CN216937582U

CN216937582U - Environment-friendly full-automatic silicon wafer cleaning machine with cooling function

Info

Publication number: CN216937582U
Application number: CN202123097834.3U
Authority: CN
Inventors: 曹志勇; 杭智华; 姜志刚
Original assignee: Yangzhou Weiye Creative Technology Ltd
Current assignee: Yangzhou Weiye Creative Technology Ltd
Priority date: 2021-12-10
Filing date: 2021-12-10
Publication date: 2022-07-12
Anticipated expiration: 2031-12-10

Abstract

The utility model discloses an environment-friendly full-automatic silicon wafer cleaning machine with a cooling function, which belongs to the technical field of silicon wafer cleaning, and comprises a silicon wafer cleaning machine body, wherein a mounting plate is arranged above the right side wall of the silicon wafer cleaning machine body, a chute is formed in the left side wall of the mounting plate, a slide block is arranged in the chute in a sliding connection manner, an adjusting assembly is arranged on the left side wall of the slide block, a spray plate is arranged on the left side of the slide block in a rotating connection manner, a plurality of groups of air outlets are arranged at the bottom of the spray plate, one end of a movable rod penetrates through the inner front side wall of the chute and is connected with a movable plate arranged outside the chute, a fixed plate is arranged on the outer wall of the movable rod in a sleeved manner, a motor is arranged on the left side wall of the fixed plate, a cam is arranged at the output end of the motor in a connected manner, a cam bulge of the cam is lapped with the front side wall of the movable plate, the cam is driven to rotate under the action of the motor, the cam indirectly beats the movable plate, the slide block can be driven to reciprocate in the chute under the cooperation of the spring, thereby better cooling the silicon wafer.

Description

Environment-friendly full-automatic silicon wafer cleaning machine with cooling function

Firstly, the following steps: Technical Field

The utility model relates to the technical field of silicon wafer cleaning, in particular to an environment-friendly full-automatic silicon wafer cleaning machine with a cooling function.

II, secondly: background

After the silicon wafer is cut, degumming and cleaning are needed, and after the silicon wafer is cleaned in a cleaning machine, the silicon wafer is dried by hot air. The temperature of the silicon wafer dried by the existing silicon wafer cleaning machine is 60-70 ℃, and the detection accuracy of the sorting machine on the silicon wafer can be influenced by overhigh temperature. The original solution is that the silicon wafer is placed for a period of time and then is sorted by a sorting machine when the temperature of the silicon wafer is reduced to about 30 ℃, so that the processing time is prolonged, and the production efficiency is influenced.

The existing silicon wafer cleaning machine needs to cool the silicon wafer after drying, but most of the air outlet nozzles of the cooling device of the existing silicon wafer cleaning machine are fixedly arranged, the angle of the air outlet nozzles cannot be reasonably adjusted, the temperature of the silicon wafer cannot be cooled quickly, the cooling effect is poor, and the production efficiency is influenced.

Thirdly, the method comprises the following steps: SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an environment-friendly full-automatic silicon wafer cleaning machine with a cooling function, wherein most of air outlet nozzles of a cooling device of the existing silicon wafer cleaning machine are fixedly arranged, the angle of the air outlet nozzles cannot be reasonably adjusted, the temperature of a silicon wafer cannot be rapidly cooled, the cooling effect is poor, and the production efficiency is influenced so as to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: an environment-friendly full-automatic silicon wafer cleaning machine with a cooling function comprises a silicon wafer cleaning machine body, wherein an air cooler is arranged at the top of the silicon wafer cleaning machine body, a blanking table is arranged below the left side wall of the silicon wafer cleaning machine body, a mounting plate is arranged above the right side wall of the silicon wafer cleaning machine body, a chute is formed in the left side wall of the mounting plate, a slider is arranged in the chute in a sliding connection manner, an adjusting assembly is arranged on the left side wall of the slider, a spray plate is arranged on the left side of the slider in a rotating connection manner, a plurality of groups of air outlets are arranged at the bottom of the spray plate, an air conveying pipe is arranged between the air cooler and the spray plate, a movable rod is arranged on the front side wall of the slider, one end of the movable rod penetrates through the front side wall in the chute to be connected with a movable plate arranged outside, a spring is sleeved on the outer wall of the movable rod, one end of the spring is connected with the front side wall of the mounting plate, and the other end of the spring is connected with the rear side wall of the movable plate, the silicon wafer cleaning machine is characterized in that a fixing plate is arranged on the front side wall of the silicon wafer cleaning machine body, a motor is arranged on the left side wall of the fixing plate, a cam is connected and arranged at the output end of the motor, and the protruding part of the cam is in lap joint with the front side wall of the movable plate.

As preferred, the adjusting part includes that the slider left side wall passes through the rolling disc that the bearing connection was equipped with, the rolling disc left side wall is connected with the dish right side wall of spouting, the rolling disc left side wall runs through and is equipped with the inserted bar, the inserted bar left side wall is equipped with the arm-tie, the inserted bar outer wall cup joints and is equipped with reset spring, reset spring one end is connected with the rolling disc left side wall, the reset spring other end is connected with arm-tie right side wall, the slider left side wall has seted up multiunit and inserted bar assorted jack.

Preferably, a plurality of groups of the jacks are distributed on the left side wall of the sliding block in an annular array.

Preferably, the sliding groove right side wall is provided with a limiting groove, and the sliding block right side wall is provided with a limiting block matched with the limiting groove.

Preferably, the plurality of groups of air outlets are distributed at the bottom of the spray plate in a linear array.

Preferably, the left side wall of the silicon wafer cleaning machine body is provided with a feed opening, and the feed opening is matched with the feed platform.

Preferably, one end of the air conveying pipe is connected with an air outlet of the air cooler, the other end of the air conveying pipe is connected with an air inlet of the spray disk, and the air conveying pipe is a hose.

Compared with the prior art, the utility model has the beneficial effects that:

1. the utility model discloses set up the air-cooler, the air-cooler passes through the defeated tuber pipe and carries cold wind in spouting the dish, then can cool off when the silicon chip passes through the unloading platform under the effect of tuyere, drives the cam simultaneously and rotates under the effect of motor, and the cam indirectness beats the fly leaf, can drive slider reciprocating motion in the spout under the cooperation of spring to can be better cool off the silicon chip, cooling range is big, and the cooling effect is good.

2. The rotating disc is rotated to drive the spray disc to rotate, and then the spray disc is inserted into the insertion holes under the action of the insertion rods, so that the angle of the air outlet nozzle can be adjusted, the angle of cold air can be changed, the silicon wafer can be better cooled, and the cooling effect is enhanced.

Fourthly, the method comprises the following steps: drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural diagram of the present invention A.

In the figure: 1. a silicon wafer cleaning machine body; 2. a motor; 3. a cam; 4. a movable plate; 5. a fixing plate; 6. a spring; 7. a movable rod; 8. a chute; 9. a slider; 10. mounting a plate; 11. an air cooler; 12. a wind delivery pipe; 13. spraying a disc; 14. an air outlet nozzle; 15. a feed opening; 16. a blanking table; 17. an adjustment assembly; 18. pulling a plate; 19. a return spring; 20. inserting a rod; 21. a jack; 22. and (6) rotating the disc.

Fifthly: Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

Referring to fig. 1, the present invention provides a technical solution: an environment-friendly full-automatic silicon wafer cleaning machine with a cooling function comprises a silicon wafer cleaning machine body 1, an air cooler 11 is arranged at the top of the silicon wafer cleaning machine body 1, a blanking table 16 is arranged below the left side wall of the silicon wafer cleaning machine body 1, a mounting plate 10 is arranged above the right side wall of the silicon wafer cleaning machine body 1, a chute 8 is arranged on the left side wall of the mounting plate 10, a slide block 9 is arranged in the chute 8 in a sliding connection manner, an adjusting assembly 17 is arranged on the left side wall of the slide block 9, a spray plate 13 is rotatably connected on the left side of the slide block 9, a plurality of groups of air outlet nozzles 14 are arranged at the bottom of the spray plate 13, the air outlet nozzles 14 are communicated with the interior of the spray plate 13, an air conveying pipe 12 is arranged between the air cooler 11 and the spray plate 13, a movable rod 7 is arranged on the front side wall of the slide block 8, one end of the movable rod 7 penetrates through the interior front side wall of the chute 8 to be connected with a movable plate 4 arranged on the exterior, a spring 6 is sleeved on the outer wall of the movable rod 7, one end of the spring 6 is connected with the front side wall of the mounting plate 10, the other end of the spring 6 is connected with the rear side wall of the movable plate 4, the front side wall of the silicon wafer cleaning machine body 1 is provided with the fixed plate 5, the left side wall of the fixed plate 5 is provided with the motor 2, the output end of the motor 2 is connected with the cam 3, the protruding part of the cam 3 is in lap joint with the front side wall of the movable plate 4, and the movable plate 4 can be knocked indirectly when the cam 3 rotates.

In this embodiment, please refer to fig. 1, a limiting groove is formed on the right side wall of the sliding groove 8, and a limiting block matched with the limiting groove is arranged on the right side wall of the sliding block 9, so that the sliding block 9 is more stable when reciprocating back and forth in the sliding groove 8 under the action of the limiting groove and the limiting block.

In this embodiment, referring to fig. 1, the plurality of groups of air outlets 14 are distributed in a linear array at the bottom of the spray plate 13, so that the silicon wafer on the blanking table 16 can be better cooled, and the cooling effect is good.

In this embodiment, referring to fig. 1, a feed opening 15 is formed in a left side wall of a silicon wafer cleaning machine body 1, the feed opening 15 is matched with a feed table 16, and a silicon wafer is cleaned and dried in the silicon wafer cleaning machine body 1 and then fed onto the feed table 16 from the feed opening 15.

In this embodiment, referring to fig. 1, one end of the air duct 12 is connected to an air outlet of the air cooler 11, the other end of the air duct 12 is connected to an air inlet of the spray tray 13, and the air duct 12 is a flexible tube, and is not damaged when the air duct 12 is stretched, and can convey cold air of the air cooler 11 into the spray tray 13 under the action of the air duct 12.

The working principle is as follows: after the silicon wafers are discharged from the discharging opening 15, the silicon wafers are cooled when passing through the discharging platform 16, cold air is conveyed into the spraying disc 13 through the air conveying pipe 12 by the air cooler 11, then the silicon wafers on the discharging platform 16 are cooled under the action of the air outlet nozzle 14, the cam 3 is driven to rotate under the action of the motor 2, the cam 3 indirectly beats the movable plate 4, the movable plate 4 drives the movable rod 7 to move, the movable rod 7 drives the sliding block 9 to move, meanwhile, the sliding block 9 is driven to reciprocate in the sliding groove 8 under the action of the spring 6, so that the air outlet nozzle 14 can be driven to reciprocate, the silicon wafers can be better cooled, the cooling range is large, and the cooling effect is good.

Example 2

Referring to fig. 2, this embodiment is different from the first embodiment in that: adjusting part 17 includes that slider 9 left side wall passes through the rolling disc 22 that the bearing connection was equipped with, the rolling disc 22 left side wall with spout 13 right side wall and be connected, rolling disc 22 left side wall runs through to be equipped with inserted bar 20, inserted bar 20 left side wall is equipped with arm-tie 18, the 20 outer walls of inserted bar cup joint and are equipped with

reset spring

19, 19 one end of reset spring is connected with rolling disc 22 left side wall, the 19 other end of reset spring is connected with 18 right side walls of arm-tie, the 9 left side walls of slider have been seted up multiunit and 20 assorted jacks 21 of inserted bar.

The multiple groups of jacks 21 are distributed on the left side wall of the sliding block 9 in an annular array manner, so that the angle of the spray disk 13 can be better adjusted.

The working principle is as follows: staff pulling arm-tie 18 drives inserted bar 20 and jack 21 phase separation, then rotates rolling disc 22 to can carry out reasonable regulation to the angle of spouting dish 13, then relieve arm-tie 18 and drive inserted bar 20 and corresponding jack 21 grafting mutually under the effect of reset spring 19 elasticity, thereby can adjust the angle of nozzle 14, make the angle of cold wind change, can be better cool off the silicon chip, reinforcing cooling effect.

Claims

1. The utility model provides a full-automatic silicon chip cleaning machine of environment-friendly with cooling function, includes silicon chip cleaning machine body (1), its characterized in that: the silicon wafer cleaning machine is characterized in that an air cooler (11) is arranged at the top of the silicon wafer cleaning machine body (1), a blanking table (16) is arranged below the left side wall of the silicon wafer cleaning machine body (1), a mounting plate (10) is arranged above the right side wall of the silicon wafer cleaning machine body (1), a chute (8) is formed in the left side wall of the mounting plate (10), a slider (9) is arranged in the chute (8) in a sliding connection mode, an adjusting assembly (17) is arranged on the left side wall of the slider (9), a spray disc (13) is arranged in the left side of the slider (9) in a rotating connection mode, a plurality of groups of air outlets (14) are arranged at the bottom of the spray disc (13), an air conveying pipe (12) is arranged between the air cooler (11) and the spray disc (13), a movable rod (7) is arranged on the front side wall of the slider (8), one end of the movable rod (7) penetrates through the inner front side wall of the chute (8) and is connected with a movable plate (4) arranged outside, the silicon wafer cleaning machine is characterized in that a spring (6) is sleeved on the outer wall of the movable rod (7), one end of the spring (6) is connected with the front side wall of the mounting plate (10), the other end of the spring (6) is connected with the rear side wall of the movable plate (4), the front side wall of the silicon wafer cleaning machine body (1) is provided with a fixed plate (5), the left side wall of the fixed plate (5) is provided with a motor (2), the output end of the motor (2) is connected with a cam (3), and the protruding portion of the cam (3) is in lap joint with the front side wall of the movable plate (4).

2. The environment-friendly full-automatic silicon wafer cleaning machine with the cooling function as claimed in claim 1, wherein: adjusting part (17) include that slider (9) left side wall passes through rolling disc (22) that the bearing connection was equipped with, rolling disc (22) left side wall is connected with spraying disc (13) right side wall, rolling disc (22) left side wall runs through and is equipped with inserted bar (20), inserted bar (20) left side wall is equipped with arm-tie (18), inserted bar (20) outer wall cup joints and is equipped with reset spring (19), reset spring (19) one end is connected with rolling disc (22) left side wall, reset spring (19) other end is connected with arm-tie (18) right side wall, slider (9) left side wall has seted up multiunit and inserted bar (20) assorted jack (21).

3. The environment-friendly full-automatic silicon wafer cleaning machine with the cooling function as claimed in claim 2, wherein: the groups of the jacks (21) are distributed on the left side wall of the sliding block (9) in an annular array.

4. The environment-friendly full-automatic silicon wafer cleaning machine with the cooling function as claimed in claim 1, wherein: the limiting groove is formed in the right side wall of the sliding groove (8), and the limiting block matched with the limiting groove is arranged on the right side wall of the sliding block (9).

5. The environment-friendly full-automatic silicon wafer cleaning machine with the cooling function as claimed in claim 1, wherein: the groups of air outlets (14) are distributed on the bottom of the spray plate (13) in a linear array.

6. The environment-friendly full-automatic silicon wafer cleaning machine with the cooling function as claimed in claim 1, wherein: the silicon wafer cleaning machine is characterized in that a feed opening (15) is formed in the left side wall of the silicon wafer cleaning machine body (1), and the feed opening (15) is matched with a feed platform (16).

7. The environment-friendly full-automatic silicon wafer cleaning machine with the cooling function as claimed in claim 1, wherein: one end of the air conveying pipe (12) is connected with an air outlet of the air cooler (11), the other end of the air conveying pipe (12) is connected with an air inlet of the spray disc (13), and the air conveying pipe (12) is a hose.