CN216954583U

CN216954583U - Thermotechnical instrument dust cover

Info

Publication number: CN216954583U
Application number: CN202220736985.4U
Authority: CN
Inventors: 许军伟; 冯丽; 符斌; 符气英; 刘庆如
Original assignee: Huaneng Yangpu Thermal Power Co Ltd
Current assignee: Huaneng Yangpu Thermal Power Co Ltd
Priority date: 2022-03-30
Filing date: 2022-03-30
Publication date: 2022-07-12
Anticipated expiration: 2032-03-30

Abstract

The utility model relates to the technical field of dust covers, in particular to a dust cover for a thermotechnical instrument. A thermal technology is dust cover for instrument, includes: the first shell is provided with a first flat plate and a first side plate arranged on the first flat plate, the second shell is provided with a second flat plate and a second side plate arranged on the second flat plate, and the first side plate and the second side plate are jointed to form an accommodating space for accommodating a thermotechnical instrument; the buffer structure comprises a buffer spring arranged between the first flat plate and the second flat plate, one end of the buffer spring is fixedly connected with the first flat plate, and the other end of the buffer spring is fixedly connected with the second flat plate. The utility model aims to solve the technical problem of overcoming the defect that the dust cover for the thermotechnical instrument in the prior art is not convenient to mount or dismount, thereby providing the dust cover for the thermotechnical instrument.

Description

Thermotechnical instrument dust cover

Technical Field

The utility model relates to the technical field of dust covers, in particular to a dust cover for a thermotechnical instrument.

Background

The thermal instrument is an instrument for measuring temperature, pressure, flow and liquid level. In a thermal power plant, thermal instruments comprise mechanical meters and electrical instruments, and dust covers are required to protect the instruments in use so as to prolong the service life of the instruments.

The existing dust cover for the thermotechnical instrument is not convenient enough to mount or dismount due to the fact that people pay attention to how to use the dust cover to protect the instrument and the dust cover is often fixed on the thermotechnical instrument.

SUMMERY OF THE UTILITY MODEL

Therefore, the technical problem to be solved by the utility model is to overcome the defect that the dust cover for the thermal instrument in the prior art is not convenient to disassemble in use, thereby providing the dust cover for the thermal instrument.

In order to solve the above problems, the present invention provides a dust cover for a thermal instrument, including:

the thermal engineering instrument comprises a first shell and a second shell which are arranged correspondingly, wherein the first shell is provided with a first flat plate and a first side plate arranged on the first flat plate, the second shell is provided with a second flat plate and a second side plate arranged on the second flat plate, and the first side plate and the second side plate are attached to form an accommodating space for accommodating a thermal engineering instrument;

the buffer structure comprises a buffer spring arranged between the first flat plate and the second flat plate, one end of the buffer spring is fixedly connected with the first flat plate, and the other end of the buffer spring is fixedly connected with the second flat plate.

Optionally, the buffer structure is a pair symmetrically arranged.

Optionally, the buffer structure further comprises a positioning sleeve and a positioning rod which are arranged in the buffer spring and matched with each other, the positioning sleeve is fixedly arranged on the first flat plate, and the positioning rod is fixedly arranged on the second flat plate.

Optionally, a baffle is further disposed in the first casing, the baffle is fixedly connected to the first side plate, and an installation space is formed between the baffle and the first plate.

Optionally, the installation structure further comprises an anti-interference shield and a connecting column which are fixed on the first flat plate, and the anti-interference shield and the connecting column are arranged in the installation space.

Optionally, one end of the connecting column is fixedly connected with the first flat plate, and the other end of the connecting column is fixedly connected with the baffle.

Optionally, the baffle is provided with at least one heat dissipation through hole.

Optionally, the thermal engineering instrument further comprises a fixing structure, the fixing structure comprises a first half ring and a second half ring, the first half ring is fixed on the first flat plate, the second half ring is fixed on the second flat plate, and a channel allowing a connection pipeline of the thermal engineering instrument to pass through is formed by the first half ring and the second half ring in a surrounding manner.

Optionally, the first half ring is fixedly connected to the first plate through a first connecting rod, and the second half ring is fixedly connected to the second plate through a second connecting rod.

The technical scheme of the utility model has the following advantages:

1. the utility model provides a dust cover for a thermotechnical instrument, which comprises: the first shell is provided with a first flat plate and a first side plate arranged on the first flat plate, the second shell is provided with a second flat plate and a second side plate arranged on the second flat plate, the first side plate and the second side plate are attached to form an accommodating space for accommodating the thermotechnical instrument, and the accommodating space is used for accommodating the thermotechnical instrument so as to seal the thermotechnical instrument between the first shell and the second shell; at least one buffer structure, buffer structure is including locating a buffer spring between first flat board and the second flat board, buffer spring's one end and first flat board fixed connection, the other end and second flat board fixed connection to realize the relative motion of first flat board and second flat board. When the thermal engineering instrument is required to be installed, the first flat plate and the second flat plate are far away through pulling the buffer spring, so that the distance between the first side plate and the second side plate is driven to appear, when the distance is larger than the thickness of the thermal engineering instrument, the first shell and the second shell can reach the thermal engineering instrument, the buffer spring is compressed again to reduce the distance between the first side plate and the second side plate until the first side plate and the second side plate are attached, so that the thermal engineering instrument is completely placed in the first shell and the second shell, and the installation and the disassembly are convenient.

2. The dustproof cover for the thermotechnical instrument provided by the utility model has the advantages that the buffering structures are symmetrically arranged in a pair, and the first flat plate and the second flat plate are subjected to more uniform force by the two buffering springs.

3. The buffering structure of the dust cover for the thermotechnical instrument further comprises a positioning sleeve and a positioning rod which are arranged in the buffering spring and matched with each other, the positioning sleeve is fixedly arranged on the first flat plate, the positioning rod is fixedly arranged on the second flat plate, and the positioning sleeve and the positioning rod are matched with each other to realize accurate positioning when the first side plate and the second side plate are attached to each other.

4. The dust cover for the thermotechnical instrument, provided by the utility model, is characterized in that a baffle is also arranged in the first shell, the baffle is fixedly connected with the first side plate, an installation space is arranged between the baffle and the first plate, and a connecting column and an anti-interference shield are arranged in the installation space so as to arrange other articles in the installation space.

5. According to the dustproof cover for the thermotechnical instrument, one end of the connecting column is fixedly connected with the first flat plate, and the other end of the connecting column is fixedly connected with the baffle plate, so that a supporting effect is achieved, and the installation space in the first shell is guaranteed.

6. The dust cover for the thermotechnical instrument provided by the utility model is characterized in that the baffle is provided with at least one heat dissipation through hole so as to dissipate heat generated by the thermotechnical instrument into the installation space.

7. The utility model provides a dust cover for a thermal instrument, which further comprises a fixing structure, wherein the fixing structure comprises a first half ring and a second half ring, the first half ring is fixed on a first flat plate, the second half ring is fixed on a second flat plate, and the first half ring and the second half ring enclose a channel allowing a connecting pipeline of the thermal instrument to pass through so as to fix the first shell and the second shell with the pipeline, and further improve the stability of the thermal instrument in use.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural diagram of a dust cover for a thermal instrument provided in an embodiment of the present invention;

fig. 2 is a schematic sectional view of a dust cover for a thermal instrument provided in an embodiment of the present invention;

fig. 3 is a schematic structural diagram of the first housing and the thermal instrument provided in the embodiment of the present invention;

fig. 4 is a schematic structural view of a first housing provided in an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a second housing provided in an embodiment of the present invention.

Description of reference numerals: 1. a first housing; 2. a second housing; 3. connecting columns; 4. a first plate; 5. a second plate; 6. a positioning sleeve; 7. positioning a rod; 8. a first link; 9. a first half ring; 10. a second half ring; 11. a baffle plate; 12. a buffer spring; 13. an interference shield.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

One specific embodiment of the dust cover for thermal instrumentation shown in fig. 1-5 comprises: the device comprises a first shell 1 and a second shell 2 which are correspondingly arranged, and a pair of buffering structures and a fixing structure which are arranged between the first shell 1 and the second shell 2.

As shown in fig. 1 to 5, the first casing 1 is provided with a first flat plate 4 and a first side plate provided on the first flat plate 4. In order to facilitate installation of the anti-interference shield 13, a baffle 11 fixedly connected with the first side plate is further arranged in the first shell 1, an installation space is formed between the first plate 4 and the baffle 11, and the anti-interference shield 13 is arranged in the installation space and fixed on the first plate 4. In order to ensure that the installation space cannot be changed, the device also comprises a connecting column 3 arranged in the installation space, one end of the connecting column 3 is fixedly connected with the first flat plate 4, and the other end of the connecting column is fixedly connected with the baffle 11. In order to realize the heat dissipation of the thermal instrument, a plurality of through holes are arranged on the baffle plate 11. The second housing 2 is provided with a second plate 5 and a second side plate provided on the second plate 5. Wherein, first flat board 4 and second flat board 5 parallel arrangement, the terminal surface laminating of first curb plate and second curb plate is in order to be formed with the accommodation space who holds thermal technology instrument.

As shown in fig. 1, 3, 4 and 5, the buffer structure includes a positioning rod 7 and a positioning sleeve 6, which are fitted, and a buffer spring 12, which is sleeved on the outer periphery of the positioning sleeve 6. Wherein, the locating sleeve 6 is fixedly arranged on the first flat plate 4, the locating rod 7 is fixedly arranged on the second flat plate 5, one end of the buffer spring 12 is fixedly connected with the first flat plate 4, and the other end is fixedly connected with the second flat plate 5.

As shown in fig. 1, 2 and 4, the fixing structure includes a first half ring 9 and a second half ring 10, wherein the first half ring 9 is fixedly connected to the first plate 4 through a first connecting rod 8, the second half ring 10 is fixedly connected to the second plate 5 through a second connecting rod, and a channel allowing a connection pipeline of the thermal instrument to pass through is formed by the first half ring 9 and the second half ring 10. For further fixed pipeline, all be equipped with the through-hole on first semi-ring 9 and the second semi-ring 10, wear to be equipped with the bolt in the through-hole in order to be connected first semi-ring 9 and second semi-ring 10 fixed connection.

In the specific implementation process, when the thermotechnical instrument needs to be installed or disassembled, a field worker respectively grasps the first flat plate 4 and the second flat plate 5 with two hands to enable the first flat plate 4 and the second flat plate 5 to move towards opposite directions, when the distance between the first side plate and the second side plate is larger than the thickness of the thermotechnical instrument, the first shell 1 and the second shell 2 are moved to the thermotechnical instrument, the positioning rod 7 is aligned to the positioning sleeve 6, the two hands slowly reduce the tensile force to enable the first flat plate 4 and the second flat plate 5 to reduce the distance between the first side plate and the second side plate under the action of the restoring force of the buffer spring 12 until the first side plate and the second side plate are completely attached to wrap the thermotechnical instrument in the first shell 1 and the second shell 2. Then, the bolts in the through holes of the first half ring 9 and the second half ring 10 are installed or disassembled to realize the installation or the disassembly of the thermal instrument.

As an alternative embodiment, the number of buffer structures may also be 1, 3, 4 or even more.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the utility model may be made without departing from the spirit or scope of the utility model.

Claims

1. A thermal technology is dust cover for instrument, its characterized in that includes:

the thermal engineering instrument comprises a first shell (1) and a second shell (2) which are arranged correspondingly, wherein the first shell (1) is provided with a first flat plate (4) and a first side plate arranged on the first flat plate (4), the second shell (2) is provided with a second flat plate (5) and a second side plate arranged on the second flat plate (5), and the first side plate and the second side plate are attached to form an accommodating space for accommodating a thermal engineering instrument;

at least one buffer structure, buffer structure is including locating a buffer spring (12) between first flat board (4) and second flat board (5), buffer spring (12) one end with first flat board (4) fixed connection, the other end with second flat board (5) fixed connection.

2. A thermal instrumentation dust cover as claimed in claim 1, wherein said cushioning structure is a pair of symmetrically disposed.

3. A dust cover for thermal instruments according to claim 2, wherein the buffering structure further comprises a positioning sleeve (6) and a positioning rod (7) which are arranged in the buffering spring (12) and adapted to each other, the positioning sleeve (6) is fixedly arranged on the first flat plate (4), and the positioning rod (7) is fixedly arranged on the second flat plate (5).

4. A dust cover for thermal instruments according to claim 1, wherein a baffle (11) is further arranged in the first housing (1), the baffle (11) is fixedly connected with the first side plate, and an installation space is formed between the baffle (11) and the first flat plate (4).

5. A thermal engineering instrument dust cover according to claim 4, further comprising an anti-interference shield (13) and a connection column (3) fixed to the first flat plate (4), wherein the anti-interference shield (13) and the connection column (3) are arranged in the installation space.

6. A thermal engineering instrument dust cover according to claim 5, wherein one end of the connecting column (3) is fixedly connected with the first flat plate (4), and the other end is fixedly connected with the baffle (11).

7. A dust cover for thermal instruments according to claim 4, characterized in that the baffle (11) is provided with at least one heat dissipating through hole.

8. The thermal engineering instrument dust cover according to any one of claims 1 to 7, further comprising a fixing structure, wherein the fixing structure comprises a first half ring (9) and a second half ring (10), the first half ring (9) is disposed on the first flat plate (4), the second half ring (10) is disposed on the second flat plate (5), and the first half ring (9) and the second half ring (10) enclose a channel formed to allow a connection pipeline of the thermal engineering instrument to pass through.

9. A thermal engineering instrument dust cover according to claim 8, characterized in that the first half ring (9) is fixedly connected with the first plate (4) through a first connecting rod (8), and the second half ring (10) is fixedly connected with the second plate (5) through a second connecting rod.