CN217007915U

CN217007915U - Promote radiating subassembly of display module assembly IC

Info

Publication number: CN217007915U
Application number: CN202123069015.8U
Authority: CN
Inventors: 金飞; 梁攀
Original assignee: Shenzhen DJN Optronics Technology Co Ltd
Current assignee: Shenzhen DJN Optronics Technology Co Ltd
Priority date: 2021-12-08
Filing date: 2021-12-08
Publication date: 2022-07-19
Anticipated expiration: 2031-12-08

Abstract

The utility model provides a promote radiating subassembly of display module IC, includes that the cross section is the base of T font, one side of base is provided with the connecting block of L shape, be provided with LED between connecting block and the base, one side that LED was kept away from to the base is provided with CF glass and TFT glass, polaroid and lower polaroid are installed respectively to one side that CF glass and TFT glass deviate from each other, and CF glass's below is provided with FPC, adopt heat conduction silica gel and IC to connect between FPC and the CF glass, the heat conduction silica gel and the IC outside are provided with the graphite alkene fin, should promote the radiating subassembly of display module IC for display module, IC heat radiation structure include TFT, IC protection heat dissipation silica gel, TFT liquid crystal glazing and graphite alkene fin. The heat dissipation performance of the IC is improved, and meanwhile the influence of the lower LED on the IC is reduced, so that the effect of reducing the heat accumulation of the display module IC is achieved.

Description

Promote radiating subassembly of display module assembly IC

Technical Field

The utility model relates to the field of display modules, in particular to a component for improving the heat dissipation of a display module IC.

Background

With the development of society and the progress of display technology, the demand of people for display devices is also higher and higher. The lcd module has a larger and larger size requirement and a higher and higher resolution requirement, which means that the workload of an IC chip on a TFT (Thin Film Transistor) lcd glass is larger and larger, especially the power consumption and temperature of the IC are higher and higher when TDDI (Touch and Display Driver Integration) IC is widely applied.

In addition, people have higher and higher requirements on the brightness of the liquid crystal display module, and the brightness can be improved by increasing the number of LEDs or the current under the condition that the optical material is optimal. The structure is limited, and the backlight LED is usually designed on the same side of the IC, so the IC side generates heat seriously. Particularly, in the application process of the vehicle-mounted display module, the surface temperature of a screen near an IC reaches 50-60 ℃, and hands are scalded by touching; under the extremely high temperature environment, the phenomenon that the temperature near the IC exceeds the clearing point of the liquid crystal to cause blackening can even occur. Therefore, the utility model provides a display module IC heat dissipation design scheme, thereby solving the problem of serious heating of the display module IC.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Aiming at the defects of the prior art, the utility model provides a component for improving the heat dissipation of a display module IC (integrated circuit), and solves the problems.

(II) technical scheme

In order to achieve the above purpose, the utility model provides the following technical scheme: the utility model provides a promote radiating subassembly of display module assembly IC, includes that the cross section is the base of T font, one side of base is provided with the connecting block of L shape, be provided with LED between connecting block and the base, one side that LED was kept away from to the base is provided with CF glass and TFT glass, polaroid and lower polaroid are installed respectively to one side that CF glass and TFT glass deviate from each other, and CF glass's below is provided with FPC, adopt heat conduction silica gel and IC to connect between FPC and the CF glass, the heat conduction silica gel and the IC outside are provided with the graphite alkene fin.

Preferably, the upper side and the lower side of the IC are bonded with the CF glass and the FPC through the heat-conducting silica gel.

Preferably, the lower extreme border that the polaroid was gone up to the graphite alkene fin flushes is attached, and the graphite alkene fin is buckled from the side and is attached to TFT glass's the back, and the graphite alkene fin flushes the edge of polaroid down and is attached simultaneously.

Preferably, the IC includes two gate ICs and a source chip, and the source chip is located between the two gate ICs.

Preferably, the thickness of the graphene radiating fin is 20-100 micrometers.

(III) advantageous effects

Compared with the prior art, the utility model provides a component for improving the heat dissipation of a display module IC, which has the following beneficial effects:

1. the component for improving the heat dissipation of the display module IC is used for the display module, and the IC heat dissipation structure comprises a TFT, an IC, IC protective heat dissipation silica gel, TFT liquid crystal glass and a graphene heat dissipation sheet. The glass step IC protective glue is formed by changing common blue glue or black silica gel into heat dissipation silica gel, a graphene heat dissipation sheet is attached to the surface of an IC and the back of TFT glass for IC bonding, the heat dissipation performance of the IC is improved, and the influence of the heat generated by a lower LED on the IC is reduced, so that the effect of reducing the heat accumulation of the display module IC is realized.

2. This promote radiating subassembly of display module assembly IC, graphite alkene fin thickness is 20 ~ 100 microns, and thickness is no longer than upper and lower polaroid thickness, does not influence backlight assembly and touch-sensitive screen and laminates entirely.

Drawings

FIG. 1 is a schematic view of the structure of the present invention;

FIG. 2 is a schematic view of the structure of the present invention;

FIG. 3 is a schematic view of the present invention.

In the figure: 1. a base; 2. an LED; 3. connecting blocks; 4. FPC; 5. a graphene heat sink; 6. IC; 7. heat conducting silica gel; 8. A gate circuit IC; 9. CF glass; 10. an upper polarizer; 11. TFT glass; 12. a lower polarizer; 13. and a source chip.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, an assembly for improving heat dissipation of a display module IC includes a base 1 having a T-shaped cross section, an L-shaped connection block 3 is disposed on one side of the base 1, an LED2 is disposed between the connection block 3 and the base 1, a CF glass 9 and a TFT glass 11 are disposed on one side of the base 1 away from the LED2, an upper polarizer 10 and a lower polarizer 12 are respectively disposed on one side of the CF glass 9 and one side of the TFT glass 11 which are away from each other, an FPC4 is disposed below the CF glass 9, the FPC4 and the CF glass 9 are connected by a thermal conductive silica gel 7 and an IC6, and a graphene heat sink 5 is disposed outside the thermal conductive silica gel 7 and the IC 6.

Further, the upper and lower sides of the IC6 are bonded to the CF glass 9 and the FPC4 through the heat conductive silicone 7.

Further, the lower extreme border that graphite alkene fin 5 flushed last polaroid 10 is attached, and graphite alkene fin 5 is buckled from the side and is attached to the back of TFT glass 11, and graphite alkene fin 5 flushes the edge of polaroid 12 down and is attached simultaneously.

Further, the IC6 includes a source chip 13 and a gate IC8, two gate ICs 8 are provided, and the source chip 13 is located between the two gate ICs 8.

Furthermore, the thickness of the graphene radiating fin 5 is 20-100 micrometers.

The working principle is as follows: coating the heat-conducting silica gel 7 in the area of the glass single layer area IC6 by using a glue dispensing process through glue dispensing equipment; in a conventional dispensing process, the IC6 protective glue is made of different materials, so that the heat dissipation of the IC6 is accelerated; the graphene heat sink 5 is attached to the surfaces of the TFT glass 11 and the IC6 along the edge of the upper polarizer 10 in a flush manner; the graphene heat sink 5 is attached to the back of the TFT glass 11 along the side edge of the TFT glass 11, and is attached to the edge of the lower polarizer 12.

The IC heat dissipation structure comprises TFT glass 11, IC6, heat-conducting silica gel 7 and a graphene heat dissipation sheet 5. The glass step IC protective glue is formed by changing common blue glue or black silica gel into heat dissipation silica gel, the surface of the IC6 and the back surface of the TFT glass 11 of the IC bonding are attached with a graphene heat dissipation sheet 5, the heat dissipation performance of the IC6 is improved, and the influence of the heat generation of the lower LED2 on the IC6 is reduced, so that the effect of reducing the heat generation accumulation of the display module IC is realized.

The thickness of the graphene radiating fins 5 is 20-100 micrometers, the thickness of the graphene radiating fins does not exceed the thickness of the upper polarizer and the lower polarizer, and backlight assembly and full lamination of the touch screen are not influenced.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a promote radiating subassembly of display module assembly IC, includes that the cross section is base (1) of T font, one side of base (1) is provided with connecting block (3) of L shape, be provided with LED (2), its characterized in that between connecting block (3) and base (1): one side that LED (2) was kept away from in base (1) is provided with CF glass (9) and TFT glass (11), polaroid (10) and lower polaroid (12) are installed respectively to one side that CF glass (9) and TFT glass (11) deviate from each other, and the below of CF glass (9) is provided with FPC (4), adopt heat conduction silica gel (7) and IC (6) to connect between FPC (4) and CF glass (9), heat conduction silica gel (7) and IC (6) outside are provided with graphite alkene fin (5).

2. The assembly of claim 1, wherein the assembly comprises: the upper side and the lower side of the IC (6) are bonded with the CF glass (9) and the FPC (4) through the heat conducting silica gel (7).

3. The assembly of claim 1, wherein the assembly comprises: graphene heat dissipation sheet (5) level the lower extreme border of last polaroid (10) and attach, and graphene heat dissipation sheet (5) are buckled from the side and are attached to the back of TFT glass (11), and graphene heat dissipation sheet (5) are levelly level the edge of lower polaroid (12) and are attached simultaneously.

4. The assembly of claim 1, wherein the assembly comprises: the IC (6) comprises two source chips (13) and two gate circuit ICs (8), wherein the source chips (13) are positioned between the two gate circuit ICs (8).

5. The assembly of claim 1, wherein the assembly comprises: the thickness of the graphene radiating fin (5) is 20-100 micrometers.