CN216959772U

CN216959772U - High-strength silicon wafer convenient to fix

Info

Publication number: CN216959772U
Application number: CN202122899688.XU
Authority: CN
Inventors: 曹志勇; 杭智华; 姜志刚
Original assignee: Yangzhou Weiye Creative Technology Ltd
Current assignee: Yangzhou Weiye Creative Technology Ltd
Priority date: 2021-11-24
Filing date: 2021-11-24
Publication date: 2022-07-12
Anticipated expiration: 2031-11-24

Abstract

The utility model discloses a high-strength silicon wafer convenient to fix, which belongs to the technical field of silicon wafers, and comprises a silicon wafer outer frame and a silicon wafer body, wherein the cross section of the silicon wafer outer frame is circular, a silicon wafer mounting groove matched with the silicon wafer body is formed in the silicon wafer outer frame, the bottom end wall of the silicon wafer mounting groove is connected with a plurality of groups of first springs, the bottom end of each first spring is connected with a cotton pad, the cotton pads are attached to the outer wall of the silicon wafer, the upper end wall and the lower end wall of the silicon wafer mounting groove are connected with a plurality of groups of second springs, the bottom ends of the second springs are connected with rubber pads, and the rubber pads are attached to the upper end surface and the lower end surface of the silicon wafer body. The silicon chip is further protected, and the practicability is good.

Description

High-strength silicon wafer convenient to fix

Technical Field

The utility model relates to the technical field of silicon wafers, in particular to a high-strength silicon wafer convenient to fix.

Background

The silicon element with the content of 25.8 percent in the crust provides an inexhaustible source for the production of monocrystalline silicon. Since silicon is one of the most abundant elements in the earth's crust, the reserve advantage is also one of the reasons that silicon is the main material for photovoltaics for solar cells, such as those products destined for large-scale market. However, the existing silicon wafer is inconvenient to install, and is easy to collide with other places during installation, so that the silicon wafer is possibly damaged, the protection effect is poor, and the practicability is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a high-strength silicon wafer convenient to fix, and aims to solve the problems that the silicon wafer is inconvenient to mount and easy to damage during mounting in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a convenient fixed high strength silicon chip, includes silicon chip frame and silicon chip body, silicon chip frame cross-section is circular, and offers the silicon chip mounting groove that matches with the silicon chip body in the silicon chip frame, the bottom wall connection of silicon chip mounting groove has the first spring of a plurality of groups, and the bottom of first spring is connected with cotton pad, the outer wall at the silicon chip body of laminating is filled up to cotton.

Further: the upper end wall and the lower end wall of the silicon wafer mounting groove are connected with a plurality of groups of second springs, the bottom ends of the second springs are connected with rubber pads, and the rubber pads are attached to the upper end face and the lower end face of the silicon wafer body.

Further: four groups of mounting screw holes are formed in the upper surface of the silicon wafer outer frame, and the four groups of mounting screw holes are distributed in an annular array of the silicon wafer outer frame.

Further: the cotton pad is a soft sponge pad.

Further: the outer frame of the silicon wafer is a gum protective cover.

Further: the shape of the outer frame of the silicon wafer can be set to be rectangular, circular or polygonal.

Further: corrugated bulges are embedded at one side of the cotton pad and the rubber pad close to the silicon wafer body.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the silicon wafer body is arranged through the silicon wafer mounting groove in the silicon wafer outer frame, and when the silicon wafer body is arranged in the silicon wafer mounting groove, the cotton pad is attached to the side wall of the silicon wafer body, so that the protection effect can be achieved, the silicon wafer body is prevented from being damaged due to collision, the installation is convenient, and the protection effect is good.

2. The silicon chip body is installed in the silicon chip mounting groove, can provide the protection for the upper and lower both ends of silicon chip body through second spring and rubber pad, and the silicon chip body has been protected from the multi-position to the cotton pad of cooperation, and first spring and second spring have the effect of shock attenuation buffering, and when the silicon chip frame received the time of colliding with, first spring and second spring can absorb partial impact, have reduced the power of conducting on the silicon chip body promptly, have further protected the silicon chip body.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a top cross-sectional view of the outer frame of a silicon wafer according to the present invention;

FIG. 3 is a front cross-sectional view of the outer frame of a silicon wafer according to the present invention;

FIG. 4 is a schematic view of the installation of the outer frame and the body of the silicon wafer according to the present invention.

In the figure: 1. a silicon wafer outer frame; 2. mounting a screw hole; 3. mounting a silicon wafer in a groove; 4. a first spring; 5. a cotton pad; 6. a second spring; 7. a rubber pad; 8. a silicon wafer body.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1:

referring to fig. 1, fig. 2 and fig. 4, the present invention provides a technical solution: the utility model provides a convenient fixed high strength silicon chip, including silicon chip frame 1 and

silicon chip body

8, 1 cross-section of silicon chip frame is circularly, and set up in the silicon chip frame 1 with silicon chip body 8 assorted silicon chip mounting groove 3, the bottom wall connection of silicon chip mounting groove 3 has the first spring 4 of a plurality of groups, and the bottom of first spring 4 is connected with cotton pad 5, the outer wall at the silicon chip of 5 laminating of cotton pad, before using, the shape of silicon chip frame 1 matches with the silicon chip type of installation, and silicon chip mounting groove 3 is unanimous with the size of installation silicon chip, install silicon chip body 8 in silicon chip mounting groove 3 again, when silicon chip body 8 is installed in silicon chip mounting groove 3, the laminating of cotton pad 5 is at the lateral wall of silicon chip body 8, can play the guard action, prevent that the silicon chip from colliding with the back damage, and is convenient for use, and good protection effect.

Referring to fig. 1-4, preferably, the upper and lower end walls of the silicon wafer mounting groove 3 are connected with a plurality of sets of second springs 6, the bottom end of each second spring 6 is connected with a rubber pad 7, the rubber pads 7 are attached to the upper and lower end faces of the silicon wafer body 8, when the silicon wafer body 8 is mounted in the silicon wafer mounting groove 3, the cotton pads 5 are attached to the side wall of the silicon wafer body 8, the rubber pads 7 are attached to the upper and lower end faces of the silicon wafer body 8, and the first springs 4 and the second springs 6 have the damping and buffering functions, when the silicon wafer outer frame 1 is collided, the first springs 4 and the second springs 6 can absorb part of the collision force, namely, the force transmitted to the silicon wafer body 8 is reduced, and the silicon wafer body 8 is further protected.

Referring to fig. 1, preferably, four sets of mounting screw holes 2 are formed in the upper surface of the silicon wafer outer frame 1, and the four sets of mounting screw holes 2 are distributed in an annular array on the silicon wafer outer frame 1, so that the whole silicon wafer can be fixed on a desired fixing surface through the mounting screw holes 2.

Referring to fig. 3, preferably, the cotton pad 5 is a soft sponge pad.

Referring to fig. 1, the silicon wafer outer frame 1 is preferably a gum protective cover.

Referring to fig. 1, preferably, the shape of the silicon wafer outer frame 1 may be rectangular, circular or polygonal, and the shape of the silicon wafer outer frame 1 may be set according to the shape of the silicon wafer.

Example 2:

referring to fig. 2, this embodiment is different from the first embodiment in that: the cotton pad 5 and the rubber pad 7 are embedded to be provided with corrugated bulges at one side close to the silicon wafer body 8, the corrugated bulges can increase the contact area and the friction force with the silicon wafer body 8, and the stability of connection between the silicon wafer and the silicon wafer mounting groove 3 is improved.

The working principle is as follows: when the silicon wafer installing device is used, firstly, the shape of the silicon wafer outer frame 1 is matched with the type of the installed silicon wafer, the size of the silicon wafer installing groove 3 is consistent with that of the installed silicon wafer body 8, then the silicon wafer body 8 is installed in the silicon wafer installing groove 3, when the silicon wafer body 8 is installed in the silicon wafer installing groove 3, the cotton pad 5 is attached to the side wall of the silicon wafer body 8, the protection effect can be achieved, the damage of the silicon wafer body 8 after collision can be prevented, the installation is convenient, the protection effect is good, when the silicon wafer body 8 is installed in the silicon wafer installing groove 3, the cotton pad 5 is attached to the side wall of the silicon wafer, the rubber pad 7 is attached to the upper end face and the lower end face of the silicon wafer body 8, the first spring 4 and the second spring 6 have the functions of shock absorption and buffering, when the silicon wafer outer frame 1 is collided, the first spring 4 and the second spring 6 can absorb part of collision force, namely, the force transmitted to the silicon wafer body 8 is reduced, and the silicon wafer body 8 is further protected, finally, the whole silicon chip can be fixed on a required fixing surface through the mounting screw holes 2.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a convenient fixed high strength silicon chip, includes silicon chip frame (1) and silicon chip body (8), its characterized in that: the cross-section of the silicon wafer outer frame (1) is circular, and silicon wafer mounting grooves (3) matched with the silicon wafer body (8) are formed in the silicon wafer outer frame (1), the bottom end wall of each silicon wafer mounting groove (3) is connected with a plurality of groups of first springs (4), the bottom ends of the first springs (4) are connected with cotton pads (5), and the cotton pads (5) are attached to the outer wall of the silicon wafer body (8).

2. The high-strength silicon wafer convenient to fix according to claim 1, wherein: the upper end wall and the lower end wall of the silicon wafer mounting groove (3) are connected with a plurality of groups of second springs (6), the bottom ends of the second springs (6) are connected with rubber pads (7), and the rubber pads (7) are attached to the upper end face and the lower end face of the silicon wafer body (8).

3. The high-strength silicon wafer convenient to fix according to claim 1, wherein: four groups of mounting screw holes (2) are formed in the upper surface of the silicon wafer outer frame (1), and the four groups of mounting screw holes (2) are distributed in an annular array on the silicon wafer outer frame (1).

4. The high-strength silicon wafer convenient to fix according to claim 1, wherein: the cotton pad (5) is a soft sponge pad.

5. The high-strength silicon wafer convenient to fix according to claim 1, wherein: the silicon slice outer frame (1) is a gum protective cover.

6. The high-strength silicon wafer convenient to fix according to claim 1, wherein: the shape of the silicon slice outer frame (1) can be rectangular, circular or polygonal.

7. The high-strength silicon wafer convenient to fix according to claim 1, wherein: corrugated bulges are embedded at one sides of the cotton pad (5) and the rubber pad (7) close to the silicon wafer body (8).