CN216914626U - Die for coating chip with bicolor rubber coating - Google Patents
Die for coating chip with bicolor rubber coating Download PDFInfo
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- CN216914626U CN216914626U CN202123379395.5U CN202123379395U CN216914626U CN 216914626 U CN216914626 U CN 216914626U CN 202123379395 U CN202123379395 U CN 202123379395U CN 216914626 U CN216914626 U CN 216914626U
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Abstract
The utility model discloses a die for coating a chip with bicolor rubber coating, and relates to the technical field of die injection production. The utility model relates to a die for coating a chip with bicolor rubber coating, which comprises an upper die, a lower die and a bicolor rubber coating, wherein the upper die comprises a cavity, an air outlet pipe, air permeable steel and a sealing sheet; the cavity is positioned on the bottom surface of the upper die, and the shape of the cavity is matched with the shapes of the one-color rubber coating and the two-color rubber coating; the one-color rubber coating is positioned in the cavity, and the one-color rubber coating is matched with the cavity to form an injection molding cavity of the two-color rubber coating; the upper surface of the cavity is provided with an air outlet, the cavity is connected with an air outlet pipe through the air outlet, and the air outlet is covered with a breathable steel sheet; a sealing sheet is arranged below the color coating, the lower surface of the sealing sheet is flush with the bottom surface of the upper die, and the side surface of the sealing sheet is tightly matched with the cavity. According to the utility model, the ventilation steel sheet is added in the cavity, so that the ventilation property and the heat dissipation of the die are improved, and the yield of the encapsulation of the chip is greatly improved.
Description
Technical Field
The utility model relates to the technical field of mold injection production, in particular to a mold for coating a chip with bicolor encapsulation.
Background
The chip encapsulation process mainly comprises two types: a two-color mold process and a rubber coating mold process. The two-color mold process is as follows: the two plastic materials are injected on the same injection molding machine and are molded twice, but the product is only demoulded once. The general encapsulation molding process is also called double-material injection molding, which is usually completed by one set of mold, and a special double-color injection molding machine is needed, the injection molding machine and the mold have high manufacturing cost and high technical requirement, and common manufacturers are difficult to master. At present, common manufacturers generally adopt a rubber coating die process, specifically: the two plastic materials are not injected on the same injection molding machine, but are molded by two times; and (3) taking out the product from one set of die to finish the one-color encapsulation, and then putting the product into the other set of die to perform secondary injection molding to finish the two-color encapsulation.
In the prior art encapsulation mold process, a large amount of gas is often collected in the cavity during the second encapsulation process, and the heat dissipation efficiency of the mold is low, so that high temperature is generated in the cavity. Gas accumulated in the cavity is easy to cause bubbles in the encapsulation process, so that the yield of products is influenced; if the high temperature in the cavity cannot be dissipated in time, the chip bonding point may be deviated, and poor contact may be caused when the formation of the cold joint is serious. Meanwhile, the high temperature generated in the cavity may cause signal failure of the chip, which results in a great reduction in product yield.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problems, the utility model provides a die for coating a chip with bicolor encapsulation, aiming at improving the air permeability and the heat dissipation of the die and greatly improving the yield of the encapsulation of the chip.
The specific technical scheme of the utility model is as follows:
the utility model relates to a die for coating a chip with bicolor encapsulation, which comprises an upper die, a lower die and a bicolor encapsulation coated with the chip.
The upper die comprises a cavity, an air outlet pipe and a breathable steel sheet, the cavity is located on the bottom surface of the upper die, and the shape of the cavity is matched with the shape of the one-color rubber coating and the shape of the two-color rubber coating.
The one-color rubber coating is positioned in the cavity, and the one-color rubber coating and the cavity are matched to form a two-color rubber coating injection molding cavity.
The upper surface of the cavity is provided with an air outlet, the cavity is connected with an air outlet pipe through the air outlet, and the air outlet is covered with a breathable steel sheet.
The further technical scheme is as follows:
the first-color rubber coating is provided with a plurality of first-color rubber coating holes which are counter-sunk holes.
The further technical scheme is as follows:
the center of the bicolor rubber coating hole is provided with a bolt, and the formed bicolor rubber coating is fixed with the one-color rubber coating through the bolt.
The further technical scheme is as follows:
the bottom surface of the one-color rubber coating is provided with two symmetrically distributed positioning mechanisms, the positioning mechanisms are distributed on two sides of the bottom surface of the one-color rubber coating, a groove is formed in the side surface of each positioning mechanism, the upper end of each groove penetrates through the one-color rubber coating, a protrusion is arranged on the upper die, and the protrusion can be tightly clamped with the groove.
The further technical scheme is as follows:
the lower die is provided with a protruding mechanism which can be tightly clamped with the groove.
The further technical scheme is as follows:
the bulge is provided with a die unloading hole which penetrates through the upper die and is positioned right above the bottom edge of the groove.
The further technical scheme is as follows:
the upper surface of the colored rubber coating is provided with a pressing hole, and the air outlet is positioned right above the pressing hole.
The further technical scheme is as follows:
the utility model also comprises a sealing sheet, wherein the sealing sheet is positioned below the color coating, the lower surface of the sealing sheet is flush with the bottom surface of the upper die, and the side surface of the sealing sheet is tightly matched with the die cavity.
The beneficial technical effects of the utility model are as follows:
(1) according to the utility model, the air-permeable steel sheet covers the air outlet of the upper mold cavity, so that the air permeability of the mold is improved, and the heat dissipation performance of the mold is greatly improved.
(2) According to the utility model, the die unloading holes are formed in the upper die and the protruding mechanism, after the bicolor encapsulation is formed, appropriate force can be applied to the bottom edge of the groove through the die unloading holes, and the chip coated with the one-color encapsulation glue and the bicolor encapsulation is ejected out of the die, so that the demolding process of the bicolor encapsulation is more convenient and efficient.
(3) According to the utility model, the single-color rubber coating is provided with the two-color rubber coating holes which are countersunk holes, and the bolts are arranged in the two-color rubber coating holes.
Drawings
FIG. 1 is an overall assembly view of the present invention;
FIG. 2 is a schematic view of the configuration of the mold cavity of the present invention;
FIG. 3 is a schematic view of an encapsulation according to the present invention;
FIG. 4 is a schematic view of the position of the air-permeable steel sheet of the present invention;
wherein:
1. an upper die; 101. a cavity; 102. an air outlet pipe; 103. a breathable steel sheet; 104. sealing the sheet; 105. an air outlet; 106. injection molding a tube; 107. an injection molding port; 108. a protrusion; 109. unloading the die hole;
2. coating with a color; 201. two-color rubber coating holes; 202. a bolt; 203. a positioning mechanism; 204. a groove; 205. pressing the hole; 206. a bottom edge;
Detailed Description
In order to make the technical means of the present invention clearer and to make the technical means of the present invention capable of being implemented according to the content of the specification, the following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings and examples, which are provided for illustrating the present invention and are not intended to limit the scope of the present invention.
Example (b):
as shown in fig. 1, the die for coating a chip with two-color encapsulation according to the present invention includes an upper die 1, a lower die, and an encapsulation 2 for coating a chip.
As shown in fig. 2, the upper die 1 is a block-shaped rectangular parallelepiped made of an aluminum alloy material, and includes: a cavity 101, an outlet pipe 102, air permeable steel 103, an injection molding pipe 106, an injection molding opening 107 and the like.
The cavity 101 is located on the bottom surface of the upper die 1, and the shape of the cavity is matched with the shape of the two-color rubber coating and the one-color rubber coating 2. The lower side of the present invention is the direction of the surface of the cavity 101, and the corresponding surface is the upper side. An air outlet 105 is formed in the upper surface of the cavity 101, and the cavity 101 is connected with the air outlet pipe 102 through the air outlet 105. The air outlet 105 is covered with the air-permeable steel sheet 103, the air-permeable steel sheet 103 can improve the air permeability of the die, accelerate the discharge rate of air in the cavity and improve the heat dissipation efficiency of the die, thereby ensuring that the product is not scrapped due to welding point offset caused by overhigh temperature in the encapsulation process, and simultaneously reducing the generation of bubbles in the encapsulation process, thereby greatly improving the yield of the product.
The bottom surface of the upper die 1 is also provided with an injection molding pipe 106, and the injection molding pipe 106 is connected with the cavity 101 through an injection molding opening 107.
The single-color rubber 2 is positioned in the cavity 101, and the single-color rubber 2 is matched with the cavity 101 to form a double-color rubber injection molding cavity for injection molding of the double-color rubber. The bottom surface of the gummed paper 2 is further provided with two symmetrically distributed positioning mechanisms 203, and the two positioning mechanisms 203 are located on two sides of the bottom surface of the gummed paper 2. A groove 204 is formed on the side surface of the positioning mechanism 203, and the upper end of the groove 204 penetrates through the color paste 2. The corresponding position of the upper die 1 is provided with a protrusion 108, and the protrusion 108 can be tightly clamped with the groove 204, so that the precise positioning of the rubber 2 and the cavity 101 is realized. The lower die is provided with a protruding mechanism which can be tightly clamped with the groove 204, so that the position of the color coating 2 is prevented from deviating in the injection molding process due to the accurate positioning of the color coating.
The die unloading hole 109 is formed in the protrusion 108, the die unloading hole 109 penetrates through the upper die 1, and the die unloading hole 109 is located right above the bottom edge 206 of the groove 204, so that after the bicolor encapsulation injection molding, proper force can be applied to the bottom edge 206 of the groove 204 through the die unloading hole 109, the chip coated with the one-color encapsulating glue and the bicolor encapsulation is ejected out of the cavity 101, and the demolding process is more convenient and efficient.
As shown in fig. 3, the upper surface of the one-color rubber 2 is provided with a plurality of two-color rubber coating holes 202, and the two-color rubber coating holes 202 are counter-sunk holes. The bicolor encapsulation can be formed in the bicolor encapsulation hole 202, so that the bonding force between the bicolor encapsulation 2 and the bicolor encapsulation is enhanced, and the phenomenon that the bicolor encapsulation 2 and the bicolor encapsulation are separated is avoided. Preferably, a bolt 202 is provided at the center of the two-color rubber coating hole 2 to further fix the two-color rubber coating 2 and the one-color rubber coating together, so that they are combined more tightly.
The encapsulation 2 is further provided with a pressing hole 205 for pressing the chip through the pressing hole 205 in the molding process of the encapsulation 2, so as to position the chip. In order to prevent the gas in the pressing hole 205 from being effectively discharged during the coating of the two-color encapsulation, the gas outlet 105 of the cavity 101 is disposed above the pressing hole 205.
As shown in fig. 4, a sealing plate 104 is disposed at the bottom of the encapsulation 2, the lower surface of the sealing plate 104 is parallel to the bottom surface of the upper mold 2, and the side surface of the sealing plate 104 can be tightly fitted with the cavity 101 to seal the bottom surface of the cavity 101. The sealing piece 104 can be made of hard materials such as stainless steel, nickel alloy, titanium alloy and the like.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, it should be noted that, for those skilled in the art, many modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (8)
1. The utility model provides a mould for giving chip cladding dichromatic rubber coating, includes mould (1), lower mould and cladding one color rubber coating (2) that have the chip, its characterized in that:
the upper die comprises a cavity (101), an air outlet pipe (102) and a breathable steel sheet (103);
the cavity (101) is positioned on the bottom surface of the upper die (1), and the shape of the cavity is matched with the shapes of the one-color rubber coating (2) and the two-color rubber coating;
the single-color rubber coating (2) is positioned in the cavity (101), and the single-color rubber coating (2) and the cavity (101) are matched to form a double-color rubber coating injection molding cavity;
the upper surface of die cavity (101) is equipped with gas outlet (105), and die cavity (101) are passed through gas outlet (105) and are linked to each other with outlet duct (102), gas outlet (105) cover have ventilative steel sheet (103).
2. The die for encapsulating a die with two-color encapsulation according to claim 1, wherein: the single-color rubber coating (2) is provided with a plurality of double-color rubber coating holes (201), and the double-color rubber coating holes (201) are counter bores.
3. The die for encapsulating a die with two-color encapsulation according to claim 2, wherein: the center of the two-color rubber coating hole (201) is provided with a bolt (202), and the formed two-color rubber coating is fixed with the one-color rubber coating (2) through the bolt (202).
4. The die for encapsulating a die with two-color encapsulation according to claim 1, wherein: the bottom surface of the colored rubber coating (2) is provided with two symmetrically distributed positioning mechanisms (203), the positioning mechanisms (203) are distributed on two sides of the bottom surface of the colored rubber coating (2), the side surface of each positioning mechanism (203) is provided with a groove (204), the upper end of each groove (204) penetrates through the corresponding colored rubber coating (2), the upper die (1) is provided with a protrusion (108), and the protrusion (108) can be tightly clamped with the corresponding groove (204).
5. The die for encapsulating a die with dichroic encapsulation as set forth in claim 4, wherein: the lower die is provided with a protruding mechanism which can be tightly clamped with the groove (204).
6. The die for encapsulating a die with dichroic encapsulation as set forth in claim 4, wherein: the bulge (108) is provided with a die unloading hole (109), and the die unloading hole (109) penetrates through the upper die (1) and is positioned right above the bottom edge (206) of the groove (204).
7. The die for encapsulating a die with two-color encapsulation according to claim 1, wherein: the upper surface of the colored rubber (2) is provided with a pressing hole (205), and the air outlet (105) is positioned right above the pressing hole (205).
8. The die for encapsulating a die with two-color encapsulation according to claim 1, wherein: the sealing device is characterized by further comprising a sealing plate (104), wherein the sealing plate (104) is located below the color coating (2), the lower surface of the sealing plate (104) is flush with the bottom surface of the upper die (1), and the side surface of the sealing plate (104) is tightly matched with the cavity (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123379395.5U CN216914626U (en) | 2021-12-29 | 2021-12-29 | Die for coating chip with bicolor rubber coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123379395.5U CN216914626U (en) | 2021-12-29 | 2021-12-29 | Die for coating chip with bicolor rubber coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216914626U true CN216914626U (en) | 2022-07-08 |
Family
ID=82255113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123379395.5U Active CN216914626U (en) | 2021-12-29 | 2021-12-29 | Die for coating chip with bicolor rubber coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216914626U (en) |
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2021
- 2021-12-29 CN CN202123379395.5U patent/CN216914626U/en active Active
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