CN215345280U - Circuit board bearing carrier and SMT system - Google Patents
Circuit board bearing carrier and SMT system Download PDFInfo
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- CN215345280U CN215345280U CN202121251471.1U CN202121251471U CN215345280U CN 215345280 U CN215345280 U CN 215345280U CN 202121251471 U CN202121251471 U CN 202121251471U CN 215345280 U CN215345280 U CN 215345280U
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- carrier
- circuit board
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- plate
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Abstract
The utility model discloses a circuit board bearing carrier and an SMT system, wherein the circuit board bearing carrier comprises: the magnet mounting device comprises a carrier plate, wherein a plurality of first through holes for mounting magnets are formed in the carrier plate; the cover plate is provided with a plurality of first windows at positions corresponding to the circuit board patches; the circuit board is arranged between the carrier plate and the cover plate, so that the cover plate is adsorbed by the magnets when the circuit board is attached. The technical scheme of the utility model can effectively improve the universality of the circuit board bearing carrier and reduce the production cost.
Description
Technical Field
The utility model relates to the field of circuit board processing, in particular to a circuit board bearing carrier and an SMT system.
Background
With the development of technology, the circuit board is miniaturized more and more, the integration level is higher and more, the packaged components are smaller and smaller, and the technical requirements for the circuit board mounting are higher and higher.
However, miniaturized and flexible circuit boards cannot be handled substantially directly by SMT equipment when mounting components. In the prior art, a supporting plate is designed for the circuit board and used as a carrier for supporting the circuit board, and then a layer of viscous material is pasted on the supporting plate to adhere the circuit board, so that the components can be conveniently pasted and processed on the SMT equipment. But the adhesive material has a short life span, is easily failed, and additionally increases the production cost.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a circuit board bearing carrier, which aims to facilitate a circuit board to realize component mounting through an SMT (surface mount technology) mounting process, improve the universality of mounting and reduce the production cost.
In order to achieve the above object, the present invention provides a circuit board supporting carrier, including:
circuit board bearing carrier includes:
the magnetic field generator comprises a carrier plate, wherein a magnet is arranged on the carrier plate; and
the cover plate is provided with a magnetic conduction part and a first window, the magnetic conduction part is arranged corresponding to the position of the magnet, and the first window is arranged corresponding to a component patch area on the circuit board;
the circuit board is arranged between the cover plate and the carrier plate, and the cover plate and the carrier plate are magnetically adsorbed by the magnet and the magnetic conduction part so as to clamp and fix the circuit board.
Optionally, a first through hole is formed in the carrier plate, and the magnet is arranged in the first through hole.
Optionally, the number of the first through holes is multiple, and the first through holes are arranged horizontally at intervals and are arranged in a staggered manner between adjacent vertical through holes without overlapping.
Optionally, the component mounting area has a plurality of component mounting positions, the first window is provided to expose the plurality of component mounting positions, or the first window is provided with an escape opening corresponding to each of the component mounting positions.
Optionally, a positioning column is arranged on the chip mounter, second through holes are arranged on the support plate at positions corresponding to the positioning column, and the second through holes are longitudinally arranged at intervals.
Optionally, the carrier plate is further provided with third through holes for conducting gas, the third through holes are arranged transversely at intervals and are staggered and not overlapped longitudinally adjacent to each other, and the first through holes and the third through holes are staggered and not located on the same horizontal line.
Optionally, a positioning pin is arranged on the chip mounter, the carrier plate is further provided with a strip-shaped groove corresponding to the positioning pin, a positioning through hole corresponding to the positioning pin is formed in the circuit board, and a second window corresponding to the positioning pin is formed in the cover plate.
Optionally, a positioning point and an NG identification area are further arranged on the circuit board, and a third window and a fourth window are arranged on the cover plate at positions corresponding to the positioning point and the NG identification area.
Optionally, the carrier plate has a first side and a second side opposite to each other, and the first side and the second side are respectively provided with a pick-and-place groove.
The utility model also provides an SMT system, wherein the SMT system comprises the circuit board bearing carrier.
According to the technical scheme, the circuit board is borne by the support plate, the cover plate is arranged above the circuit board, the circuit board is clamped by the support plate and the cover plate, the magnet is arranged in the support plate and used for adsorbing the cover plate, accurate positioning and fixing of the circuit board are achieved, the circuit board bearing carrier can be recycled and practical, corresponding positioning modes can be achieved according to different specifications of the circuit board, accordingly, the universality of the circuit board bearing carrier is improved, and compared with the prior art, the production cost can be effectively reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic view of a circuit board carrier of the present invention
FIG. 2 is a schematic view of a circuit board carrier of the present invention;
FIG. 3 is a schematic diagram of a circuit board supporting carrier circuit board according to the present invention;
FIG. 4 is a schematic view of a circuit board supporting carrier cover plate according to the present invention;
FIG. 5 is a schematic view of a circuit board carrier assembly according to the present invention;
FIG. 6 shows an embodiment of a circuit board holding carrier magnet of the present invention;
FIG. 7 shows another embodiment of the circuit board holding carrier magnet of the present invention;
fig. 8 shows another embodiment of the circuit board holding carrier magnet of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Circuit board bearing carrier | 200 | |
| 10 | |
20 | |
| 30 | |
11 | First through |
| 12 | Second through |
13 | Third through |
| 14 | Strip- |
15 | Taking and placing |
| 21 | |
22 | |
| 23 | |
24 | |
| 31 | Positioning through |
32 | Mark point |
| 33 | NG identification area |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a circuit board bearing carrier 100, which is used for bearing a circuit board on a chip mounter.
In an embodiment of the present invention, as shown in fig. 1 to 8, the circuit board supporting carrier 100 includes:
the magnetic field generator comprises a carrier plate 10, wherein a magnet is arranged on the carrier plate 10; and
the cover plate 20 is provided with a magnetic conduction part and a first window 21, the magnetic conduction part is arranged corresponding to the position of the magnet, and the first window 21 is arranged corresponding to the component patch area on the circuit board 30;
the circuit board 30 is disposed between the cover plate 20 and the carrier plate 10, and the cover plate 20 and the carrier plate 10 are magnetically attracted by the magnet and the magnetic conductive portion to sandwich and fix the circuit board 30.
It should be noted that magnet is alnico magnet, because circuit board bearing carrier 100 still need pass through the reflow soldering process after the paster process, and the general temperature of reflow soldering is 300 ℃, but magnet is easy demagnetization under high temperature environment, so magnet adopts the alnico magnet that extreme temperature is 450 ℃, still need pay attention to regularly magnet magnetizes simultaneously, ensures circuit board bearing carrier 100's working property.
Further, a first through hole 11 is disposed on the carrier plate 10, and the magnet is disposed in the first through hole 11.
The number of the first through holes 11 is multiple, and the first through holes 11 are arranged horizontally at intervals and are arranged in a staggered manner between adjacent longitudinal through holes without overlapping.
Referring to fig. 5 to 7, since the carrier board 10 has a certain flatness requirement, the top surface of the magnet is flush with the top surface of the carrier board 10, and the circuit board 30 may be an FPC circuit board, when the circuit board is taken out after the process is completed, the absorption force between the cover plate 20 and the magnet may cause irreversible damage to the FPC circuit board, so that the carrier board 10 needs to limit the position of the magnet, and the magnet may be limited in the moving direction by using a sinker-type through hole and an inverted cone-shaped through hole, and may also be in a threaded connection form, so as to meet the flatness requirement of the carrier board 10, protect the circuit board 30, and meet the requirement of clamping the circuit board 30.
In the above technical solution, the carrier plate 10 is provided with the first through hole 11 for installing the magnet, the cover plate 20 is provided with the first window 21 at the corresponding position of the circuit board patch, the circuit board 30 is disposed between the carrier plate 10 and the cover plate 20, the carrier plate 10 adsorbs the cover plate 20 through the magnet, thereby fixing the circuit board 30, meanwhile, the first through hole 11 is transversely arranged at intervals and longitudinally arranged at intervals in a staggered manner without overlapping, that is, the magnet is also distributed over the carrier plate 10, that is, the circuit board bearing carrier 100 can be assembled with circuit boards 30 of different specifications, thereby improving the universality of the circuit board bearing carrier 100, and further reducing the production cost.
In an embodiment, the component mounting area has a plurality of component mounting positions, the first window 21 is configured to expose the plurality of component mounting positions correspondingly, or the first window 21 is configured with an evacuation port corresponding to each of the component mounting positions.
In an embodiment, the placement machine is provided with a positioning column, the carrier 10 is provided with second through holes 12 at a position corresponding to the positioning column, and the second through holes 12 are longitudinally arranged at intervals. It should be noted that, simultaneously, in the paster, there is a certain requirement for the position of circuit board, because the position of chip mounter self is fixed, therefore this application through set up second through-hole 12 on the support plate 10, be used for with chip mounter base fixed connection, thereby make circuit board bearing carrier 100 for the position of chip mounter is fixed, does benefit to the yields that improves the paster process.
Further, the carrier plate 10 is further provided with third through holes 13 for conducting gas, the third through holes 13 are arranged transversely at intervals and are arranged in a staggered manner between adjacent longitudinal through holes without overlapping, and the first through holes 11 and the third through holes 13 are staggered with each other and are not located on the same horizontal line. It should be noted that, circuit board 30 is after paster process, and follow-up still need carry out the reflow soldering process, during the reflow soldering process circuit board 30 needs even intensification, just can guarantee the yields, but in this application circuit board 30 sets up carrier plate 10 with between the apron 20, be unfavorable for circuit board 30's even intensification, consequently be provided with transversely according to interval arrangement and vertically between adjacent dislocation arrangement non-overlapping third through hole 13 each other on carrier plate 10 for hot gas convection when reflow soldering, make circuit board 30 intensifies more evenly, has promoted the yields.
In an embodiment, the chip mounter is provided with a positioning pin, the carrier board 10 is further provided with a strip-shaped groove 14 corresponding to the positioning pin, the circuit board 30 is provided with a positioning through hole 31 corresponding to the positioning pin, and the cover plate 20 is provided with a second window 22 corresponding to the positioning pin. It should be noted that a positioning pin is disposed in the bar-shaped groove, and can pass through the positioning through hole 31 of the circuit board 30 at the corresponding position and the second window 22 of the cover plate 20, so that the circuit board 30 can be fixed relative to the circuit board support carrier 100, the consistency of the relative position relationship between the circuit board support carrier 100 and the circuit board 30 is maintained, and the yield of the mounting process is improved.
In an embodiment, the circuit board 30 is further provided with a positioning point 32 and an NG identification area 33, and the cover plate 20 is provided with a third window 23 and a fourth window 24 at positions corresponding to the positioning point 32 and the NG identification area 33. It should be noted that although the circuit board 30 is detected in the production process, there still exists an NG board, and the time is wasted and the NG board is difficult to recycle after being pasted. Therefore, the NG plate identification program is added to the chip mounter in the application, the circuit board 30 is provided with the NG plate identification area, the NG plate is distinguished before the chip mounting process, and the chip mounting process is directly skipped when the NG plate is identified. The NG board can be directly identified by the chip mounter, so that the processing time is saved, the material waste is reduced, and meanwhile, the NG board can be identified in the subsequent process at a glance.
In one embodiment, the carrier 10 has a first side and a second side opposite to each other, and the first side and the second side are respectively provided with a pick-and-place slot 15. It should be noted that, because the circuit board 30 may be an FPC circuit board, after the surface mount process is completed, the magnet may attract the circuit board 30, so that it is difficult to remove the circuit board 30, and the strength of the circuit board 30 is low, therefore, the two side surfaces 10 are provided with the inward concave pick-and-place grooves 15, and the pick-and-place grooves 15 are used for picking and placing the circuit board 30, so as to improve the working efficiency.
An SMT system 200 comprising a circuit board carrier 100 as described in any of the above embodiments.
It should be noted that, since the SMT system 200 of the present invention includes all embodiments of the circuit board carrier 100, the SMT system 200 of the present invention has all the advantages of the circuit board carrier 100, and thus, the description thereof is omitted.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The utility model provides a circuit board bearing carrier for bearing circuit board on chip mounter, its characterized in that, circuit board bearing carrier includes:
the magnetic field generator comprises a carrier plate, wherein a magnet is arranged on the carrier plate; and
the cover plate is provided with a magnetic conduction part and a first window, the magnetic conduction part is arranged corresponding to the position of the magnet, and the first window is arranged corresponding to a component patch area on the circuit board;
the circuit board is arranged between the cover plate and the carrier plate, and the cover plate and the carrier plate are magnetically adsorbed by the magnet and the magnetic conduction part so as to clamp and fix the circuit board.
2. The carrier of claim 1 wherein the carrier has a first through hole and the magnet is disposed in the first through hole.
3. The carrier of claim 2 wherein the first plurality of through holes are spaced apart from one another in the transverse direction and are offset from one another in the longitudinal direction.
4. The circuit board support carrier of claim 1, wherein the component mounting area has a plurality of component mounting sites, and wherein the first window is configured to expose a plurality of component mounting sites, or wherein the first window is configured with an escape opening corresponding to each of the component mounting sites.
5. The carrier of claim 1, wherein the placement machine has positioning posts, and wherein the carrier has second through holes at locations corresponding to the positioning posts, the second through holes being spaced apart from each other in the longitudinal direction.
6. The carrier of claim 2 further comprising third through holes for gas communication, wherein the third through holes are spaced apart from each other and are staggered from each other and do not overlap each other, and the first through holes and the third through holes are staggered from each other and do not lie on the same horizontal line.
7. The carrier for supporting circuit board as claimed in claim 1, wherein the carrier board is provided with a positioning pin, and the carrier board is further provided with a bar-shaped slot corresponding to the positioning pin, the circuit board is provided with a positioning through hole corresponding to the positioning pin, and the cover board is provided with a second window corresponding to the positioning pin.
8. The carrier for supporting circuit board as claimed in claim 1, wherein said circuit board further has a positioning point and an NG mark area, and said cover plate has a third window and a fourth window at the corresponding positions of said positioning point and said NG mark area.
9. The carrier of claim 1 wherein the carrier has opposing first and second sides, each of the first and second sides having access slots.
10. An SMT system comprising a board support carrier according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121251471.1U CN215345280U (en) | 2021-06-04 | 2021-06-04 | Circuit board bearing carrier and SMT system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121251471.1U CN215345280U (en) | 2021-06-04 | 2021-06-04 | Circuit board bearing carrier and SMT system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215345280U true CN215345280U (en) | 2021-12-28 |
Family
ID=79551180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121251471.1U Active CN215345280U (en) | 2021-06-04 | 2021-06-04 | Circuit board bearing carrier and SMT system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215345280U (en) |
-
2021
- 2021-06-04 CN CN202121251471.1U patent/CN215345280U/en active Active
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| GR01 | Patent grant |