CN216967383U - Silicon carbide double-sided polishing machine with dust collecting device - Google Patents

Silicon carbide double-sided polishing machine with dust collecting device Download PDF

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Publication number
CN216967383U
CN216967383U CN202220394740.8U CN202220394740U CN216967383U CN 216967383 U CN216967383 U CN 216967383U CN 202220394740 U CN202220394740 U CN 202220394740U CN 216967383 U CN216967383 U CN 216967383U
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polishing
dust collecting
silicon carbide
dust
collecting device
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杨青
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Nantong Gangfeng Technology Co ltd
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Nantong Gangfeng Technology Co ltd
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  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The application relates to the technical field of processing of silicon carbide wafers, in particular to a silicon carbide double-sided polishing machine with a dust collecting device, which comprises a base, a bearing table, an installation frame and a limiting assembly, wherein the bearing table is installed on the base; spacing subassembly circumference distributes around the rubbing head, including butt piece, telescopic machanism and collection dirt mechanism, and wherein telescopic machanism's one end is fixed on the mounting bracket, and the other end rotates with the butt piece to be connected, and collection dirt mechanism installs negative pressure device including setting up at dust collection mouth, the dust collection box of butt piece terminal surface and the dust collecting pipe who connects dust collection mouth and dust collection box in the dust collection box. The dust piece that produces in the polishing process can effectively be got rid of to this application, improves the polishing quality of follow-up carborundum wafer.

Description

Silicon carbide double-sided polishing machine with dust collecting device
Technical Field
The application relates to the technical field of silicon carbide wafer processing, in particular to a silicon carbide double-side polishing machine with a dust collecting device.
Background
Silicon carbide is an important raw material in the field of semiconductors, is at the front of the development of new materials, and has higher and higher requirements on the flatness of semiconductor wafers along with the development of the semiconductor industry.
Chinese patent CN213106223U, a two-sided burnishing machine of full-automatic high-efficient single crystal high-efficient grinding monocrystalline silicon discloses a two-sided burnishing machine of full-automatic high-efficient monocrystalline silicon, relates to the monocrystalline silicon processing field, the on-line screen storage device comprises a base, the centre at base top is provided with the cushion cap, the flexible guide arm of fixedly connected with elasticity respectively in four corners of cushion cap bottom, the bilateral symmetry fixedly connected with brace table at base top, the middle part symmetry of two relative one sides of brace table is provided with claw shape centre gripping anchor clamps, the centre swing joint that brace table one side was kept away from to claw shape centre gripping anchor clamps has the extension axle, the one end fixedly connected with rubbing head of claw shape centre gripping anchor clamps is kept away from to the extension axle, the centre fixedly connected with axis of rotation of claw shape centre gripping anchor clamps opposite side. According to the full-automatic efficient monocrystalline silicon double-side polishing machine, the pressure plate is close to the bearing platform to clamp monocrystalline silicon, the buffer area is arranged at the bottom of the bearing platform, the pressure on the special-shaped monocrystalline silicon supporting point is slowly increased in the clamping process, the monocrystalline silicon is conveniently fixed, and further convenience is brought to processing.
To the above-mentioned correlation technique, the inventor thinks that the double-side polishing machine among the prior art can appear the raise dust in the in-process of using, and the raise dust can not be got rid of completely to the dust cage in traditional polishing dish outside, and the raise dust that the polishing produced still can adhere to on the polishing dish, and easy adhesion granule when polishing once more influences polishing quality.
SUMMERY OF THE UTILITY MODEL
In order to overcome the existence among the prior art, this application provides a carborundum double side polishing machine with dust collecting device.
The application provides a two-sided burnishing machine of carborundum with dust collecting device adopts following technical scheme:
a silicon carbide double-sided polishing machine with a dust collecting device comprises a base, a bearing table, an installation frame and a limiting assembly, wherein the bearing table is installed on the base, the installation frame is installed on the bearing table, symmetrically distributed polishing assemblies are installed on the installation frame, each polishing assembly comprises a support frame, a motor is installed on each support frame, a claw-shaped clamping mechanism is installed at the end part of an output shaft of each motor, and a polishing head is installed in each claw-shaped clamping mechanism; spacing subassembly circumference distributes around the rubbing head, including butt piece, telescopic machanism and collection dirt mechanism, and wherein telescopic machanism's one end is fixed on the mounting bracket, and the other end rotates with the butt piece to be connected, and collection dirt mechanism installs negative pressure device including setting up at the dust collection mouth of butt piece terminal surface, dust collection box and the dust collecting pipe who connects dust collection mouth and dust collection box in the dust collection box.
Through adopting above-mentioned technical scheme, install the plummer on double-sided polishing machine's the base, the mounting bracket on the plummer is used for installing double-sided polishing machine and dust collecting device, and wherein the subassembly of polishing rotates through the motor drive claw type fixture who installs on the support frame, and the last polishing head of centre gripping of claw type fixture polishes silicon carbide wafer. Spacing subassembly sets up around the rubbing head, can be fixed with silicon carbide wafer all around through the mortgage piece, and wherein the butt piece rotates and connects telescopic machanism, can satisfy not unidimensional silicon carbide wafer's centre gripping, and the dust collection mouth on the butt piece terminal surface can absorb the dust piece that the in-process produced of polishing, collects in entering into the dust collecting tank through dust collecting pipe, and the effectual impurity of getting rid of on the rubbing head improves subsequent quality of polishing.
Preferably, the mounting bracket is a rectangular frame, wherein the two ends of the mounting bracket are mounting cavities, the middle of the mounting bracket is a polishing cavity, and the outer side of the mounting bracket is provided with a detachable protection plate.
Through adopting above-mentioned technical scheme, the installation cavity in the mounting bracket is used for installing the motor of the subassembly of polishing, polishes the operation in the chamber, and the effectual dust of avoiding gets into the motor and causes the damage, improves the life of motor.
Preferably, the supporting frame of the polishing assembly is arranged in the mounting cavity, the motor is fixed on the supporting frame, and the output shaft of the motor is rotatably connected with the mounting cavity and the partition plate of the polishing cavity through the bearing.
Through adopting above-mentioned technical scheme, the output shaft of motor passes through the bearing and rotates with the space bar in installation cavity and the chamber of polishing to be connected, satisfies the dustless work of motor to normal transmission efficiency has been guaranteed.
Preferably, the claw type clamping mechanism comprises a clamping claw and a pressure mechanism, and the polishing head comprises a polishing surface, a connecting rod and a limiting cam, wherein the limiting cam is arranged in the clamping claw and attached to the pressure mechanism.
By adopting the technical scheme, the claw-shaped family congratulation word mechanism fixes the limiting cam in the polishing heads through the clamping claw and pushes the limiting cam through the pressure mechanism, so that the position adjustment between the two polishing heads which are symmetrically distributed is realized, and the clamping of the polishing heads on the silicon carbide wafer is realized.
Preferably, a pressure mechanism in the claw-shaped clamping mechanism is arranged in the clamping claw, the pressure mechanism is fixedly connected to the end part of the output shaft of the motor, the pressure mechanism is attached to the limiting cam, and a buffer spring is arranged at one end, far away from the pressure mechanism, of the limiting cam.
Through adopting above-mentioned technical scheme, the pressure mechanism sets up in the gripper jaw, and the pressure mechanism is fixed at the tip of motor output shaft, and the pressure mechanism can laminate with spacing cam to the buffer spring of the cooperation spacing cam other end can extrude spacing cam and guarantee its and claw type gripper mechanism's being connected, can polish through the motor drive rubbing head.
Preferably, the pressure mechanism is a hydraulic telescopic mechanism or a pneumatic telescopic mechanism.
Through adopting above-mentioned technical scheme, adopt hydraulic pressure and the mode that pneumatics is flexible, have stable regulation performance, can guarantee the normal operating of double-side polishing machine.
Preferably, the one side that telescopic machanism was kept away from to the butt piece is the arcwall face, and includes the butt face in center and the dust collection mouth of both sides on the arcwall face.
Through adopting above-mentioned technical scheme, the one side that telescopic machanism was kept away from to the butt piece adopts the arcwall face, can laminate with the edge of carborundum wafer, and the butt face at butt piece center is used for fixing, and the dust collecting opening of butt face both sides is used for absorbing the dust granule of two under polishing.
Preferably, the top protection plate of the grinding cavity is provided with an air inlet through hole.
Through adopting above-mentioned technical scheme, the through-hole that admits air that the top in chamber of polishing was seted up can guarantee that dust collecting device carries out the in-process of dust absorption, can have the air admission of continuous in the chamber of polishing, guarantees the circulation of gas and the absorption of dust.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the installation cavity in the installation frame is used for installing a motor of the polishing assembly, and polishing operation is carried out in the polishing cavity, so that dust is effectively prevented from entering the motor to cause damage, and the service life of the motor is prolonged;
2. the pressure mechanism can be attached to the limiting cam, and can extrude the limiting cam and ensure the connection between the limiting cam and the claw-shaped clamping mechanism by matching with a buffer spring at the other end of the limiting cam, and a polishing head can be driven by a motor to polish;
3. can effectively get rid of two-sided burnishing machine raise dust can appear at the in-process that uses, avoid the raise dust to adhere to on the polishing head, adnexed granule influences polishing quality when avoiding polishing once more.
Drawings
FIG. 1 is a schematic front view of a silicon carbide double-side polishing machine with a dust collecting device;
FIG. 2 is a schematic side view of a silicon carbide double-side polishing machine limiting assembly with a dust collecting device;
FIG. 3 is a schematic view of the inner side structure of the abutting block in the silicon carbide double-side polishing machine limiting component with a dust collecting device.
Description of reference numerals: 1. a base; 2. a bearing table; 3. a mounting frame; 31. polishing the assembly; 311. a support frame; 312. a motor; 313. a claw-shaped clamping mechanism; 3131. a polishing head; 31311. polishing the surface; 31312. a connecting rod; 31313. a limiting cam; 3132. a gripper jaw; 3133. a pressure mechanism; 3134. a buffer spring; 32. a mounting cavity; 33. grinding the cavity; 34. a protection plate; 341. an air inlet through hole; 4. a limiting component; 41. a butting block; 411. a dust collection port; 412. a dust collection box; 4121. a negative pressure device; 413. a dust collecting duct; 414. an abutting surface; 42. a telescoping mechanism; 43. a dust collecting mechanism.
Detailed Description
The present application is described in further detail below with reference to figures 1-3.
The embodiment of the application discloses carborundum double-side polishing machine with dust collecting device.
Referring to fig. 1, 2 and 3, a silicon carbide double-sided polishing machine with a dust collecting device comprises a base 1, a bearing table 2, a mounting frame 3 and a limiting assembly 4, wherein the bearing table 2 is mounted on the base 1, the mounting frame 3 is mounted on the bearing table 2, the mounting frame 3 is provided with polishing assemblies 31 which are symmetrically distributed, each polishing assembly 31 comprises a supporting frame 311, a motor 312 is mounted on each supporting frame 311, a claw-shaped clamping mechanism 313 is mounted at the end part of an output shaft of the motor 312, and a polishing head 3131 is mounted in each claw-shaped clamping mechanism 313; spacing subassembly 4 circumference distributes around polishing head 3131, including butt piece 41, telescopic machanism 42 and collection dirt mechanism 43, and wherein telescopic machanism 42's one end is fixed on mounting bracket 3, and the other end rotates with butt piece 41 to be connected, and collection dirt mechanism 43 is including setting up dust collection mouth 411, the dust collection box 412 and the dust collecting pipe 413 of connecting dust collection mouth 411 and dust collection box 412 at butt piece 41 terminal surface, installs negative pressure device 4121 in the dust collection box 412. A bearing platform 2 is arranged on a base 1 of the double-sided polishing machine, a mounting frame 3 on the bearing platform 2 is used for mounting the double-sided polishing machine and a dust collecting device, wherein a polishing component 31 drives a claw-shaped clamping mechanism 313 to rotate through a motor 312 arranged on a supporting frame 311, and a polishing head 3131 clamped on the claw-shaped clamping mechanism 313 polishes a silicon carbide wafer. Spacing subassembly 4 sets up around polishing head 3131, can be fixed with silicon carbide wafer from all around through the mortgage piece, wherein butt piece 41 rotates and connects telescopic machanism 42, can satisfy the centre gripping of the silicon carbide wafer of not unidimensional, dust collection mouth 411 on butt piece 41 terminal surface can absorb the dust piece that the in-process produced of polishing, enter into dust collection box 412 through dust collecting pipe 413 and collect, the effectual impurity of getting rid of on the polishing head 3131, improve subsequent quality of polishing.
Referring to fig. 1, the mounting frame 3 is a rectangular frame, wherein the two ends of the mounting frame 3 are mounting cavities 32, the middle of the mounting frame 3 is a grinding cavity 33, and a detachable protection plate 34 is mounted on the outer side of the mounting frame 3. Installation cavity 32 in mounting bracket 3 is arranged in installing the motor 312 of subassembly 31 of polishing, polishes the operation in the chamber 33, and the effectual dust of avoiding gets into motor 312 and causes the damage, improves motor 312's life.
Referring to fig. 1, the supporting frame 311 of the grinding assembly 31 is in the mounting cavity 32, wherein the motor 312 is fixed on the supporting frame 311, and the output shaft of the motor 312 is rotatably connected with the partition plate between the mounting cavity 32 and the grinding cavity 33 through a bearing. The output shaft of the motor 312 is rotatably connected with the partition plates of the mounting cavity 32 and the grinding cavity 33 through bearings, so that the dust-free work of the motor 312 is met, and the normal transmission efficiency is ensured.
Referring to fig. 1, the jaw type clamping mechanism 313 includes a clamping jaw 3132 and a pressure mechanism 3133, and the polishing head 3131 includes a polishing surface 31311, a connecting bar 31312, and a limiting cam 31313, wherein the limiting cam 31313 is disposed within the clamping jaw 3132 and engages with the pressure mechanism 3133. The claw type homeword mechanism fixes a limit cam 31313 in a polishing head 3131 through a clamping claw, and pushes the limit cam 31313 through a pressure mechanism 3133, so that position adjustment between two polishing heads 3131 which are symmetrically distributed is realized, and the polishing head 3131 clamps a silicon carbide wafer.
Referring to fig. 1, a pressing mechanism 3133 in the jaw type clamping mechanism 313 is disposed inside the clamping jaw 3132, the pressing mechanism 3133 is fixedly connected to an end portion of an output shaft of the motor 312, the pressing mechanism 3133 is attached to a limit cam 31313, and a buffer spring 3134 is disposed at an end of the limit cam 31313 away from the pressing mechanism 3133. A pressing means 3133 is provided in the jaw 3132, the pressing means 3133 is fixed to an end of an output shaft of the motor 312, the pressing means 3133 can be engaged with a limit cam 31313, and the limit cam 31313 can be pressed and connected to the jaw type clamping means 313 by engaging with a buffer spring 3134 at the other end of the limit cam 31313, and a polishing head 3131 can be driven by the motor 312 to perform polishing.
Referring to fig. 1, 2, and 3, the pressure mechanism 3133 is a hydraulic expansion mechanism 42 or a pneumatic expansion mechanism 42. The adoption hydraulic pressure and the mode of pneumatics flexible have stable regulation performance, can guarantee the normal operating of two-sided burnishing machine.
Referring to fig. 1, 2 and 3, one surface of the abutting block 41 away from the telescopic mechanism 42 is an arc surface, and the arc surface includes a central abutting surface 414 and dust collecting ports 411 on two sides. The surface of the abutting block 41 far away from the telescopic mechanism 42 is an arc surface and can be attached to the edge of the silicon carbide wafer, the abutting surface 414 in the center of the abutting block 41 is used for fixing, and dust collecting openings 411 on two sides of the abutting surface 414 are used for absorbing dust particles of the two ground lower parts.
Referring to fig. 1, an air inlet 341 is formed in the top guard plate 34 of the grinding chamber 33. The air inlet 341 formed in the top of the polishing chamber 33 can ensure that air can continuously enter the polishing chamber 33 during the dust collection process of the dust collecting device, thereby ensuring the circulation of air and the absorption of dust.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (8)

1. The utility model provides a carborundum double-side polishing machine with dust collecting device, includes base (1), plummer (2), mounting bracket (3) and spacing subassembly (4), its characterized in that: the polishing device comprises a bearing table (2), a mounting frame (3), a polishing assembly (31), a support frame (311), a motor (312), a claw-shaped clamping mechanism (313) and a polishing head (3131), wherein the bearing table (2) is mounted on a base (1), the mounting frame (3) is mounted on the bearing table (2), the polishing assembly (31) is symmetrically distributed on the mounting frame (3), the polishing assembly (31) comprises the support frame (311), the support frame (311) is provided with the motor (312), the end part of an output shaft of the motor (312) is provided with the claw-shaped clamping mechanism (313), and the polishing head (3131) is mounted in the claw-shaped clamping mechanism (313); spacing subassembly (4) circumference distributes around polishing head (3131), including butt joint piece (41), telescopic machanism (42) and collection dirt mechanism (43), wherein the one end of telescopic machanism (42) is fixed on mounting bracket (3), and the other end rotates with butt joint piece (41) and is connected, collection dirt mechanism (43) are including setting up dust collection mouth (411), dust collection box (412) and the dust collection pipeline (413) of connecting dust collection mouth (411) and dust collection box (412) at butt joint piece (41) terminal surface, install negative pressure device (4121) in dust collection box (412).
2. The silicon carbide double-sided polishing machine with the dust collecting device according to claim 1, characterized in that: the mounting bracket (3) is a rectangular frame, wherein the two ends of the mounting bracket (3) are mounting cavities (32), the middle of the mounting bracket (3) is a grinding cavity (33), and detachable protection plates (34) are mounted on the outer side of the mounting bracket (3).
3. The silicon carbide double-sided polishing machine with the dust collecting device according to claim 2, characterized in that: a supporting frame (311) of the grinding assembly (31) is arranged in an installation cavity (32), a motor (312) is fixed on the supporting frame (311), and an output shaft of the motor (312) is rotationally connected with a spacing plate of the installation cavity (32) and a grinding cavity (33) through a bearing.
4. The silicon carbide double-sided polishing machine with the dust collecting device according to claim 1, characterized in that: the claw type clamping mechanism (313) comprises a clamping claw (3132) and a pressure mechanism (3133), the polishing head (3131) comprises a polishing surface (31311), a connecting rod (31312) and a limiting cam (31313), wherein the limiting cam (31313) is arranged in the clamping claw (3132) and is attached to the pressure mechanism (3133).
5. The silicon carbide double-sided polishing machine with the dust collecting device according to claim 4, characterized in that: a pressure mechanism (3133) in the claw type clamping mechanism (313) is arranged in the clamping claw (3132), the pressure mechanism (3133) is fixedly connected to the end part of the output shaft of the motor (312), the pressure mechanism (3133) is attached to a limiting cam (31313), and a buffer spring (3134) is arranged at one end, away from the pressure mechanism (3133), of the limiting cam (31313).
6. The silicon carbide double-sided polishing machine with the dust collecting device according to claim 5, characterized in that: the pressure mechanism (3133) is a hydraulic telescopic mechanism (42) or a pneumatic telescopic mechanism (42).
7. The silicon carbide double-sided polishing machine with the dust collecting device according to claim 1, characterized in that: one surface of the abutting block (41) far away from the telescopic mechanism (42) is an arc-shaped surface, and the arc-shaped surface comprises a central abutting surface (414) and dust collecting openings (411) on two sides.
8. The silicon carbide double-sided polishing machine with the dust collecting device according to claim 2, characterized in that: and an air inlet through hole (341) is formed in the top protection plate (34) of the grinding cavity (33).
CN202220394740.8U 2022-02-25 2022-02-25 Silicon carbide double-sided polishing machine with dust collecting device Active CN216967383U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220394740.8U CN216967383U (en) 2022-02-25 2022-02-25 Silicon carbide double-sided polishing machine with dust collecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220394740.8U CN216967383U (en) 2022-02-25 2022-02-25 Silicon carbide double-sided polishing machine with dust collecting device

Publications (1)

Publication Number Publication Date
CN216967383U true CN216967383U (en) 2022-07-15

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Family Applications (1)

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CN (1) CN216967383U (en)

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