CN216889072U - No-damage wafer material neatening device - Google Patents
No-damage wafer material neatening device Download PDFInfo
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- CN216889072U CN216889072U CN202220739286.5U CN202220739286U CN216889072U CN 216889072 U CN216889072 U CN 216889072U CN 202220739286 U CN202220739286 U CN 202220739286U CN 216889072 U CN216889072 U CN 216889072U
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- strip
- guide rod
- bottom plate
- shaped hole
- material receiving
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model relates to a non-damage material wafer aligning device which comprises a rack and a material receiving table arranged above the rack, wherein a bottom plate is arranged on the rack in a sliding manner, a guide rod I and an air cylinder are arranged on the bottom plate, an output shaft of the air cylinder is connected with the material receiving table through a movable assembly, and the upper end part of the guide rod I is connected with the material receiving table through a connecting seat; the material receiving platform is provided with a first strip-shaped hole or a first groove, the bottom plate is provided with a second strip-shaped hole or a second groove corresponding to the first strip-shaped hole or the second groove, a second guide rod penetrates through the first strip-shaped hole or the first groove, and the lower end of the second guide rod is fixed in the second strip-shaped hole or the second groove corresponding to the second guide rod in a sliding mode. Through adjustable material receiving table inclination, cooperation guide arm two for when falling on the material receiving bench that the slope set up, can not injure by a crashing object and damage the disk surface.
Description
Technical Field
The utility model relates to the technical field of mechanical equipment, in particular to a non-damage wafer aligning device.
Background
The material aligning device is mainly used for carrying cut round sheet materials in structure, the existing material aligning device is mostly a horizontally arranged material receiving platform which is arranged at the end part of a conveying belt, round sheet materials fall on the horizontally arranged material receiving platform one by one under the action of gravity from the end part of the conveying belt, and the round sheet materials are taken away after being stacked to a certain height. When the round sheet material falls down, the round sheet material is smashed on the surface of the round sheet material which falls down, so that the surface of the wafer is easy to damage, and the round sheet material is easy to damage.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the background art, the utility model provides a non-damage wafer material neatening device, and overcomes the defects.
The technical scheme adopted by the utility model for solving the technical problem is as follows: a damage-free material wafer aligning device comprises a rack and a material receiving table arranged above the rack, wherein a bottom plate is arranged on the rack in a sliding mode, a guide rod I and an air cylinder are arranged on the bottom plate, an output shaft of the air cylinder is connected with the material receiving table through a movable assembly, and the upper end part of the guide rod I is connected with the material receiving table through a connecting seat; the material receiving platform is provided with a first strip-shaped hole or groove, the bottom plate is provided with a second strip-shaped hole or groove corresponding to the first strip-shaped hole or groove, a second guide rod penetrates through the first strip-shaped hole or groove, and the lower end of the second guide rod is fixed in the second strip-shaped hole or groove corresponding to the second guide rod in a sliding mode.
The cylinder is fixed below the bottom plate.
The first strip-shaped holes or the first grooves are three, and the three circumferences are evenly distributed.
The movable assembly comprises an intermediate piece and a connecting seat; the intermediate piece is rotatably connected with the connecting seat, the intermediate piece is rotatably connected with the cylinder output shaft, and the connecting seat is fixedly connected with the material receiving platform.
The automatic feeding machine is characterized in that a guide rail and a transverse cylinder are further arranged on the rack, a sliding block is arranged at the bottom of the bottom plate and slides along the guide rail, and an output pump of the transverse cylinder is fixedly connected with the bottom plate through a connecting sheet.
The two transverse cylinders are respectively positioned on the front side and the rear side of the bottom plate and are arranged diagonally.
The lower end part of the second guide rod is provided with an upper pressing plate and a lower pressing plate, the upper pressing plate and the lower pressing plate are respectively positioned above and below the bottom plate, the upper pressing plate and the lower pressing plate are connected through a stud, the stud penetrates through the strip-shaped hole or the second groove, and the stud is in threaded connection with the lower pressing plate.
The top end of the second guide rod far away from the cylinder is arranged in an inclined plane.
By adopting the technical scheme, the horizontal arrangement of the material receiving platform of the conventional material aligning device is effectively improved, and the round sheet materials falling on the material receiving platform before being damaged by smashing are avoided when the round sheet materials are stacked. Through adjustable material receiving table inclination, cooperation guide arm two for when falling on the material receiving bench that the slope set up, can not injure by a crashing object and damage the disk surface.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a plan view of the left receiving plate in fig. 1.
Fig. 3 is a schematic sectional view taken at a-a of fig. 2.
FIG. 4 is a schematic view of a connection structure between the first guide rod and the receiving platform.
Detailed Description
Referring to fig. 1-4, the utility model discloses a damage-free material wafer aligning device, which comprises a rack 1 and a material receiving table 2 arranged above the rack 1, wherein a bottom plate 3 is arranged on the rack 1 in a sliding manner, a guide rod I4 and an air cylinder 5 are arranged on the bottom plate 3, an output shaft of the air cylinder 5 is connected with the material receiving table 2 through a movable assembly 6, and the upper end part of the guide rod I4 is connected with the material receiving table 2 through a connecting seat 41; the material receiving platform 2 is provided with a first strip-shaped hole or groove 21, the bottom plate 3 is provided with a second strip-shaped hole or groove 31 corresponding to the first strip-shaped hole or groove, a second guide rod 7 penetrates through the first strip-shaped hole or groove 21, and the lower end of the second guide rod 7 is fixed in the second strip-shaped hole or groove 31 corresponding to the second guide rod in a sliding mode.
The cylinder 5 is fixed below the bottom plate 3.
The first strip-shaped holes or the first grooves 21 are three and are evenly distributed on the three circumferences. As shown in figures 1-2.
The movable assembly 6 comprises an intermediate piece 61 and a connecting seat 41; the intermediate piece 61 is rotatably connected with the connecting base 41, the intermediate piece 61 is rotatably connected with the cylinder output shaft 51, and the connecting base 41 is fixedly connected with the material receiving platform 2. As shown in fig. 3-4, the inclination angle of the material receiving plate 2 is adjusted by the cylinder 5.
The machine frame 1 is further provided with a guide rail 11 and a transverse cylinder 8, the bottom of the bottom plate 3 is provided with a sliding block 32, the sliding block 32 slides along the guide rail 11, and the output pump of the transverse cylinder 8 is fixedly connected with the bottom plate 6 through a connecting sheet 81. The two transverse cylinders 8 are respectively arranged at the front side and the rear side of the bottom plate 3, and the two transverse cylinders 8 are arranged diagonally, so that the movement is more stable. As shown in fig. 1-2, the transverse cylinder 8 adjusts the position of the bottom plate 3 on the frame 1, and drives the bottom plate 3 to move left and right along the guide rail 11.
The lower end part of the second guide rod 7 is provided with an upper pressing plate 71 and a lower pressing plate 72, the upper pressing plate and the lower pressing plate are respectively positioned above and below the base plate 3, the upper pressing plate and the lower pressing plate are connected through a stud (not shown in the figure), the stud penetrates through the strip-shaped hole or the second groove 31, the stud is in threaded connection with the lower pressing plate 72, as shown in the attached drawing 3, the position of the second guide rod 7 in the strip-shaped hole or the second groove 31 is adjusted by adjusting the distance between the lower pressing plate 72 and the upper pressing plate 71, namely, the pressing friction force of the upper pressing plate and the lower pressing plate on the base plate 3 is adjusted, namely, the position of the second guide rod 7 in the strip-shaped hole or the first groove 21 is adjusted, and wafers with different diameters are corresponded.
The top end of the second guide rod 7 far away from the cylinder 5 is arranged in a slope 70, and the height of the second guide rod 7 is lower than that of the other two guide rods 7, as shown in fig. 3.
Preferably, the utility model is a double station arrangement, i.e. two wafers can be stacked. Specifically, as shown in fig. 1, the three second guide rods 7 and the receiving platform 2 form a wafer stacking area 9, and when the device is placed, one side far away from the cylinder 5 is close to a wafer conveyer belt (not shown in the figure), and when the wafers on the conveyer belt pass through the second guide rods 7 with the inclined surfaces 70 by self gravity and inertia, the wafers fall into the stacking area 9.
The utility model effectively improves the condition that the material receiving platform 2 of the existing material aligning device is horizontally arranged, and round sheet materials falling on the material receiving platform 2 are damaged before the round sheet materials falling on the material receiving platform are stacked. Through adjustable material platform 2 inclination, cooperation guide arm two 7 for when falling on the material platform 2 that connects that the slope set up, can not injure by a crashing object and damage the disk surface.
It is to be understood that the above examples are merely illustrative for clarity of description and are not limiting on the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are intended to be within the scope of the utility model.
Claims (8)
1. The utility model provides a no hinder material disk and expect device together, includes the frame and arranges the material platform that connects of frame top in, its characterized in that: a bottom plate is arranged on the rack in a sliding mode, a guide rod I and an air cylinder are arranged on the bottom plate, an output shaft of the air cylinder is connected with the material receiving table through a movable assembly, and the upper end portion of the guide rod I is connected with the material receiving table through a connecting seat; the material receiving platform is provided with a first strip-shaped hole or groove, the bottom plate is provided with a second strip-shaped hole or groove corresponding to the first strip-shaped hole or groove, a second guide rod penetrates through the first strip-shaped hole or groove, and the lower end of the second guide rod is fixed in the second strip-shaped hole or groove corresponding to the second guide rod in a sliding mode.
2. A wound-free wafer collating device as claimed in claim 1, wherein: the cylinder is fixed below the bottom plate.
3. A wound-free wafer collating device as claimed in claim 1, wherein: the first strip-shaped holes or the first grooves are three, and the three circumferences are evenly distributed.
4. A wound-free wafer collating device as claimed in claim 1, wherein: the movable assembly comprises an intermediate piece and a connecting seat; the intermediate piece is rotatably connected with the connecting seat, the intermediate piece is rotatably connected with the cylinder output shaft, and the connecting seat is fixedly connected with the material receiving platform.
5. A wound-free wafer collating device as claimed in claim 1, wherein: the automatic feeding machine is characterized in that a guide rail and a transverse cylinder are further arranged on the rack, a sliding block is arranged at the bottom of the bottom plate and slides along the guide rail, and an output pump of the transverse cylinder is fixedly connected with the bottom plate through a connecting sheet.
6. A wound-free wafer collating device as claimed in claim 5, wherein: the two transverse cylinders are respectively positioned on the front side and the rear side of the bottom plate and are arranged diagonally.
7. A wound-free wafer collating device as claimed in claim 1, wherein: the lower end part of the second guide rod is provided with an upper pressing plate and a lower pressing plate, the upper pressing plate and the lower pressing plate are respectively positioned above and below the bottom plate, the upper pressing plate and the lower pressing plate are connected through a stud, the stud penetrates through the strip-shaped hole or the second groove, and the stud is in threaded connection with the lower pressing plate.
8. A wound-free wafer collating device as claimed in claim 1, wherein: the top end of a guide rod II far away from the cylinder is arranged in an inclined plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220739286.5U CN216889072U (en) | 2022-04-01 | 2022-04-01 | No-damage wafer material neatening device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220739286.5U CN216889072U (en) | 2022-04-01 | 2022-04-01 | No-damage wafer material neatening device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216889072U true CN216889072U (en) | 2022-07-05 |
Family
ID=82193634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220739286.5U Active CN216889072U (en) | 2022-04-01 | 2022-04-01 | No-damage wafer material neatening device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216889072U (en) |
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2022
- 2022-04-01 CN CN202220739286.5U patent/CN216889072U/en active Active
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