CN216902812U

CN216902812U - Double-swing-arm die bonder

Info

Publication number: CN216902812U
Application number: CN202123116821.6U
Authority: CN
Inventors: 孙杰; 杨吉明; 王彦彦; 徐海军
Original assignee: Jiangsu High Diode Semiconductor Co ltd
Current assignee: Jiangsu High Diode Semiconductor Co ltd
Priority date: 2021-12-10
Filing date: 2021-12-10
Publication date: 2022-07-05
Anticipated expiration: 2031-12-10

Abstract

The utility model relates to a double-swing-arm die bonder which comprises a rotating shaft and a rotating arm, wherein the rotating shaft is vertically arranged, the axis of the rotating arm is perpendicular to and intersected with the axis of the rotating shaft, the middle end of the rotating arm is fixedly arranged at the bottom end of the rotating shaft, two ends of the rotating arm are respectively provided with a sucker, the two suckers are respectively connected with the rotating arm through two connecting mechanisms, the top end of the rotating shaft is in transmission connection with a driving mechanism, and the rotating shaft is also provided with a lifting structure; this solid brilliant device of double swing arm, its one-way reciprocating rotation through the rotor arm can realize adsorbing the wafer and pasting the dress wafer simultaneously, has improved production efficiency, moreover, on the air current that produces through the removal of movable plate in the pipe was used the wafer on the base plate, can also clear away the impurity on base plate and the wafer.

Description

Double-swing-arm die bonder

Technical Field

The utility model relates to a double-swing-arm die bonder, and belongs to the field of semiconductor component production.

Background

The semiconductor is a material with electric conductivity between a conductor and an insulator at normal temperature, a wafer needs to be attached to a substrate in the production process of a semiconductor component, and most of the existing chip mounters adopt a single swing arm mode, namely, the attachment of only one wafer can be completed in each reciprocating motion, so that the efficiency is low, and the chip mounters are not suitable for the requirements of large-scale production at present. Therefore, a double swing arm die bonder is needed to improve the production efficiency of semiconductor devices.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the utility model is as follows: in order to overcome the defects of the prior art, the double-swing-arm die bonder is provided.

The technical scheme adopted by the utility model for solving the problems is as follows: a double-swing-arm die bonder comprises a rotating shaft and a rotating arm, wherein the rotating shaft is vertically arranged, the axis of the rotating arm is perpendicular to and intersected with the axis of the rotating shaft, the middle end of the rotating arm is fixedly arranged at the bottom end of the rotating shaft, two ends of the rotating arm are respectively provided with a sucker, the two suckers are respectively connected with the rotating arm through two connecting mechanisms, the top end of the rotating shaft is in transmission connection with a driving mechanism, and the rotating shaft is also provided with a lifting structure;

the connecting mechanism comprises a connecting pipe, the axis of the connecting pipe is perpendicular to and intersected with the axis of the rotating arm, the connecting pipe is fixedly arranged on the rotating arm, the sucker is located under the connecting pipe and connected with the connecting pipe, the connecting pipe is further provided with a blowing assembly, and the blowing assembly is located above the sucker.

Preferably, the driving mechanism comprises a driving box, the rotating shaft penetrates through the bottom of the driving box in a movable mode, the rotating shaft is connected with the driving box through a bearing, a driving motor is arranged in the driving box, a driven gear is installed on the rotating shaft, a driving gear is installed on the driving motor, and the driving gear is meshed with the driven gear.

Preferably, the lifting structure comprises a fixed plate, a plurality of air cylinders are vertically arranged on the fixed plate, the air cylinders are uniformly distributed by taking the axis of the rotating shaft as a central axis, the cylinder bodies of the air cylinders are fixedly arranged on the fixed plate, and the telescopic ends of the air cylinders are fixedly connected with the driving box.

Preferably, the blowing assembly comprises a guide pipe, the guide pipe is parallel to the rotating arm, the guide pipe is arranged on one side, away from the rotating arm, of the connecting pipe, the guide pipe is communicated with the connecting pipe, a moving plate is arranged in the guide pipe, the moving plate is connected with the inner wall of the guide pipe in a sliding and sealing mode, one side, away from the rotating arm, of the moving plate is connected with the inner wall of the guide pipe through a spring, and a sealing block is arranged at the top end of the connecting pipe in a sealing mode.

Preferably, a limiting block is arranged in the connecting pipe and abuts against one side, close to the rotating arm, of the moving plate.

Preferably, the limiting block is made of rubber.

Compared with the prior art, the utility model has the advantages that:

according to the double-swing-arm die bonder, the wafers can be adsorbed and pasted simultaneously through the unidirectional reciprocating rotation of the rotating arms, the production efficiency is improved, and the impurities on the substrates and the wafers can be removed through the action of airflow generated by the movement of the moving plate in the guide pipe on the wafers on the substrates.

Drawings

FIG. 1 is a schematic structural view of a double-swing-arm die bonder according to the present invention;

fig. 2 is a schematic structural view of the connection mechanism.

Wherein: 1. the automatic sealing device comprises a rotating shaft, 2 rotating arms, 3 sucking discs, 4 connecting pipes, 5 driving boxes, 6 bearings, 7 driving motors, 8 driven gears, 9 driving gears, 10 fixing plates, 11 cylinders, 12 guide pipes, 13 moving plates, 14 springs, 15 sealing blocks and 16 limiting blocks.

Detailed Description

As shown in fig. 1-2, in this embodiment, the double swing arm die bonder comprises a rotating shaft 1 and a rotating arm 2, wherein the rotating shaft 1 is vertically arranged, an axis of the rotating arm 2 is perpendicular to and intersects with an axis of the rotating shaft 1, a middle end of the rotating arm 2 is fixedly arranged at a bottom end of the rotating shaft 1, two ends of the rotating arm 2 are respectively provided with a sucker 3, the two suckers 3 are respectively connected with the rotating arm 2 through two connecting mechanisms, a driving mechanism is connected to a top end of the rotating shaft 1 in a transmission manner, the driving mechanism comprises a driving box 5, the rotating shaft 1 movably penetrates through a bottom of the driving box 5, the rotating shaft 1 is connected with the driving box 5 through a bearing 6, a driving motor 7 is arranged in the driving box 5, a driven gear 8 is arranged on the rotating shaft 1, a driving gear 9 is arranged on the driving motor 7, and the driving gear 9 is meshed with the driven gear 8, the lifting structure is further arranged on the rotating shaft 1 and comprises a fixing plate 10, a plurality of air cylinders 11 are vertically arranged on the fixing plate 10, the air cylinders 11 are uniformly distributed by taking the axis of the rotating shaft 1 as a central axis, the cylinder bodies of the air cylinders 11 are fixedly arranged on the fixing plate 10, and the telescopic ends of the air cylinders 11 are fixedly connected with the driving box 5;

the connecting mechanism comprises a connecting pipe 4, the axis of the connecting pipe 4 is perpendicular to and intersected with the axis of the rotating arm 2, the connecting pipe 4 is fixedly arranged on the rotating arm 2, the sucker 3 is positioned under the connecting pipe 4, the sucker 3 is connected with the connecting pipe 4, an air blowing assembly is further arranged on the connecting pipe 4 and positioned above the sucker 3, the air blowing assembly comprises a guide pipe 12, the guide pipe 12 is parallel to the rotating arm 2, the guide pipe 12 is arranged on one side, far away from the rotating arm 2, of the connecting pipe 4, the guide pipe 12 is communicated with the connecting pipe 4, a moving plate 13 is arranged in the guide pipe 12, the moving plate 13 is connected with the inner wall of the guide pipe 12 in a sliding and sealing mode, one side, far away from the rotating arm 2, of the moving plate 13 is connected with the inner wall of the guide pipe 12 through a spring 14, and a sealing block 15 is arranged at the top end of the connecting pipe 4 in a sealing mode, a limiting block 16 is arranged in the connecting pipe 4, the limiting block 16 is abutted against one side, close to the rotating arm 2, of the moving plate 13, and the limiting block 16 is made of rubber.

During the operation of the device, the driving motor 7 is started to make the driving gear 9 rotate in a reciprocating way, and the rotating shaft 1 rotates in a reciprocating way on the bearing 6 through the driven gear 8, the reciprocating rotation of the rotating shaft 1 drives the rotating arm 2 to rotate in a reciprocating way, the single rotation angle of the rotating arm 2 is 180 degrees through calculation, the reciprocating rotation of the rotating arm 2 drives the sucker 3 to synchronously rotate in a reciprocating way through the connecting pipe 4, when the sucker 3 stops rotating, the driving box 5 moves downwards through the air cylinder 11, namely the sucker 3 can synchronously move downwards, so that the sucker 3 can suck the wafer, then the driving box 5 moves upwards through the air cylinder 11 to realize resetting, then, after the rotating arm 2 rotates in a reverse way for 180 degrees, the rotating arm 2 moves downwards again, so that the sucker 3 which sucks the wafer can move downwards, the wafer is attached to a substrate, and simultaneously, the other sucker 3 can suck the wafer, by such reciprocating, the wafer can be adsorbed and mounted when the rotating arm 2 rotates in a single reciprocating way, the production efficiency is improved, here, when the rotating arm 2 rotates the connecting tube 4, the moving plate 13 in the guide tube 12 is driven to move synchronously, and the moving plate 13 is moved away from the rotating arm 2 by the centrifugal force, and the spring 14 is deformed, and simultaneously, air is sucked into the connection tube 4 from the bottom end of the connection tube 4 and then into the suction duct 12, when the rotation of the rotating arm 2 is stopped, the moving plate 13 can be moved reversely by the elastic action of the spring 14, the air in the guide duct 12 can be delivered into the connection tube 4 and then discharged from the bottom end of the connection tube 4, and the air discharged from the bottom ends of the two connecting pipes 4 can be respectively used on the wafer and the substrate, so that impurities on the wafer and the substrate are blown away, and the effect of the sucking disc 3 for sucking the wafer and the effect of the wafer attached on the substrate are prevented from being influenced by the impurities.

In addition to the above embodiments, the present invention also includes other embodiments, and any technical solutions formed by equivalent transformation or equivalent replacement should fall within the scope of the claims of the present invention.

Claims

1. The utility model provides a solid brilliant device of double swing arm which characterized in that: the lifting mechanism comprises a rotating shaft (1) and a rotating arm (2), wherein the rotating shaft (1) is vertically arranged, the axis of the rotating arm (2) is perpendicular to and intersected with the axis of the rotating shaft (1), the middle end of the rotating arm (2) is fixedly arranged at the bottom end of the rotating shaft (1), two ends of the rotating arm (2) are respectively provided with a sucker (3), the two suckers (3) are respectively connected with the rotating arm (2) through two connecting mechanisms, the top end of the rotating shaft (1) is in transmission connection with a driving mechanism, and the rotating shaft (1) is further provided with a lifting structure;

coupling mechanism includes connecting pipe (4), the axis of connecting pipe (4) is perpendicular and crossing with the axis of rotor arm (2), connecting pipe (4) are fixed to be set up on rotor arm (2), sucking disc (3) are located connecting pipe (4) under, sucking disc (3) are connected with connecting pipe (4), still be provided with the subassembly of blowing on connecting pipe (4), the subassembly of blowing is located the top of sucking disc (3).

2. The double-swing-arm die bonder according to claim 1, wherein: actuating mechanism includes drive case (5), the bottom of drive case (5) is passed in axis of rotation (1) activity, axis of rotation (1) is connected with drive case (5) through bearing (6), be provided with driving motor (7) in drive case (5), install driven gear (8) on axis of rotation (1), install drive gear (9) on driving motor (7), drive gear (9) and driven gear (8) meshing.

3. The double-swing-arm die bonder according to claim 2, wherein: the lifting structure comprises a fixing plate (10), wherein a plurality of cylinders (11) are vertically arranged on the fixing plate (10), the cylinders (11) are uniformly distributed by taking the axis of the rotating shaft (1) as the central axis, the cylinder bodies of the cylinders (11) are fixedly arranged on the fixing plate (10), and the telescopic ends of the cylinders (11) are fixedly connected with a driving box (5).

4. The double-swing-arm die bonder according to claim 1, wherein: the blowing assembly comprises a guide pipe (12), the guide pipe (12) is parallel to the rotating arm (2), the guide pipe (12) is arranged on one side, away from the rotating arm (2), of the connecting pipe (4), the guide pipe (12) is communicated with the connecting pipe (4), a moving plate (13) is arranged in the guide pipe (12), the moving plate (13) slides and is connected with the inner wall of the guide pipe (12) in a sealing mode, one side, away from the rotating arm (2), of the moving plate (13) is connected with the inner wall of the guide pipe (12) through a spring (14), and a sealing block (15) is arranged at the top end of the connecting pipe (4) in a sealing mode.

5. The double-swing-arm die bonder according to claim 4, wherein: a limiting block (16) is arranged in the connecting pipe (4), and the limiting block (16) is abutted against one side, close to the rotating arm (2), of the moving plate (13).

6. The double-swing-arm die bonder according to claim 5, wherein: the limiting block (16) is made of rubber.