CN216884888U

CN216884888U - Preparation device of high-heat-conduction and high-resilience heat-conduction silica gel pad

Info

Publication number: CN216884888U
Application number: CN202220303056.4U
Authority: CN
Inventors: 陶凤娟; 陈杨光
Original assignee: Shenzhen Shenyu Xinke Rubber Plastic Co ltd
Current assignee: Shenzhen Shenyu Xinke Rubber Plastic Co ltd
Priority date: 2022-02-15
Filing date: 2022-02-15
Publication date: 2022-07-05
Anticipated expiration: 2032-02-15

Abstract

The utility model relates to the technical field of silica gel processing, in particular to a high-thermal-conductivity high-resilience thermal silica gel pad preparation device, which comprises a portal bracket, wherein the top of the surface of the portal bracket is connected with a hydraulic cylinder, the hydraulic cylinder is connected with a die plate through a hydraulic rod, one side of the die plate, which is far away from the hydraulic cylinder, is integrally connected with a shaping plate, one side of the shaping plate, which is far away from the die plate, is connected with a cutting blade, an anti-overflow groove is arranged below the cutting blade, the anti-overflow groove is connected to the surface of a first die plate for a circle, the surface of the first die plate is provided with a first die groove, the bottom of the first die groove is connected with a second die groove, the bottom of the second die groove is connected with a baking box, the baking box is connected with the die plate, the connection of the die plate and the hydraulic cylinder are matched with the cutting blade on the surface, so that the baking, the calendaring molding and the cutting can be simultaneously carried out during the production of the silica gel pad, the time and labor cost are reduced, and meanwhile, the production efficiency is improved.

Description

Preparation device of high-heat-conduction and high-resilience heat-conduction silica gel pad

Technical Field

The utility model relates to the technical field of silica gel processing, in particular to a preparation device of a high-heat-conductivity and high-resilience heat-conducting silica gel pad.

Background

The heat conducting silica gel is one kind of heat conducting insulating compound and is used widely in various electronic products, electric equipment and other basic surface between heat generator and heat dissipating facility to reach the functions of heat conducting medium, damp proofing, dust proofing, anticorrosion, buffering, shock resistance, etc. The size of the heat conductivity coefficient of the heat-conducting silica gel pad determines the heat conductivity of the heat-conducting silica gel pad, and the compressibility and resilience of the heat-conducting silica gel pad determine whether the heat-conducting silica gel pad can be well filled into gaps of a heating part and a radiating part, and the gaps can be sealed. A good thermally conductive silicone pad should have good thermal conductivity, compressibility, and resiliency.

When the heat-conducting silica gel pad is produced, the production amount is low due to the fact that the production process is complex and the baking time of the heat-conducting silica gel pad is long, the time cost and the labor cost required in the production process are high, and the production efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a preparation device of a high-heat-conduction high-resilience heat-conduction silica gel pad, which can effectively solve the problems in the background art.

In order to realize the purpose, the utility model adopts the technical scheme that:

the device for preparing the high-heat-conductivity and high-resilience heat-conducting silica gel pad comprises a portal support, wherein the top of the surface of the portal support is connected with a hydraulic cylinder, the hydraulic cylinder is connected with a die plate through a hydraulic rod, one side of the die plate, which is far away from the hydraulic cylinder, is integrally connected with a shaping plate, one side of the shaping plate, which is far away from the die plate, is provided with a connecting cavity, two ends of the inner wall of the connecting cavity are both connected with connecting springs, two sides of each connecting spring are provided with limiting strips, the limiting strips are integrally connected with the top of the surface of a cutting blade, an anti-overflow groove is arranged below the cutting blade, the anti-overflow groove is connected to the periphery of the surface of a template, a first die groove is arranged on the surface of the template, a second die groove is connected below the first die groove, the second die groove is arranged on the surface of the template, one side of the template, which is far away from the second die groove, is integrally connected with a supporting rod, the bracing piece other end is equipped with the loop bar, the loop bar is established with bracing piece surface cover and is connected with reset spring, reset spring is located toasts the incasement, it connects in No. two template bottoms to toast the case.

As preferred, the one side that the stereotype is close to a template is connected with a plurality of cutting blade, cutting blade is close to the one side fixedly connected with connecting spring of stereotype.

As preferred, the stereotype board is fixed cutting blade in the bottom through spacing and coupling spring, the spacing and the coupling spring of cutting blade one end are located the coupling cavity.

Preferably, the bottom surface of the first die groove is fixedly connected with a sizing plate and a cutting blade.

Preferably, a connecting groove is formed in one surface, close to the second die pressing groove, of the first die pressing groove, and the connecting groove is formed in two sides of the shaping plate at the bottom of the first die pressing groove.

Preferably, a connecting block is arranged on one surface, close to the first die groove, of the second die groove, and the connecting block is integrally connected to two sides of the second die groove.

Preferably, the supporting rod is sleeved with the loop bar, and one end of the loop bar, which is far away from the supporting rod, is integrally connected to the bottom of the inner wall of the baking oven.

Compared with the prior art, the utility model has the following beneficial effects:

connect again through die plate and pneumatic cylinder and the cutting blade on stereotype plate surface periphery mutually support make the toasting of silica gel pad when production, calendering molding and cutting three step can go on simultaneously, and toast incasement portion and connect the die plate at toasting case surface top through loop bar and bracing piece and reset spring cooperation, make the die plate can rise to toasting case surface top voluntarily after toasting the completion, it is more convenient to use, and template and No. two templates are connected and are made the production capacity promote, also improved production efficiency when having reduced time and cost of labor.

Drawings

FIG. 1 is a schematic view of the overall structure of a high thermal conductivity and high resilience thermal conductive silica gel pad preparation device of the present invention;

FIG. 2 is a schematic diagram of a front view structure of the high thermal conductivity and high resilience thermal conductive silica gel pad preparation device of the present invention;

FIG. 3 is a schematic structural view of line a-a in FIG. 2 of the apparatus for preparing a high thermal conductivity and high resilience thermal silica gel pad of the present invention;

fig. 4 is a schematic structural view of a cutting blade of the high thermal conductivity and high resilience thermal conductive silicone pad preparation device of the present invention.

In the figure: 1. a door-type support; 2. a hydraulic cylinder; 3. a hydraulic lever; 4. pressing the template; 5. shaping plates; 501. connecting the cavity; 6. a cutting blade; 601. a connecting spring; 602. a limiting strip; 7. an anti-overflow groove; 8. a first template; 9. a first die groove; 10. connecting grooves; 11. connecting blocks; 12. a second template; 13. pressing a die cavity II; 14. a support bar; 15. a loop bar; 16. a return spring; 17. a baking oven.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

As shown in fig. 1 to 4, the high-thermal-conductivity high-resilience heat-conducting silica gel pad preparation device comprises a door-type support 1, wherein the top of the surface of the door-type support 1 is connected with a hydraulic cylinder 2, the hydraulic cylinder 2 is connected with a die plate 4 through a hydraulic rod 3, one side of the die plate 4, which is far away from the hydraulic cylinder 2, is integrally connected with a shaping plate 5, one side of the shaping plate 5, which is far away from the die plate 4, is provided with a connecting cavity 501, two ends of the inner wall of the connecting cavity 501 are both connected with connecting springs 601, two sides of the connecting springs 601 are provided with limiting strips 602, the limiting strips 602 are integrally connected to the top of the surface of a cutting blade 6, an anti-overflow groove 7 is arranged below the cutting blade 6, the anti-overflow groove 7 is connected to the surface of a first die plate 8 for a circle, the surface of the first die plate 8 is provided with a first die groove 9, the lower side of the first die groove 9 is connected with a second die groove 13, the second die groove 13 is arranged on the surface of a second die plate 12, no. two template 12 keeps away from one side integration of No. two die cavity 13 and is connected with bracing piece 14, the bracing piece 14 other end is equipped with loop bar 15, loop bar 15 establishes with bracing piece 14 surface cover and is connected with reset spring 16, reset spring 16 is located toasts the incasement 17, toast the case 17 and connect in No. two template 12 bottoms.

Through the technical scheme, hydraulic stem 3 promotes die plate 4 not only can indirectly promote a template 8 and No. two templates 12 and can also make the silica gel in a moulding-die groove 9 and No. two moulding-die grooves 13 prolong the pressure forming, and 5 cutting blade 6 all around of stereotype are responsible for toasting and prolong the in-process of pressure forming with the leftover bits excision, anti-overflow groove 7 overflows in order to prevent to prolong the pressure in-process silica gel raw materials, bracing piece 14 overlaps with loop bar 15 cover and establishes in reset spring 16 in order to increase reset spring 16's steadiness, prevent reset spring 16 from buckling.

In this embodiment, the one side that the stereotype 5 is close to template 8 is connected with a plurality of cutting blade 6, cutting blade 6 is close to the one side fixedly connected with coupling spring 601 of stereotype 5, stereotype 5 fixes cutting blade 6 in the bottom through spacing 602 and coupling spring 601, the spacing 602 and the coupling spring 601 of cutting blade 6 one end are located and connect the cavity 501, the same fixedly connected with stereotype 5 of the same surface in first moulding-die groove 9 bottom and cutting blade 6, the one side that first moulding-die groove 9 is close to No. two moulding-die groove 13 has seted up spread groove 10, spread groove 10 sets up the stereotype 5 both sides in first moulding-die groove 9 bottom, No. two moulding-die groove 13 one side that is close to No. one moulding-die groove 9 is equipped with connecting block 11, connecting block 11 integration is connected in No. two moulding-die groove 13 both sides, bracing piece 14 establishes with loop bar 15 cover and is connected, the one end integration that bracing piece 14 was kept away from to loop bar 15 is connected in baking oven 17 inner wall bottom, and No. two template 12 surface bottoms also are connected with and stereotype board 5 and cutting blade 6, and cutting blade 6 and the coupling spring 601 between the board 5 of stereotypeing make stereotype 5 down not influenced by cutting blade 6 to the silica gel design, and spread groove 10 is located directly over connecting block 11, and No. one template 8 is established through spread groove 10 and connecting block 11 cover and is connected and fix at No. two template 12 surface tops.

This high heat conduction high resilience heat conduction silica gel pad preparation facilities's theory of operation:

when in use, firstly, the silica gel raw material is put into the second die groove 13, then the first die plate 8 is fixed above the second die plate 12 through the connecting groove 10 and the connecting block 11, then the rest silica gel raw material is put into the first die groove 9, then the power supply is started, the hydraulic rod 3 drives the die plate 4 to move downwards, the shaping plate 5 on the surface of the die plate 4 is responsible for rolling and shaping the silica gel, the cutting blade 6 is responsible for cutting off unnecessary silica gel leftover materials during silica gel extension forming, the connecting spring 601 between the shaping plate 5 and the cutting blade 6 is used for enabling the cutting blade 6 to adapt to silica gel pads with different thicknesses and have better effect when the silica gel pads are extended, the hydraulic rod 3 pushes the first template 8 and the second template 12 to be downwards baked in the baking box 17 to form the silica gel, when baking is completed, hydraulic rod 3 retracts upwards, and support rod 14 and return spring 16 on the surface of sleeve rod 15 are responsible for pushing template No. one 8 and template No. two 12 upwards to the top of the surface of baking box 17.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. High heat conduction high resilience heat conduction silica gel pad preparation facilities, including portal frame (1), its characterized in that: the gate-type support (1) surface top is connected with pneumatic cylinder (2), pneumatic cylinder (2) are connected with die board (4) through hydraulic stem (3), the one side integration that pneumatic cylinder (2) were kept away from to die board (4) is connected with stereotype board (5), stereotype board (5) one side of keeping away from die board (4) has been seted up and has been connected cavity (501), it all is connected with coupling spring (601) to connect cavity (501) inner wall both ends, coupling spring (601) both sides are equipped with spacing (602), spacing (602) integration is connected at cutting blade (6) surface top, cutting blade (6) below is equipped with anti-overflow groove (7), anti-overflow groove (7) are connected in template (8) surface a week, a die cavity (9) has been seted up on template (8) surface, a die cavity (9) below is connected with No. two die cavities (13), no. two die cavity (13) are seted up on No. two template (12) surfaces, the one side integration that No. two die cavity (13) were kept away from in No. two template (12) is connected with bracing piece (14), the bracing piece (14) other end is equipped with loop bar (15), loop bar (15) are established with bracing piece (14) surface cover and are connected with reset spring (16), reset spring (16) are located and toast case (17), it connects in No. two template (12) bottoms to toast case (17).

2. The device for preparing a high thermal conductivity and high resilience thermal silica gel pad according to claim 1, wherein: the one side that stereotypes board (5) is close to template (8) is connected with a plurality of cutting blade (6), cutting blade (6) are close to the one side fixedly connected with connecting spring (601) of stereotype board (5).

3. The device for preparing a high thermal conductivity and high resilience thermal silica gel pad according to claim 1, wherein: the shaping plate (5) fixes the cutting blade (6) at the bottom through a limiting strip (602) and a connecting spring (601), and the limiting strip (602) and the connecting spring (601) at one end of the cutting blade (6) are located in the connecting cavity (501).

4. The device for preparing a high thermal conductivity and high resilience thermal silica gel pad according to claim 1, wherein: the bottom surface of the first pressing die groove (9) is fixedly connected with a shaping plate (5) and a cutting blade (6) in the same way.

5. The device for preparing a high thermal conductivity and high resilience thermal silica gel pad according to claim 1, wherein: a connecting groove (10) is seted up to the one side that a moulding-die groove (9) is close to No. two moulding-die grooves (13), stereotype (5) both sides in a moulding-die groove (9) bottom are seted up in connecting groove (10).

6. The device for preparing a high thermal conductivity and high resilience thermal silica gel pad according to claim 1, wherein: a connecting block (11) is arranged on one surface, close to the first die pressing groove (9), of the second die pressing groove (13), and the connecting block (11) is integrally connected to two sides of the second die pressing groove (13).

7. The device for preparing a high thermal conductivity and high resilience thermal silica gel pad according to claim 1, wherein: the supporting rod (14) is sleeved with the sleeve rod (15) and connected with the sleeve rod, and one end, far away from the supporting rod (14), of the sleeve rod (15) is integrally connected to the bottom of the inner wall of the baking box (17).