CN217019927U - Equipment for grinding circular workpiece - Google Patents
Equipment for grinding circular workpiece Download PDFInfo
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- CN217019927U CN217019927U CN202123420045.9U CN202123420045U CN217019927U CN 217019927 U CN217019927 U CN 217019927U CN 202123420045 U CN202123420045 U CN 202123420045U CN 217019927 U CN217019927 U CN 217019927U
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- polishing
- drum
- drums
- semiconductor wafer
- peripheral surface
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- 238000000227 grinding Methods 0.000 title claims abstract description 22
- 238000005498 polishing Methods 0.000 claims abstract description 166
- 239000004065 semiconductor Substances 0.000 claims abstract description 58
- 230000002093 peripheral effect Effects 0.000 claims abstract description 43
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The utility model discloses a device for grinding round workpieces, comprising: a worktable for fixing the semiconductor wafer and driving the semiconductor wafer to rotate; and a plurality of lower polishing drums, upper polishing drums and peripheral surface polishing drums distributed around the workbench; the utility model is characterized in that the lower polishing drums, the upper polishing drums and the peripheral surface polishing drums are the same in number, the lower polishing drums and the upper polishing drums are correspondingly distributed up and down, and the lower polishing drums and the upper polishing drums are arranged in an inclined shape.
Description
Technical Field
The utility model relates to the technical field of grinding, polishing, cleaning and machining of surfaces with cubic curved surfaces and complex shapes, in particular to equipment for grinding circular workpieces.
Background
A silicon semiconductor wafer is formed by cutting a cylindrical silicon single crystal ingot into a disk shape with a cutting apparatus. Both front and rear surfaces of the cut semiconductor wafer are ground with a grindstone, and the outer peripheral portion is chamfered with the grindstone to grind a chamfered surface, i.e., an inclined surface, and the outer peripheral surface is also polished with the grindstone. The ground semiconductor wafer is ground or polished by a polishing tool, and the polished portion is finished into a mirror surface.
When a semiconductor wafer is fixed on its back surface by a chuck and is rotationally driven, a vacuum chuck is generally used as the chuck. In order to solve the problem that since the vacuum chuck is formed of a suction pad made of an elastic material such as rubber and the suction pad is closely adhered to the back surface of the semiconductor wafer when the semiconductor wafer is rotated, the suction pad becomes a generation source of surface defects and stains of the adsorption surface of the semiconductor wafer. When the semiconductor wafer is sucked by the suction pad and is rotationally driven, the manufacturing yield of the semiconductor device is lowered due to the suction pad.
The chamfering precision and the chamfering capacity of the existing chamfering equipment cause great troubles for a large number of semiconductor manufacturers, equipment introduced abroad is very long in delivery period, and the market share of the domestic equipment is little and few.
SUMMERY OF THE UTILITY MODEL
The present invention has been made to solve the above-mentioned problems occurring in the prior art, and an object of the present invention is to provide an apparatus for grinding a circular workpiece.
In order to achieve the purpose, the utility model provides the following technical scheme:
an apparatus for abrading a circular workpiece, comprising:
a worktable for fixing the semiconductor wafer and driving the semiconductor wafer to rotate;
and a plurality of lower polishing drums, upper polishing drums and peripheral surface polishing drums distributed around the work table; wherein,
the polishing device comprises a lower polishing drum, an upper polishing drum and peripheral surface polishing drums, wherein the lower polishing drum, the upper polishing drum and the peripheral surface polishing drums are the same in number, the lower polishing drum and the upper polishing drum are distributed up and down correspondingly, the lower polishing drum and the upper polishing drum are arranged in an inclined manner, the peripheral surface polishing drums are arranged in a horizontal manner, and a lower polishing drum and an upper polishing drum are arranged between every two peripheral surface polishing drums;
the lower polishing drum is used for grinding a lower chamfer surface of the semiconductor wafer, the upper polishing drum is used for grinding an upper chamfer surface of the semiconductor wafer, and the outer peripheral surface polishing drum is used for grinding an outer peripheral surface of the semiconductor wafer.
As a further scheme of the utility model: the lower polishing drum, the upper polishing drum and the peripheral surface polishing drum are distributed around the workbench in a circumferential array.
As a still further scheme of the utility model: the utility model discloses a semiconductor wafer's rotation, including workstation, connecting axle, base, workstation, supporting bench, fixing base, connecting axle and second motor, the surperficial middle part of workstation is provided with the connecting axle, the bottom of connecting axle extends to the below of workstation and is connected with the second motor, the bottom of second motor is provided with the base, be provided with a supporting bench between base and the workstation, the top of connecting axle extends to the top of workstation and is provided with the fixing base, and through starting the second motor, can make the connecting axle drive the fixing base and rotate to can realize semiconductor wafer's rotation.
As a still further scheme of the utility model: the semiconductor wafer fixing device is characterized in that a joint pin is arranged on one side of the upper surface of the fixing seat, notches distributed corresponding to the joint pin are arranged on one side of the surface of the semiconductor wafer, the notches are of a V-shaped structure, and the semiconductor wafer can be limited and fixed through the matching between the notches and the joint pin, so that the semiconductor wafer can rotate along with the rotation of the fixing seat.
As a still further scheme of the utility model: the upper polishing drum is connected with the upper surface of the workbench through a supporting seat, and the surface of the workbench is provided with a mounting opening for mounting the lower polishing drum.
As a still further scheme of the utility model: go up the polishing drum include with supporting seat top fixed connection's guide rail, just there is the angle between guide rail and the supporting seat, one side sliding connection of guide rail has the motor cabinet, install first motor on the motor cabinet, first motor has the connecting seat through retarder connection, install the rubbing head in the connecting seat, the cylinder is installed to the opposite side of guide rail, the movable rod tip of cylinder passes through linking bridge and motor cabinet fixed connection, the structure of lower polishing drum and peripheral surface polishing drum is the same with the structure of last polishing drum, through actuating cylinder for movable rod on the cylinder promotes the motor cabinet and removes, thereby makes the rubbing head be close to semiconductor wafer, makes rubbing head and semiconductor wafer surface contact.
As a still further scheme of the utility model: the polishing head is composed of a lower side polishing head, an upper side polishing head, a horizontal polishing head and an annular polishing surface.
As a still further scheme of the utility model: the diameter of the polishing head on the lower polishing drum is smaller than that of the polishing head on the upper polishing drum so as to polish one lower chamfer surface and the other upper chamfer surface of a disc-shaped workpiece such as a semiconductor wafer.
The utility model also relates to a method for grinding round workpieces, comprising the following steps:
s1, putting the semiconductor wafer on the fixing base, aligning the notch on the semiconductor wafer with the joint pin on the fixing base for clamping;
s2, starting the cylinders on the lower polishing drum, the upper polishing drum and the peripheral surface polishing drum, so that the cylinders respectively push the polishing heads on the lower polishing drum, the upper polishing drum and the peripheral surface polishing drum to be respectively contacted with the lower chamfering surface, the upper chamfering surface and the peripheral surface of the semiconductor wafer;
s3, starting the second motor, the lower polishing drum, the upper polishing drum and the first motor on the peripheral surface polishing drum, driving the semiconductor wafer to rotate by the fixing seat at the moment, and driving the polishing head to rotate by the first motor, thereby simultaneously polishing the lower chamfer surface, the upper chamfer surface and the peripheral surface of the semiconductor wafer.
Compared with the prior art, the utility model has the beneficial effects that:
the present invention is effective in polishing the chamfered surfaces because the outer peripheral portion of the disc-shaped workpiece is sandwiched by the pair of lower and upper polishing drums and both the chamfered surfaces are simultaneously polished, and further, by polishing the outer peripheral surface simultaneously with the outer peripheral surface polishing drum, both surfaces of the outer peripheral portion of the disc-shaped workpiece such as a semiconductor wafer can be simultaneously effectively polished, and the yield and the production efficiency are greatly improved.
Drawings
Fig. 1 is a schematic view of a structure of an apparatus for grinding a circular workpiece.
Fig. 2 is a schematic view of a polishing head in an apparatus for polishing a circular workpiece.
Fig. 3 is a top view of an apparatus for abrading a circular workpiece.
Fig. 4 is a schematic view of the structure of an annular polishing surface in an apparatus for abrading a circular workpiece.
In fig. 5, a is a perspective view of a semiconductor wafer, and B is a cross-sectional view of the semiconductor wafer.
In the figure: 1. a semiconductor wafer; 3. a lower chamfered surface; 4. an upper chamfer surface; 5. an outer peripheral surface; 6. a recess; 7. a base; 8. a support table; 9. a work table; 11. a lower polishing drum; 12. a lower side polishing head; 13. an upper side polishing head; 14. a horizontal polishing head; 16. an annular polishing surface; 17. a joint pin; 18. a fixed seat; 21. an upper polishing drum; 22. a connecting seat; 31. A peripheral surface polishing drum; 41. a speed reducer; 42. a supporting seat; 43. a guide rail; 46. a first motor; 51. a cylinder; 84. A connecting shaft; 85. a second motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 5, in an embodiment of the present invention, an apparatus for grinding a circular workpiece includes a worktable 9, and a plurality of lower polishing drums 11, upper polishing drums 21, and peripheral surface polishing drums 31 distributed around the worktable 9, the lower polishing drums 11, the upper polishing drums 21, and the peripheral surface polishing drums 31 are distributed around the worktable 9 in a circumferential array, the upper polishing drums 21 are connected to an upper surface of the worktable 9 through supporting seats 42, a mounting opening for mounting the lower polishing drums 11 is formed in a surface of the worktable 9, wherein the worktable 9 is configured to fix a semiconductor wafer 1 and drive the semiconductor wafer 1 to rotate, a connecting shaft 84 is disposed in a middle portion of the surface of the worktable 9, a bottom of the connecting shaft 84 extends to a lower portion of the worktable 9 and is connected to a second motor 85, a base 7 is disposed at a bottom of the second motor 85, a supporting table 8 is disposed between the base 7 and the worktable 9, the top end of the connecting shaft 84 extends to the upper side of the workbench 9 and is provided with a fixed seat 18, the connecting shaft 84 can drive the fixed seat 18 to rotate by starting the second motor 85, so that the rotation of the semiconductor wafer 1 can be realized, one side of the upper surface of the fixed seat 18 is provided with a joint pin 17, one side of the surface of the semiconductor wafer 1 is provided with a notch 6 which is distributed corresponding to the joint pin 17, the notch 6 is in a V-shaped structure, as shown in A in figure 5, the semiconductor wafer 1 can be limited and fixed by the matching between the notch 6 and the joint pin 17, so that the semiconductor wafer 1 can rotate along with the rotation of the fixed seat 18;
the number of the lower polishing drums 11, the number of the upper polishing drums 21 and the number of the peripheral surface polishing drums 31 are the same, the lower polishing drums 11 and the upper polishing drums 21 are distributed up and down correspondingly, the lower polishing drums 11 and the upper polishing drums 21 are arranged in an inclined manner, the peripheral surface polishing drums 31 are arranged in a horizontal manner, and one lower polishing drum 11 and one upper polishing drum 21 are arranged between every two peripheral surface polishing drums 31; as shown in B of fig. 5, the lower polishing drum 11 is used for polishing the lower chamfer surface 3 of the semiconductor wafer 1, the upper polishing drum 21 is used for polishing the upper chamfer surface 4 of the semiconductor wafer 1, the peripheral surface polishing drum 31 is used for polishing the peripheral surface of the semiconductor wafer 1, the upper polishing drum 21 comprises a guide rail 43 fixedly connected with the top end of a support seat 42, an angle is formed between the guide rail 43 and the support seat 42, one side of the guide rail 43 is slidably connected with a motor seat, a first motor 46 is installed on the motor seat, the first motor 46 is connected with a connecting seat 22 through a reducer 41, a polishing head is installed in the connecting seat 22, the other side of the guide rail 43 is provided with a cylinder 51, the end of a movable rod of the cylinder 51 is fixedly connected with the motor seat through a connecting bracket, the structures of the lower polishing drum 11 and the peripheral surface polishing drum 31 are the same as the structure of the upper polishing drum 21, by activating the cylinder 51, so that the movable rod on the cylinder 51 pushes the motor base to move so that the polishing heads approach the semiconductor wafer 1 so that the polishing heads come into contact with the surface of the semiconductor wafer 1, the polishing heads being constituted by the lower side polishing head 12, the upper side polishing head 13, the horizontal polishing head 14, and the annular polishing surface 16, the polishing heads on the lower polishing drum 11 having a smaller diameter than the polishing heads on the upper polishing drum 21, so as to polish one lower chamfer surface 3 and the other upper chamfer surface 4 of a disc-shaped workpiece such as the semiconductor wafer 1.
The utility model also relates to a method for grinding round workpieces, comprising the following steps:
s1, placing the semiconductor chip 1 on the fixing base 18, aligning the notch 6 on the semiconductor chip 1 with the joint pin 17 on the fixing base 18 for clamping;
s2, activating the air cylinders 51 on the lower polishing drum 11, the upper polishing drum 21 and the peripheral surface polishing drum 31 so that the air cylinders 51 push the polishing heads on the lower polishing drum 11, the upper polishing drum 21 and the peripheral surface polishing drum 31, respectively, into contact with the lower chamfer surface 3, the upper chamfer surface 4 and the peripheral surface 5 of the semiconductor wafer 1, respectively;
s3, the second motor 85 and the first motors 46 of the lower polishing drum 11, the upper polishing drum 21, and the outer circumferential surface polishing drum 31 are started, and at this time, the fixing base 18 drives the semiconductor wafer 1 to rotate, and the first motor 46 drives the polishing head to rotate, thereby simultaneously polishing the lower chamfer surface 3, the upper chamfer surface 4, and the outer circumferential surface of the semiconductor wafer 1.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (8)
1. An apparatus for grinding a circular workpiece, comprising:
a working table (9) which is used for fixing the semiconductor wafer (1) and can drive the semiconductor wafer (1) to rotate;
and a plurality of lower polishing drums (11), upper polishing drums (21) and peripheral surface polishing drums (31) distributed around the work table (9); wherein,
the number of the lower polishing drums (11), the number of the upper polishing drums (21) and the number of the peripheral surface polishing drums (31) are the same, the lower polishing drums (11) and the upper polishing drums (21) are distributed up and down correspondingly, the lower polishing drums (11) and the upper polishing drums (21) are arranged in an inclined manner, the peripheral surface polishing drums (31) are arranged in a horizontal manner, and one lower polishing drum (11) and one upper polishing drum (21) are arranged between every two peripheral surface polishing drums (31);
the lower polishing drum (11) is used for grinding the lower chamfer surface (3) of the semiconductor wafer (1), the upper polishing drum (21) is used for grinding the upper chamfer surface (4) of the semiconductor wafer (1), and the peripheral surface polishing drum (31) is used for grinding the peripheral surface of the semiconductor wafer (1).
2. An apparatus for abrading round objects according to claim 1, characterized in that the lower polishing drum (11), the upper polishing drum (21) and the peripheral surface polishing drum (31) are distributed in a circumferential array around the table (9).
3. The apparatus for grinding round workpieces according to claim 1, characterized in that a connecting shaft (84) is arranged in the middle of the surface of the workbench (9), the bottom of the connecting shaft (84) extends to the lower part of the workbench (9) and is connected with a second motor (85), a base (7) is arranged at the bottom of the second motor (85), a supporting table (8) is arranged between the base (7) and the workbench (9), and the top end of the connecting shaft (84) extends to the upper part of the workbench (9) and is provided with a fixed seat (18).
4. A device for grinding round pieces according to claim 3, characterized in that the side of the upper surface of the holder (18) is provided with a joint pin (17), and the side of the surface of the semiconductor wafer (1) is provided with a notch (6) distributed corresponding to the joint pin (17), the notch (6) having a "V" shaped configuration.
5. An apparatus for grinding round workpieces according to claim 1, characterized in that the upper polishing drum (21) is connected to the upper surface of the table (9) by means of a support (42), the surface of the table (9) being provided with mounting openings for mounting the lower polishing drum (11).
6. The apparatus according to claim 5, wherein the upper polishing drum (21) comprises a guide rail (43) fixedly connected with the top end of the support base (42), an angle exists between the guide rail (43) and the support base (42), a motor base is slidably connected to one side of the guide rail (43), a first motor (46) is installed on the motor base, the first motor (46) is connected with the connection base (22) through a speed reducer (41), a polishing head is installed in the connection base (22), a cylinder (51) is installed on the other side of the guide rail (43), the end of a movable rod of the cylinder (51) is fixedly connected with the motor base through a connection bracket, and the structures of the lower polishing drum (11) and the outer peripheral surface polishing drum (31) are the same as that of the upper polishing drum (21).
7. An apparatus for grinding round workpieces according to claim 6, characterized in that the polishing head consists of a lower polishing head (12), an upper polishing head (13), a horizontal polishing head (14) and an annular polishing surface (16).
8. An apparatus for grinding round workpieces according to claim 1, characterized in that the diameter of the polishing heads on the lower polishing drum (11) is smaller than the diameter of the polishing heads on the upper polishing drum (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123420045.9U CN217019927U (en) | 2021-12-31 | 2021-12-31 | Equipment for grinding circular workpiece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123420045.9U CN217019927U (en) | 2021-12-31 | 2021-12-31 | Equipment for grinding circular workpiece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217019927U true CN217019927U (en) | 2022-07-22 |
Family
ID=82444698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123420045.9U Active CN217019927U (en) | 2021-12-31 | 2021-12-31 | Equipment for grinding circular workpiece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217019927U (en) |
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2021
- 2021-12-31 CN CN202123420045.9U patent/CN217019927U/en active Active
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