CN216905627U

CN216905627U - Electronic equipment shell and electronic equipment

Info

Publication number: CN216905627U
Application number: CN202220454083.1U
Authority: CN
Inventors: 刘海涛; 熊过房
Original assignee: Huizhou TCL Mobile Communication Co Ltd
Current assignee: Huizhou TCL Mobile Communication Co Ltd
Priority date: 2022-03-03
Filing date: 2022-03-03
Publication date: 2022-07-05
Anticipated expiration: 2032-03-03

Abstract

The application provides an electronic equipment shell and electronic equipment, wherein the electronic equipment shell comprises a first shell and a second shell, the first shell adopts a one-time injection molding process, and a groove is formed in the surface of the first shell; the second casing adopts the secondary technology of moulding plastics to seted up the jut on the second casing, the jut sets up in the recess and with recess sealing connection, strengthened the waterproof performance between first casing and the second casing, improved the waterproof performance of casing, solved current intelligent electronic equipment and adopted the secondary technology of moulding plastics and once mould plastics the casing that the technology combines together and form, can't satisfy waterproof problem of requirement.

Description

Electronic equipment shell and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to an electronic equipment shell and electronic equipment.

Background

Along with the development in the technical field of mobile communication, the experience that intelligent electronic equipment brings people is rich and varied, for example, in the past, the wrist-watch that can only be used for seeing the time now also can realize functions such as monitoring rhythm of the heart, reply information, motion record now, along with the increase of function, the inside electronic components of intelligent electronic equipment is also more accurate, therefore intelligent electronic equipment's waterproof function is very necessary.

At present, the waterproof function of intelligent electronic equipment focuses on the casing usually and waterproof requirement is very high, and in order to make the surface of intelligent electronic equipment softer, the casing is made by adopting the process of combining once injection molding and twice injection molding usually, so that the waterproof performance of the casing is insufficient, and the waterproof requirement cannot be met.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an electronic equipment casing and electronic equipment to solve the problem that the waterproof performance is not enough when current intelligent electronic equipment adopts secondary injection molding technology and once injection molding technology to combine together and form the casing in the manufacturing process, can't satisfy waterproof requirement.

In a first aspect, an embodiment of the present application provides an electronic device housing, including:

the first shell is formed by one-time injection molding, and a groove is formed in the surface of the first shell;

the second shell is formed by secondary injection molding and comprises a body and a protruding portion, the protruding portion protrudes out of the body, and the protruding portion is arranged in the groove and is connected with the groove in a sealing mode.

Optionally, the first housing is further provided with a first recess, and the groove is at least partially disposed in the first recess; the body comprises a protruding structure matched with the first concave part, the protruding structure is filled in the first concave part, and the protruding part protrudes out of the protruding structure.

Optionally, the groove includes a bottom surface far away from the protruding structure and a side surface adjacent to the bottom surface, and the bottom surface and the side surface are arranged perpendicularly.

Optionally, the first housing includes a first side facing the protruding structure, the first side includes a first side and a second side, the first side is narrower than the second side, the groove includes a first groove, and the first groove is disposed on the first side.

Optionally, the first shell further comprises a second side adjacent to the first side, the second side is provided with a through hole, the second side comprises a first portion and a second portion, the first portion and the second portion are arranged on two sides of the through hole, the first portion is narrower than the second portion, the groove further comprises a second groove, and the second groove is arranged on the first portion.

Optionally, the first housing is hollow in the middle, and the hollow part in the middle is used for mounting a display device; the second housing covers the first and second sides of the first housing.

Optionally, the first groove exceeds the first concave part along the length direction of the second side body

Optionally, the first housing is further provided with a second recess, and a notch is arranged on the second recess; the second shell further comprises a cover plate, a convex body matched with the notch is arranged on the cover plate, the convex body is arranged in the notch, and the cover plate is covered on the second concave portion.

Optionally, the electronic device housing further includes an antenna, and the antenna is disposed between the first housing and the second housing and is staggered with the groove.

In a second aspect, an embodiment of the present application further provides an electronic device, including:

the electronic equipment shell is the electronic equipment shell as described above;

a display device mounted to the electronic device housing.

The electronic equipment shell provided by the embodiment of the application comprises a first shell and a second shell, wherein the first shell adopts a one-time injection molding process, and a groove is formed in the surface of the first shell; the second casing adopts the secondary technology of moulding plastics to seted up the jut on the second casing, the jut sets up in the recess and with recess sealing connection, strengthened the waterproof performance between first casing and the second casing, improved the waterproof performance of casing, solved current intelligent electronic equipment and adopted the secondary technology of moulding plastics and once mould plastics the casing that the technology combines together and form, can't satisfy waterproof problem of requirement.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that other drawings can be derived from these drawings by a person skilled in the art without inventive effort.

For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts in the following description.

Fig. 1 is a schematic front structure diagram of a first housing according to an embodiment of the present application.

Fig. 2 is a schematic side structure view of a first housing according to an embodiment of the present application.

Fig. 3 is a schematic overall structure diagram of the first housing according to an embodiment of the present application.

Fig. 4 is a schematic front structure diagram of a second housing according to an embodiment of the present application.

Fig. 5 is a schematic back structure diagram of a second housing according to an embodiment of the present application.

Fig. 6 is a schematic overall structure diagram of a second housing according to an embodiment of the present application.

Fig. 7 is a schematic front structure diagram of an electronic device housing according to an embodiment of the present application.

Fig. 8 is a schematic side structure diagram of an electronic device housing according to an embodiment of the present application.

Fig. 9 is a schematic cross-sectional view of the electronic device housing shown in fig. 7 along the direction a-a.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The waterproof function of the intelligent electronic equipment is very necessary for the high-speed development in the technical field of mobile communication today, and meanwhile, in order to make the surface of the intelligent electronic equipment soft, a mode of combining a secondary injection molding process and a primary injection molding process is generally adopted to manufacture the shell, but the waterproof performance of the shell is insufficient due to the adoption of the process, and the problem that the secondary injection molding process and the waterproof function cannot be achieved at the same time exists.

Therefore, the embodiment of the application provides an electronic equipment shell and electronic equipment to solve the problem that the shell waterproof performance is not enough and the waterproof requirement cannot be met when the existing intelligent electronic equipment adopts the secondary injection molding process and the primary injection molding process to combine together in the manufacturing process. The following description will be made with reference to the accompanying drawings.

Illustratively, the electronic device housing 10 in the embodiment of the present application includes a first housing 100 and a second housing 200, where the first housing 100 is formed by one-time injection molding and a groove 101 is formed on a surface of the first housing 100; the second housing 200 is formed by two-shot molding, and the second housing 200 includes a body 201 and a protrusion 211, the protrusion 211 protrudes from the body 201, and the protrusion 211 is disposed in the groove 101 and hermetically connected to the groove 101.

Illustratively, the first housing 100 in the embodiment of the present application is further provided with a first recess 110, and the groove 101 is at least partially disposed in the first recess 110; the body 201 includes a protruding structure 210 matching with the first recess 110, the protruding structure 210 is filled in the first recess 110, and the protrusion 211 protrudes from the protruding structure 210.

Specifically, please refer to fig. 1 to 6, fig. 1 is a schematic front structure diagram of a first housing 100 according to an embodiment of the present disclosure, fig. 2 is a schematic side structure diagram of the first housing 100 according to the embodiment of the present disclosure, fig. 3 is a schematic overall structure diagram of the first housing 100 according to the embodiment of the present disclosure, fig. 4 is a schematic front structure diagram of a second housing 200 according to the embodiment of the present disclosure, fig. 5 is a schematic back structure diagram of the second housing 200 according to the embodiment of the present disclosure, and fig. 6 is a schematic overall structure diagram of the second housing 200 according to the embodiment of the present disclosure.

As shown in fig. 1 to fig. 3, in the embodiment of the present application, the first housing 100 is formed by injection molding through a one-time injection molding process, in the one-time injection molding process, a groove 101 is reserved on a surface of the first housing 100, and the groove 101 includes a left first groove 111A, a right first groove 111B, and a second groove 112; the surface of the first shell 100 is reserved with a recess, the recess comprises a first recess 110 and a second recess 140, and the groove 101 is arranged in the first recess 110, so that the bonding area with the second shell 200 can be increased, and a better waterproof effect is achieved.

As shown in fig. 4-6, the second housing 200 is manufactured by using the first housing 100 as a mold and using a two-shot molding process, and since the first housing 100 is used as a mold, the second housing 200 has a main body 201 and a protruding structure 210 matching with the first recess 110 of the first housing 100, and the protruding structure 210 can cover and seal the first recess 110 integrally, that is, there is also a protrusion 211 matching with the groove 101 of the first housing 100, wherein the protrusion 211 is protrudingly disposed on the protruding structure 210. The protrusion 211 includes a first protrusion 211A, a second protrusion 211B, and a third protrusion 211C, which correspond to the left first groove 111A, the right first groove 111B, and the second groove 112 on the first housing 100, respectively.

Referring to fig. 7 and 8, fig. 7 is a schematic front structure diagram of the electronic device housing 10 according to the embodiment of the present application, and a schematic side structure diagram 12 of the electronic device housing 10 according to the embodiment of the present application. In the secondary injection molding process of the second housing 200 using the first housing 100 as a mold, the protruding structure 210 of the second housing 200 and the protrusion 211 located on the protruding structure 210 can cover the first recess 110 as a whole, as shown in fig. 7 and 8, the surface of the electronic device housing 10 after combining the first housing 100 and the second housing 200 has substantially no gap, which can achieve a good waterproof effect, and after the first housing 100 is provided with the groove 101 in the first recess 110, the groove 101 contacts with the protrusion 211 of the second housing 200, which also increases the contact area with the second housing 200, and improves the waterproof effect.

It should be noted that, in the embodiment of the present application, the number and the positions of the grooves 101 and the protrusions 211 matching with the grooves 101 are not limited, and may be the number in the embodiment, or may be a plurality of grooves 101 and protrusions 211 arranged at different positions on the first casing 100 and the second casing 200; in the embodiment of the present application, the positions of the left first groove 111A, the right first groove 111B, the first protrusion 211A, the second protrusion 211B, and the third protrusion 211C are not limited, and A, B, C is used to indicate that different components are only used for better identifying the positions in the embodiment of the present application, and the specific positions of the components are not limited, and the above components may be in the same shape and position, or may be in different shapes and positions.

Illustratively, the groove 101 includes a bottom surface 11 away from the protruding structure 210 and a side surface 12 adjacent to the bottom surface 11, the bottom surface 11 and the side surface 12 being disposed perpendicularly.

Specifically, referring to fig. 9, fig. 9 is a schematic cross-sectional view of the electronic device housing 10 shown in fig. 7 along a direction a-a. As shown in fig. 9, the bottom surface 11 of the groove 101 of the first housing 100 and the side surface 12 adjacent to the bottom surface 11 are vertically arranged, the second housing 200 which is molded twice is filled in the position of the groove 101, and the filled combination structure can bend the air inlet channel of the combination surface at a right angle, so that the combination area is increased, and the waterproof effect is improved.

Illustratively, the first housing 100 includes a first side 120 facing the protruding structure 210, the first side 120 includes a first side 121 and a second side 122, the first side 121 is narrower than the second side 122, the groove 101 includes a first groove 101, and the first groove 101 is disposed on the first side 121.

Specifically, as shown in fig. 1, the first housing 100 adopting the one-time injection molding process includes the first side 120 facing the protruding structure 210, and the first side 120 includes the second side 122 having a wider width and the first side 121 having a narrower width than the second side 122, because the one side having a narrower width often fails to reach the waterproof rating when the two-time injection molding process is adopted in the process of manufacturing the electronic device housing 10, and even when the housing is manufactured by the two-time injection molding process, because the bonding area with the second housing 200 is relatively large, the structure without the matching of the groove 101 and the protrusion 211 can also achieve the excellent waterproof effect and achieve the waterproof standard. Therefore, in the embodiment of the present application, the groove 101 is disposed on the first side body 121 with a narrow width, and is used for combining with the protrusion 211 on the second casing 200 formed by the secondary injection molding process, so as to achieve or exceed the waterproof capability of the second side body 122 with a wide width in a manner of increasing the combining area, and enhance the overall waterproof performance of the combined electronic equipment casing 10.

It should be noted that the specific arrangement positions of the groove 101 formed by the primary injection molding process and the protrusion 211 formed by the secondary injection molding process are not limited in the embodiments of the present application, for example, the waterproof structure combining the groove 101 and the protrusion 211 may be arranged on the narrow side or the wide side of the electronic device housing 10. The waterproof capability of the equipment on the level of IPX7 can be achieved by arranging the waterproof device on the narrow side, and the waterproof capability of the equipment on the level of IPX7 can be improved by arranging the waterproof device on the wide side.

Illustratively, the first housing 100 further includes a second side 130 adjacent to the first side 120, the second side 130 is provided with a through hole 131, the second side 130 further includes a first portion 132 and a second portion 133 disposed at two sides of the through hole 131, the first portion 132 is narrower than the second portion 133, the groove 101 further includes a second groove 112, and the second groove 112 is disposed at the first portion 132.

Specifically, as shown in fig. 2, the first housing 100 adopting the one-time injection molding process further includes a second side 130 adjacent to the first side 120, the second side 130 is divided into a first portion 132 and a second portion 133, the first portion 132 is narrower than the second portion 133, that is, the second portion 133 has a wider width, and when the housing is manufactured by the two-time injection molding process, the bonding area is larger, so that a qualified waterproof grade can be achieved without adopting any structure. And be provided with second recess 112 on narrower first portion 132 of width, second recess 112 is used for combining together with third protruding portion 211C in order to increase the area of combining with second casing 200, second recess 112 also can adopt if the bottom surface 11 of first casing 100 recess 101 with the adjacent side 12 of bottom surface 11 set up perpendicularly, second casing 200 that the secondary was moulded plastics fills in second recess 112 position, the bonding structure after the packing can carry out the right angle bending to the inlet channel of bonding surface, the looks increase the area of combining, more can promote water-proof effects. As shown in fig. 8, the combined electronic device housing 10 has substantially no gap, which makes the product more beautiful while meeting the waterproof requirement.

As shown in fig. 2, the first casing 100 is provided with a through hole 131 between the first portion 132 and the second portion 133, and the through hole 131 is used for storing the key, so that the user can manipulate the intelligent electronic device by touching and pressing the key.

It should be noted that, in the embodiment of the present application, the position of the through hole 131 is not limited, for example, the position may be any position on the first casing 100 that is convenient for a user to touch and press, if the through hole 131 is opened at other positions on the first casing 100, which may result in a narrower side, the second groove 112 may be further disposed on the narrower side, and the corresponding protrusion 211 is disposed on the second casing 200, which may be combined together to achieve the waterproof requirement.

Illustratively, the first housing 100 is provided with a hollow middle part, and the hollow middle part is used for mounting a display device; the second case 200 covers the first and

second sides

120 and 130 of the first case 100.

Specifically, as shown in fig. 7 and 8, a hollow area 150 is disposed in the middle of the first casing 100 by using a one-time injection molding process, and the hollow area 150 may be used for storing elements required by the intelligent electronic device, such as: display devices, batteries, touch devices, and the like. The second housing 200 of the secondary injection molding process is wrapped and covers the first side 120 and the second side 130 of the first housing 100, at this time, the protruding structure 210 on the second housing 200 covers the recessed portion on the first housing 100, and the protruding portion 211 on the protruding structure 210 is also combined with the groove 101 on the recessed portion, so that the integrity of the electronic device product can be improved under the effect of sealing and waterproofing, and the product is more beautiful.

Illustratively, the first groove 101 extends along the length direction of the second side body 122 to exceed the first recess 110.

Specifically, as shown in fig. 1, in the embodiment of the present application, the left first groove 111A and the right first groove 111B extend toward the length direction of the second side body 122 toward the first side body 121 to exceed the recessed portion region of the first side body 121. The left first groove 111A and the right first groove 111B extend to increase the bonding area with the protrusion 211, thereby achieving a better waterproof effect.

It should be noted that the positions of the extending grooves 101 such as the left first groove 111A and the right first groove 111B are not limited in the embodiment of the present application, for example, all the grooves 101 on the first housing 100 may be provided with the extending grooves 101 to achieve a better waterproof effect.

Illustratively, the first housing 100 is further provided with a second recess 140, and the second recess 140 is provided with a notch 141; the second housing 200 further includes a cover plate 220, the cover plate 220 is provided with a convex body 221 matching with the concave opening 141, the convex body 221 is disposed in the concave opening 141, and the cover plate 220 covers the second concave portion 140.

Specifically, as shown in fig. 1, 4 and 6, even if the second side body 122 with a wider width is manufactured by a secondary injection molding process, since the contact bonding area with the second housing 200 is larger, the structure that the groove 101 is not matched with the protrusion 211 can also achieve a good waterproof effect, but other waterproof structures are still needed to achieve a better waterproof effect. Therefore, in the embodiment of the present application, the second side body 122 with a wider width is provided with the second recess 140, the second recess 140 is provided with the notch 141, the second casing 200 is provided with the cover plate 220, the cover plate 220 is provided with the protrusion 221, and the protrusion 221 is matched with the notch 141 of the first casing 100 to seal the second side body 122, and during the matching and sealing process, the protrusion 221 is arranged in the notch 141. The cover plate 220 is covered on the second concave portion 140 by a secondary injection molding method, so that the integrity of the electronic device product can be enhanced, and the appearance of the product can be beautified.

In the embodiment of the present application, the combination structure of the second side body 122 with a wider width on the electronic device housing 10 is not limited, for example, the notch 141 and the convex body 221 may be matched, or the groove 101 and the protrusion 211 may be matched; the shape of the notch 141 is not limited in the embodiments of the present application, and for example, the shape may be circular, rectangular or other shape, and the shape of the convex body 221 matching with the notch 141 may be changed accordingly.

Illustratively, the electronic device housing 10 further includes an antenna 160, and the antenna 160 is disposed between the first housing 100 and the second housing 200 and is staggered with the groove 101.

Specifically, as shown in fig. 1, in the embodiment of the present application, the antenna 160 is disposed on the surface of the first casing 100 and is disposed in a staggered manner in the groove 101, so as to prevent the antenna 160 from being covered after the groove 101 of the first casing 100 and the protrusion 211 of the second casing 200 are combined, which affects the communication effect of the electronic device; as shown in fig. 7, when the second housing 200 is combined with the first housing 100, the antenna 160 is not completely covered by the second housing 200, so that the communication effect of the electronic device is more stable.

Wherein, in this application embodiment, the setting of antenna 160 adopts LDS antenna technology, also is the laser direct structuring technique, adopts LDS antenna technology to make antenna 160 more stable, avoids the interference of inside components and parts, can also save more design spaces, lets electronic equipment thin more.

Note that the position of the antenna 160 is not limited in the embodiment of the present application, and for example, the antenna may be provided at a position not coinciding with the groove 101 on the surface of the first housing 100, or may be provided at an inner surface of the second housing 200, or the like.

The embodiment of the present application further includes an electronic device, which includes a display device (not shown) and an electronic device housing 10, where the electronic device housing 10 is the electronic device housing 10 described above, and the display device is installed in the electronic device housing 10. The electronic equipment can be intelligent electronic equipment such as a smart phone, intelligent wearable equipment and a tablet computer.

The first shell provided by the embodiment of the application adopts a one-time injection molding process, and the surface of the first shell is provided with a groove; the second casing adopts the secondary technology of moulding plastics to seted up the jut on the second casing, the jut sets up in the recess and with recess sealing connection, strengthened the waterproof performance between first casing and the second casing, improved the waterproof performance of casing, solved current intelligent electronic equipment and adopted the secondary technology of moulding plastics and once mould plastics the casing that the technology combines together and form, can't satisfy waterproof problem of requirement.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features.

The electronic device housing and the electronic device provided by the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are explained herein by applying specific examples, and the description of the embodiments above is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. An electronic device housing, comprising:

2. The electronic device housing of claim 1, wherein the first housing further defines a first recess, the groove being at least partially disposed within the first recess; the body comprises a protruding structure matched with the first concave part, the protruding structure is filled in the first concave part, and the protruding part protrudes out of the protruding structure.

3. The electronic device housing of claim 2, wherein the recess comprises a bottom surface distal from the protruding structure and a side surface adjacent to the bottom surface, the bottom surface and the side surface being disposed perpendicularly.

4. The electronic device housing of claim 2, wherein the first housing comprises a first side facing the protruding structure, the first side comprising a first side and a second side, the first side being narrower than the second side, the recess comprising a first recess, the first recess being disposed on the first side.

5. The electronic device housing of claim 4, wherein the first housing further comprises a second side adjacent to the first side, wherein the second side is provided with a through hole, wherein the second side comprises a first portion and a second portion disposed on two sides of the through hole, wherein the first portion is narrower than the second portion, wherein the groove further comprises a second groove, and wherein the second groove is disposed on the first portion.

6. The electronic device housing according to claim 4, wherein the first housing is hollow in the middle, and the hollow part in the middle is used for mounting a display device; the second housing covers the first and second sides of the first housing.

7. The electronic device housing of claim 4, wherein the first groove extends beyond the first recess along a length of the second side body.

8. The electronic device casing of claim 1, wherein the first casing is further provided with a second recess, and the second recess is provided with a notch; the second shell further comprises a cover plate, a convex body matched with the notch is arranged on the cover plate, the convex body is arranged in the notch, and the cover plate is covered on the second concave portion.

9. The electronic device housing of claim 1, further comprising an antenna disposed between the first housing and the second housing and offset from the recess.

10. An electronic device, comprising:

an electronic device housing according to any one of claims 1 to 9;

a display device mounted to the electronic device housing.