CN213503599U

CN213503599U - Warm up special mushroom board packing mould

Info

Publication number: CN213503599U
Application number: CN202021876839.9U
Authority: CN
Inventors: 李云峰; 吴梦威
Original assignee: Chongqing Yunfeng Mould Co ltd
Current assignee: Chongqing Yunfeng Mould Co ltd
Priority date: 2020-09-01
Filing date: 2020-09-01
Publication date: 2021-06-22
Anticipated expiration: 2030-09-01

Abstract

The utility model discloses a warm up special mushroom board packing mould, including first mould, second mould, the front surface of first mould just is located the below fixedly connected with PMKD of first fixed plate, PMKD's the first fixed stop of front surface fixedly connected with, first fixed stop's last fixed surface fixedly connected with slide bar, the front surface fixedly connected with reference column of second mould, the front surface of second mould just is located the right side of reference column and is provided with the second recess, the front surface of second mould just is located the below fixedly connected with second fixed stop of second recess, the lower fixed surface fixedly connected with fixed block of second fixed stop. The utility model discloses in, the reference column makes the precision in the packaging process improve with first recess, avoids causing the waste, and slide bar and spout mutually support realize dismantling fast between the mould, improve the fast production of packing goods simultaneously.

Description

Warm up special mushroom board packing mould

Technical Field

The utility model relates to a packaging mold technical field especially relates to a warm up special mushroom board packaging mold.

Background

The floor heating is entirely called floor radiation heating, the whole floor is used as a radiator, the floor is uniformly heated by low-temperature heating medium with the temperature not higher than 60 ℃, and heat is supplied to the indoor through the floor in a radiation and convection heat transfer mode, so that the purpose of comfortable heating is achieved. The heat medium is divided into a water floor heating system and an electric floor heating system, and the heat medium is divided into a wet floor heating system and a dry floor heating system according to a paving structure.

Present current mushroom board packing mould, the accuracy is not high in packaging process, causes the waste of material easily, and when packing goods, it is troublesome to dismantle, extravagant a large amount of time, consequently needs a warm special mushroom board packing mould to solve above shortcoming.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a special mushroom plate packaging mold for floor heating.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a mushroom plate packaging mould special for floor heating comprises a first mould and a second mould, wherein the front surface of the first mould is fixedly connected with a first fixing plate, a first groove is arranged on the front surface of the first mould and positioned on the left side of the first fixing plate, a fixed bottom plate is fixedly connected on the front surface of the first mould and positioned below the first fixing plate, the front surface of the fixed bottom plate is fixedly connected with a first fixed baffle, the upper surface of the first fixed baffle is fixedly connected with a sliding rod, the front surface of the second die is fixedly connected with a positioning column, a second groove is arranged on the front surface of the second die and positioned at the right side of the positioning column, a second fixed baffle is fixedly connected with the front surface of the second die and positioned below the second groove, the lower fixed surface of second fixed stop is connected with the fixed block, the lower surface of fixed block is provided with the spout.

As a further description of the above technical solution:

the left side face of the first die is fixedly connected with two fixed handles.

As a further description of the above technical solution:

the front surface of first mould just is located PMKD's right side fixedly connected with second fixed plate, the quantity of second fixed plate is two, the front surface of first mould just is located first fixed stop's inside and is provided with places the kerve.

As a further description of the above technical solution:

the front surface of second mould just is located the right side of second fixed stop and is provided with the third recess, the quantity of third recess is two, the front surface of second mould just is located the below fixedly connected with lug of fixed block, the inner wall and the second fixed plate sliding connection of third recess.

As a further description of the above technical solution:

and a fourth groove is formed in the front surface of the second mold and positioned between the second fixed baffle and the bump.

As a further description of the above technical solution:

the inner wall of the second groove is connected with the first fixing plate in a sliding mode.

As a further description of the above technical solution:

the inner wall of the sliding groove is connected with the sliding rod in a sliding mode, and the inner wall of the first groove is connected with the positioning column in a sliding mode.

The utility model discloses following beneficial effect has:

1. compared with the prior art, the special mushroom plate packaging mold for floor heating has the advantages that the positioning columns and the first grooves are added, so that the precision in the packaging process is improved, and the waste is avoided.

2. Compared with the prior art, this special mushroom board packing mould warms up, the slide bar is mutually supported with the spout, realizes dismantling fast between the mould, improves the quick production of packing goods simultaneously.

Drawings

Fig. 1 is a schematic view of a first mold structure of a special mushroom plate packaging mold for floor heating provided by the utility model;

fig. 2 is a front view of a first mold of the mushroom plate package mold for floor heating of the present invention;

fig. 3 is a second mold structure diagram of the special mushroom plate packaging mold for floor heating provided by the utility model.

Illustration of the drawings:

1. fixing a handle; 2. a first mold; 3. a first groove; 4. a first fixing plate; 5. a slide bar; 6. fixing the bottom plate; 7. a second fixing plate; 8. placing a bottom groove; 9. a first fixed baffle; 10. a second mold; 11. a positioning column; 12. a second groove; 13. a fixed block; 14. a chute; 15. a second fixed baffle; 16. a third groove; 17. a bump; 18. and a fourth groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-3, the present invention provides an embodiment: a special mushroom plate packaging mold for floor heating comprises a first mold 2 and a second mold 10, wherein a first fixing plate 4 is fixedly connected to the front surface of the first mold 2, a first groove 3 is formed in the front surface of the first mold 2 and located on the left side of the first fixing plate 4, the first groove 3 is matched with a positioning column 11 to improve packaging accuracy, a fixing bottom plate 6 is fixedly connected to the front surface of the first mold 2 and located below the first fixing plate 4, a first fixing baffle 9 is fixedly connected to the front surface of the fixing bottom plate 6, a sliding rod 5 is fixedly connected to the upper surface of the first fixing baffle 9, the sliding rod 5 is matched with a sliding groove 14 to enable the first mold 2 and the second mold 10 to be conveniently detached, a positioning column 11 is fixedly connected to the front surface of the second mold 10, a second groove 12 is formed in the front surface of the second mold 10 and located on the right side of the positioning column 11, and the second groove 12 is matched with the first fixing plate 4 to guarantee sealing performance during packaging, the front surface of second mould 10 just is located the below fixedly connected with second fixed stop 15 of second recess 12, and second fixed stop 15 guarantees the leakproofness in the packaging process, and the lower fixed surface of second fixed stop 15 is connected with fixed block 13, and the lower surface of fixed block 13 is provided with spout 14.

The left side surface of the first mold 2 is fixedly connected with two fixed handles 1, the number of the fixed handles 1 is two, the front surface of the first mold 2 and positioned at the right side of the fixed bottom plate 6 are fixedly connected with a second fixed plate 7, the number of the second fixed plate 7 is two, the front surface of the first mold 2 and positioned at the inner part of the first fixed baffle 9 are provided with a placing bottom groove 8, the front surface of the second mold 10 and positioned at the right side of the second fixed baffle 15 are provided with a third groove 16, the number of the third grooves 16 is two, the front surface of the second mold 10 and positioned below the fixed block 13 are fixedly connected with a convex block 17, the front surface of the second mold 10 and positioned between the second fixed baffle 15 and the convex block 17 are provided with a fourth groove 18, the inner wall of the second groove 12 is connected with the first fixed plate 4 in a sliding manner, the inner wall of the third groove 16 is connected with the second fixed plate 7 in a sliding manner, and the inner wall of the, the inner wall of the first groove 3 is connected with the positioning column 11 in a sliding mode.

The working principle is as follows: when using the device, the front surface of first mould 2 is provided with PMKD 6, PMKD 6's front surface is provided with places the kerve 8, place the mushroom board through placing the kerve 8, the front surface of first mould 2 is equipped with slide bar 5, first fixed plate 4 and second fixed plate 7 make the sealed closure that packs goods is quick through the front surface spout 14 of cooperation second mould 10, second recess 12 and third recess 16, reference column 11 and first recess 3 mutually support the accuracy of guaranteeing the packing and decide, lug 17 and place the kerve 8 mutually support and make the quick shaping of packing.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. The utility model provides a warm up special mushroom board packing mould, includes first mould (2), second mould (10), its characterized in that: the front surface of the first mold (2) is fixedly connected with a first fixing plate (4), the front surface of the first mold (2) and positioned on the left side of the first fixing plate (4) are provided with a first groove (3), the front surface of the first mold (2) and positioned below the first fixing plate (4) are fixedly connected with a fixing bottom plate (6), the front surface of the fixing bottom plate (6) is fixedly connected with a first fixing baffle (9), the upper surface of the first fixing baffle (9) is fixedly connected with a slide bar (5), the front surface of the second mold (10) is fixedly connected with a positioning column (11), the front surface of the second mold (10) and positioned on the right side of the positioning column (11) is provided with a second groove (12), the front surface of the second mold (10) and positioned below the second groove (12) are fixedly connected with a second fixing baffle (15), the lower surface of the second fixed baffle (15) is fixedly connected with a fixed block (13), and the lower surface of the fixed block (13) is provided with a sliding groove (14).

2. The mushroom plate packaging mold special for floor heating as claimed in claim 1, wherein: the left side face of the first die (2) is fixedly connected with two fixed handles (1), and the number of the fixed handles (1) is two.

3. The mushroom plate packaging mold special for floor heating as claimed in claim 1, wherein: the front surface of first mould (2) just is located the right side fixedly connected with second fixed plate (7) of PMKD (6), the quantity of second fixed plate (7) is two, the front surface of first mould (2) just is located the inside of first fixed stop (9) and is provided with places kerve (8).

4. The mushroom plate packaging mold special for floor heating as claimed in claim 1, wherein: the front surface of second mould (10) just is located the right side of second fixed stop (15) and is provided with third recess (16), the quantity of third recess (16) is two, the front surface of second mould (10) just is located below fixedly connected with lug (17) of fixed block (13), the inner wall and the second fixed plate (7) sliding connection of third recess (16).

5. The mushroom plate packaging mold special for floor heating as claimed in claim 1, wherein: and a fourth groove (18) is formed in the front surface of the second die (10) and positioned between the second fixed baffle (15) and the bump (17).

6. The mushroom plate packaging mold special for floor heating as claimed in claim 1, wherein: the inner wall of the second groove (12) is connected with the first fixing plate (4) in a sliding mode.

7. The mushroom plate packaging mold special for floor heating as claimed in claim 1, wherein: the inner wall of the sliding groove (14) is connected with the sliding rod (5) in a sliding mode, and the inner wall of the first groove (3) is connected with the positioning column (11) in a sliding mode.