CN216928552U - De-bubble chip packaging display device - Google Patents
De-bubble chip packaging display device Download PDFInfo
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- CN216928552U CN216928552U CN202220306415.1U CN202220306415U CN216928552U CN 216928552 U CN216928552 U CN 216928552U CN 202220306415 U CN202220306415 U CN 202220306415U CN 216928552 U CN216928552 U CN 216928552U
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- glue injection
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Abstract
The utility model discloses a de-bubble chip packaging and displaying device, which comprises: an upper housing and a lower housing; a die cavity for placing the bare chip is formed between the upper shell and the lower shell; the lower shell is internally provided with a glue injection cavity, and the lower shell is provided with a glue injection port communicated with the glue injection cavity; the front surface of the bare chip faces the glue injection cavity; the inner wall of the glue injection cavity is provided with a glue injection piece, the glue injection piece is of a cone structure, and the glue injection piece is communicated with the die cavity and the glue injection cavity; the die cavity is filled with transparent colloid. According to the utility model, the bare chip is packaged through the transparent colloid, the cover is not required to be opened, the packaged part and the bare chip are not stained, and the display effect is good. In addition, in the process of injecting glue into the die cavity, the glue injection piece can prevent bubbles from entering the glue injection piece as much as possible so as to prevent the bubbles from blocking the bare chips in the die cavity, and after the packaging is completed, the bare chips can be displayed more clearly, so that the display effect and the packaging quality are further improved.
Description
Technical Field
The utility model belongs to the technical field of chip packaging, and particularly relates to a de-bubble chip packaging and displaying device.
Background
Modern electronic information technology is rapidly developed, and electronic products are developed in the directions of miniaturization, portability and multi-functionalization. In the manufacturing process of chips of electronic products, bare chips need to be mounted on a substrate connected with pins, and the substrates are packaged to complete the manufacturing of the chips. For better show chip commodity, often accomplish the back chip with its encapsulation and carry out partial uncapping to show for the customer inside the chip, nevertheless uncap time-consuming, hard, with high costs, moreover, the material in the external environment can get into the encapsulation after uncapping, causes stained to encapsulation and chip, and simultaneously, uncapping afterwards is not pleasing to the eye, great influence the effect of show.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems in the prior art, the present invention provides a de-bubbling chip package display device. The technical problem to be solved by the utility model is realized by the following technical scheme:
a de-bubbling chip package display device, comprising: an upper housing and a lower housing;
a die cavity for placing a bare chip is formed between the upper shell and the lower shell;
a glue injection cavity is formed in the lower shell, and a glue injection port communicated with the glue injection cavity is formed in the lower shell; the front surface of the bare chip faces the glue injection cavity; a first gap is formed between the front surface of the bare chip and the bottom surface of the die cavity;
the inner wall of the glue injection cavity is provided with a glue injection piece, the glue injection piece is of a cone structure, and the glue injection piece is communicated with the die cavity and the glue injection cavity;
the conical tip part of the glue injection piece is opposite to the glue injection port;
and transparent colloid is filled in the die cavity.
In one embodiment of the utility model, further comprising a blocking station;
the blocking table is fixedly arranged on the inner wall of the glue injection cavity and is positioned on the circumferential position of the glue injection piece;
the blocking table is protruded towards the glue injection port.
In one embodiment of the present invention, the glue injection member is a net structure.
In one embodiment of the utility model, there is a second gap between the back side of the die and the top of the mold cavity;
and the upper shell is provided with a glue outlet communicated with the die cavity.
In one embodiment of the present invention, a plurality of chip pins are disposed on the upper case;
the chip pin is electrically connected with the bare chip through a bonding wire.
In one embodiment of the utility model, the wire support is further comprised;
and the lead support is fixedly arranged in the die cavity and is fixedly connected with the bare chip.
In one embodiment of the present invention, the colloid is an epoxy resin.
In one embodiment of the present invention, the glue injection port is located at a central position near the bottom of the lower case.
The utility model has the beneficial effects that:
according to the utility model, the bare chip is packaged by the transparent colloid, and the lower shell is polished after the packaging is finished, so that the solid colloid part is exposed, therefore, the bare chip can be displayed without opening the cover, the packaging part and the bare chip are not stained, and the display effect is good. In addition, in the injection molding process of the die cavity, the resistance that the bubble in the colloid received when meetting the injection piece is great, consequently, can follow the conical point portion of injection piece and spread to the injecting glue piece outside, thereby avoid the bubble to get into the injection piece as far as possible and get into sheltering from to the formation of bare chip in the die cavity, the encapsulation is accomplished the back, can demonstrate the bare chip more clearly, has further promoted bandwagon effect and encapsulation quality.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Drawings
Fig. 1 is a schematic structural diagram of a de-bubble chip package display device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of the glue injection member according to the embodiment of the present invention.
Description of reference numerals:
10-an upper shell; 11-glue outlet; 12-chip pins; 13-bonding wires; 14-a lead frame; 20-a lower shell; 21-glue injection cavity; 22-glue injection port; 30-bare chip; 40-a mold cavity; 41-a first gap; 50-glue injection; 60-blocking table.
Detailed Description
The present invention will be described in further detail with reference to specific examples, but the embodiments of the present invention are not limited thereto.
Example one
Referring to fig. 1, a de-bubbling chip package display device includes: an upper case 10 and a lower case 20. A cavity 40 for placing the bare chip 30 is formed between the upper case 10 and the lower case 20. A glue injection cavity 21 is arranged in the lower shell 20, and a glue injection port 22 communicated with the glue injection cavity 21 is formed in the lower shell 20. The front side of the bare chip 30 faces the glue cavity 21. A first gap 41 is formed between the front surface of the die 30 and the bottom surface of the cavity 40, that is, the cavity 40 corresponding to the front surface of the die 30 is the first gap 41.
The inner wall of the glue injection cavity 21 is provided with a glue injection piece 50, the glue injection piece 50 is of a cone structure, and the glue injection piece 50 is communicated with the mold cavity 40 and the glue injection cavity 21. The taper of the injection member 50 is opposite to the injection opening 22. The mold cavity 40 is filled with a transparent gel. During packaging, the glue enters the glue injection cavity 21 from the glue injection opening 22, and then enters the mold cavity 40 through the glue injection member 50, and the glue fills the mold cavity 40 to seal the bare chip 30 in the mold cavity 40.
In this embodiment, when the bare chip 30 in the mold cavity 40 is packaged, the glue enters the glue injection cavity 21 from the glue injection opening 22, and then enters the mold cavity 40 through the glue injection member 50. When the glue flows to the glue injection member 50, the bubbles in the glue meet a large resistance at the conical tip of the glue injection member 50, so that the bubbles are separated by the glue injection member 50 and can be diffused to the periphery of the glue injection cavity 21 along the inclined surface of the outer side of the glue injection member 50, and the bubbles can be prevented from entering the die cavity 40 from the glue injection member 50 to shield the bare chip 30 as much as possible. Treat that the colloid solidifies completely after, with whole upset, casing 20 down up, the colloid part of the solid in the first clearance 41 is bared to lower casing 20 after polishing, and the colloid is transparent to can demonstrate the front of bare chip 30, need not to uncap, can not cause the defiling to packaging part and bare chip 30, the bandwagon effect is good. Meanwhile, bubbles do not exist in the solidified colloid basically, the bare chip 30 is not shielded, the bare chip 30 can be displayed more clearly, and the display effect is further improved. In addition, fewer bubbles are in the solidified colloid, the adhesive force of the colloid is better, and the packaging quality is improved.
Preferably, the colloid is a transparent epoxy resin.
Further, as shown in fig. 1 and 2, a de-bubbling chip package display apparatus further includes a blocking stage 60. The blocking table 60 is fixedly arranged on the inner wall of the glue injection cavity 21, and the blocking table 60 is located at the circumferential position of the glue injection piece 50. The blocking table 60 is convex toward the glue injection opening 22.
In this embodiment, block that platform 60 forms one-level step form in injecting glue chamber 21, bubble in the colloid diffuses to stopping platform 60 department when the inclined plane diffusion in the injecting glue piece 50 outside is followed, the bubble continues to the peripheral part diffusion of injecting glue piece 50 along blocking platform 60, block that platform 60 can hinder the bubble after being separated by injecting glue piece 50 and flow along with the colloid and get back to again injecting glue piece 50, further avoid the bubble to get into die cavity 40 from injecting glue piece 50 in, the further bandwagon effect that has promoted, the encapsulation quality has been improved.
Preferably, the height L1 of the blocking table 60 is greater than or equal to 3mm, and the distance (width) L2 between the side edge of the blocking table 60 and the glue injection member 50 is less than or equal to 2 mm.
Further, as shown in fig. 2, the glue injection member 50 has a net structure. Preferably, the diameter of the holes of the net structure is less than or equal to 0.5mm, and the included angle β of the tapered tip portion of the cross section of the glue injection piece 50 is 45 ° to 60 °.
Further, there is a second gap between the back surface of the die 30 and the top of the cavity 40. The upper housing 10 is provided with a glue outlet 11 communicated with the mold cavity 40, that is, the glue outlet 11 is communicated with the second gap.
In this embodiment, when the colloid is filled into the mold cavity 40, the colloid overflows from the colloid outlet 11 after passing through the second gap, which indicates that the mold cavity 40 is filled with the colloid, and the next packaging operation can be performed. Meanwhile, the colloid is easy to form bubble residue at the glue outlet 11, the residual bubble is positioned in the die cavity 40 (second gap) corresponding to the back of the bare chip 30 and at the glue outlet 11, and the front of the bare chip 30 is back to the glue outlet 11 and the second gap, so that the residual bubble cannot shield the front of the bare chip 30, the structure for observing the front of the bare chip 30 cannot be influenced, and the display effect is further improved. Wherein, the glue outlet 11 is a through hole structure.
Further, a plurality of chip pins 12 are provided on the upper case 10. The chip pins 12 are electrically connected to the bare chip 30 by bonding wires 13. The bonding wires 13 are used to form electrical connections between the chip pins 12 and the bare chip 30. The chip pins 12 are used for bare chips 30 to make electrical connections on the PCB board.
Further, a de-bubbling chip package display device further comprises a lead frame 14. The lead frame 14 is fixed in the mold cavity 40, and the lead frame 14 is fixedly connected with the bare chip 30. The lead frame 14 is used to carry the bare chip 30.
Further, the glue injection port 22 is located at a central position near the bottom of the lower case 20.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being permanently connected, detachably connected, or integral; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.
The foregoing is a further detailed description of the utility model in connection with specific preferred embodiments and it is not intended to limit the utility model to the specific embodiments described. For those skilled in the art to which the utility model pertains, several simple deductions or substitutions can be made without departing from the spirit of the utility model, and all shall be considered as belonging to the protection scope of the utility model.
Claims (8)
1. A de-bubbling chip package display device, comprising: an upper case (10) and a lower case (20);
a die cavity (40) for placing a bare chip (30) is formed between the upper shell (10) and the lower shell (20);
a glue injection cavity (21) is formed in the lower shell (20), and a glue injection opening (22) communicated with the glue injection cavity (21) is formed in the lower shell (20); the front surface of the bare chip (30) faces the glue injection cavity (21); a first gap (41) is arranged between the front surface of the bare chip (30) and the bottom surface of the die cavity (40);
the inner wall of the glue injection cavity (21) is provided with a glue injection piece (50), the glue injection piece (50) is of a cone structure, and the glue injection piece (50) is communicated with the die cavity (40) and the glue injection cavity (21);
the conical tip of the glue injection piece (50) is opposite to the glue injection opening (22);
and transparent colloid is filled in the die cavity (40).
2. The de-bubbled chip package display apparatus as recited in claim 1, further comprising a baffle table (60);
the blocking table (60) is fixedly arranged on the inner wall of the glue injection cavity (21) and is positioned on the circumferential position of the glue injection piece (50);
the blocking table (60) protrudes towards the glue injection port (22).
3. The de-bubbled chip package display apparatus as recited in claim 2, wherein the gel-casting member (50) is a net-like structure.
4. A de-bubbled chip package display apparatus as recited in claim 3, wherein there is a second gap between the back of the bare chip (30) and the top of the die cavity (40);
and the upper shell (10) is provided with a glue outlet (11) communicated with the die cavity (40).
5. The de-bubbled chip package display apparatus according to claim 4, wherein the upper case (10) is provided with a plurality of chip pins (12);
the chip pins (12) are electrically connected with the bare chip (30) through bonding wires (13).
6. The de-bubbled chip package display apparatus as recited in claim 5, further comprising a lead frame (14);
the lead support (14) is fixedly arranged in the die cavity (40) and is fixedly connected with the bare chip (30).
7. The de-bubbled chip package display apparatus as recited in claim 6, wherein the gel is an epoxy.
8. The de-bubbled chip package display device according to claim 6, wherein the glue injection port (22) is located at a central position near the bottom of the lower case (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220306415.1U CN216928552U (en) | 2022-02-15 | 2022-02-15 | De-bubble chip packaging display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220306415.1U CN216928552U (en) | 2022-02-15 | 2022-02-15 | De-bubble chip packaging display device |
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| Publication Number | Publication Date |
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| CN216928552U true CN216928552U (en) | 2022-07-08 |
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| CN202220306415.1U Active CN216928552U (en) | 2022-02-15 | 2022-02-15 | De-bubble chip packaging display device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116705656A (en) * | 2023-05-29 | 2023-09-05 | 武汉光启源科技有限公司 | Method and device for directionally removing bubbles of glue at bottom |
| CN117650085A (en) * | 2024-01-29 | 2024-03-05 | 凯瑞电子(诸城)有限公司 | Semiconductor chip packaging device |
-
2022
- 2022-02-15 CN CN202220306415.1U patent/CN216928552U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116705656A (en) * | 2023-05-29 | 2023-09-05 | 武汉光启源科技有限公司 | Method and device for directionally removing bubbles of glue at bottom |
| CN116705656B (en) * | 2023-05-29 | 2024-03-22 | 武汉光启源科技有限公司 | Method and device for directionally removing bubbles of glue at bottom |
| CN117650085A (en) * | 2024-01-29 | 2024-03-05 | 凯瑞电子(诸城)有限公司 | Semiconductor chip packaging device |
| CN117650085B (en) * | 2024-01-29 | 2024-04-16 | 凯瑞电子(诸城)有限公司 | Semiconductor chip packaging device |
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