CN216960294U

CN216960294U - High-power lamp bead packaging circuit board

Info

Publication number: CN216960294U
Application number: CN202122977569.1U
Authority: CN
Inventors: 刘兴武; 邵胜修; 詹梦阳; 陈月莲
Original assignee: Dongguan Xinzhixin Precision Technology Co ltd
Current assignee: Dongguan Xinzhixin Precision Technology Co ltd
Priority date: 2021-11-30
Filing date: 2021-11-30
Publication date: 2022-07-12
Anticipated expiration: 2031-11-30

Abstract

The utility model discloses a high-power lamp bead packaging circuit board which comprises a base, wherein a mounting seat is arranged at the upper end of the base, a group of fixing bolts are arranged on the left portion and the right portion of the upper end of the base, the two groups of fixing bolts are symmetrically distributed in the left-right direction, two groups of fixing bolts are arranged, a group of limiting assemblies are arranged at the front portion and the rear end of the upper end of the mounting seat, two groups of limiting assemblies are symmetrically distributed in the front-back direction, two groups of limiting assemblies are arranged, a main body plate is arranged in the middle of the upper end of the mounting seat, heat dissipation equipment is arranged at the left end of the mounting seat, a ventilation groove penetrating through the left end and the right end is formed in the left end of the mounting seat, a support frame is arranged in the middle of the upper end of the mounting seat, and a group of mounting grooves are formed in the front portion and the rear portion of the upper end of the mounting seat. According to the high-power lamp bead packaging circuit board, the limiting assembly and the heat dissipation device are arranged, so that the heat dissipation effect of the circuit board can be improved, and meanwhile, the stability of the circuit board can be improved.

Description

High-power lamp bead packaging circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a high-power lamp bead packaging circuit board.

Background

The high-power LED circuit board can generate a large amount of heat in the working process, and at present, the LED circuit board mainly adopts fins for heat dissipation, and the heat dissipation effect is poor. In the prior art: 1. the spacing effect of current equipment to the circuit board is poor to influence the steadiness of circuit board, make and reduce the availability factor, 2, current equipment is poor to the radiating effect of circuit board, makes the circuit board cause the damage because of high temperature easily, thereby has caused the limitation that this high-power lamp pearl packaged circuit board used, so, we provide a neotype high-power lamp pearl packaged circuit board.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a high-power lamp bead packaging circuit board which can effectively solve the problems in the background technology.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides a high-power lamp pearl packaging circuit board, includes the base, the base upper end is provided with the mount pad, base upper end left part and upper end right part all are provided with a set of gim peg, and are two sets of the gim peg is bilateral symmetry and every group sets up to two, mount pad upper end front portion and upper end rear end all are provided with a set of spacing subassembly, and are two sets of symmetric distribution and every group set up to two around spacing subassembly is, mount pad upper end middle part is provided with the main part board, the mount pad left end is provided with the heat dissipation equipment, the ventilation groove of break-over about the mount pad left end is seted up, mount pad upper end middle part is provided with the support frame, a set of mounting groove has all been seted up at anterior and the upper end rear portion of mount pad upper end, and is two sets up to two to around the mounting groove is symmetric distribution and every group.

Preferably, two sets of spacing subassembly is connected in two sets of mounting grooves.

Preferably, the limiting assembly comprises a fixing plate, a supporting plate is arranged at the upper part of the front end of the fixing plate, a limiting bolt is arranged in the middle of the upper end of the supporting plate, a limiting block is arranged at the lower end of the limiting bolt, and the fixing plate is connected in the mounting groove.

Preferably, the limiting bolt penetrates through the lower end face of the support plate and extends downwards to the upper end face of the main body plate.

Preferably, the heat dissipation equipment comprises a mounting rack, a plurality of air inlet holes penetrating from left to right are formed in the left end of the mounting rack, three fans are arranged inside the mounting rack, a rotation column is arranged at the output end of each fan, fan blades are arranged at the right end of the rotation column, and the mounting rack is connected to the left end of the mounting seat.

Preferably, three the fan is the equidistance and distributes, and is a plurality of the fresh air inlet is the equidistance and distributes, all do not contact between flabellum and the inside wall of going up of mounting bracket and the inside wall of going down.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, the limiting assembly is arranged on the whole device, when the device is used, a group of mounting grooves are respectively formed in the front part and the rear part of the upper end of the mounting seat, two groups of fixing plates are respectively connected in the two groups of mounting grooves, the supporting plate is inserted into the upper parts of the rear ends and the front ends of the fixing plates, the limiting bolts are inserted into the supporting plate, the limiting blocks are connected to the lower ends of the limiting bolts, the circuit board is placed on the supporting frame, and the limiting blocks are adjusted to move downwards, so that the limiting and fixing of the circuit board are facilitated, and the stability of the circuit board is improved;

2. according to the utility model, through the arrangement of the heat dissipation equipment, the mounting frame is connected to the left end of the mounting base, the fan is connected to the inside of the mounting frame, the rotating column is connected to the output end of the fan, the fan blades are connected to the right end of the rotating column, and meanwhile, the left end of the mounting frame is provided with the plurality of left and right through air inlet holes.

Drawings

FIG. 1 is a schematic diagram of an overall structure of a high-power lamp bead packaging circuit board according to the present invention;

fig. 2 is a schematic diagram of the overall structure of a movable supporting device of a high-power lamp bead packaging circuit board according to the utility model;

FIG. 3 is a schematic diagram of the overall structure of a left limiting device of a high-power lamp bead packaging circuit board according to the utility model;

fig. 4 is a schematic connection diagram of an extension board of a high-power lamp bead packaging circuit board according to the utility model.

In the figure: 1. a base; 2. a mounting seat; 3. a limiting component; 4. a main body plate; 5. a heat dissipating device; 6. a fixing bolt; 7. a support frame; 8. mounting grooves; 9. a ventilation slot; 31. a fixing plate; 32. a support plate; 33. a limiting block; 34. a limit bolt; 51. a mounting frame; 52. a fan; 53. rotating the column; 54. a fan blade; 55. and air inlet holes.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, a high-power lamp pearl packaging circuit board, including base 1, base 1 upper end is provided with mount pad 2, base 1 upper end left part and upper end right part all are provided with a set of gim peg 6, two sets of gim peg 6 are bilateral symmetry and distribute and every group sets up to two, mount pad 2 upper end front portion and upper end rear end all are provided with a set of spacing subassembly 3, symmetric distribution and every group set up to two around two sets of spacing subassembly 3 are, mount pad 2 upper end middle part is provided with main part board 4, mount pad 2 left end is provided with heat abstractor 5, the ventilation groove 9 of break-over about 2 left end of mount pad is seted up, mount pad 2 upper end middle part is provided with support frame 7, a set of mounting groove 8 has all been seted up to mount pad 2 upper end front portion and upper end rear portion, symmetric distribution and every group set up to two around two sets up to two sets up.

The two groups of limiting assemblies 3 are connected in the two groups of mounting grooves 8; the limiting component 3 comprises a fixing plate 31, a support plate 32 is arranged at the upper part of the front end of the fixing plate 31, a limiting bolt 34 is arranged in the middle of the upper end of the support plate 32, a limiting block 33 is arranged at the lower end of the limiting bolt 34, and the fixing plate 31 is connected in the mounting groove 8; the limiting block 33 is driven by the limiting bolt 34 to move downwards, so that the limiting block 33 is convenient for limiting and fixing the circuit board.

The limit bolt 34 penetrates through the lower end face of the support plate 32 and extends downwards to the upper end face of the main body plate 4; the heat dissipation device 5 comprises a mounting frame 51, the left end of the mounting frame 51 is provided with a plurality of air inlet holes 55 which penetrate left and right, three fans 52 are arranged inside the mounting frame 51, the output end of each fan 52 is provided with a rotating column 53, the right end of each rotating column 53 is provided with a fan blade 54, the mounting frame 51 is connected to the left end of the mounting base 2, and the rotating columns 53 and the fan blades 54 are driven by the fans 52, so that heat dissipated by the circuit board can be conveniently discharged;

the three fans 52 are distributed at equal intervals, the air inlet holes 55 are distributed at equal intervals, and the fan blades 54 are not contacted with the inner upper wall surface and the inner lower wall surface of the mounting rack 51; without contact, damage to the fan blades 54 and the mounting bracket 51 can be avoided, thereby prolonging the service life.

When the circuit board is used, firstly, a group of mounting grooves 8 are formed in the front part of the upper end and the rear part of the upper end of the mounting seat 2, two groups of fixing plates 31 are respectively connected into the two groups of mounting grooves 8, a support plate 32 is inserted into the upper part of the rear end and the upper part of the front end of each fixing plate 31, a limiting bolt 34 is inserted into the support plate 32, a limiting block 33 is connected to the lower end of the limiting bolt 34, the circuit board is placed on the support frame 7, and the limiting block 33 is moved downwards by adjusting the limiting bolt 34, so that the circuit board is limited and fixed conveniently, and the stability of the circuit board is improved; through setting up radiator 5, when using, connect mounting bracket 51 at the 2 left ends of mount pad, and connect fan 52 inside mounting bracket 51, will rotate post 53 and connect at the fan 52 output again, connect flabellum 54 at the post 53 right-hand member that rotates, set up a plurality of inlet openings 55 of controlling the break-over simultaneously at the mounting bracket 51 left end, when the circuit board gave out the heat, drive through fan 52 and rotate post 53 and flabellum 54, can discharge the heat from ventilation duct 9, thereby improve the radiating effect, avoid the circuit board to cause the damage because of high temperature.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, but that various changes and modifications may be made without departing from the spirit and scope of the utility model, and such changes and modifications are within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a high-power lamp pearl packaging circuit board, includes base (1), its characterized in that: the upper end of the base (1) is provided with a mounting seat (2), the left part and the right part of the upper end of the base (1) are respectively provided with a group of fixing bolts (6), the two groups of fixing bolts (6) are distributed in a bilateral symmetry way, and each group is provided with two fixing bolts, the front part of the upper end and the rear end of the upper end of the mounting seat (2) are respectively provided with a group of limiting components (3), the two groups of limiting components (3) are symmetrically distributed in the front and back direction, and each group is provided with two groups, a main body plate (4) is arranged in the middle of the upper end of the mounting seat (2), a heat dissipation device (5) is arranged at the left end of the mounting seat (2), the left end of the mounting seat (2) is provided with a ventilation groove (9) which is penetrated through from left to right, mount pad (2) upper end middle part is provided with support frame (7), a set of mounting groove (8), two sets of have all been seted up to mount pad (2) upper end front portion and upper end rear portion mounting groove (8) are front and back symmetric distribution and every group and set up to two.

2. The high-power lamp bead packaging circuit board of claim 1, characterized in that: two sets of spacing subassembly (3) are connected in two sets of mounting grooves (8).

3. The high-power lamp bead packaging circuit board of claim 2, characterized in that: the limiting component (3) comprises a fixing plate (31), a supporting plate (32) is arranged at the upper part of the front end of the fixing plate (31), a limiting bolt (34) is arranged in the middle of the upper end of the supporting plate (32), a limiting block (33) is arranged at the lower end of the limiting bolt (34), and the fixing plate (31) is connected in the mounting groove (8).

4. The high-power lamp bead packaging circuit board of claim 3, characterized in that: the limiting bolt (34) penetrates through the lower end face of the support plate (32) and extends downwards to the upper end face of the main body plate (4).

5. The high-power lamp bead packaging circuit board of claim 4, characterized in that: the heat dissipation device (5) comprises a mounting rack (51), a plurality of air inlet holes (55) penetrating from left to right are formed in the left end of the mounting rack (51), three fans (52) are arranged inside the mounting rack (51), a rotating column (53) is arranged at the output end of each fan (52), fan blades (54) are arranged at the right end of the rotating column (53), and the mounting rack (51) is connected to the left end of the mounting seat (2).

6. The high-power lamp bead packaging circuit board of claim 5, characterized in that: the three fans (52) are distributed at equal intervals, the air inlet holes (55) are distributed at equal intervals, and the fan blades (54) are not in contact with the inner upper wall surface and the inner lower wall surface of the mounting frame (51).