CN216891289U - Electroplating device capable of cleaning conductive copper head - Google Patents
Electroplating device capable of cleaning conductive copper head Download PDFInfo
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- CN216891289U CN216891289U CN202220273970.9U CN202220273970U CN216891289U CN 216891289 U CN216891289 U CN 216891289U CN 202220273970 U CN202220273970 U CN 202220273970U CN 216891289 U CN216891289 U CN 216891289U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
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Abstract
The utility model relates to an electroplating device capable of cleaning a conductive copper head, which mainly comprises a transmission mechanism, a clamping mechanism and a copper head cleaning mechanism, wherein the transmission mechanism is provided with a steel belt and a plurality of conductive units, the steel belt is driven to simultaneously drive the conductive units and the clamping mechanism to move, in addition, a conductive seat of each conductive unit is connected with the steel belt, and the conductive copper head of each conductive unit is provided with a conductive surface to be contacted with a conductive component capable of being electrified, wherein the copper head cleaning mechanism is provided with a copper head brush head and a copper head cleaning drive source, the copper head brush head is contacted with the conductive surface, and the copper head brush head can rotate through the copper head cleaning drive source to clean the conductive surface, therefore, when the electroplating device carries out electroplating operation on an electroplating plate, the copper head can synchronously rotate to remove dust remained on the conductive surface, so that the conductive surface cannot rust due to dust accumulation, the service life of the conductive copper head can be prolonged relatively.
Description
Technical Field
The utility model relates to an electroplating device capable of electroplating an electroplating plate, in particular to an electroplating device capable of cleaning a conductive copper head simultaneously in the electroplating process of the electroplating plate.
Background
In general, in the electroplating process, current is input to an anode and a cathode during electrolysis, and the anode and the cathode perform oxidation-reduction reaction, so that metal ions in the electroplating solution move to the cathode to adhere to the surface of an object to be plated (e.g., an electroplating plate), thereby forming a metal shell on the surface of the object to be plated.
At present, in order to improve the production efficiency, the plated object (such as an electroplating plate) is automatically electroplated by an electroplating device, however, at present, a conventional electroplating device utilizes a steel belt and a rotating wheel to drive the plated object (such as an electroplating plate) to move, when the plated object moves through the steel belt and the rotating wheel, the conductive copper head assembled on the steel belt can contact the electrified assembly, so that the plating object (such as a plating plate) can move into the plating tank to start the plating operation, however, in the process of electroplating an object to be plated (such as an electroplating plate) for a long time by the existing electroplating device, dust is gradually accumulated on the surface of the conductive copper head contacting with the electrified component, so that the surface of the conductive copper head begins to rust, therefore, the conductivity between the conductive copper head and the electrified component is changed, and the service life of the conductive copper head is also reduced.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to improve the structural composition of an electroplating device, so that the improved electroplating device can simultaneously clean a conductive copper head on a conductive surface contacting a power-on component in the process of electroplating an electroplating plate, thereby not only preventing the conductive copper head from rusting due to accumulated dust, but also keeping a good conductive effect between the conductive copper head and the power-on component.
The electroplating device comprises a frame, a transmission mechanism, a clamping mechanism and a copper head cleaning mechanism, wherein the frame is provided with an electrifying assembly capable of being electrified, the transmission mechanism is provided with a steel belt in an annular shape and a plurality of conductive units connected to the steel belt, the steel belt is driven to drive the conductive units to move, each conductive unit is provided with a conductive seat assembled on the steel belt and a conductive copper head connected to the conductive seat, and the conductive copper head is contacted with the electrifying assembly, so that the surface of the conductive copper head contacted with the electrifying assembly is a conductive surface.
However, the clamping mechanism has a plurality of clamps arranged at intervals, and the plurality of clamps are connected to the steel belt, and the copper head cleaning mechanism has a copper head brush head contacting the conductive surface and a copper head cleaning driving source connected to the copper head brush head, and the copper head brush head can rotate to clean the conductive surface by the copper head cleaning driving source.
In this embodiment, the steel belt is wound around two rotating wheels arranged at intervals, so that an inner side surface of the steel belt is wound to form a surrounding space for accommodating the rotating wheels, the rotating wheels can rotate by taking a rotating axis as an axis under the driving, and the copper head brush head rotates by taking a copper head cleaning axis which is approximately perpendicular to the rotating axis as an axis.
In addition, the copper head cleaning mechanism is located above the steel belt, so that the copper head brush head and the copper head cleaning driving source are both located outside the surrounding space, the steel belt is provided with two installation sections which are installed on one of the rotating wheels in a one-to-one mode, a cleaning section close to the copper head cleaning mechanism and an electroplating section which is arranged on the cleaning section at intervals are arranged between the two installation sections, the electroplating section is located above an electroplating bath which is installed on the rack, the conductive unit is further connected with two guide rollers on the conductive base, and the two guide rollers are in contact with a guide rail which is connected with the rack.
The electroplating device is characterized in that the copper head cleaning mechanism is additionally arranged on the electroplating device, so that in the process that the transmission mechanism moves the electroplating plate to the inside of the electrolytic bath for electroplating operation, the copper head cleaning mechanism can simultaneously clean dust remained on the conductive surface, the conductive surface of the conductive copper head can not accumulate dust through the copper head cleaning mechanism, a good conductive effect can be kept between the conductive copper head and the electrifying assembly, the conductive copper head can be prevented from rusting to generate verdigris, and the service life of the conductive copper head can be relatively prolonged.
Drawings
FIG. 1 is a side view of an electroplating apparatus according to the present invention;
FIG. 2 is a top view of an electroplating apparatus according to the present invention;
FIG. 3 is a schematic view of the clamping mechanism assembled to the steel strip;
FIG. 4 is a perspective view of the clamp;
FIG. 5 is a schematic view of a copper brushhead being adjacent to a cleaning track;
FIG. 6 is a schematic view of the plating plate being moved into the plating bath;
fig. 7 is a schematic view of a copper head brush head cleaning a conductive copper head.
Description of reference numerals: 1-an electroplating device capable of cleaning the conductive copper head; 10-a frame; 11-a plating area; 12-a cleaning area; 13-an electroplating bath; 14-a power-on component; 20-a drive mechanism; 21-a drive source; 22-a drive rod; 30-a transmission mechanism; 31-a running wheel; 31 a-a main running wheel; 31 b-an auxiliary rotating wheel; 311-a groove; 32-a steel belt; 321-a main mounting section; 322-a secondary mounting section; 323-electroplating section; 324-a cleaning section; 325-upper connection; 326-lower connection; 33-a conductive component; 331-a guide track; 331 a-plating the track; 331 b-cleaning track; 332-a conductive element; 332 a-conductive seat; 332 b-conductive copper head; 332b1 — conductive surface; 332 c-guide rollers; 40-a clamping mechanism; 41-a clamp; 411-a stationary fixture; 412-a movable clamp; 413-return piece; 50-a copper head cleaning mechanism; 51-a copper head brush head; 52-copper head cleaning drive source; 60-electroplating a plate; l1-axis of rotation; l2-copper head cleaning axis; s-surrounding space.
Detailed Description
The utility model will be further described with reference to specific embodiments and drawings, the advantages and features of which will become apparent as the description proceeds.
Referring to fig. 1 and 2, the electroplating apparatus 1 capable of cleaning conductive copper heads of the present invention mainly comprises a frame 10, a driving mechanism 20, a transmission mechanism 30, a clamping mechanism 40, and a copper head cleaning mechanism 50, wherein a left region of the frame 10 is defined as an electroplating region 11, a right region of the frame 10 is defined as a cleaning region 12 adjacent to the electroplating region 11, wherein an electroplating tank 13 containing an electrolyte and a power-on assembly 14 capable of conducting power-on are disposed inside the electroplating region 11, and the electroplating tank 13 is located below the power-on assembly 14, as shown in the figure, the driving mechanism 20 has a driving source 21 fixedly connected to the frame 10, and the driving source 21 can drive a driving rod 22 assembled to the driving source 21 to rotate.
The transmission mechanism 30 has two rotatable rotating wheels 31, a steel belt 32 with a ring-shaped structure, and a conductive member 33 disposed between the frame 10 and the steel belt 32, wherein a plurality of concave grooves 311 are formed on an outer side of each rotating wheel 31, in this embodiment, one rotating wheel 31 is assembled to the driving rod 22 of the driving mechanism 20 to be a main rotating wheel 31a, so that the driving source 21 of the driving mechanism 20 can drive the main rotating wheel 31a to rotate around a rotating axis L1 parallel to the driving rod 22, and the other rotating wheel 31 is pivotally connected to the frame 10 to be a sub rotating wheel 31b arranged at an interval on the main rotating wheel 31a, wherein the steel belt 32 simultaneously surrounds the two rotating wheels 31, so that an inner side surface of the steel belt 32 surrounds a surrounding space S for accommodating the two rotating wheels 31, in this embodiment, the steel belt 32 has a main mounting section 321 mounted on the main rotating wheel 31a and a mounting section mounted on the sub rotating wheel 31b And a plating section 323 and a cleaning section 324 arranged at an interval in the plating section 323 are arranged between the main mounting section 321 and the sub mounting section 322, wherein the two rotating wheels 31 are located at a boundary between the plating area 11 and the cleaning area 12, so that the plating section 323 of the steel strip 32 is located inside the plating area 11, the plating section 323 is located above the plating tank 13, and the cleaning section 324 of the steel strip 32 is located inside the cleaning area 12.
Referring to fig. 2 and 3, the upper and lower portions of the steel belt 32 are respectively provided as an upper connection portion 325 and a lower connection portion 326 located below the upper connection portion 325, and the conductive element 33 of the transmission mechanism 30 has two guide tracks 331 and a plurality of conductive units 332, both of the two guide tracks 331 and the plurality of conductive units 332 are located outside the space S surrounded by the steel belt 32, in this embodiment, the two guide tracks 331 are respectively located at two opposite sides of the steel belt 32 of the transmission mechanism 30, such that one of the guide tracks 331 is located in the plating region 11 of the rack 10 and is provided as a plating track 331a, and the other guide track 331 is located in the cleaning region 12 of the rack 10 and is provided as a cleaning track 331b arranged at intervals on the plating track 331a, and in addition, the plurality of conductive units 332 are assembled on the upper connection portion 325 of the steel belt 32, as shown in the figure, each conductive unit 332 has a conductive seat 332a locked to the upper connection portion 325, the conductive socket 332a is connected to a conductive copper head 332b at the highest position, and two guide rollers 332c arranged at intervals are mounted on the conductive socket 332a at a side away from the steel belt 32, as shown in the figure, two opposite ends of each conductive copper head 332b are respectively in surface contact with the conductive copper heads 332b of the other conductive elements 33, and each conductive copper head 332b is provided with a conductive surface 322b1 in contact with the conductive elements 14 of the rack 10, however, one guide roller 332c of each conductive unit 332 can be in contact with the upper end of the guide rail 331, and the other guide roller 332c of each conductive unit 332 can be in contact with the lower end of the guide rail 331, so that the conductive elements 33 can support the weight of the steel belt 32 of the transmission mechanism 30 when two guide rollers 332c of a part of the conductive elements 33 are respectively located at the upper and lower ends of the guide rail 331.
Referring to fig. 1, 3 and 4, the clamping mechanism 40 has a plurality of clamps 41 with the same specification, as shown in the figure, the clamp 41 has a fixed clamp 411 and a movable clamp 412 capable of moving relative to the fixed clamp 411, the fixed clamp 411 is fixedly connected to the lower connecting portion 326 of the steel belt 32, and the movable clamp 412 is pivotally connected to the fixed clamp 411, wherein a return piece 413 provided as a spring is provided between the fixed clamp 411 and the movable clamp 412, and the return piece 413 can continuously push the movable clamp 412, so that the end of the fixed clamp 411 is continuously contacted with the end of the movable clamp 412.
Referring to fig. 1 and 5, the copper cleaning mechanism 50 is located inside the cleaning region 12 of the frame 10, and the copper cleaning mechanism 50 has a copper head 51 and a copper cleaning driving source 52, wherein the copper head 51 and the copper cleaning driving source 52 are both located above the cleaning section 324 of the steel belt 32, so that the copper head 51 is close to the cleaning section 324 of the steel belt 32, and further, the copper head 51 and the copper cleaning driving source 52 are both disposed outside the surrounding space S of the steel belt 32, in this embodiment, the copper head 51 contacts the conductive surface 322b1 of the conductive copper head 332b, and the copper cleaning driving source 52 is assembled to the copper head 51, so that the copper cleaning driving source 52 can drive the copper head 51 to rotate around a copper cleaning axis L2 substantially perpendicular to the rotation axis L1.
Referring to fig. 6 and 7, when the electroplating device 1 capable of cleaning conductive copper heads performs electroplating operation, the plurality of clamps 41 of the clamping mechanism 40 clamp a plating plate 60 together, and then the driving source 21 of the driving mechanism 20 drives the main rotating wheel 31a of the transmission mechanism 30 to rotate around the rotation axis L1 via the driving rod 22 of the driving mechanism 20, and the rotating main rotating wheel 31a can drive the steel belt 32 of the transmission mechanism 30 to move, so that the auxiliary rotating wheel 31b of the transmission mechanism 30 synchronously rotates in the same direction, and the moving steel belt 32 drives the plating plate 60 to move into the electroplating bath 13 via the clamping mechanism 40 for electroplating operation, and at the same time, the copper head cleaning driving source 52 of the copper head cleaning mechanism 50 can drive the copper head 51 of the copper head cleaning mechanism 50 to rotate around the copper head cleaning axis L2, so that the lowest side of the copper head 51 can clean the conductive surface 322b1 of the conductive copper head 332b of the cleaning region 12, further, the conductive copper head 332b will not rust due to dust accumulation on the conductive surface 322b1, and good conductive effect can be maintained between the conductive copper head 332b and the conductive assembly 14.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the utility model as defined in the appended claims.
Claims (5)
1. An electroplating apparatus capable of cleaning a conductive copper head, comprising:
the device comprises a rack, a power supply module and a control module, wherein the rack is provided with the power supply module capable of being electrified;
the transmission mechanism is provided with a steel belt in an annular shape and a plurality of conductive units connected with the steel belt, the steel belt is driven to drive the conductive units to move, each conductive unit is provided with a conductive seat assembled on the steel belt and a conductive copper head connected with the conductive seat, and a conductive surface of the conductive copper head is contacted with the electrifying assembly; and
the clamping mechanism is provided with a plurality of clamps which are arranged at intervals, and the clamps are connected with the steel belt;
the electroplating device is characterized in that the electroplating device is also provided with a copper head cleaning mechanism, the copper head cleaning mechanism is provided with a copper head brush head which is contacted with the conductive surface and a copper head cleaning driving source which is connected with the copper head brush head, and the copper head brush head can rotate to clean the conductive surface through the copper head cleaning driving source.
2. The plating apparatus capable of cleaning a conductive copper head as recited in claim 1, wherein: the steel belt surrounds the two rotating wheels which are arranged at intervals, so that a surrounding space for containing the rotating wheels is formed by the inner side surface of the steel belt in a surrounding mode, the rotating wheels can rotate by taking a rotating axis as an axis under the driving of the rotating wheels, and the copper head brush head rotates by taking a copper head cleaning axis which is perpendicular to the rotating axis as the axis.
3. The plating apparatus capable of cleaning a conductive copper head as recited in claim 2, wherein: the copper head cleaning mechanism is located above the steel belt so that the copper head brush head and the copper head cleaning drive source are both located outside the surrounding space.
4. The plating apparatus capable of cleaning a conductive copper head as recited in claim 2, wherein: the steel belt is provided with two mounting sections which are mounted on one of the rotating wheels in a one-to-one mode, a cleaning section close to the copper head cleaning mechanism and an electroplating section which is arranged on the cleaning section at intervals are arranged between the two mounting sections, and the electroplating section is located above an electroplating tank which is mounted on the rack.
5. The plating apparatus capable of cleaning a conductive copper head as recited in claim 1, wherein: the conductive unit is also connected with two guide rollers on the conductive seat, and the two guide rollers are contacted with a guide rail connected with the rack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220273970.9U CN216891289U (en) | 2022-02-10 | 2022-02-10 | Electroplating device capable of cleaning conductive copper head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220273970.9U CN216891289U (en) | 2022-02-10 | 2022-02-10 | Electroplating device capable of cleaning conductive copper head |
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| Publication Number | Publication Date |
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| CN216891289U true CN216891289U (en) | 2022-07-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220273970.9U Active CN216891289U (en) | 2022-02-10 | 2022-02-10 | Electroplating device capable of cleaning conductive copper head |
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| CN (1) | CN216891289U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115369470A (en) * | 2022-09-26 | 2022-11-22 | 惠州深格光电科技有限公司 | Copper plating device and copper plating method for PET (polyethylene terephthalate) conducting layer |
-
2022
- 2022-02-10 CN CN202220273970.9U patent/CN216891289U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115369470A (en) * | 2022-09-26 | 2022-11-22 | 惠州深格光电科技有限公司 | Copper plating device and copper plating method for PET (polyethylene terephthalate) conducting layer |
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