CN216987762U - Micro-fluidic chip clamping device - Google Patents

Abstract

The utility model relates to a microfluidic chip clamping device; the method comprises the following steps: the chip clamping main body module is used for forming a clamping carrier of the microfluidic chip; the clamping switch module is used for controlling clamping of the microfluidic chip and adjusting clamping force; the power supply module is used for supplying power to the reaction/detection unit on the microfluidic chip; the power supply module is fixed on the chip clamping main body module through the connecting module, the connecting module comprises an adjusting mechanism, and mechanical contact between the power supply module and the upper electrode of the microfluidic chip is achieved in a chip clamping state through controlling the adjusting mechanism. The microfluidic chip is clamped by arranging the independent clamping switch module, so that the reversible connection mode can be realized, and the secondary utilization of the microfluidic chip is facilitated.

Description

Micro-fluidic chip clamping device

[ technical field ] A

The utility model relates to the technical field of microfluidic chip clamping, in particular to a microfluidic chip clamping device.

[ background of the utility model ]

The micro-fluidic chip is an analysis and detection technology with a sample inlet, a sample outlet, a micro-channel and a reaction/detection unit arranged on glass, silicon and quartz materials, and has great application potential in the field of biomedical detection. The existing microfluidic chip clamping device has the following problems: 1. because the chip is mostly processed by using brittle materials, the chip is easy to break due to uneven stress in the clamping process; 2. the existing microfluidic chip clamping device has the disadvantages of complicated use steps and inconvenient disassembly, assembly and replacement.

Therefore, there is a need for an effective microfluidic chip clamping device to solve the problems of the prior art.

[ Utility model ] content

Aiming at the defects of the prior art, the utility model aims to provide a microfluidic chip clamping device; the method comprises the following steps:

the chip clamping main body module is used for forming a clamping carrier of the microfluidic chip;

the clamping switch module is used for controlling clamping of the microfluidic chip and adjusting clamping force;

the power supply module is used for supplying power to the reaction/detection unit on the microfluidic chip;

the power supply module is fixed on the chip clamping main body module through the connecting module, the connecting module comprises an adjusting mechanism, and mechanical contact between the power supply module and the upper electrode of the micro-fluidic chip is achieved in a chip clamping state through controlling the adjusting mechanism.

Preferably, the clamping switch module further comprises a plurality of compression switch mechanisms, a synchronous transmission mechanism and a handle, wherein the handle is fixedly connected with the synchronous transmission mechanism, the compression switch mechanisms are detachably connected with the synchronous transmission mechanism, and the compression switch mechanisms are fixed on the microfluidic chip substrate; and operating the handle to enable the synchronous transmission mechanism to drive the plurality of pressing switch mechanisms to simultaneously clamp or release the microfluidic chip.

Preferably, the pressing switch mechanism comprises a switch rotating shaft and a switch outer sleeve sleeved outside the switch rotating shaft; grooves are formed in two ends of the switch rotating shaft, through holes are formed in the bottoms of the grooves and used for placing pressing heads, fastening structures are mounted on the tops of the grooves, and pressure springs and adjusting pressing blocks are further arranged in the grooves; and pressing the fastening structure to force the adjusting pressing block to compress the pressure spring so as to adjust the pretightening force of the pressure head.

Preferably, the switch outer sleeve further comprises a deep groove at the side close to the microfluidic chip to accommodate the switch rotating shaft with the pressure head.

Preferably, the bottom in the switch outer sleeve further comprises a rotating shaft limiting surface for limiting the switch rotating shaft to prevent the switch rotating shaft from being separated from the switch outer sleeve.

Preferably, the both ends of switch overcoat still are provided with adjusting screw holding tank, pressure head respectively and hold the position groove, the pressure head hold the position groove with the deep groove is linked together, so that be used for the switch rotation axis rotates the in-process and holds adjusting screw, pressure head.

Preferably, the synchronous transmission mechanism comprises a synchronous belt wheel and a synchronous belt, the synchronous belt wheel is fixed on the switch rotating shaft, and the handle is fixedly connected with the switch rotating shaft; and operating the handle to drive the plurality of pressure heads to simultaneously clamp or release the microfluidic chip through the synchronous belt wheel and the synchronous belt.

Preferably, the chip clamping main body module comprises a microfluidic chip substrate, a first pressing plate and a second pressing plate, wherein the microfluidic chip is provided with a sample inlet and a sample outlet, one side of the sample inlet and the other side of the sample outlet are attached to the microfluidic chip substrate, and the other side of the microfluidic chip is respectively arranged on the first pressing plate and the second pressing plate from two end covers of the microfluidic chip.

Preferably, the second pressing plate further comprises a handle limiting surface for abutting against a handle pressed downwards.

Preferably, the chip clamping main body module further comprises a plurality of guide pin shafts, and one ends of the guide pin shafts are inserted into the microfluidic chip substrate and are in interference fit with the microfluidic chip substrate; the other end of the guide pin shaft is inserted into the first pressing plate and the second pressing plate and is in clearance fit with the first pressing plate and the second pressing plate; and a return spring is sleeved outside the guide pin shaft.

Compared with the prior art, the utility model has the beneficial effects that:

the utility model provides a microfluidic chip clamping device; the method comprises the following steps: the chip clamping main body module is used for forming a clamping carrier of the microfluidic chip; the clamping switch module is used for controlling clamping of the microfluidic chip and adjusting clamping force; the power supply module is used for supplying power to the reaction/detection unit on the microfluidic chip; the power supply module is fixed on the chip clamping main body module through the connecting module, the connecting module comprises an adjusting mechanism, and mechanical contact between the power supply module and the upper electrode of the microfluidic chip is achieved in a chip clamping state through controlling the adjusting mechanism. The microfluidic chip is clamped by arranging the independent clamping switch module, so that the loading and unloading are convenient, and the secondary utilization of the microfluidic chip is convenient.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings. The detailed description of the present invention is given in detail by the following examples and the accompanying drawings.

[ description of the drawings ]

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the utility model and together with the description serve to explain the utility model without limiting the utility model. In the drawings:

FIG. 1 is a schematic structural diagram of a microfluidic chip clamping device according to the present invention;

FIG. 2 is a schematic structural view of the compression switch mechanism of the present invention; wherein 2a is a side view of the compression switch mechanism; 2b is a cross-sectional view of the compression switch mechanism;

FIG. 3 is a schematic structural view of a rotating shaft of the switch according to the present invention;

FIG. 4 is a schematic view of the structure of the switch housing of the present invention; wherein 4a is a front view of the switch housing; 4b is the bottom view of the switch outer sleeve;

FIG. 5 is a schematic structural view of a clamping switch module according to the present invention;

FIG. 6 is a schematic structural diagram of a chip mounting and clamping main module according to the present invention;

FIG. 7 is an exploded view of the chip mounting body module of the present invention;

FIG. 8 is a schematic structural diagram of a microfluidic chip substrate according to the present invention; wherein, 8a is a schematic view of the mounting direction of the microfluidic chip; 8b is the bottom view of the microfluidic chip substrate;

fig. 9 is a schematic structural diagram of a power supply module according to the present invention.

Description of reference numerals:

100. clamping the switch module; 101. a handle; 102. a switch housing; 1021. deep grooves; 1022. a rotating shaft limiting surface; 1023. adjusting screw accommodating grooves; 1024. a pressure head containing groove; 1025. positioning holes; 103. a switch rotating shaft; 104. a pressure head; 105. a pressure spring; 106. adjusting the pressing block; 107. adjusting screws; 108. positioning a pin shaft; 109. tightening the screw; 110. a synchronous pulley; 111. a synchronous belt; 112. fixing the bolt; 113. a groove; 114. a through hole;

200. a chip clamping main body module; 201. a first platen; 202. a second platen; 203. a microfluidic chip; 204. a microfluidic chip substrate; 205. a guide pin shaft; 206. a return spring; 207. sealing the O-shaped ring; 208. a fluid flow adapter; 210. connecting columns; 211. a spring; 212. adjusting the bolt;

300. a power supply module; 301. a circuit connector; 302. a wiring circuit board card; 303. a spring probe.

[ detailed description ] A

The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings, wherein like reference characters designate like parts throughout the several views. In the drawings, the shape and size may be exaggerated for clarity, and the same reference numerals will be used throughout the drawings to designate the same or similar components. In the following description, terms such as center, thickness, height, length, front, back, rear, left, right, top, bottom, upper, lower, and the like are used based on the orientation or positional relationship shown in the drawings. In particular, "height" corresponds to the dimension from top to bottom, "width" corresponds to the dimension from left to right, and "depth" corresponds to the dimension from front to back. These relative terms are for convenience of description and generally are not intended to require a particular orientation. Terms concerning attachments, coupling and the like (e.g., "connected" and "attached") refer to a relationship wherein structures are secured or attached to one another either directly or indirectly through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise.

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict. It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.

Example one

As shown in fig. 1-9, the present invention relates to a microfluidic chip clamping device; the method comprises the following steps:

the chip clamping main body module 200 is used for forming a clamping carrier of the microfluidic chip 203;

the clamping switch module 100 is used for controlling clamping of the microfluidic chip 203 and adjusting clamping force;

a power supply module 300 for supplying power to the reaction/detection unit on the microfluidic chip; meanwhile, the power supply module 300 can adjust the contact force between the microfluidic chip 203 and the electrodes;

the power supply module 300 is fixed on the chip mounting and clamping main body module 200 through a connection module, and the connection module includes an adjusting mechanism, and the adjustment mechanism is controlled to realize mechanical contact between the power supply module 300 and the upper electrode of the microfluidic chip 203 in a chip mounting and clamping state. By using the microfluidic chip clamping device, on one hand, the microfluidic chip is convenient to be reused, and on the other hand, the clamping stability and reliability of the microfluidic chip are ensured.

Specifically, as shown in fig. 1, the connection module includes a connection column 210, a spring 211, and an adjusting bolt 212 (i.e., an adjusting mechanism), the power supply module 300 is fixed on the chip-mounting main body module 200 through the connection column 210, the spring 211, and the adjusting bolt 212, and the spring 211 is pressed by controlling the adjusting bolt 212, so that the power supply module 300 mechanically contacts the electrode on the microfluidic chip 203 in the chip-mounting state.

The clamping switch module 100 is used as a module independent of the microfluidic chip 203, and ensures that the microfluidic chip can be replaced conveniently and effectively. It should be understood that the clamping switch module 100 applied to the microfluidic chip needs to have the following features: 1. multipoint uniform distribution type synchronous clamping; 2. the clamping force is adjustable; 3. the clamping operation is convenient. In some embodiments, the clamping switch module 100 further comprises a plurality of compression switch mechanisms, a synchronous transmission mechanism, and a handle 101, wherein the handle 101 is fixedly connected with the synchronous transmission mechanism, the plurality of compression switch mechanisms are detachably connected with the synchronous transmission mechanism, and the plurality of compression switch mechanisms are fixed on the microfluidic chip substrate 204; the handle 101 is operated to make the synchronous transmission mechanism drive a plurality of compression switch mechanisms to clamp or release the microfluidic chip 203.

It should be understood that the detachable connection of the plurality of compression switch mechanisms and the detachable connection of the synchronous drive mechanism are various connection methods described in the prior art. In some embodiments, a plurality of compression switch mechanisms are sleeved on the synchronous transmission mechanism; as shown in fig. 1, the four pressing switch mechanisms are sleeved at different positions of the synchronous transmission mechanism.

Taking one of the pressing switch mechanisms as an example, as shown in fig. 2-3, the pressing switch mechanism includes a switch rotating shaft 103, and a switch housing 102 sleeved outside the switch rotating shaft 103; both ends of the switch rotating shaft 103 are provided with grooves 113, the bottom of each groove 113 is provided with a through hole 114 for placing the pressure head 104, the top of each groove 113 is provided with a fastening structure, and each groove also comprises a pressure spring 105 and an adjusting pressing block 106 (namely the area between the pressure head 104 and the fastening structure also comprises the pressure spring 105 and the adjusting pressing block 106); the tightening mechanism is forced to force the adjustment mass 106 to compress the compression spring 105 to adjust the ram 104 preload.

It should be understood that the recess 113 may be provided in any shape, and in principle the recess 113 may be sized to accommodate the adjustment screw 107, the adjustment mass 106, the compression spring 105, and the ram 104 without affecting the movement of the ram 104, the compression spring 105, and the adjustment mass 106 within the recess 113. In order to simplify the structure and facilitate the movement of the pressing head 104, the pressure spring 105 and the adjusting press block 106, the groove 113 is preferably a straight groove, such as a square groove.

It should be understood that the fastening structure may be a fastening means as is common in the art to achieve the fixation. In some embodiments, the fastening structure may be a threaded hole disposed at the top of the groove 113, the threaded hole is used for fixing the adjusting screw 107, the adjusting screw 107 is screwed, and the adjusting pressure block 106 compresses the pressure spring 105, so that the pre-tightening force of the pressure head 104 can be adjusted, thereby controlling the clamping force on the microfluidic chip 203.

The switch housing 102 is provided with a groove for receiving the switch rotating shaft 103 with the pressure head 104, so that the switch housing and the pressure head 104 can be used together, and the groove is a deep groove 1021 for ensuring that the switch rotating shaft 103 with the pressure head 104 can be received. The shape of the deep groove 1021 is set according to the portion of the pressing head 104 protruding from the switch rotation shaft 103. In some embodiments, as shown in fig. 4, the deep groove 1021 is configured as a half-kidney shape to facilitate the installation of the switch rotation shaft.

A limit structure is also required to be arranged in the switch housing 102 to prevent the switch rotating shaft 103 from falling off the switch housing 102 during the movement process. In some embodiments, the bottom portion inside the switch housing 102 further includes a rotation axis limiting surface 1022 to limit the switch rotation axis 103 from disengaging from the switch housing 102.

Both ends of the switch housing 102 are also required to be respectively provided with an adjusting screw accommodating groove 1023 and a pressure head accommodating groove 1024, and the pressure head accommodating groove 1024 is communicated with the deep groove 1021 so as to accommodate the adjusting screw 107 and the pressure head 104 in the rotating process of the switch rotating shaft 103. In one embodiment, as shown in fig. 4, the top and bottom of the switch housing 102 are further provided with an adjusting screw receiving groove 1023 and a pressing head receiving groove 1024, respectively, for receiving the adjusting screw 107 and the pressing head 104 during the rotation of the switch rotating shaft 103. Adjusting screw holding groove 1023, pressure head hold the position groove 1024 and can set up to arbitrary shape, in some embodiments, hold the position groove 1024 with adjusting screw holding groove 1023, pressure head and set up to the waist shape to in the groove inslot removal under the drive of handle 101 is convenient for adjusting screw, pressure head.

When the push switch mechanism is assembled, as shown in fig. 1 to 4, the switch rotary shaft 103 with the push head 104 is inserted from the deep groove 1021 until the end face of the switch rotary shaft 103 abuts against the rotary shaft stopper surface 1022 on the switch case 102, and the push head 104 is rotated to the position 1.

It will be appreciated that the placement of the ram receiving slot 1024 ensures that the ram 104 is fully embedded during assembly.

In order to avoid the interface dislocation in the clamping process of the compression switch mechanism, the clamping mechanism further comprises a positioning mechanism, and it should be understood that the positioning mechanism can be a positioning mechanism which is common in the prior art. In some embodiments, as shown in fig. 4, the positioning hole 1025 is an interference fit with the positioning pin 108 for positioning the entire compression switch mechanism.

In order to ensure the clamping stability of the microfluidic chip, a plurality of compression switch mechanisms can be uniformly dispersed. In some embodiments, as shown in fig. 5, the clamping switch module includes four pressing switch mechanisms, each of which is similar to the above-mentioned pressing switch mechanism, and is not described herein again.

The synchronous drive can be a drive common in the art. In some embodiments, the synchronous transmission mechanism includes a synchronous pulley 110 and a synchronous belt 111, the synchronous pulley 110 is fixed on the switch rotating shaft 103, and the handle 101 is fixedly connected with the switch rotating shaft 103; the handle 101 is operated to drive a plurality of pressing heads to clamp or release the microfluidic chip through the synchronous pulley 110 and the synchronous belt 111. The synchronous transmission mechanism formed by the synchronous pulley 110 and the synchronous belt 111 can ensure that when the handle 101 is pressed downwards, the four pressing heads simultaneously apply point pressure on the first pressing plate 201 and the second pressing plate 202 on the upper part of the chip. It should be understood that the fixing manner of the handle 101 and the switch rotating shaft 103 may be a fixing manner commonly known in the art. For example, in some embodiments, the handle 101 is threadably fastened to the switch rotating shaft 103.

It should be understood that the timing pulley 110 may be fixed to the switch rotating shaft 103 by any fixing means known in the art; in some embodiments, the timing pulley 110 is fixed to the switch rotating shaft 103 by a set screw 109.

The chip clamping main body module 200 is mainly a structure for loading a microfluidic chip, is a main body for realizing effective clamping and convenient replacement of the microfluidic chip, and is also used for ensuring accurate access and sealing of liquid flow. In some embodiments, as shown in fig. 6 to 7, the chip-mounting main body module 200 includes a microfluidic chip substrate 204, a first pressing plate 201, and a second pressing plate 202, wherein one side of the microfluidic chip 203, on which sample inlets and sample outlets are disposed, is attached to the microfluidic chip substrate 204, and the first pressing plate 201 and the second pressing plate 202 are respectively disposed on the other side of the microfluidic chip 203 from two end covers of the microfluidic chip 203; at the moment, the clamping main body module forms a sandwich structure, the first pressing plate 201 and the second pressing plate 202 of the two pressing plates on the upper part of the microfluidic chip 203 respectively clamp two ends of the microfluidic chip, and meanwhile, the point contact force generated by the clamping switch module 100 is converted into plane distribution force, so that the microfluidic chip is ensured to be uniformly pressed, and the risk of breaking the microfluidic chip caused by stress concentration is avoided.

In order to limit the handle 101, in some embodiments, the second pressing plate 202 further includes a handle limiting surface thereon for abutting against the handle 101 pressed downward; when the handle 101 abuts against the handle limit surface, the pressure head 104 is located at position 2 (position 2 is the central position below the switch rotating shaft 103), and at this time, the clamping of the microfluidic chip 203 is completed.

In some embodiments, the microfluidic chip substrate 204 further has a process groove (not shown) thereon, which can be used to avoid interference of the right-angled side of the microfluidic chip.

In order to avoid flexural fracture in the process of clamping the microfluidic chip, a plurality of guide structures are often required to be arranged on the chip clamping main body module, and the guide structures can be guide devices which are common in the prior art. In some embodiments, the guide structure is a guide pin 205, one end of the guide pin 205 is inserted into the microfluidic chip substrate 204 and is in interference fit with the microfluidic chip substrate 204, and the other end of the guide pin 205 is inserted into the first pressing plate and the second pressing plate and is in clearance fit with the first pressing plate 201 and the second pressing plate 202; specifically, a plurality of guide pin shafts 205 are further distributed on the chip clamping main body module 200, the guide pin shafts 205 are in interference fit with the microfluidic chip substrate 204, and the guide pin shafts 205 are in clearance fit with the first pressing plate 201 and the second pressing plate 202 to guide the pressing plates. In order to facilitate the replacement of the microfluidic chip when the handle 101 is released, a reset mechanism, which may be a reset device commonly known in the art, is further included on the chip clamping main body module 200. In some embodiments, the return mechanism is a return spring 206, and the return spring 206 is sleeved outside the guide pin 205; when the handle is loosened, the first pressing plate 201 and the second pressing plate 202 of the two pressing plates on the upper part of the chip are upwards bounced to reset under the action of spring force, so that the microfluidic chip 203 can be smoothly drawn out.

The common microfluidic chip clamping device has the problem of difficult chip positioning, so a structure for positioning the microfluidic chip is often required to be arranged on the device. In some embodiments, as shown in fig. 8, the microfluidic chip substrate 204 is provided with a chip-receiving groove corresponding to the shape and size of the microfluidic chip 203, and the microfluidic chip 203 is positioned and limited by the groove side surface; in addition, the microfluidic chip substrate 204 has an open side so that the microfluidic chip can be easily inserted into the microfluidic chip substrate 204 along the direction a.

When the microfluidic chip is placed, the microfluidic chip 203 is inserted into the chip accommodating groove for accommodating the microfluidic chip 203 through the open side surface of the microfluidic chip substrate 204 along the direction a in fig. 8, and at this time, it should be noted that the side of the microfluidic chip 203 on which the sample inlet and the sample outlet are disposed faces the microfluidic chip substrate 204; pressing the handle 101 down to the handle limit surface of the second press plate 202; the handle 101 is pressed, the handle 101 drives the two switch rotating shafts 103 to rotate by the same angle through the synchronous transmission mechanism, and further drives the pressure head 104 to gradually rotate from the position 1 to the position 2 (the position 2 is the central position below the switch rotating shafts 103) in the pressure head containing groove 1024; in the process of pressing down the handle 101, the pressing head 104 gradually abuts against the first pressing plate 201 and the second pressing plate 202 and presses the pressure spring 105 to approach to the central position (the central position can refer to the central position of the square groove 113), and the pressure of the pressing head 104 on the first pressing plate 201 and the second pressing plate 202 gradually changes to the maximum value; the arrangement of the first pressing plate 201 and the second pressing plate 202 converts the downward pressure of the pressing head 104 into uniform clamping force on the microfluidic chip 203; at this time, the handle 101 just abuts against the handle limit surface of the second pressure plate 202, and the clamping of the microfluidic chip 203 is prompted to be completed. Meanwhile, the power supply module 300 moves downwards synchronously with the second pressing plate 202 and contacts with the electrodes in the microfluidic chip 203 to complete the power supply action.

When the microfluidic chip needs to be taken out, the handle 101 is lifted upwards, the four pressing heads 104 are driven by the synchronous pulley mechanism to rotate from the position 2 to the position 1, and the pressing heads 104 abut against the first pressing plate 201 and the second pressing plate 202 by pressure until the pressing heads are separated from the first pressing plate 201 and the second pressing plate 202; under the action of the return spring 206, the first pressing plate 201 and the second pressing plate 202 are bounced, and the microfluidic chip 203 is released. Meanwhile, the power supply module 300 is separated from the contact with the electrodes in the microfluidic chip, so that the chip can be conveniently pulled out of the chip accommodating groove.

In order to prevent liquid leakage in the clamping process, the device further comprises a sealing ring 207, and the sealing ring 207 can be arranged at the sample inlet and the sample outlet of the microfluidic chip to avoid liquid leakage. Specifically, a groove for placing a sealing ring 207 is arranged at a position on the microfluidic chip substrate 204 corresponding to a sample inlet and a sample outlet of the microfluidic chip, the sealing ring 207 is adhered to the groove, the shape of the groove can correspond to the shape of the sealing ring, and when the microfluidic chip 203 is inserted into the microfluidic chip substrate 204 along the direction a, an inner ring of each sealing ring 207 corresponds to the sample inlet and the sample outlet of the microfluidic chip 203, so as to avoid liquid leakage.

In order to fix the liquid flow adapter 208, the microfluidic chip substrate 204 is further provided with a matching opening groove, and the size and shape of the opening groove are matched with those of the liquid flow adapter 208. Specifically, the microfluidic chip substrate 204 is provided with an open slot at the bottom, which is in clearance fit with the flow adaptor 208.

The slot and flow adapter 208 may be secured by any securing means known in the art. In some embodiments, to ensure the stability of the flow adapter 208, the open slot is attached to the flow adapter 208 by an AB glue. In some embodiments, the flow adapter 208 has 1/4-28 internal threads, which can be adapted to a universal liquid path adapter, thereby ensuring the liquid flow tightness and operation stability of the microfluidic chip. The liquid flow adapter 208 is not directly adhered to the microfluidic chip, so that the liquid leakage risk is avoided, the stability is enhanced, the switching and the replacement of a liquid path are facilitated, and the secondary utilization rate of the microfluidic chip is improved.

In order to facilitate the optical detection of the microfluidic chip, the microfluidic chip substrate 204 is further provided with a through hole. The shape of the through hole can be any shape, such as a kidney shape.

The clamping switch module can be positioned by clearance fit of the positioning pin 108 on the pressing switch mechanism and the microfluidic chip substrate 204.

The clamping switch module is fixed with the microfluidic chip substrate 204 through four fixing bolts 112.

The power supply module 300 realizes power on and off of the micro-fluidic chip reaction/detection unit in a mechanical contact manner. In some embodiments, as shown in fig. 9, a circuit connector 301, a patch circuit board card 302, and a spring probe 303 are included. The spring probe 303 is internally provided with a spring, when the handle 101 is pressed down, the spring probe 303 is contacted with an electrode plated on the reaction/detection unit of the microfluidic chip 203, when the handle 101 is loosened, the spring probe 303 is separated from the electrode of the microfluidic chip, and a proper critical position can be set by controlling the adjusting bolt 212. A through groove is formed in the wiring circuit board card 302 and used for optical detection of the microfluidic chip; circuit connectors 301 are welded to two ends of the wiring circuit board card 302, and are in conduction with the spring probes 303 and used for supplying power to a reaction/detection unit of the microfluidic chip.

The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the system embodiment, since it is substantially similar to the method embodiment, the description is simple, and for the relevant points, reference may be made to the partial description of the method embodiment.

Claims (10)

1. A microfluidic chip clamping device is characterized by comprising:

the chip clamping main body module is used for forming a clamping carrier of the microfluidic chip;

the clamping switch module is used for controlling clamping of the microfluidic chip and adjusting clamping force;

the power supply module is used for supplying power to the reaction/detection unit on the microfluidic chip;

the power supply module is fixed on the chip clamping main body module through the connecting module, the connecting module comprises an adjusting mechanism, and mechanical contact between the power supply module and the upper electrode of the micro-fluidic chip is achieved in a chip clamping state through controlling the adjusting mechanism.

2. The microfluidic chip clamping device according to claim 1, wherein the clamping switch module further comprises a plurality of compression switch mechanisms, a synchronous transmission mechanism and a handle, the handle is fixedly connected with the synchronous transmission mechanism, the plurality of compression switch mechanisms are detachably connected with the synchronous transmission mechanism, and the plurality of compression switch mechanisms are fixed on the microfluidic chip substrate; and operating the handle to enable the synchronous transmission mechanism to drive the plurality of pressing switch mechanisms to simultaneously clamp or release the microfluidic chip.

3. The microfluidic chip clamping device according to claim 2, wherein the pressing switch mechanism comprises a switch rotating shaft, a switch outer sleeve sleeved outside the switch rotating shaft; grooves are formed in two ends of the switch rotating shaft, through holes are formed in the bottoms of the grooves and used for placing pressing heads, fastening structures are mounted on the tops of the grooves, and pressure springs and adjusting pressing blocks are further arranged in the grooves; and pressing the fastening structure to force the adjusting pressing block to compress the pressure spring so as to adjust the pretightening force of the pressure head.

4. The microfluidic chip clamping device according to claim 3, wherein the switch housing further comprises a deep groove in a side of the switch housing adjacent to the microfluidic chip for accommodating the switch rotating shaft with the pressing head.

5. The microfluidic chip clamping device according to any one of claims 3 to 4, wherein the bottom of the switch housing further comprises a rotation axis limiting surface for limiting the rotation axis of the switch from being separated from the switch housing.

6. The microfluidic chip clamping device according to claim 4, wherein the switch housing is further provided at two ends thereof with an adjusting screw receiving groove and a pressure head receiving groove, respectively, and the pressure head receiving groove is communicated with the deep groove for receiving the adjusting screw and the pressure head during rotation of the switch rotating shaft.

7. The microfluidic chip clamping device according to claim 3, wherein the synchronous transmission mechanism comprises a synchronous pulley and a synchronous belt, the synchronous pulley is fixed on the switch rotating shaft, and the handle is fixedly connected with the switch rotating shaft; and operating the handle to drive the plurality of pressure heads to simultaneously clamp or release the microfluidic chip through the synchronous belt pulley and the synchronous belt.

8. The microfluidic chip clamping device according to claim 1, wherein the chip clamping main body module comprises a microfluidic chip substrate, a first pressing plate and a second pressing plate, wherein one side of the microfluidic chip, on which the sample inlet and the sample outlet are disposed, is attached to the microfluidic chip substrate, and the first pressing plate and the second pressing plate are respectively disposed on the other side of the microfluidic chip from two end caps of the microfluidic chip.

9. The microfluidic chip clamping device according to claim 8, wherein the second pressing plate further comprises a handle limiting surface for abutting against a handle pressed downwards.

10. The microfluidic chip clamping device according to claim 8, wherein the chip clamping main body module further comprises a plurality of guide pins, and one ends of the guide pins are inserted into the microfluidic chip substrate and are in interference fit with the microfluidic chip substrate; the other end of the guide pin shaft is inserted into the first pressing plate and the second pressing plate and is in clearance fit with the first pressing plate and the second pressing plate; and a return spring is sleeved outside the guide pin shaft.

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