CN216928208U

CN216928208U - High-temperature-resistant quick-response thermistor

Info

Publication number: CN216928208U
Application number: CN202122513886.8U
Authority: CN
Inventors: 刘威呈
Original assignee: Shenzhen Jiushengchang Electronics Co ltd
Current assignee: Shenzhen Jiushengchang Electronics Co ltd
Priority date: 2021-10-19
Filing date: 2021-10-19
Publication date: 2022-07-08
Anticipated expiration: 2031-10-19

Abstract

The utility model discloses a high-temperature-resistant quick-response thermistor which comprises a sealing shell, wherein sealing sleeves are fixedly connected to two sides of the bottom of the sealing shell, leads are fixedly connected to the bottoms of the sealing sleeves, the sealing shell comprises a thermosensitive chip, a first protective layer is fixedly connected to the top of the thermosensitive chip, a second protective layer is fixedly connected to the bottom of the thermosensitive chip, and a packaging layer is fixedly connected to one sides, far away from the thermosensitive chip, of the first protective layer and the second protective layer. According to the utility model, through the matched use of the sealing shell, the sealing sleeve, the lead wire, the thermosensitive chip, the first protective layer, the second protective layer and the packaging layer, the problem that the service life of an element is reduced due to material aging caused by insufficient heat resistance in the use process of the traditional thermistor can be effectively solved, and the element ensures the high temperature resistance of the chip and greatly prolongs the service life of the chip through the built-in protective material.

Description

High-temperature-resistant quick-response thermistor

Technical Field

The utility model relates to the technical field of thermistors, in particular to a thermistor with high temperature resistance and quick response.

Background

The thermistor is an electronic element manufactured by utilizing the characteristic that the resistivity of a thermosensitive material changes along with the temperature, the NTC thermistor is widely applied to surge current suppression, temperature measurement, control, temperature compensation and the like, and the PTC thermistor is widely applied to overcurrent protection and starting of circuits and electronic elements and related instruments and application fields of flow velocity, flow and ray measurement; at present, the existing thermistor still has the phenomenon of insufficient heat resistance or heat dissipation, so that the aging of materials is easily caused, and the service performance and the service life of the thermistor are influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a high-temperature-resistant quick-response thermistor which has the advantages of improving the temperature resistance and prolonging the service life, and solves the problems that the existing thermistor still has insufficient heat resistance or heat dissipation, is easy to cause material aging and influences the service performance and the service life of the thermistor.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a high temperature resistant quick response's thermistor, includes seal shell, the equal fixedly connected with seal cover in both sides of seal shell bottom, the bottom fixed connection of seal cover has the lead wire, seal shell includes the temperature sensing chip, the first protective layer of top fixedly connected with of temperature sensing chip, the bottom fixedly connected with second protective layer of temperature sensing chip, one side fixedly connected with encapsulated layer of temperature sensing chip is kept away from to first protective layer and second protective layer.

Preferably, the lead is a copper wire with tin plated at two ends, and the diameter of the lead is 0.1-0.2 mm.

Preferably, the thermosensitive chip is an NTC chip, and the surface of the NTC chip is packaged by ceramic.

Preferably, the first protective layer is a heat conduction layer, and the heat conduction layer is an alumina heat conduction filler.

Preferably, the second protective layer is an insulating layer, and the insulating layer is made of polytetrafluoroethylene.

Preferably, the packaging layer is made of a ceramic material, and the shape of the packaging layer is circular.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, through the matched use of the sealing shell, the sealing sleeve, the lead wire, the thermosensitive chip, the first protective layer, the second protective layer and the packaging layer, the problem that the service life of an element is reduced due to material aging caused by insufficient heat resistance in the use process of the traditional thermistor can be effectively solved, and the element ensures the high temperature resistance of the chip and greatly prolongs the service life of the chip through the built-in protective material.

2. The heat-sensitive chip is effectively protected from high temperature by arranging the first protective layer and being made of the alumina heat-conducting filler, so that the heat-conducting effect is achieved, the second protective layer is arranged and made of polytetrafluoroethylene, the purpose of effective insulation is achieved while high temperature resistance is achieved, and the thermistor can be effectively packaged by arranging the packaging layer.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure of the sealed housing of the present invention;

fig. 3 is a schematic front view of the structure of the present invention.

In the figure: 1. sealing the housing; 101. a heat-sensitive chip; 102. a first protective layer; 103. a second protective layer; 104. a packaging layer; 2. sealing sleeves; 3. and (7) leading wires.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The components used in the present invention are all standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experiments.

Referring to fig. 1-3, a thermistor with high temperature resistance and fast response comprises a sealing housing 1, wherein two sides of the bottom of the sealing housing 1 are fixedly connected with a sealing sleeve 2, the bottom of the sealing sleeve 2 is fixedly connected with a lead 3, the lead 3 is a copper wire with tin-plated two ends, the diameter of the lead 3 is 0.1-0.2mm, the sealing housing 1 comprises a thermosensitive chip 101, the thermosensitive chip 101 is an NTC chip, the surface of the NTC chip is packaged by ceramic, the top of the thermosensitive chip 101 is fixedly connected with a first protective layer 102, the first protective layer 102 is a heat conducting layer, the heat conducting layer is an aluminum oxide heat conducting filler, the bottom of the thermosensitive chip 101 is fixedly connected with a second protective layer 103, the second protective layer 103 is an insulating layer, the insulating layer is polytetrafluoroethylene, one side of the first protective layer 102 and the second protective layer 103 away from the thermosensitive chip 101 is fixedly connected with a packaging layer 104, and the packaging layer 104 is made of a ceramic material, the shape of the packaging layer 104 is round, the packaging layer is made of aluminum oxide heat-conducting filler by arranging the lead 3, a tinned copper wire can have good conduction performance, the thermosensitive chip 101 can be effectively protected from high temperature by arranging the first protective layer 102, a heat-conducting effect is achieved, the second protective layer 103 is made of polytetrafluoroethylene by arranging the second protective layer 103, the purpose of effective insulation is achieved while high temperature resistance is achieved, the thermistor can be effectively packaged by arranging the packaging layer 104, the problem that the service life of an element is shortened due to material aging caused by insufficient heat resistance in the using process of a traditional thermistor can be effectively solved by matching the sealing shell 1, the sealing sleeve 2, the lead 3, the thermosensitive chip 101, the first protective layer 102, the second protective layer 103 and the packaging layer 104, and the element is provided with a built-in protective material, the high temperature resistance of the chip is ensured, and the service life of the chip is greatly prolonged.

During the use, through lead wire 3, adopt the tinned copper line, can possess good conductivity, through setting up first protective layer 102, adopt aluminium oxide heat conduction filler to make, can effectively protect temperature sensing chip 101 not receive the influence of high temperature, reach the effect of heat conduction, through second protective layer 103, adopt polytetrafluoroethylene to make, when possessing high temperature resistance, reach effective insulating purpose, through encapsulated layer 104, can effectually encapsulate thermistor.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A thermistor with high temperature resistance and rapid response comprises a sealed shell (1), and is characterized in that: the sealing structure is characterized in that sealing sleeves (2) are fixedly connected to two sides of the bottom of the sealing shell (1), a lead (3) is fixedly connected to the bottom of each sealing sleeve (2), each sealing shell (1) comprises a thermosensitive chip (101), a first protection layer (102) is fixedly connected to the top of each thermosensitive chip (101), a second protection layer (103) is fixedly connected to the bottom of each thermosensitive chip (101), and a packaging layer (104) is fixedly connected to one side, away from each thermosensitive chip (101), of each first protection layer (102) and each second protection layer (103).

2. A thermistor according to claim 1, characterized in that: the lead (3) is a copper wire with tin-plated two ends, and the diameter of the lead (3) is 0.1-0.2 mm.

3. A thermistor according to claim 1, characterized in that: the thermosensitive chip (101) is an NTC chip, and the surface of the NTC chip is packaged by ceramic.

4. A thermistor according to claim 1, characterized in that: the first protection layer (102) adopts a heat conduction layer, and the heat conduction layer is made of aluminum oxide heat conduction filler.

5. A thermistor according to claim 1, characterized in that: the second protection layer (103) is an insulation layer, and the insulation layer is made of polytetrafluoroethylene.

6. A thermistor according to claim 1, characterized in that: the packaging layer (104) is made of ceramic materials, and the shape of the packaging layer (104) is circular.