CN216982229U - Adsorption jig - Google Patents
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- CN216982229U CN216982229U CN202123420221.9U CN202123420221U CN216982229U CN 216982229 U CN216982229 U CN 216982229U CN 202123420221 U CN202123420221 U CN 202123420221U CN 216982229 U CN216982229 U CN 216982229U
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Abstract
The utility model discloses an adsorption jig, which comprises: the jig base is provided with an installation surface, the installation surface is provided with an installation area, the installation area is configured to install the ceramic copper-clad plate, the installation area comprises a positioning area and an adsorption area, and the positioning area is located at the edge of the adsorption area; the adsorption area is provided with a plurality of adsorption holes, the adsorption holes are arranged in the installation area at intervals, and the diameter phi of each adsorption hole is smaller than or equal to 1.6 mm; the jig base is further provided with a stress release area used for releasing stress, the stress release area is close to the mounting surface, the stress release area is provided with a plurality of stress release holes, the stress release holes penetrate through the jig base along a first direction, and the stress release holes are distributed along a second direction. According to the adsorption jig disclosed by the utility model, the diameter phi of the adsorption hole is set to be less than or equal to 1.6mmm, so that the ceramic copper-clad plate is prevented from being damaged by a wire bonder during wire bonding.
Description
Technical Field
The utility model relates to the technical field of jigs, in particular to an adsorption jig.
Background
The copper-clad ceramic substrate is called a ceramic copper-clad plate for short, the ceramic copper-clad plate has the characteristics of high heat conduction, high electrical insulation, high mechanical strength, low expansion and the like of ceramics, and the ceramic copper-clad plate is often applied to electric power, electronics, high-power modules, aerospace and the like.
When the ceramic copper-clad plate needs to be connected with electronic components except the ceramic copper-clad plate, the wires need to be connected through the wires, the wires need to be punched to the ceramic copper-clad plate when connecting wires are carried out, when the wire bonding is carried out on the ceramic copper-clad plate, the ceramic copper-clad plate needs to be fixed by utilizing a jig, and the problem that the wire bonding cannot be carried out due to the fact that the wire bonding is pulled up by a wire bonding machine when the wire bonding is carried out is solved. However, the structure for fixing the ceramic copper-clad plate is unreasonable at present, and after the ceramic copper-clad plate is fixed, the wire bonder is easy to punch the ceramic copper-clad plate when the wire bonder is used for punching the ceramic copper-clad plate, so that the ceramic copper-clad plate is damaged, and the cost is not saved.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide an adsorption jig, and aims to solve the technical problem that a ceramic copper-clad plate is easy to damage when the ceramic copper-clad plate is subjected to routing.
In order to achieve the above object, the present invention provides an adsorption jig comprising:
the jig comprises a jig base, a positioning base and a clamping base, wherein the jig base is provided with an installation surface, the installation surface is provided with an installation area, the installation area is configured to install a ceramic copper-clad plate, the installation area comprises a positioning area and an adsorption area, and the positioning area is located at the edge of the adsorption area;
the adsorption area is provided with a plurality of adsorption holes, the adsorption holes are arranged in the installation area at intervals, and the diameter phi of each adsorption hole is smaller than or equal to 1.6 mm;
the jig base is further provided with a stress release area used for releasing stress, the stress release area is close to the mounting surface, the stress release area is provided with a plurality of stress release holes, the stress release holes penetrate through the jig base along a first direction, and the stress release holes are distributed along a second direction.
Optionally, the diameter Φ of the adsorption hole is greater than or equal to 0.6mm and less than or equal to 1 mm.
Optionally, a distance L between centers of two adjacent adsorption holes is greater than or equal to 1.5mm and less than or equal to 4.5 mm.
Optionally, the adsorption region has a hole array formed by a plurality of adsorption holes arranged at intervals, the hole array extends along the first direction, the hole array has a plurality of rows, and the plurality of rows of hole arrays are arranged at intervals along the second direction.
Optionally, the adsorption jig further comprises an adapter;
an adsorption pipeline is formed in the jig seat, and the adsorption hole penetrates through the inner wall of the adsorption pipeline;
the fixture seat is provided with a connecting hole, the connecting hole is communicated with the inner space and the outer space of the adsorption pipeline, and the connecting hole is configured to be in at least partial inserting fit with the adapter.
Optionally, the adsorption line comprises:
the longitudinal pipelines extend along the first direction, the longitudinal pipelines are provided with a plurality of pipelines, the plurality of pipelines are arranged at intervals along the second direction, and the adsorption holes penetrate through the inner walls of the longitudinal pipelines;
the transverse pipelines extend along the second direction and penetrate through the inner walls of the plurality of longitudinal pipelines;
the connecting hole at least penetrates through the inner wall of the transverse pipeline.
Optionally, the stress relief holes are located between two adjacent hole rows;
the stress release hole and the adsorption pipeline are independent.
Optionally, the stress release hole has a diameter Φ smaller than twice the diameter Φ of the adsorption hole.
Optionally, the jig base is further provided with a disassembly avoidance groove, and the disassembly avoidance groove extends to the lower part of the mounting area so that the edge of the ceramic copper-clad plate protrudes out of the groove wall of the avoidance groove.
Optionally, the mounting region includes a mounting groove, and the plurality of adsorption holes are disposed at a groove bottom of the mounting groove.
According to the adsorption jig disclosed by the utility model, the jig seat is provided with the mounting area which is provided with the ceramic copper-clad plate used for adsorbing the ceramic copper-clad plate placed in the adsorption area, so that the jig seat can adsorb and position the ceramic copper-clad plate through the adsorption area. The adsorption zone is provided with a plurality of adsorption holes, so that the adsorption zone can adsorb the ceramic copper-clad plate on the adsorption zone through the adsorption holes, and the purposes of positioning and fixing the ceramic copper-clad plate are achieved. And secondly, the radius of the adsorption hole is required to be less than or equal to r1.6mm, so that the stress of a wire bonder on the ceramic copper clad laminate is reduced when the wire bonder is used for bonding the ceramic copper clad laminate after the ceramic copper clad laminate is positioned, and the damage of the ceramic copper clad laminate is avoided. Secondly, set up the locating area at the edge of adsorption zone, the locating area is used for dodging ceramic copper-clad plate, has promoted the efficiency of installation ceramic copper-clad plate. In addition, set up a plurality of stress release holes on the tool seat, avoid damaging the tool seat at the stress that the tool seat left over in process of production to promote the life who adsorbs the tool.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic view of an assembly structure of a plurality of adsorption jigs according to an embodiment of the adsorption jig of the present invention;
FIG. 2 is a schematic structural diagram of an adsorption jig for adsorbing a ceramic copper-clad plate according to an embodiment of the adsorption jig of the utility model;
FIG. 3 is a schematic structural diagram of an adsorption jig according to an embodiment of the present invention;
FIG. 4 is a schematic structural view of an adsorption pipeline according to an embodiment of the adsorption jig of the present invention;
fig. 5 is a schematic structural view of a stress release hole according to an embodiment of the suction jig of the utility model.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
13 | |
4 | Disassembly avoiding |
| 11 | |
131 | |
5 | |
| 12 | |
2 | Adsorption pipeline | 61 | A |
| 121 | |
21 | |
62 | |
| 122 | |
22 | |
7 | Ceramic copper- |
| 1221 | |
3 | Connecting hole |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "second", etc. in an embodiment of the present invention, the description of "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicit identification of the number of technical features indicated. Thus, a feature defined as "a" or "a second" can explicitly or implicitly include at least one of the feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, technical solutions between the embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides an adsorption jig.
In an embodiment of the present invention, as shown in fig. 1 to 4, the adsorption jig includes:
the jig base 1 is provided with an installation surface 11, the installation surface 11 is provided with an installation area 12, the installation area 12 is configured to install the ceramic copper-clad plate 7, the installation area 12 comprises a positioning area 121 and an adsorption area 122, and the positioning area 121 is located at the edge of the adsorption area 122; the adsorption area 122 is provided with a plurality of adsorption holes 1221, the adsorption holes 1221 are arranged in the installation area 12 at intervals, and the diameter Φ of the adsorption holes 1221 is less than or equal to 1.6 mm; the jig base 1 is further provided with a stress release area 13 for releasing stress, the stress release area 13 is adjacent to the mounting surface 11, the stress release area 13 is provided with a plurality of stress release holes 131, the stress release holes 131 penetrate through the jig base 1 along a first direction 61, and the stress release holes 131 are arranged along a second direction 62.
In this embodiment, the overall shape of the jig base 1 may be a cube or a cuboid, etc., and no specific limitation is made herein, and only the jig base needs to be limited to be used as a carrying medium for the ceramic copper-clad plate 7. The installation face 11 can set up the upside at tool seat 1, and in some embodiments, under special operating mode demand, installation face 11 still can set up the lateral wall at the mount pad, also can set up at tool seat 1 downside etc. do not do specific restriction here, only need installation face 11 can place ceramic copper-clad plate 7 can, this embodiment is preferred to be set up in the upside of tool seat 1. The positioning area 121 is arranged at the edge of the adsorption area 122, and the positioning area 121 is configured to avoid a product to be positioned so as to avoid interference with the jig base 1 when the ceramic copper-clad plate 7 to be positioned is installed. The overall shape of the positioning area 121 may be an arc surface or an opposite surface, and the like, and the positioning area is not particularly limited herein, and only a product to be positioned can be avoided. The adsorption area 122 is used for positioning the ceramic copper-clad plate 7 to be positioned on the adsorption area 122, and the shape of the adsorption area 122 may be circular or rectangular, and the like, which is not limited specifically herein. Adsorption zone 122 has seted up a plurality of adsorption holes 1221, has the interval between a plurality of adsorption holes 1221, simultaneously, in equipartition and the adsorption zone 122 to when fixing a position the product, can fix a position ceramic copper-clad plate 7 in adsorption zone 122 through a plurality of adsorption holes 1221 cooperation. Secondly, the diameter phi of the adsorption hole 1221 is smaller than or equal to 1.6mm, so that when the ceramic copper-clad plate 7 is positioned and then the wire bonding is carried out on the ceramic copper-clad plate 7, the stress of a wire bonding machine on the ceramic copper-clad plate 7 is reduced, the wire bonding machine is prevented from punching through the ceramic copper-clad plate 7 in a too long wire bonding process, and the purpose of protecting the ceramic copper-clad plate 7 from being damaged by the wire bonding machine is achieved.
The stress releasing region 13 is used for releasing the stress of the jig base 1, so as to prolong the service life of the jig base 1. The stress releasing region 13 may be disposed in the length direction of the jig base 1, or in the width direction of the jig base 1, and only needs to be disposed so as to avoid the mounting region 12. The stress area is opened with a plurality of stress releasing holes 131, the number of the stress releasing holes 131 is plural, and the plurality of stress releasing holes 131 penetrate through the jig base 1 so as to release the stress of the jig base 1. In order to improve the stress releasing effect, the stress releasing holes 131 extend along the first direction 61, and the stress releasing holes 131 are arranged at intervals along the second direction 62, so as to better release the stress.
According to the adsorption jig disclosed by the utility model, the mounting area 12 is arranged on the jig base 1, and the mounting area 12 is provided with the ceramic copper-clad plate 7 which is adsorbed and placed in the adsorption area 122, so that the jig base 1 can adsorb and position the ceramic copper-clad plate 7 through the adsorption area 122. The adsorption area 122 is provided with a plurality of adsorption holes 1221, so that the adsorption area 122 can adsorb the ceramic copper-clad plate 7 on the adsorption area 122 through the adsorption holes 1221, thereby achieving the purpose of positioning and fixing the ceramic copper-clad plate 7. Secondly, the radius of the adsorption hole 1221 needs to be smaller than or equal to r1.6mm, so that the stress of a wire bonder on the ceramic copper-clad plate 7 is reduced when the ceramic copper-clad plate 7 is bonded after the ceramic copper-clad plate 7 is positioned, and the damage of the ceramic copper-clad plate 7 is avoided. Secondly, set up locating area 121 at the edge of adsorption zone 122, locating area 121 is used for dodging ceramic copper-clad plate 7, has promoted the efficiency of installation ceramic copper-clad plate 7. In addition, a plurality of stress releasing holes 131 are formed in the jig base 1, so that the jig base 1 is prevented from being damaged by stress left in the production process of the jig base 1, and the service life of the adsorption jig is prolonged.
In one embodiment, as shown in fig. 3, the diameter Φ of the adsorption hole 1221 is greater than or equal to 0.6mm, and less than or equal to 1 mm. The distance L between the centers of the two adjacent adsorption holes 1221 is greater than or equal to 1.5mm and less than or equal to 4.5 mm.
Diameter of the adsorption hole 1221
The size of the suction hole is larger than or equal to 0.6mm, the phenomenon that the suction hole 1221 is too small and the processing difficulty is increased is avoided, and the phenomenon that the suction force is insufficient due to the fact that the suction hole 1221 is too small is avoided; meanwhile, the diameter of the adsorption hole 1221
And the thickness is required to be less than or equal to 1mm, so that the phenomenon that the adsorption hole 1221 is too large and the ceramic copper-clad plate 7 cannot be protected is avoided. In addition, in order to protect the ceramic copper clad laminate 7 and have good adsorption capacity, the interval between two adjacent adsorption holes 1221 needs to be between two times of the diameter of the adsorption holes 1221 and four times of the diameter of the adsorption holes 1221. For example, when the diameter of the adsorption hole 1221 is larger
When the diameter is 0.6mm, the circle center distance L between two adjacent adsorption holes 1221 is between 1.2mm and 2.4 mm; when the diameter of the adsorption hole 1221
When the diameter is 0.7mm, the circle center distance L between two adjacent adsorption holes 1221 is between 1.4mm and 2.8 mm; when the diameter of the adsorption hole 1221
When the diameter is 0.8mm, the circle center distance L between two adjacent adsorption holes 1221 is between 1.6mm and 3.2 mm; when the diameter of the adsorption hole 1221
When the diameter is 0.9mm, the circle center distance L between two adjacent adsorption holes 1221 is between 1.6mm and 3.6 mm; when the diameter of the adsorption hole 1221
When the diameter is 1mm, the circle center distance L between two adjacent adsorption holes 1221 is between 2mm and 4 mm; with the interval between two adjacent absorption holes 1221 according to absorption hole 1221 2 times to 4 times between set up the multiple setting, can be according to the interval between two adjacent absorption holes 1221 of size adjustment of absorption hole 1221 to promote the stability of ceramic copper-clad plate 7 in adsorption zone 122, simultaneously, can compromise the protection product.
In one embodiment, as shown in fig. 3, the adsorption region 122 has a hole array formed by a plurality of adsorption holes 1221 arranged at intervals, the hole array extends along the first direction 61, the hole array has a plurality of rows, and the plurality of rows of hole arrays are arranged at intervals along the second direction 62. When fixing a position ceramic copper-clad plate 7 for adsorption hole 1221, the suction of adsorbing ceramic copper-clad plate 7 is more even, a plurality of adsorption holes 1221 set up along 61 interval arrangements in first direction, and simultaneously, adsorption zone 122 is equipped with multirow adsorption hole 1221, thus, when ceramic copper-clad plate 7 was placed in adsorption zone 122, the suction that ceramic copper-clad plate 7 received was more even, because the uneven adsorption affinity that leads to of distribution of adsorption hole 1221 was not enough when avoiding the routing, thereby further protected ceramic copper-clad plate 7.
In an embodiment, as shown in fig. 4, the adsorption jig further includes an adapter; an adsorption pipeline 2 is formed in the jig seat 1, and the adsorption hole 1221 penetrates through the inner wall of the adsorption pipeline 2; the fixture seat 1 is provided with a connecting hole 3, the connecting hole 3 is communicated with the inner space and the outer space of the adsorption pipeline 2, and the connecting hole 3 is configured to be matched with at least part of the adapter in an inserting mode. The adsorption line 2 includes: a plurality of longitudinal pipes 21, the longitudinal pipes 21 extending along the first direction 61, the longitudinal pipes 21 being spaced apart from each other along the second direction 62, and the adsorption holes 1221 penetrating through an inner wall of the longitudinal pipes 21; a transverse pipe 22 extending along the second direction 62 and penetrating the inner walls of the plurality of longitudinal pipes 21; the connecting hole 3 penetrates at least the inner wall of the transverse duct 22.
The adsorption pipeline 2 is used for connecting a plurality of adsorption holes 1221 to adsorb a plurality of adsorption holes 1221 through the adsorption pipeline 2, so as to ensure the adsorption force of the adsorption holes 1221. The adsorption pipeline 2 can be formed by bending a single pipe for multiple times, and also can be formed by a plurality of branches, so that specific limitation is not required, and only a plurality of adsorption holes 1221 are required to be conveniently communicated. The connecting hole 3 supplies the outside to communicate with the adsorption pipeline 2, the size of the connecting hole 3 is not specifically limited, only the set air quantity can be reached, the position of the connecting hole 3 can be located at any position of the adsorption pipeline 2, and only the adsorption pipeline 2 needs to be communicated. The adapter is used as a transfer medium for connecting with an external pipeline, and the type of the adapter may be a common adapter or other medium capable of being used as a transfer medium, and the like, which is not limited specifically herein. In order to make the adsorption force of each adsorption hole 1221 uniform, the adsorption pipeline 2 is composed of a plurality of longitudinal pipelines 21 extending in the first direction 61, and the interval between two adjacent longitudinal pipelines 21 is the same as the interval between two adjacent adsorption holes 1221 of the adsorption hole 1221, so that the adsorption holes 1221 are communicated with the adjacent longitudinal pipelines 21. The position of the transverse pipeline 22 is not particularly limited, and it is only necessary that the transverse pipeline 22 extends along the second direction 62 and then can be communicated with each longitudinal pipeline 21, so that each longitudinal pipeline 21 can vent air through the transverse pipeline 22. The connecting hole 3 can run through any longitudinal pipeline 21 and also can run through the transverse pipeline 22, the embodiment takes the transverse pipeline 22 as an example, the connecting hole 3 runs through the transverse pipeline 22, so that the negative pressure of each longitudinal pipeline 21 is more uniform when the ceramic copper-clad plate 7 is positioned, and therefore, the uniform adsorption force of each adsorption hole 1221 is ensured.
In one embodiment, as shown in fig. 3 and 5, the stress releasing holes 131 are located between two adjacent hole rows; the stress relief hole 131 is independent from the adsorption line 2. The diameter phi of the stress release hole 131 is smaller than twice the diameter phi of the adsorption hole 1221.
In order to better release the stress of the jig base 1, each stress release hole 131 is disposed between two adjacent hole rows, so as to better release the stress of the jig base 1. In addition, the stress release hole 131 and the adsorption pipeline 2 are independent from each other (i.e. the adsorption pipeline 2 is not communicated with the stress release hole 131), so that the phenomenon of air leakage when the adsorption pipeline 2 is pumped is avoided. In addition, in order to increase the stress releasing of the stress releasing hole 131, the diameter of the stress releasing hole 131 is larger than the diameter of the adsorption hole 1221 and is smaller than the hole partition wall distance between two adjacent adsorption holes 1221, so as to prevent the stress releasing hole 131 from communicating with the adsorption holes 1221.
In an embodiment, as shown in fig. 2 and 3, the jig base 1 is further provided with a detachment avoiding groove 4, and the detachment avoiding groove 4 partially extends to the lower side of the mounting area 12, so that the edge of the ceramic copper-clad plate 7 protrudes out of the groove wall of the detachment avoiding groove. The mounting region 12 includes a mounting groove 5, and the adsorption holes 1221 are provided in a plurality at the bottom of the mounting groove 5.
Dismantle and dodge groove 4 and be located installing zone 12, simultaneously with adsorption zone 122 and close to the setting, dismantle and dodge one side that groove 4 can be located adsorption zone 122, also can be located the relative both sides of adsorption zone 122, do not do specific restriction here, this embodiment is with the relative both sides of adsorption zone 122, and simultaneously, dismantle and dodge 4 partial downside that extend to installing zone 12 in groove, so that when dismantling ceramic copper-clad plate 7, operating personnel can dodge the groove through the ability and stretch into installing zone 12 and dismantle installing zone 12 with ceramic copper-clad plate 7, thereby promote the efficiency of dismantling. In addition, in order to facilitate the installation and location to ceramic copper clad laminate 7, mounting groove 5 is preferred to installing zone 12, the mode that mounting groove 5 formed can be sunken on tool seat 1, also can enclose into etc. through the locating piece, do not do specific restriction here, this embodiment forms the example with sunken, sunken formation mounting groove 5 is compared in enclosing into by the locating piece, sunken formation has avoided carrying out the butt with the locating piece when installation ceramic copper clad laminate 7, and then make and carry out the scratch to ceramic copper clad laminate 7, thereby reach the purpose of protection ceramic copper clad laminate 7.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. An adsorption jig, comprising:
the jig base is provided with an installation surface, the installation surface is provided with an installation area, the installation area is configured to install the ceramic copper-clad plate, the installation area comprises a positioning area and an adsorption area, and the positioning area is located at the edge of the adsorption area;
the adsorption area is provided with a plurality of adsorption holes, the adsorption holes are arranged in the installation area at intervals, and the diameter phi of each adsorption hole is smaller than or equal to 1.6 mm;
the jig base is further provided with a stress release area used for releasing stress, the stress release area is close to the mounting surface, the stress release area is provided with a plurality of stress release holes, the stress release holes penetrate through the jig base along a first direction, and the stress release holes are distributed along a second direction.
2. The suction jig according to claim 1, wherein the diameter Φ of the suction hole is greater than or equal to 0.6mm and less than or equal to 1 mm.
3. The absorption jig according to claim 1, wherein a distance L between centers of two adjacent absorption holes is greater than or equal to 1.5mm and less than or equal to 4.5 mm.
4. The suction jig according to claim 1, wherein the suction area has a hole row formed by a plurality of suction holes arranged at intervals, the hole row extends along the first direction, the hole row has a plurality of rows, and the plurality of rows of the hole rows are arranged at intervals along the second direction.
5. The suction jig of claim 4, further comprising an adapter;
an adsorption pipeline is formed in the jig seat, and the adsorption hole penetrates through the inner wall of the adsorption pipeline;
the fixture seat is provided with a connecting hole, the connecting hole is communicated with the inner space and the outer space of the adsorption pipeline, and the connecting hole is configured to be in at least partial inserting fit with the adapter.
6. The adsorption jig of claim 5, wherein the adsorption pipeline comprises:
the longitudinal pipelines extend along the first direction, the longitudinal pipelines are provided with a plurality of pipelines, the plurality of pipelines are arranged at intervals along the second direction, and the adsorption holes penetrate through the inner walls of the longitudinal pipelines;
the transverse pipelines extend along the second direction and penetrate through the inner walls of the plurality of longitudinal pipelines;
the connecting hole at least penetrates through the inner wall of the transverse pipeline.
7. The absorption jig according to claim 6, wherein the stress releasing holes are located between two adjacent hole rows;
the stress release hole and the adsorption pipeline are independent.
8. The adsorption jig according to any one of claims 1 to 7, wherein the diameter φ of the stress release holes is smaller than twice the diameter φ of the adsorption holes.
9. The adsorption jig according to any one of claims 1 to 7, wherein the jig base is further provided with a detachment avoiding groove, and the detachment avoiding groove partially extends to a position below the mounting area, so that the edge of the ceramic copper-clad plate protrudes out of the groove wall of the avoiding groove.
10. The suction jig according to any one of claims 1 to 7, wherein the mounting area includes a mounting groove, and a plurality of the suction holes are provided at a groove bottom of the mounting groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123420221.9U CN216982229U (en) | 2021-12-31 | 2021-12-31 | Adsorption jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123420221.9U CN216982229U (en) | 2021-12-31 | 2021-12-31 | Adsorption jig |
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| Publication Number | Publication Date |
|---|---|
| CN216982229U true CN216982229U (en) | 2022-07-15 |
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|---|---|---|---|
| CN202123420221.9U Active CN216982229U (en) | 2021-12-31 | 2021-12-31 | Adsorption jig |
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|---|---|
| CN (1) | CN216982229U (en) |
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2021
- 2021-12-31 CN CN202123420221.9U patent/CN216982229U/en active Active
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