CN216980498U - Wafer processing equipment - Google Patents

Abstract

The embodiment of the application discloses a wafer processing device. Wherein, the wafer processing equipment includes: the liquid drainage device comprises a box body and a liquid drainage component, wherein the box body is used for containing liquid, a plurality of wafer placing positions are arranged in the box body, and the wafer placing positions are used for placing wafers; the liquid drainage assembly is arranged in the box body and used for driving the liquid in the box body to flow so as to utilize the flowing liquid to flush the surface of the wafer. The liquid is driven to flow by the liquid drainage assembly, on one hand, the liquid etches or cleans the wafer in the flow, on the other hand, the liquid in the whole box body flows, the liquid in all positions in the box body is uniformly mixed, and the uniformity of etching or cleaning the wafer can be improved.

Description

Wafer processing equipment

Technical Field

The application relates to the technical field of semiconductors, in particular to a wafer processing device.

Background

In the production of semiconductor devices, a plurality of complicated processing steps including etching, exposure, cleaning, etc. are required for a wafer.

In the related art, in some process procedures for cleaning or etching a wafer, when the wafer is immersed in a cleaning solution or an etching solution to be etched or cleaned, the problem of inconsistent processing efficiency at various positions on the surface of the wafer is easily caused.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a wafer processing device which can effectively improve the uniformity of wafer etching or cleaning. The technical scheme is as follows:

the embodiment of the application provides a wafer processing device, including:

the wafer placing position is used for placing wafers;

and the liquid drainage component is arranged in the box body and used for driving the liquid in the box body to flow so as to utilize the flowing liquid to flush the surface of the wafer.

According to the wafer processing equipment provided by the embodiment of the application, the wafer to be processed is placed through the wafer placing position, the wafer is enabled to be vertically placed in the box body, liquid is injected into the box body to immerse the wafer, different liquids can be injected, and the wafer is selected to be etched or cleaned; meanwhile, a plurality of wafer placing positions are arranged, so that a plurality of wafers can be processed at one time, and the wafer processing efficiency is improved; in addition, the liquid drainage assembly is arranged to drive liquid to flow, on one hand, the liquid etches or cleans the wafer in the flowing process, on the other hand, the liquid in the whole box body flows, the liquid in all positions in the box body is uniformly mixed, and the uniformity of etching or cleaning the wafer can be improved.

In some embodiments, the liquid guiding assembly includes a plurality of nozzles, and the plurality of nozzles are installed inside the box body and are arranged around the plurality of wafer mounting positions to drive the liquid to flow.

In some embodiments, the plurality of wafer mounting positions are arranged in a preset direction, and the plurality of nozzles of the liquid guiding assembly are arranged around the preset direction in a shaft surrounding manner on the peripheral side of the wafer mounting positions;

the box body comprises a bottom plate and a side plate connected with the bottom plate, the side plate is connected with the periphery of the bottom plate and surrounds the bottom plate to form a containing space for containing the liquid, and the spray head is arranged on the side plate or the bottom plate and used for driving the liquid to flow.

In some embodiments, the spray head is fixed on the bottom plate or the side plate, and the spray head is configured to spray in an inclined direction relative to the bottom plate or the side plate.

In some embodiments, the showerhead is rotatably mounted on the bottom plate or the side plate, and the wafer processing apparatus further includes a driving assembly mounted on the box and connected to the showerhead for driving the showerhead to rotate.

In some embodiments, the spray heads include a mounting end and a spraying end, the mounting end is mounted to the tank, and a distance between the mounting end of one of the spray heads and the spraying end of another spray head in the same liquid diversion assembly is smaller than a distance between the mounting ends of the two spray heads.

In some embodiments, the driving assembly includes a motor, the mounting end of the nozzle is rotatably mounted in the box body through a rotating shaft, and an output shaft of the motor is connected to the rotating shaft of the nozzle to drive the nozzle to rotate through the rotating shaft.

In some embodiments, the spray head is rotatably mounted on the side plate or the bottom plate through a ball head connecting piece, the driving assembly includes a first telescopic piece and a second telescopic piece, one end of the first telescopic piece and one end of the second telescopic piece are both mounted on the box body, the other end of the first telescopic piece and the other end of the second telescopic piece are both connected with the spray head, and the first telescopic piece and the second telescopic piece both drive the spray head to rotate through stretching.

In some embodiments, the wafer processing equipment further comprises a connecting rod, the length direction of the connecting rod is parallel to the length direction of the rotating shaft, the connecting rod is connected with the plurality of nozzles, and the driving assembly drives the plurality of nozzles connected to the connecting rod to rotate synchronously.

In some of these embodiments, the fluid diversion assembly further comprises:

the liquid pump is arranged in the box body or the external liquid storage tank and used for sucking the liquid in the box body or the external liquid storage tank;

a liquid guide tube connecting the liquid pump and the spray head to guide the liquid pumped by the liquid pump to the spray head.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a side sectional view of a wafer processing apparatus according to one embodiment of the present disclosure;

FIG. 2 is a sectional top view of a wafer processing apparatus according to a second embodiment of the present disclosure;

FIG. 3 is a cross-sectional side view of a wafer processing apparatus according to a third embodiment of the present application;

FIG. 4 is a sectional side view of a wafer processing apparatus according to a fourth embodiment of the present application;

FIG. 5 is a sectional top view of a wafer processing apparatus according to a third embodiment of the present application;

Fig. 6 is a top sectional view of a wafer processing apparatus according to a fourth embodiment of the present disclosure.

Reference numerals are as follows: 100. a box body; 101. a wafer placing position; 102. a base plate; 103. a side plate; 200. a fluid drainage assembly; 210. a spray head; 211. an installation end; 212. a spray end; 300. a drive assembly; 310. a motor; 320. a first telescoping member; 330. a second telescoping member; 400. a rotating shaft; 500. a ball head connecting piece; 600. a connecting rod.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims.

Referring to fig. 1-6, embodiments of the present application provide a wafer processing apparatus including a tank 100 and a fluid diversion assembly 200.

The box 100 is used for containing liquid, the box 100 is provided with a plurality of wafer placing positions 101, the wafer placing positions 101 are used for placing wafers, and the liquid drainage component 200 is arranged in the box 100 and used for driving the liquid in the box 100 to flow so as to flush the surfaces of the wafers with the flowing liquid.

According to the wafer processing equipment provided by the embodiment of the application, the wafer to be processed is placed through the wafer placing position 101, the wafer is vertically placed in the box body 100, liquid is injected into the box body 100 to immerse the wafer, different liquids can be injected, and the wafer is selected to be etched or cleaned; meanwhile, a plurality of wafer placing positions 101 are arranged, so that a plurality of wafers can be processed at one time, and the wafer processing efficiency is improved; in addition, the liquid drainage assembly 200 is arranged to drive the liquid to flow, on one hand, the liquid etches or cleans the wafer in the flowing process, on the other hand, the liquid in the whole box body 100 flows, the liquid in all positions in the box body 100 is uniformly mixed, and the uniformity of wafer etching or cleaning can be improved.

Specifically, the wafer includes, but is not limited to, a wafer made of a semiconductor material, which may be a silicon wafer with semi-finished devices or wires, or a single crystal silicon wafer without being processed. The wafer is placed vertically on the wafer seating position 101, or the surface of the wafer is at a first angle with the horizontal plane, and the first angle may be greater than 0 and less than 90 degrees, i.e. tilted. When the wafers are circular sheet-like structures, all the wafers are coaxially and alternately placed in the box body 100, which is a placement mode that can accommodate the largest number of wafers in the box body 100 and save the most space.

In addition, the wafer placement site 101 may include a support that exposes the surface of the wafer to the environment by supporting a number of support points on the lateral edge of the wafer, out of contact with the wafer placement site. The wafer receiving station 101 may also include a plurality of suction devices, such as suction pads or suction holes connected to the suction holes, for sucking and fixing the wafer by reducing the air pressure between the suction holes and the wafer, so that the wafer may be adjusted to be horizontal when the wafer is removed, and then the vacuum of the suction devices is released to detach the wafer, and the wafer may be removed by a moving device, such as a robot arm.

Different wafer placing positions 101 have preset spacing distances therebetween, where it should be noted that the preset spacing distances between the wafers are determined by the structural configuration of the box 100, and when the preset spacing distances are smaller, the number of wafers that can be accommodated in the box 100 is larger, but the wafer processing effect may be poor, so that a larger preset spacing distance needs to be set; the larger the preset spacing distance is, the smaller the number of wafers that can be accommodated in the box 100 is, which is not favorable for the lifting of the cleaning assembly WPH (Wafer per Hour, the number of wafers processed per Hour), and therefore, the preset spacing distance can be set to a distance that meets the demand according to the actual demand. In some embodiments, the housing 100 may hold between 1 and 50 wafers.

The liquid for containing in the box 100 may be a cleaning liquid or an etching liquid, the etching liquid may be selected from acidic copper chloride, basic copper chloride, ferric chloride, ammonium persulfate, sulfuric acid/chromic acid, sulfuric acid/hydrogen peroxide etching liquid, and the like, and the cleaning liquid may be water, deionized water, and the like, or other water doped with carbon dioxide or oxygen.

Referring to fig. 1, further, the fluid guiding assembly 200 includes a plurality of nozzles 210, and the plurality of nozzles 210 are mounted inside the chamber 100 and are disposed around the plurality of wafer receiving positions 101 for driving the fluid to flow. When a plurality of wafers are processed at the same time, the process requirement is high, so that a plurality of nozzles 210 are arranged to surround a plurality of wafer placing positions 101, so as to enable liquid flow around the wafer placing positions 101 to wash the wafers on one hand and drive the liquid flow around the wafers on the other hand, thereby improving the uniformity of the liquid contacting with the wafers and further improving the uniformity of etching or cleaning of the wafers.

Referring to fig. 2, in some embodiments, the plurality of wafer mounting sites 101 are arranged in a predetermined direction, and the plurality of nozzles 210 of the fluid-directing assembly 200 are disposed around the wafer mounting sites 101 around the predetermined direction. The plurality of nozzles 210 are disposed around the wafer placement site 101 to drive the liquid around the wafer to flow, and the liquid slaps on the wafer to perform a scouring action by utilizing a slapping force, so that the impact force of the flowing liquid on the wafer is relatively large, and the liquid in the box body flows to improve the uniformity of the liquid in the box body 100, thereby improving the uniformity of wafer etching or cleaning.

Referring to fig. 3, in some embodiments, the plurality of wafer mounting positions 101 are arranged in a predetermined direction, and the plurality of nozzles 210 of the fluid-directing assembly 200 are disposed around the wafer mounting positions 101 around the predetermined direction; the box body 100 comprises a bottom plate 102 and a side plate 103 connected with the bottom plate 102, the side plate 103 is connected with the periphery of the bottom plate 102 and encloses a containing space for containing liquid with the bottom plate 102, and the spray head 210 is installed on the side plate 103 or the bottom plate 102 and used for driving the liquid to flow. When a plurality of wafers are placed on the wafer placing position 101, all wafer shafts are arranged at intervals, the plurality of spray heads 210 are arranged around the wafer placing position 101 by taking the preset direction as a shaft so as to drive the liquid on the periphery of the wafer to flow, the liquid flows in a shaft ring shape by taking the preset direction as a shaft ring, and the wafer is flushed.

Specifically, referring to fig. 1, in some embodiments, the spray head 210 is fixed on the bottom plate 102 or the side plate 103, and the spray head 210 may be configured to spray in an inclined direction with respect to the bottom plate 102 or the side plate 103. The spray head 210 is fixedly arranged in the box body 100, liquid can be driven to flow by controlling the opening and closing of the spray head 210, an operator does not need to adjust the position of the spray head 210, and the operation is simple.

Referring to fig. 3 or 4, in other embodiments, the showerhead 210 is rotatably mounted on the bottom plate 102 or the side plate 103, and the wafer processing apparatus further comprises a driving assembly 300, wherein the driving assembly 300 is mounted on the chamber body 100 and connected to the showerhead 210 for driving the showerhead 210 to rotate. The spray head 210 is rotatably arranged in the box body 100, the drive component 300 controls the spray head 210 to rotate, the position of the spray head 210 is changed, when the spray head 210 works, the flow direction of liquid in the box body 100 is changed, an operator can adjust the flow direction of the liquid by controlling the position of the spray head 210, the wafer can be washed from different angles, the etching or cleaning uniformity of the wafer is improved, and the universality and operability of the wafer processing equipment are enhanced.

In one embodiment, all the nozzles 210 are disposed on two side plates 103 (not shown) opposite to each other. In another embodiment, referring to fig. 3 or fig. 4, a part of the nozzles 210 are disposed on the two side plates 103 disposed oppositely, and another part of the nozzles 210 are disposed on the bottom plate 102.

In this embodiment, the spray heads 210 include mounting ends 211 and spraying ends 212, the mounting ends 211 are mounted on the box 100, and the distance between the mounting end 211 of one spray head 210 and the spraying end 212 of another spray head 210 in the same fluid diversion assembly 200 is smaller than the distance between the mounting ends 211 of the two spray heads 210. All shower nozzles 210 can make liquid flow towards the specified direction in the box 100 when working, avoid appearing causing the circumstances that liquid offset when spouting between the shower nozzle 210, all shower nozzles 210 of make full use of drive liquid and effectively flow, can avoid the circumstances that liquid splashes when appearing the liquid offset simultaneously.

Referring to fig. 3 and 5, in one embodiment, the driving assembly 300 includes a motor 310, the mounting end 211 of the nozzle 210 is rotatably mounted in the housing 100 through a rotating shaft 400, and an output shaft of the motor 310 is connected to the rotating shaft 400 of the nozzle 210 to rotate the nozzle 210 through the rotating shaft 400. When the motor 310 is operated, the output shaft of the motor rotates to drive the rotating shaft 400 to rotate, so as to drive the spray head 210 to rotate, the inclination direction of the spray head 210 is changed, and the purpose of adjusting the flow direction of the liquid in the box body 100 is achieved, the spray head 210 is driven to rotate through the motor 310, the operation is simple, in addition, the rotating direction of the spray head 210 is single, and the regulation and control are simple.

Referring to fig. 4 and 6, in one embodiment, the nozzle 210 is rotatably mounted on the side plate 103 or the bottom plate 102 through a ball joint 600, the driving assembly 300 includes a first telescopic member 320 and a second telescopic member 330, one end of the first telescopic member 320 and one end of the second telescopic member 330 are both mounted on the box body 100, the other end of the first telescopic member 320 and the other end of the second telescopic member 330 are both connected to the nozzle 210, and both the first telescopic member 320 and the second telescopic member 330 drive the nozzle 210 to rotate through expansion and contraction. When the motor 310 runs, the output shaft of the motor rotates to drive the rotating shaft 400 to rotate, so as to drive the spray head 210 to rotate, the inclination direction of the spray head 210 is changed, the purpose of adjusting the flow direction of the liquid in the box body 100 is achieved, the inclination direction of the spray head 210 is adjusted and controlled through the extension and retraction of the driving assembly 300, the adjusting mode is simple, and the operation is convenient; in addition, the spray head 210 is rotatably connected with the box body 100 through the ball head connecting piece 600, the rotating direction of the spray head 210 is changeable, the flow direction of liquid in the box body 100 is changeable, the flexibility and the controllability are stronger, wafers in various shapes can be conveniently processed, the purpose of flushing the surfaces of the wafers without dead angles is achieved, the uniformity of etching or cleaning the wafers is improved, and the universality and the operability of wafer processing equipment are enhanced.

In this embodiment, the extending direction of the first extensible member 320 is perpendicular to the predetermined direction and parallel to the inner wall of the box 100 where the connected spray head is located, and the extending direction of the second extensible member 330 is parallel to the predetermined direction. Because the first expansion piece and the second expansion piece both expand and contract along a straight line, and the spray head rotates around the ball head connecting piece 600, in order to meet the stroke requirement, the first expansion piece 320 and the second expansion piece 330 are respectively movably connected with the spray head through a ring chain or a steel wire rope.

Further, the wafer processing apparatus further includes a connecting rod 600, a length direction of the connecting rod 600 is parallel to a length direction of the rotating shaft 400, the connecting rod 600 is connected to the plurality of nozzles 210, and the driving assembly 300 drives the plurality of nozzles 210 connected to the connecting rod 600 to rotate synchronously. Connect a plurality of shower nozzles 210 through connecting rod 600, and then be convenient for drive a plurality of shower nozzles 210 rotation in step through a drive assembly 300, strengthen the convenience of shower nozzle 210 angle modulation.

In some embodiments, the fluid diversion assembly 200 further comprises a fluid pump and a fluid guide (not shown), the fluid pump is disposed in the tank 100 or the external tank for pumping the fluid in the tank 100 or the external tank, and the fluid guide is connected to the fluid pump and the spray head 210 for guiding the fluid pumped by the fluid pump to the spray head 210. The liquid pump provides power to pump the liquid in the tank 100 or the liquid storage tank, and the liquid is transported to the spray head 210 through the liquid guiding tube and sprayed out through the spray head 210.

In the description of the present application, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the above terms in this application will be understood to be a specific case for those of ordinary skill in the art. In addition, in the description of the present application, "a plurality" means two or more unless otherwise specified. "and/or" describes the association relationship of the associated object, indicating that there may be three relationships, for example, a and/or B, which may indicate: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present application and is not to be construed as limiting the scope of the present application, so that the present application is not limited thereto, and all equivalent variations and modifications can be made to the present application.

Claims (10)

1. A wafer processing apparatus, comprising:

the liquid container comprises a container body, a liquid storage tank and a liquid outlet pipe, wherein the container body is used for containing liquid, a plurality of wafer placing positions are arranged in the container body, and the wafer placing positions are used for placing wafers;

and the liquid drainage component is arranged in the box body and used for driving the liquid in the box body to flow so as to flush the surface of the wafer by utilizing the flowing liquid.

2. The apparatus of claim 1, wherein the fluid directing assembly comprises a plurality of nozzles, the plurality of nozzles being mounted inside the chamber and surrounding the plurality of wafer receiving locations for driving the fluid to flow.

3. The wafer processing apparatus as claimed in claim 2, wherein the plurality of wafer receiving positions are arranged in a predetermined direction, and the plurality of nozzles of the liquid guiding member are arranged around the wafer receiving positions in a collar manner around the predetermined direction;

the box body comprises a bottom plate and a side plate connected with the bottom plate, the side plate is connected with the periphery of the bottom plate and surrounds the bottom plate to form a containing space for containing the liquid, and the spray head is arranged on the side plate or the bottom plate and used for driving the liquid to flow.

4. The wafer processing apparatus of claim 3, wherein the showerhead is fixed to the bottom plate or the side plate, and the showerhead is configured to spray in a direction inclined with respect to the bottom plate or the side plate.

5. The wafer processing apparatus of claim 3, wherein the showerhead is rotatably mounted on the bottom plate or the side plate, the wafer processing apparatus further comprising a drive assembly mounted to the housing and connected to the showerhead for driving the showerhead to rotate.

6. The wafer processing apparatus of claim 5, wherein the spray heads include mounting ends and spray ends, the mounting ends are mounted to the box, and a distance between the mounting end of one of the spray heads and the spray end of another of the spray heads in the same fluid directing assembly is less than a distance between the mounting ends of the two spray heads.

7. The wafer processing apparatus of claim 6, wherein the driving assembly comprises a motor, the mounting end of the showerhead is rotatably mounted in the chamber through a rotating shaft, and an output shaft of the motor is connected to the rotating shaft of the showerhead to drive the showerhead to rotate through the rotating shaft.

8. The wafer processing apparatus of claim 5, wherein the shower head is rotatably mounted to the side plate or the bottom plate through a ball head connector, the driving assembly includes a first telescopic member and a second telescopic member, one end of the first telescopic member and one end of the second telescopic member are both mounted to the box body, the other end of the first telescopic member and the other end of the second telescopic member are both connected to the shower head, and the first telescopic member and the second telescopic member both drive the shower head to rotate through telescoping.

9. The wafer processing apparatus as claimed in claim 7, further comprising a connecting rod, wherein the length direction of the connecting rod is parallel to the length direction of the rotating shaft, the connecting rod is connected to the plurality of nozzles, and the driving assembly drives the plurality of nozzles to rotate synchronously via the connecting rod.

10. The wafer processing apparatus of claim 3, wherein the fluid diversion assembly further comprises:

the liquid pump is arranged in the box body or the external liquid storage tank and used for sucking the liquid in the box body or the external liquid storage tank;

a liquid guide tube connecting the liquid pump and the spray head to guide the liquid pumped by the liquid pump to the spray head.

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