CN216914430U

CN216914430U - Ultra-thin disk cutting device of silicon nitride for instant heating device

Info

Publication number: CN216914430U
Application number: CN202220032385.XU
Authority: CN
Inventors: 柏小龙; 徐祖东; 蔡晓霞
Original assignee: Acro New Materials Dalian Co ltd
Current assignee: Acro New Materials Dalian Co ltd
Priority date: 2022-01-07
Filing date: 2022-01-07
Publication date: 2022-07-08
Anticipated expiration: 2032-01-07

Abstract

The utility model discloses a silicon nitride ultrathin wafer cutting device for an instant heating device. The utility model provides a silicon nitride ultrathin wafer cutting device for an instant heating device, which comprises a raw material placing groove, a cutting driving device, a clamping device and a contraposition device.

Description

Ultra-thin disk cutting device of silicon nitride for instant heating device

Technical Field

The utility model relates to the technical field of cutting equipment, in particular to a silicon nitride ultrathin wafer cutting device for an instant heating device.

Background

Silicon nitride is an important structural ceramic material, has high hardness, self lubricating property and abrasion resistance, and is an atomic crystal; is resistant to oxidation at high temperature. It can resist cold and hot impact, and can be heated to above 1000 deg.C in air, and can be rapidly cooled and then rapidly heated, and can not be broken. Due to such excellent characteristics of silicon nitride ceramics, ultra-thin silicon nitride wafers are widely used in instant heating devices in various fields.

The cutting of silicon nitride usually adopts a machining method, is also a traditional processing technology of ceramic materials, and is also the processing method with the widest application range. The mechanical processing mainly refers to the turning, cutting, grinding, drilling and the like of the ceramic material, and has simple process and high processing efficiency. However, due to the high hardness and high brittleness of the ceramic material, the engineering ceramic part with a complex shape, high dimensional precision, low surface roughness and high reliability is difficult to machine by machining, so that the problems of low cutting efficiency and poor yield are generally existed when the silicon nitride ultrathin wafer is cut by the traditional machining mode. Therefore, there is a need for a silicon nitride ultra-thin wafer cutting device for an instant heating device to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a silicon nitride ultrathin wafer cutting device for an instant heating device, which aims to solve the problems of low cutting efficiency and poor yield generally existing in the traditional machining mode when a silicon nitride ultrathin wafer is cut.

The utility model provides a silicon nitride ultrathin wafer cutting device for an instant heating device, which comprises: the device comprises a raw material placing groove, a cutting driving device, a clamping device and a contraposition device; the clamping device is arranged at one end of the raw material placing groove, the aligning device is arranged at the other end of the raw material placing groove, symmetrical cutting driving devices are arranged at two sides of the aligning device, each cutting driving device comprises a motor, a reciprocating wire drawing mechanism and a diamond wire saw, each reciprocating wire drawing mechanism comprises a disc, four rotating wheels are rotationally connected to the end face of each disc, the four rotating wheels are distributed in a rectangular mode, a cross-shaped moving block is arranged between the four rotating wheels and comprises a translation part and a transmission part vertically connected with the translation part, the translation part is slidably connected between the four rotating wheels, a strip-shaped hollow part is arranged on the transmission part and is perpendicular to the translation part, a cylindrical groove is arranged at the end part of each disc, a rocker part is arranged in the cylindrical groove, and the rocker part is Z-shaped, one end of the rocking bar piece is coaxially connected with an output shaft of the motor, the other end of the rocking bar piece is located in the strip-shaped hollow part, the end part of the translation part is provided with a fretsaw fixing seat, and a diamond fretsaw is connected between the fretsaw fixing seats of the two cutting driving devices.

Furthermore, the raw material placing groove is provided with a semi-cylindrical groove matched with the diameter of the silicon nitride column with cutting, two ends of the raw material placing groove are fixed on the base through supports, the aligning device is fixed on the base through an aligning support, and a cutting groove is formed between the aligning device and the raw material placing groove.

Further, clamping device includes cylinder ejector pad, backup pad, screw rod and carousel, the backup pad is fixed raw materials standing groove tip, screw rod threaded connection in the backup pad, the cylinder ejector pad is located in the semi-cylindrical recess, the cylinder ejector pad with screw rod tip rotates and is connected, the carousel is located the backup pad outside, the carousel with screw rod fixed connection.

Furthermore, the end face of the rotating wheel is provided with a limiting disc, the diameter of the limiting disc is larger than that of the rotating wheel, the limiting disc is coaxially connected with the rotating wheel, and the translation part is located on the inner side of the limiting disc.

Further, the cutting driving device is arranged on the end face of the vertical seat, a first guide rail extending vertically is arranged on the end face of the vertical seat, and the cutting driving device is connected in the first guide rail in a sliding mode.

Further, second guide rails are arranged on two sides of the upper surface of the base, the second guide rails extend along the length direction of the raw material placing groove, and the bottom of the vertical seat is connected in the second guide rails in a sliding mode.

Further, a cutting slag collecting groove is formed in the base and corresponds to the position below the cutting groove.

The utility model has the following beneficial effects: the utility model provides a silicon nitride ultrathin wafer cutting device for an instant heating device, which comprises a raw material placing groove, a cutting driving device, a clamping device and a contraposition device, wherein when the silicon nitride ultrathin wafer is cut, a silicon nitride column can be placed in the raw material placing groove, the silicon nitride column is fixed through the clamping device and the contraposition device, and then a motor of the cutting driving device rotates to drive a diamond wire saw to reciprocate on the surface of the silicon nitride column to realize cutting.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a structural diagram of an apparatus for cutting an ultra-thin silicon nitride wafer for an instant heating apparatus according to the present invention;

FIG. 2 is a partial enlarged view of an ultra-thin silicon nitride wafer cutting device for an instant heating device according to the present invention;

FIG. 3 is a structural diagram of a cutting driving device of the silicon nitride ultra-thin wafer cutting device for an instant heating device according to the present invention;

FIG. 4 is a structural diagram of a clamping device of the silicon nitride ultra-thin wafer cutting device for the instant heating device.

Illustration of the drawings: 1-a raw material placing groove; 2-a scaffold; 3-a cutting drive; 4-a clamping device; 5-aligning device; 6-vertical seat; 7-a base; 8-cutting slag collecting tank; 9-diamond wire saw; 31-a motor; 32-reciprocating wire pulling mechanism; 9-a diamond wire saw; 321-a disc; 322-a rotating wheel; 323-cross shaped moving block; 3231-translation section; 32323-a transmission part; 3233-strip routing; 3211-cylindrical recess; 3212-a rocker member; 3234-wire saw holder; 100-silicon nitride pillars; 51-aligning support; 52-cutting the groove; 41-a cylindrical push block; 42-a support plate; 43-screw rod; 44-a turntable; 3221-a spacing disc; 61-a first guide rail; 71-second guide rail.

Detailed Description

It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings. It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

Spatially relative terms, such as "above … …," "above … …," "above … … surface," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Exemplary embodiments according to the present application will now be described in more detail with reference to the accompanying drawings. These exemplary embodiments may, however, be embodied in many different forms and should not be construed as limited to only the embodiments set forth herein. It is to be understood that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art, in the drawings, the thicknesses of layers and regions are exaggerated for clarity, and the same devices are denoted by the same reference numerals, and thus the description thereof will be omitted.

Referring to fig. 1 to 4, an embodiment of the present invention provides an apparatus for cutting an ultra-thin silicon nitride wafer for an instant heating device, including: raw material placing groove 1, cutting drive device 3, clamping device 4 and aligning device 5. Wherein, clamping device 4 sets up in the one end of raw materials standing groove 1, and aligning device 5 sets up in the other end of raw materials standing groove 1, and aligning device 5 is for fixed, and clamping device 4 is portable, fixes silicon nitride post 100 centre gripping in raw materials standing groove 1.

The two sides of the alignment device 5 are provided with symmetrical cutting driving devices 3, and the cutting driving devices 3 specifically include a motor 31, a reciprocating wire drawing mechanism 32 and a diamond wire saw 9. The reciprocating wire drawing mechanism 32 comprises a disc 321, the end face of the disc 321 is rotatably connected with four rotating wheels 322, the four rotating wheels 322 are distributed in a rectangular shape, and a cross-shaped moving block 323 is arranged between the four rotating wheels 322.

The cross-shaped moving block 323 may specifically include a translation portion 3231 and a transmission portion 3232 perpendicularly connected to the translation portion 3231, where the translation portion 3231 is slidably connected between the four pulleys 322, and specifically, one pulley 322 is located in each of four regions into which the translation portion 3231 and the transmission portion 3232 are divided. The runner 322 is in contact with upper and lower surfaces of the translation portion 3231.

A strip hollow portion 3233 is arranged on the transmission portion 3232, the strip hollow portion 3233 is perpendicular to the translation portion 3231, a cylindrical groove 3211 is arranged at the end of the disc 321, a rocker member 3212 is arranged in the cylindrical groove 3211, the rocker member 3212 is Z-shaped, one end of the rocker member 3212 is coaxially connected with an output shaft of the motor 31, and the other end of the rocker member 3212 is located in the strip hollow portion 3233. An output shaft of the motor 31 can drive the rocker member 3212 to rotate, so that the end portion of the rocker member 3212 moves in the strip-shaped hollow portion 3233, and the translation portion 3231 is driven to reciprocate between the rotating wheels 322 in a telescopic manner.

The end of the translation portion 3231 is provided with a wire saw holder 3234, and a diamond wire saw 9 is connected between the wire saw holders 3234 of the two cutting driving devices 3. By setting the output directions of the motors 31 of the two cutting driving devices 3, the moving directions of the translation parts 3231 of the two cutting driving devices 3 are ensured to be consistent, so that the surface of the silicon nitride column 100 is cut in a reciprocating manner by the diamond wire saw 9.

Specifically, the raw material placing groove 1 is provided with a semi-cylindrical groove matched with the diameter of the silicon nitride column 100 with cutting, two ends of the raw material placing groove 1 are fixed on the base 7 through the support 2, the aligning device 5 is fixed on the base 7 through the aligning support 51, and the cutting groove 52 is arranged between the aligning device 5 and the raw material placing groove 1. The cutting groove 52 facilitates the diamond wire saw 9 to pass through.

Specifically, the clamping device 4 comprises a cylindrical pushing block 41, a supporting plate 42, a screw 43 and a rotary table 44, wherein the supporting plate 42 is fixed at the end of the raw material placing groove 1, the screw 43 is in threaded connection with the supporting plate 42, the cylindrical pushing block 41 is located in a semi-cylindrical groove, the cylindrical pushing block 41 is in rotary connection with the end of the screw 43, the rotary table 44 is located outside the supporting plate 42, and the rotary table 44 is fixedly connected with the screw 43. The rotating disc 44 can be rotated to drive the screw 43 to rotate, so as to push the cylindrical push block 41 to extrude the silicon nitride column 100 onto the alignment device 5.

Specifically, the end surface of the wheel 322 is provided with a limiting disc 3221, the diameter of the limiting disc 3221 is greater than that of the wheel 322, the limiting disc 3221 is coaxially connected with the wheel 322, the translation portion 3231 is located on the inner side of the limiting disc 3221, and the limiting disc 3221 can prevent the translation portion 3231 from falling off.

Specifically, the cutting drive device 3 is disposed on an end surface of the vertical seat 6, the end surface of the vertical seat 6 is provided with a first guide rail 61 extending vertically, and the cutting drive device 3 is slidably connected in the first guide rail 61. Two sides of the upper surface of the base 7 are provided with second guide rails 71, the second guide rails 71 extend along the length direction of the raw material placing groove 1, and the bottom of the vertical seat 6 is slidably connected in the second guide rails 71. The position of the vertical seat 6 can be flexibly adjusted, the height of the cutting driving device 3 can be flexibly adjusted to adapt to different cutting requirements, and the positions of the vertical seat 6 and the cutting driving device 3 after adjustment can be fixed through bolts and the like. A cutting slag collecting groove 8 is arranged on the base 7 below the cutting groove 52 and can be used for collecting residues generated when the silicon nitride column 100 is cut.

According to the embodiment, when the silicon nitride ultrathin wafer cutting device for the instant heating device is used for cutting a silicon nitride ultrathin wafer, a silicon nitride column can be placed in a raw material placing groove, the silicon nitride column is fixed through the clamping device and the aligning device, and then the diamond wire saw is driven to reciprocate on the surface of the silicon nitride column through the rotation of the motor of the cutting driving device so as to realize cutting.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the accompanying drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A silicon nitride ultra-thin wafer cutting device for an instant heating device is characterized by comprising: the cutting machine comprises a raw material placing groove (1), a cutting driving device (3), a clamping device (4) and an aligning device (5);

clamping device (4) set up in the one end of raw materials standing groove (1), aligning device (5) set up in the other end of raw materials standing groove (1), the both sides of aligning device (5) are provided with symmetrical cutting drive arrangement (3), cutting drive arrangement (3) include motor (31), reciprocal wire drawing mechanism (32) and diamond wire saw (9), reciprocal wire drawing mechanism (32) include disc (321), the terminal surface of disc (321) is rotated and is connected with four runner (322), four runner (322) are the rectangular distribution, be provided with cross movable block (323) between four runner (322), cross movable block (323) include translation portion (3231) and with translation portion (3231) transmission portion (3232) of connecting perpendicularly, translation portion (3231) sliding connection is between four runner (322), be provided with strip fretwork portion (3233) on transmission portion (3232), strip fretwork portion (3233) with translation portion (3231) is perpendicular, disc (321) tip is provided with cylinder recess (3211), be provided with rocking bar piece (3212) in cylinder recess (3211), rocking bar piece (3212) is the Z type, the one end of rocking bar piece (3212) with the output shaft coaxial coupling of motor (31), the other end of rocking bar piece (3212) is located in strip fretwork portion (3233), the tip of translation portion (3231) is provided with coping saw fixing base (3234), is connected with diamond coping saw (9) between coping saw fixing base (3234) of two cutting drive arrangement (3).

2. The silicon nitride ultrathin wafer cutting device for the instant heating device as claimed in claim 1, characterized in that the raw material placing groove (1) is provided with a semi-cylindrical groove matched with the diameter of the silicon nitride column (100) to be cut, both ends of the raw material placing groove (1) are fixed on a base (7) through a bracket (2), the alignment device (5) is fixed on the base (7) through an alignment bracket (51), and a cutting groove (52) is arranged between the alignment device (5) and the raw material placing groove (1).

3. The silicon nitride ultrathin wafer cutting device for the instant heating device as claimed in claim 2, wherein the clamping device (4) comprises a cylindrical pushing block (41), a supporting plate (42), a screw rod (43) and a rotating disc (44), the supporting plate (42) is fixed at the end of the raw material placing groove (1), the screw rod (43) is in threaded connection with the supporting plate (42), the cylindrical pushing block (41) is located in the semi-cylindrical groove, the cylindrical pushing block (41) is in rotary connection with the end of the screw rod (43), the rotating disc (44) is located at the outer side of the supporting plate (42), and the rotating disc (44) is fixedly connected with the screw rod (43).

4. The silicon nitride ultrathin disk cutting device for the instant heating device as claimed in claim 3, wherein a limiting disc (3221) is arranged on the end surface of the rotating wheel (322), the diameter of the limiting disc (3221) is larger than that of the rotating wheel (322), the limiting disc (3221) is coaxially connected with the rotating wheel (322), and the translation portion (3231) is located on the inner side of the limiting disc (3221).

5. The silicon nitride ultrathin wafer cutting device for the instant heating device as claimed in claim 4, characterized in that the cutting driving device (3) is arranged on the end surface of the vertical seat (6), the end surface of the vertical seat (6) is provided with a first guide rail (61) extending vertically, and the cutting driving device (3) is slidably connected in the first guide rail (61).

6. The silicon nitride ultra-thin wafer cutting device for the instant heating device as claimed in claim 5, wherein the base (7) is provided with second guide rails (71) at two sides of the upper surface, the second guide rails (71) extend along the length direction of the raw material placing groove (1), and the bottom of the vertical seat (6) is slidably connected in the second guide rails (71).

7. The silicon nitride ultrathin disk cutting device for the instant heating device as claimed in claim 6, characterized in that a cutting slag collecting groove (8) is arranged on the base (7) below the cutting groove (52).