CN216956398U

CN216956398U - Infrared correlation sensor

Info

Publication number: CN216956398U
Application number: CN202220077957.6U
Authority: CN
Inventors: 隋志坤; 费沂东; 宋加才; 陈杰
Original assignee: Zhejiang Dahua Technology Co Ltd
Current assignee: Zhejiang Dahua Technology Co Ltd
Priority date: 2022-01-07
Filing date: 2022-01-07
Publication date: 2022-07-12
Anticipated expiration: 2032-01-07

Abstract

The application discloses infrared correlation sensor includes: the mainboard comprises a first interface and a second interface which are connected with a power supply; the transmitting terminal comprises a first line and a plurality of transmitting modules, the first line is electrically connected with the first node, and the plurality of transmitting modules are sequentially connected with the first line; a first resistor and a first voltage acquisition part are arranged in the transmitting module, the first end of the first resistor is connected with the first circuit, and the second end of the first resistor is grounded; the first voltage acquisition part is used for acquiring a first voltage value of the first end; the receiving end comprises a second line and a plurality of receiving modules, the second line is electrically connected with the second node, and the plurality of receiving modules are sequentially connected with the second line; a second resistor and a second voltage acquisition part are arranged in the receiving module, the third end of the second resistor is connected with a second line, and the fourth end of the second resistor is grounded; the second voltage acquisition unit is used for acquiring a second voltage value of the third terminal. The application provides an infrared correlation sensor, its circuit is less, and can effectively avoid detecting the blind area.

Description

Infrared correlation sensor

Technical Field

The application relates to the technical field of infrared correlation, in particular to an infrared correlation sensor.

Background

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.

The common infrared correlation switch in the market consists of a transmitting terminal and a receiving terminal. The transmitting end only transmits infrared pulse signals, and the receiving end outputs judgment signals according to whether the infrared pulse signals are received. For example, if the receiving end receives an infrared pulse signal, the receiving end judges that the signal outputs a high level; and if the receiving end does not receive the infrared pulse signal, judging that the signal outputs low level.

In the prior art, under the scene of using the infrared correlation switch on a large scale, the layout and the wiring are more, a circuit board for receiving signals needs to be provided with a plurality of interfaces, the construction is inconvenient, and the difficulty is increased. In addition, if two sets of infrared correlation switches are installed relatively close to each other, mutual interference may be caused, so a certain gap is required between the two sets of infrared correlation switches, and the gap may cause a detection blind area.

It should be noted that the above background description is only for the convenience of clear and complete description of the technical solutions in the present specification and for the understanding of those skilled in the art. Such solutions are not considered to be known to the person skilled in the art merely because they have been set forth in the background section of the present specification.

SUMMERY OF THE UTILITY MODEL

The main technical problem who solves of this application provides an infrared correlation sensor, and its circuit is less, and can effectively avoid detecting the blind area.

In order to solve the technical problem, the application adopts a technical scheme that: provided is an infrared correlation sensor including:

the main board comprises a first interface and a second interface, wherein the first interface and the second interface are both connected with a power supply, the electric connection position of the power supply and the first interface is defined as a first node, and the electric connection position of the power supply and the second interface is defined as a second node;

the transmitting end comprises a first line and a plurality of transmitting modules, the first line is electrically connected with the first node, and the plurality of transmitting modules are sequentially connected with the first line; a first resistor and a first voltage acquisition part are arranged in the transmitting module, the first resistor is provided with a first end and a second end which are opposite, the first end is connected with the first circuit, and the second end is grounded; the first voltage acquisition part is connected to the first end and used for acquiring a first voltage value of the first end; wherein the first voltage value of the transmit module is currently related to a resistance of the first resistor and a resistance of the first line between the transmit module and the first node;

the receiving end comprises a second line and a plurality of receiving modules, the second line is electrically connected with the second node, and the plurality of receiving modules are sequentially connected with the second line; a second resistor and a second voltage acquisition element are arranged in the receiving module, the second resistor is provided with a third end and a fourth end which are opposite, the third end is connected with the second line, and the fourth end is grounded; the second voltage acquisition part is connected to the third end and used for acquiring a second voltage value of the third end; wherein the second voltage value of the receiving module is currently related to a resistance value of the second resistor and a resistance value of the second line between the receiving module and the second node.

Furthermore, the first end of the first resistor and the first line intersect at a third node on the first line, and a third resistor is arranged on the first line between adjacent third nodes.

Furthermore, a fourth resistor is arranged between the first node and the power supply, a third voltage acquisition part is arranged in the mainboard, and the third voltage acquisition part is connected to one end, far away from the power supply, of the fourth resistor and is used for acquiring a voltage value, far away from one end of the power supply, of the fourth resistor.

Furthermore, a third interface is arranged in the transmitting module, and a second end of the first resistor is connected with the third interface; the third interface is grounded, and only one of the third interfaces is grounded at the same time.

Furthermore, the third end of the second resistor and the second line intersect at a fourth node on the second line, and a fifth resistor is disposed on the second line between adjacent fourth nodes.

Furthermore, a sixth resistor is arranged between the second node and the power supply, a fourth voltage acquisition part is arranged in the main board, and the fourth voltage acquisition part is connected to one end, far away from the power supply, of the sixth resistor and is used for acquiring a voltage value, far away from one end of the power supply, of the sixth resistor.

Furthermore, a fourth interface is arranged in the receiving module, and a fourth end of the second resistor is connected with the fourth interface; the fourth interface is grounded, and only one of the fourth interfaces is grounded at the same moment.

Further, the resistance value of the first resistor is equal to the resistance value of the second resistor.

Furthermore, the transmitting modules correspond to the receiving modules one to one, and the corresponding transmitting modules and the corresponding receiving modules communicate through infrared codes.

Furthermore, the plurality of transmitting modules are sequentially ordered from near to far away from the first interface, the plurality of receiving modules are sequentially ordered from near to far away from the second interface, and the transmitting modules and the receiving modules with the same sequence numbers correspond to each other.

Different from the prior art, the beneficial effects of the application are that: the infrared correlation sensor that this application embodiment provided, the transmitting terminal sets up a plurality of emission module and links to each other with first circuit in proper order, the receiving terminal sets up a plurality of receiving module and links to each other with the second circuit in proper order, then the transmitting terminal only needs the power supply line, first circuit and ground connection circuit, the receiving terminal only needs the power supply line, second circuit and ground connection circuit, transmitting terminal and receiving terminal all only need three circuit promptly, thereby the total circuit of the sensor that significantly reduces, reduce the construction degree of difficulty, practice thrift construction cost.

And a first voltage value of one end of the first resistor connected with the first line is obtained by arranging the first resistor and the first voltage obtaining part in the transmitting module, the first voltage values of the transmitting modules at different positions are different, and the position of the transmitting module can be judged according to the first voltage value. And setting a second resistor and a second voltage acquisition element in the receiving module to acquire a second voltage value of one end of the second resistor connected with the second line, wherein the second voltage values of the receiving modules at different positions are different, and the position of the receiving module can be judged according to the second voltage value. The transmitting module and the receiving module can identify the position of the receiving module, so that the subsequent receiving module can receive the code corresponding to the transmitting module according to the position, mutual interference can be avoided, the distance between the adjacent modules can be very small, and the detection blind area can be effectively avoided.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:

fig. 1 is a schematic structural diagram of an infrared correlation sensor provided in this embodiment;

fig. 2 is a schematic diagram of an internal structure of a group of the transmitting module and the receiving module in fig. 1.

Description of the reference numerals:

1. a main board; 2. a first interface; 3. a second interface; 4. a third voltage acquisition element; 5. a fourth voltage acquisition element;

6. a first line; 7. a second line; 8. a power supply line; 9. a ground line; 10. a power supply; 11. a first node; 12. a second node; 13. a third node; 14. a fourth node;

15. a transmitting module; 16. a first resistor; 161. a first end; 162. a second end; 17. a first voltage acquisition element; 18. a third interface; 19. an encoder;

20. a receiving module; 21. a second resistor; 211. a third end; 212. a fourth end; 22. a second voltage acquisition element; 23. a fourth interface; 24. a photoelectric amplifier; 25. a decoder;

26. a third resistor; 27. a fourth resistor; 28. a fifth resistor; 29. and a sixth resistor.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to fig. 1 and fig. 2. The embodiment of the application provides an infrared correlation sensor, including mainboard 1, transmitting terminal and receiving terminal.

The motherboard 1 comprises a first interface 2 and a second interface 3. The first interface 2 and the second interface 3 are both connected to a power supply 10, and an electrical connection position between the power supply 10 and the first interface 2 is defined as a first node 11, and an electrical connection position between the power supply 10 and the second interface 3 is defined as a second node 12.

The transmitting end comprises a first line 6 and a plurality of transmitting modules 15. The first line 6 is electrically connected to the first node 11. A plurality of transmitter modules 15 are in turn connected to the first line 6. The transmitting module 15 is provided with a first resistor 16 and a first voltage obtaining member 17. The first resistor 16 has a first end 161 and a second end 162 opposite to each other, the first end 161 is connected to the first line 6, and the second end 162 is grounded. The first voltage obtaining element 17 is connected to the first terminal 161 for obtaining a first voltage value of the first terminal 161. The first voltage value of the transmitting module 15 is related to the resistance of the first resistor 16 and the resistance of the first line 6 between the transmitting module 15 and the first node 11.

The receiving end comprises a second line 7 and a plurality of receiving modules 20. The second line 7 is electrically connected to the second node 12. The plurality of receiving modules 20 are connected to the second line 7 in turn. The receiving module 20 is provided with a second resistor 21 and a second voltage obtaining member 22. The second resistor 21 has a third terminal 211 and a fourth terminal 212 opposite to each other, the third terminal 211 is connected to the second line 7, and the fourth terminal 212 is grounded. The second voltage obtaining element 22 is connected to the third terminal 211, and is configured to obtain a second voltage value of the third terminal 211. The second voltage value of the receiving module 20 is related to the resistance of the second resistor 21 and the resistance of the second line 7 between the receiving module 20 and the second node 12.

The infrared correlation sensor that this application embodiment provided, the transmitting terminal sets up a plurality of emission module 15 and links to each other with first circuit 6 in proper order, the receiving terminal sets up a plurality of receiving module 20 and links to each other with second circuit 7 in proper order, then the transmitting terminal only needs power supply line 8, first circuit 6 and ground circuit 9, the receiving terminal only needs power supply line 8, second circuit 7 and ground circuit 9, transmitting terminal and receiving terminal all only need three circuit promptly, thereby the total circuit of the sensor that significantly reduces, reduce the construction degree of difficulty, practice thrift construction cost.

Furthermore, by arranging the first resistor 16 and the first voltage obtaining element 17 in the transmitting module 15, the first voltage value of the end of the first resistor 16 connected to the first line 6 is obtained, the first voltage values of the transmitting modules 15 at different positions are different, and the position of the transmitting module 15 can be determined according to the first voltage value. A second resistor 21 and a second voltage obtaining element 22 are arranged in the receiving module 20 to obtain a second voltage value of an end of the second resistor 21 connected to the second line 7, the second voltage values of the receiving modules 20 at different positions are different, and the position of the receiving module 20 can be determined according to the second voltage value. The transmitting module 15 and the receiving module 20 can both identify the positions of the transmitting module and the receiving module 20, so that the subsequent receiving module 20 can receive the codes corresponding to the transmitting module 15 according to the positions, mutual interference can be avoided, the distance between the adjacent modules can be small, and the detection blind area can be effectively avoided.

In the present embodiment, since the respective transmitting modules 15 are located at different positions of the first line 6, the lengths of the first line 6 between different transmitting modules 15 and the first node 11 are different, and thus the resistance values of the first line 6 between different transmitting modules 15 and the first node 11 are different. In one embodiment, the transmitting modules 15 may be connected to the first line 6 at regular intervals.

Specifically, the first terminal 161 of the first resistor 16 and the first line 6 intersect at the third node 13 on the first line 6. A third resistor 26 is provided on the first line 6 between the adjacent third nodes 13. Here, the third resistor 26 may be a resistor of the first line 6 itself, an additionally provided resistor, or a total resistor of the first line 6 itself and the additionally provided resistor, which is not limited in the present application. Preferably, a third resistor 26 is also provided between the third node 13 closest to the main board 1 and the first node 11.

In the present embodiment, a fourth resistor 27 may be provided between the first node 11 and the power supply line 10 on the power supply line 8. The main board 1 is provided with a third voltage obtaining element 4, and the third voltage obtaining element 4 is connected to one end of the fourth resistor 27 far away from the power supply 10, and is used for obtaining a voltage value of the end of the fourth resistor 27 far away from the power supply 10, so that the number of the transmitting modules 15 connected to the first line 6 can be obtained. The voltage value obtained by the third voltage obtaining part 4 changes every time one transmitting module 15 is connected.

Specifically, the third interface 18 is disposed in the transmitting module 15, and the second end 162 of the first resistor 16 is connected to the third interface 18. The third interface 18 is grounded and only one third interface 18 of the plurality of third interfaces 18 is grounded at the same time. That is, the plurality of third interfaces 18 may dynamically form GND (ground of the wire), and when a certain third interface 18 is pulled down, the GND is formed, and the power supply 10 is grounded through the fourth resistor 27, the third resistor 26 and the first resistor 16, so that the first voltage obtaining device 17 may monitor the accurate first voltage value at the input side of the first resistor 16. The number of the third resistors 26 through which the transmitting modules 15 at different positions pass is different, so that the first voltage values of the transmitting modules 15 at different positions are different, and as long as it is ensured that only one transmitting module 15 pulls GND at the same time, the address of the transmitting module 15 on the first line 6 can be identified according to different voltage division values.

Each transmitting module 15 is connected to each third node 13 with the first line 6, each transmitting module 15 is numbered according to the length of the first line 6 from each third node 13 to the first node 11 from small to large, each transmitting module 15 is respectively No. 1, No. 2, No. 3 and No. … … m, and each transmitting module 15 represents a total of m transmitting modules 15. The first voltage value Vm measured by the mth first voltage obtaining part 17 can be calculated by the following equation:

wherein m represents the number of the transmitting module 15, and m may be a natural number greater than 0; r1 represents the resistance value of the first resistor 16; r4 represents the resistance value of the fourth resistor 27; r3 represents the resistance value of the third resistor 26; vcc denotes the power supply source 10; vm denotes a first voltage value of the mth transmitting module 15.

In the present embodiment, since the respective receiving modules 20 are located at different positions of the second line 7, the lengths of the second line 7 between different receiving modules 20 and the second node 12 are different, and thus the resistance values of the second line 7 between different receiving modules 20 and the second node 12 are different. In one embodiment, the receiving modules 20 may be connected to the second line 7 at regular intervals.

Specifically, the third terminal 211 of the second resistor 21 and the second line 7 intersect at the fourth node 14 on the second line 7. A fifth resistor 28 is provided on the second line 7 between adjacent fourth nodes 14. The fifth resistor 28 may be the own resistor of the second line 7, an additionally provided resistor, or the total of the own resistor of the second line 7 and the additionally provided resistor, which is not limited in this application. Preferably, a fifth resistor 28 is also provided between the fourth node 14 closest to the main board 1 and the second node 12.

In the present embodiment, a sixth resistor 29 may be provided between the second node 12 and the power supply line 10 on the power supply line 8. A fourth voltage obtaining component 5 is arranged in the main board 1, and the fourth voltage obtaining component 5 is connected to one end of the sixth resistor 29 far away from the power supply 10, and is used for obtaining a voltage value of one end of the sixth resistor 29 far away from the power supply 10, so that the number of the receiving modules 20 connected to the second line 7 can be obtained. The voltage value obtained by the fourth voltage obtaining part 5 changes every time one receiving module 20 is connected.

Specifically, the receiving module 20 is provided with a fourth interface 23, and the fourth end 212 of the second resistor 21 is connected to the fourth interface 23. The fourth interface 23 is grounded, and only one fourth interface 23 of the plurality of fourth interfaces 23 is grounded at the same time. That is, the plurality of fourth interfaces 23 may dynamically form GND (ground of the wire), and when a certain fourth interface 23 is pulled down, the GND is formed, and the power supply 10 is grounded through the sixth resistor 29, the fifth resistor 28, and the second resistor 21, so that the second voltage obtaining device 22 may monitor the accurate second voltage value at the input side of the second resistor 21. The number of the fifth resistors 28 passed by the receiving modules 20 at different positions is different, so that the second voltage values of the receiving modules 20 at different positions are different, and as long as only one receiving module 20 pulls GND at the same time, the address of the receiving module 20 on the second line 7 can be identified according to different voltage division values.

Each receiving module 20 and the second line 7 are connected to each fourth node 14, each receiving module 20 is numbered according to the length of the second line 7 from each fourth node 14 to the second node 12 from small to large, each receiving module 20 is respectively No. 1, No. 2, No. 3 and No. … … n, and a total of n receiving modules 20 are shown. The second voltage value Vn measured by the nth second voltage obtaining part 22 can be calculated by the following equation:

where n denotes the number of the receiving module 20, and n may be a natural number greater than 0; r2 represents the resistance value of the second resistor 21; r6 represents the resistance value of the sixth resistor 29; r5 represents the resistance of fifth resistor 28; vcc denotes the power supply source 10; vn denotes a second voltage value of the nth receiving module 20.

In a preferred embodiment, the resistance of the first resistor 16 may be equal to the resistance of the second resistor 21, thereby further simplifying the circuitry and operation. Further, the third resistor 26 may have a resistance equal to that of the fifth resistor 28, and the fourth resistor 27 may have a resistance equal to that of the sixth resistor 29. The number of the transmitting modules 15 is equal to the number of the receiving modules 20. The first line 6 and its connection structure and the second line 7 and its connection structure are mirror images from the hardware configuration.

In this embodiment, the first interface 2, the second interface 3, the third interface 18, and the fourth interface 23 may be IO interfaces, and the functions of the first voltage obtaining element 17, the second voltage obtaining element 22, the third voltage obtaining element 4, and the fourth voltage obtaining element 5 may be implemented by using an ADC (analog to digital converter) module.

In the present embodiment, the transmitting modules 15 and the receiving modules 20 correspond to each other, and the corresponding transmitting modules 15 and the corresponding receiving modules 20 communicate with each other through infrared codes. As shown in fig. 2, the transmitting module 15 may be provided therein with an MCU (micro control unit) and an encoder 19, and both the first voltage obtaining part 17 and the third interface 18 are located in the MCU. The receiving module 20 may be provided with a photoelectric amplifier 24, a decoder 25 and an MCU, and the second voltage obtaining element 22 and the fourth interface 23 are both located in the MCU. The transmitting module 15 is connected with three lines of a power supply line 8, a first line 6 and a grounding line 9, and the receiving module 20 is connected with three lines of a power supply line 8, a second line 7 and a grounding line 9.

Specifically, the plurality of transmitting modules 15 are sequentially ordered from near to far according to the distance from the first interface 2, the plurality of receiving modules 20 are sequentially ordered from near to far according to the distance from the second interface 3, and the transmitting modules 15 and the receiving modules 20 with the same sequence number correspond to each other. For example, in fig. 1, the transmitting module 15RF _ TX1 and the receiving module 20RF _ RX1 are paired, the transmitting module 15RF _ TX2 and the receiving module 20RF _ RX2 are paired, the transmitting module 15RF _ TX3 and the receiving module 20RF _ RX3 are paired, and the transmitting module 15RF _ TX4 and the receiving module 20RF _ RX4 are paired.

In this embodiment, the transmitting terminal and the receiving terminal are respectively cascaded, the power supply 10 is connected, the third interface 18 and the fourth interface 23 are grounded, and the positions of the transmitting module 15 and the receiving module 20 can be determined according to the change of the first voltage value and the second voltage value. Each transmitting module 15 transmits its own code according to its own sequence, each receiving module 20 receives only the code transmitted by the corresponding transmitting module 15 according to its own sequence and performs demodulation processing, the processed signal is transmitted to the MCU, and the MCU determines whether the infrared correlation module is shielded by receiving the corresponding coded signal. Finally, the state of the infrared correlation module is reported through the mode of single bus (Signal) communication, namely the state is reported to the second interface 3 of the mainboard 1 through the second line 7, so that the construction difficulty is reduced, and the construction cost is greatly saved. Two adjacent groups of the transmitting module 15 and the receiving module 20 can have a small distance during installation due to different infrared codes and are not interfered with each other.

It should be noted that, in the description of the present specification, the terms "first", "second", and the like are used for descriptive purposes only and for distinguishing similar objects, and no order is present therebetween, and no indication or suggestion of relative importance is to be made. Further, in the description of the present specification, "a plurality" means two or more unless otherwise specified.

The use of the terms "comprising" or "including" to describe combinations of elements, components, or steps herein also contemplates embodiments that consist essentially of such elements, components, or steps. By using the term "may" herein, it is intended to indicate that any of the described attributes that "may" include are optional.

A plurality of elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, ingredient, component or step is not intended to foreclose other elements, ingredients, components or steps.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. An infrared correlation sensor, comprising:

2. The ir-ir sensor according to claim 1, wherein the first end of the first resistor and the first line intersect at a third node on the first line, and a third resistor is disposed on the first line between adjacent third nodes.

3. The infrared correlation sensor as claimed in claim 1, wherein a fourth resistor is disposed between the first node and the power supply, and a third voltage obtaining element is disposed in the main board and connected to one end of the fourth resistor away from the power supply, for obtaining a voltage value of the fourth resistor away from the end of the power supply.

4. The infrared correlation sensor of claim 1, wherein a third interface is disposed in the transmission module, and a second end of the first resistor is connected to the third interface; the third interface is grounded, and only one of the third interfaces is grounded at the same time.

5. The ir-ir sensor according to claim 1, wherein the third end of the second resistor and the second line intersect at a fourth node on the second line, and a fifth resistor is disposed on the second line between adjacent fourth nodes.

6. The infrared correlation sensor as claimed in claim 1, wherein a sixth resistor is disposed between the second node and the power supply, and a fourth voltage obtaining element is disposed in the main board and connected to an end of the sixth resistor away from the power supply, for obtaining a voltage value of the sixth resistor away from the end of the power supply.

7. The infrared correlation sensor of claim 1, wherein a fourth interface is disposed in the receiving module, and a fourth end of the second resistor is connected to the fourth interface; the fourth interface is grounded, and only one of the fourth interfaces is grounded at the same moment.

8. An infrared correlation sensor as claimed in claim 1, wherein a resistance value of the first resistor and a resistance value of the second resistor are equal.

9. The infrared correlation sensor of claim 1, wherein the transmitting modules and the receiving modules are in one-to-one correspondence, and the corresponding transmitting modules and the corresponding receiving modules communicate with each other through infrared codes.

10. The infrared correlation sensor of claim 9, wherein the plurality of transmitting modules are sequentially ordered from near to far from the first interface, the plurality of receiving modules are sequentially ordered from near to far from the second interface, and the transmitting modules and the receiving modules with the same serial number correspond to each other.