPLE III
The structure of this embodiment is the same basically as embodiment one, and the difference lies in, and the top fixed mounting of drum 62 has rubber protection pad 12, and the top of rubber protection pad 12 and the top of platform 5 are for flushing the setting, through the setting of rubber protection pad 12, not only can promote the frictional force when the wafer is placed, can also form the protection to the wafer bottom to avoid causing the damage to the wafer, can also promote the leakproofness between wafer and the gas pocket simultaneously, in order to increase the firm by adsorption degree of negative pressure mechanism 6.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the utility model disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the utility model to the precise forms disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best understand the utility model for and utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.
Claims (6)
1. The utility model provides a wafer surface detection machine, includes base (1), its characterized in that: a vertical beam (2) is fixedly mounted at the top of the base (1), a cross beam (3) is slidably connected to the right side of the vertical beam (2), a detector body (4) is fixedly mounted at the bottom of the cross beam (3), and a platform (5) is fixedly mounted on the right side of the top of the base (1);
a negative pressure mechanism (6) is arranged on the right side of the inner cavity of the base (1), and a cleaning mechanism (7) is arranged on the left side of the inner cavity of the base (1);
and a lifting mechanism (8) is arranged in the vertical beam (2).
2. The wafer surface inspection machine of claim 1, wherein: the negative pressure mechanism (6) comprises an air pump (61), the air pump (61) is fixedly installed inside the base (1), an air inlet end of the air pump (61) is communicated with a cylinder (62), the top of the cylinder (62) extends into the platform (5), and an air hole is formed in the top of the cylinder (62).
3. The wafer surface inspection machine of claim 1, wherein: cleaning mechanism (7) include fan (71), fan (71) fixed mounting is in the left side of base (1) inner chamber, the exhaust end intercommunication of fan (71) has conveyer pipe (72), the outside of base (1) is run through to the other end of conveyer pipe (72), the both sides of conveyer pipe (72) all communicate there are hose (73), the other end fixed mounting of hose (73) has hollow plate (74), the bottom fixed mounting of hollow plate (74) has splint (75), one side intercommunication of hollow plate (74) has nozzle (76).
4. The wafer surface inspection machine of claim 3, wherein: the equal fixed mounting in both sides of platform (5) inner chamber has slide bar (9), the sliding surface of slide bar (9) is connected with slider (10), the top of slider (10) and the bottom fixed mounting of splint (75), the surface cover of slide bar (9) is equipped with spring (11), the one end and the slider (10) fixed mounting of spring (11), the other end of spring (11) and the inner wall fixed mounting of base (1).
5. The wafer surface inspection machine of claim 1, wherein: elevating system (8) are including motor (81), motor (81) fixed mounting is in the inside of erecting roof beam (2), the output shaft fixed mounting of motor (81) has lead screw (82), the top of lead screw (82) is rotated with the top of erecting roof beam (2) inner chamber and is connected, the surperficial threaded connection of lead screw (82) has sleeve (83), the outside of erecting roof beam (2) is run through to the right side of sleeve (83), the right side of sleeve (83) and the left side fixed mounting of crossbeam (3).
6. The wafer surface inspection machine of claim 2, wherein: the top of the cylinder (62) is fixedly provided with a rubber protection pad (12), and the top of the rubber protection pad (12) is flush with the top of the platform (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220060740.4U CN217033690U (en) | 2022-01-11 | 2022-01-11 | Wafer surface detection machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220060740.4U CN217033690U (en) | 2022-01-11 | 2022-01-11 | Wafer surface detection machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217033690U true CN217033690U (en) | 2022-07-22 |
Family
ID=82445076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220060740.4U Active CN217033690U (en) | 2022-01-11 | 2022-01-11 | Wafer surface detection machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217033690U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115815152A (en) * | 2022-11-17 | 2023-03-21 | 无锡芯启博科技有限公司 | Wafer detection equipment and wafer detection method |
| CN117549351A (en) * | 2024-01-11 | 2024-02-13 | 诺宸智能装备(常州)有限公司 | Robot testing device |
-
2022
- 2022-01-11 CN CN202220060740.4U patent/CN217033690U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115815152A (en) * | 2022-11-17 | 2023-03-21 | 无锡芯启博科技有限公司 | Wafer detection equipment and wafer detection method |
| CN117549351A (en) * | 2024-01-11 | 2024-02-13 | 诺宸智能装备(常州)有限公司 | Robot testing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN217033690U (en) | Wafer surface detection machine | |
| CN213764995U (en) | Clamp for gold-plated sheet production and processing | |
| CN220625662U (en) | Be used for waterproof sealing detection device of building | |
| CN220188395U (en) | Detection device for surface defects of cast tube | |
| CN111633583B (en) | Rapid clamping and positioning device and method for glass processing | |
| CN218444310U (en) | Building outer wall infiltration testing arrangement | |
| CN209312732U (en) | A kind of device for wafer filling glass powder | |
| CN216662869U (en) | Automatic feeding device of glass cutting machine | |
| CN215968154U (en) | Quick location structure is restoreed to crystallizer copper pipe | |
| CN205650575U (en) | Hull cell deposition furnace silica flour cleaning device | |
| CN114102403A (en) | Single silicon wafer surface polishing device and using method | |
| CN215173261U (en) | Pipeline inspection robot | |
| CN210547084U (en) | Improved vertical hydraulic cold extruder for aluminum pipe | |
| CN214952780U (en) | Ceramic grinding wheel surface hardness detection device | |
| CN221020339U (en) | Ceramic tile grinding device | |
| CN217369566U (en) | Plane plate processing device | |
| CN209740165U (en) | Silicon wafer detects loading attachment with cleaning device | |
| CN213271616U (en) | Portable over-and-under type empty gas detection surveys device | |
| CN218121302U (en) | Building curtain wall air tightness detection device | |
| CN219587007U (en) | Building curtain wall with anti-drop structure | |
| CN216050522U (en) | Oil pipe gas tightness detection device | |
| CN218239213U (en) | Airtight check out test set of car gas receiver | |
| CN216831243U (en) | Pneumatic film cutting device | |
| CN215391242U (en) | Silicon wafer cleaning tank | |
| CN219684842U (en) | Glass processing polisher |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |