CN216884791U

CN216884791U - Mould with compound die buffering protection

Info

Publication number: CN216884791U
Application number: CN202123423274.6U
Authority: CN
Inventors: 龚发友; 周桥如; 王雨波; 吴兆松; 杨军
Original assignee: Dongguan Dingwei Precision Technology Co ltd
Current assignee: Dongguan Dingwei Precision Technology Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-07-05
Anticipated expiration: 2031-12-31

Abstract

The utility model belongs to the technical field of dies, and particularly relates to a die with die assembly buffering protection, which comprises an upper die body and a lower die body, wherein a heat conducting plate is fixedly installed on the inner wall of the lower die body, heat conducting rods are fixedly installed on the surface of the heat conducting plate at equal intervals, heat radiating pieces are symmetrically and fixedly installed on the surface of the heat conducting rods, sleeves are fixedly installed on the surface of the lower die body at equal intervals, a moving disc is slidably installed on the inner wall of each sleeve, and a first spring is fixedly installed on the surface of the moving disc. According to the utility model, through the arrangement of the pressure-resistant pad, the compression property of the upper die body can be improved, the buffer treatment can be carried out during die assembly under the action of the buffer pad, and the support disc and the support pad ring have good impact-resistant effect, so that when the telescopic column is stressed to push the moving disc to slide along the inner wall of the sleeve, the first spring and the second spring are stressed and deformed, the external force can be released, and the problem of overlarge impact force during die assembly is avoided.

Description

Mould with compound die buffering protection

Technical Field

The utility model relates to the technical field of dies, in particular to a die with die assembly buffer protection.

Background

As is well known, dies are various molds and tools used in industrial production for obtaining desired products by injection molding, blow molding, extrusion, die casting or forging molding, smelting, stamping and the like. In short, the mould is the instrument that is used for making shaping article, but current mould also has certain defect, does not possess good compound die buffering protection mechanism, uses for a long time and easily causes the impact damage of mould, and the radiating effect of bed die body is not good, the quick shaping of the object of not being convenient for.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a die with die assembly buffering protection, which solves the problems that the existing die does not have a good die assembly buffering protection mechanism and is easy to cause impact damage of the die after being used for a long time, and solves the problems that a lower die body is poor in heat dissipation effect and inconvenient for rapid forming of an object.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a mould with compound die buffering protection, includes mould body and bed die body, the inner wall fixed mounting of bed die body has the heat-conducting plate, the surperficial equidistance fixed mounting of heat-conducting plate has the heat conduction pole, the surperficial symmetry fixed mounting of heat conduction pole has the radiating piece, the surperficial equidistance fixed mounting of bed die body has the sleeve, telescopic inner wall slidable mounting has the removal dish, the fixed surface who removes the dish installs first spring, it is fixed between the other end of first spring and the sleeve inner wall, the fixed surface who removes the dish installs flexible post, telescopic inner wall symmetry fixed mounting has the stopper, contact between stopper and the flexible post, the fixed surface of flexible post installs the supporting disk.

Preferably, the surface of the upper die body is symmetrically and fixedly provided with pressure-resistant pads, and the surface of each pressure-resistant pad is fixedly provided with a cushion pad.

Preferably, the inner wall equidistance of bed die body has seted up the radiating groove, contact between radiating groove and the heat conduction pole.

Preferably, the inner wall of the heat dissipation groove is symmetrically provided with heat dissipation holes, and the heat dissipation holes are in contact with the heat dissipation piece.

Preferably, the surface of the supporting disk is fixedly provided with a supporting backing ring, and the supporting backing ring is made of soft rubber.

Preferably, the outside of flexible post is provided with the second spring, the both ends of second spring are fixed respectively with between supporting disk, the sleeve.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, through the arrangement of the pressure-resistant pad, the compression performance of the upper die body can be improved, the buffer treatment can be carried out during die assembly under the action of the buffer pad, and the support disc and the support pad ring have good impact-resistant effect, so that when the telescopic column is stressed to push the movable disc to slide along the inner wall of the sleeve, the first spring and the second spring are stressed and deformed, the external force can be released, and the problem of overlarge impact force during die assembly is avoided.

2. According to the utility model, through the arrangement of the heat conducting plate, the formed article on the inner wall of the lower die body can be subjected to rapid heat conducting treatment, and the heat can be conducted under the action of the heat conducting rod, and the heat can be rapidly volatilized through the matched use of the heat radiating piece, the heat radiating groove and the heat radiating hole, so that the cooling effect of object forming is improved.

Drawings

FIG. 1 is a perspective view of the overall structure of the present invention;

FIG. 2 is an elevational, cross-sectional view of FIG. 1 in accordance with the present invention;

FIG. 3 is an enlarged view taken at A of FIG. 2 in accordance with the present invention;

fig. 4 is an enlarged view of fig. 2 at B of the present invention.

In the figure: 1. an upper die body; 2. a lower die body; 3. a pressure resistant pad; 4. a cushion pad; 5. a heat conducting plate; 6. a heat conducting rod; 7. a heat sink; 8. a heat sink; 9. heat dissipation holes; 10. a sleeve; 11. a movable tray; 12. a first spring; 13. a telescopic column; 14. a limiting block; 15. a support disc; 16. a support grommet; 17. a second spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

Referring to fig. 1-4, a mold with mold closing buffer protection includes an upper mold body 1 and a lower mold body 2, a heat conducting plate 5 is fixedly mounted on an inner wall of the lower mold body 2, heat conducting rods 6 are fixedly mounted on a surface of the heat conducting plate 5 at equal intervals, heat dissipating pieces 7 are fixedly mounted on a surface of the heat conducting rods 6 at equal intervals, sleeves 10 are fixedly mounted on the surface of the lower mold body 2 at equal intervals, a moving plate 11 is slidably mounted on an inner wall of the sleeve 10, a first spring 12 is fixedly mounted on a surface of the moving plate 11, the other end of the first spring 12 is fixed to an inner wall of the sleeve 10, telescopic columns 13 are fixedly mounted on a surface of the moving plate 11, limit blocks 14 are fixedly mounted on an inner wall of the sleeve 10 at equal intervals, the limit blocks 14 contact with the telescopic columns 13, and support disks 15 are fixedly mounted on surfaces of the telescopic columns 13.

Referring to fig. 1-2, the pressure pads 3 are symmetrically and fixedly mounted on the surface of the upper die body 1, the cushion pads 4 are fixedly mounted on the surface of the pressure pads 3, and the impact force can be buffered when the upper die body 1 and the lower die body 2 are assembled by the cooperation of the pressure pads 3 and the cushion pads 4.

Referring to fig. 1-3, the inner wall of the lower mold body 2 is equidistantly provided with heat dissipation grooves 8, the heat dissipation grooves 8 are in contact with the heat conduction rod 6, and heat can be conducted and volatilized by the cooperation between the heat dissipation grooves 8 and the heat conduction rod 6.

Referring to fig. 1-3, heat dissipation holes 9 are symmetrically formed in the inner wall of the heat dissipation groove 8, the heat dissipation holes 9 are in contact with the heat dissipation member 7, and heat can be conducted and volatilized by the cooperation between the heat dissipation holes 9 and the heat dissipation member 7.

Referring to fig. 1, 2 and 4, a supporting ring 16 is fixedly mounted on a surface of the supporting plate 15, the supporting ring 16 is made of soft rubber, and the supporting effect of the supporting plate 15 can be improved by the supporting ring 16.

Referring to fig. 1, 2 and 4, the outer side of the telescopic column 13 is provided with a second spring 17, two ends of the second spring 17 are respectively fixed between the supporting plate 15 and the sleeve 10, and the arrangement of the second spring 17 can improve the buffering effect of the lower mold body 2.

The specific implementation process of the utility model is as follows: when the mould that has compound die buffering protection is used to needs, through the setting of heat-conducting plate 5, can become the heat of intracavity portion and conduct lower mould body 2, and under the heat conduction pole 6 and radiating groove 8 with the mating reaction of radiating piece 7 and louvre 9, can conduct the heat, resume, improve the shaping cooling effect of object, through withstand voltage pad 3, blotter 4's setting, make upper mould body 1, when the compound die of lower mould body 2, can cushion the release to the impact force, and supporting disk 15, support backing ring 16 possesses good shock-resistant effect, when making flexible post 13 atress promote to move dish 11 and slide along sleeve 10 inner wall, first spring 12, the compression of second spring 17 atress, can release to the external force, avoid the too big problem during the compound die.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a mould with compound die buffering protection, includes mould body (1) and bed die body (2), its characterized in that: the inner wall of the lower die body (2) is fixedly provided with a heat conducting plate (5), the surface of the heat conducting plate (5) is fixedly provided with heat conducting rods (6) at equal intervals, radiating pieces (7) are symmetrically and fixedly installed on the surface of the heat conducting rod (6), sleeves (10) are fixedly installed on the surface of the lower die body (2) at equal intervals, a moving disc (11) is slidably mounted on the inner wall of the sleeve (10), a first spring (12) is fixedly mounted on the surface of the moving disc (11), the other end of the first spring (12) is fixed with the inner wall of the sleeve (10), the surface of the movable disc (11) is fixedly provided with a telescopic column (13), the inner wall of the sleeve (10) is symmetrically and fixedly provided with limit blocks (14), the limiting block (14) is in contact with the telescopic column (13), and a supporting disk (15) is fixedly mounted on the surface of the telescopic column (13).

2. The mold with clamping buffer protection as claimed in claim 1, wherein: the surface of the upper die body (1) is symmetrically and fixedly provided with a pressure-resistant pad (3), and the surface of the pressure-resistant pad (3) is fixedly provided with a cushion pad (4).

3. The mold with clamping buffer protection as claimed in claim 1, wherein: radiating grooves (8) have been seted up to the inner wall equidistance of bed die body (2), contact between radiating grooves (8) and heat conduction pole (6).

4. A mold having clamping cushioning protection as set forth in claim 3, wherein: the heat dissipation groove is characterized in that heat dissipation holes (9) are symmetrically formed in the inner wall of the heat dissipation groove (8), and the heat dissipation holes (9) are in contact with the heat dissipation piece (7).

5. A mold having clamp buffering protection as claimed in claim 1, wherein: the surface fixed mounting of supporting disk (15) has support backing ring (16), support backing ring (16) are soft rubber material.

6. The mold with clamping buffer protection as claimed in claim 1, wherein: the outside of flexible post (13) is provided with second spring (17), the both ends of second spring (17) are fixed respectively with between supporting disk (15), sleeve (10).