CN216871768U - Film capacitor heat conduction channel - Google Patents
Film capacitor heat conduction channel Download PDFInfo
- Publication number
- CN216871768U CN216871768U CN202220047112.2U CN202220047112U CN216871768U CN 216871768 U CN216871768 U CN 216871768U CN 202220047112 U CN202220047112 U CN 202220047112U CN 216871768 U CN216871768 U CN 216871768U
- Authority
- CN
- China
- Prior art keywords
- heat
- capacitor
- resistant sleeve
- heat conduction
- insulating heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 49
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000741 silica gel Substances 0.000 claims abstract description 11
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 11
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 9
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 9
- 239000008187 granular material Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000006004 Quartz sand Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Images
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model discloses a heat conduction channel of a film capacitor, which comprises an insulating heat-resistant sleeve, wherein metal oxide is filled in the insulating heat-resistant sleeve, and two ends of the insulating heat-resistant sleeve are packaged by heat-conducting silica gel; the insulating heat-resistant sleeve is arranged in the gap between the containing cores. The utility model leads out the high temperature point between the capacitor cores of the capacitor, reduces the internal temperature gradient of the capacitor and prolongs the service life of the capacitor.
Description
Technical Field
The utility model relates to a heat conduction channel, in particular to a heat conduction channel of a film capacitor.
Background
The film capacitor is one of the main passive devices of the power electronic equipment, and plays roles of supporting, filtering, absorbing, resonating and the like in a circuit, the voltage resistance, the working current and the like of the single film capacitor cannot meet the requirements of practical application along with the improvement of the power electronic equipment, and a combined method is generally adopted in order to meet the requirements of the circuit on the performance of the film capacitor. Various losses exist due to the capacitor itself, such as: the dielectric loss, impedance, capacitive reactance and inductive reactance all cause the power loss of the capacitorThe capacitor is heated due to consumption, the combined thin-film capacitor widely applied at present basically adopts a natural heat dissipation method, although various methods are adopted in the design and manufacturing process of the capacitor to reduce the power loss of the capacitor, the temperature inside the capacitor is uneven, and the high point temperature is 5-10 ℃ higher than the shell temperatureoC or higher. Organic dielectric materials used for thin film capacitors, such as: the service life of the polypropylene can be reduced by more than 10 percent when the temperature of the polypropylene is increased by 10K, so that the reduction of the high point temperature in the film capacitor has positive significance for prolonging the service life of the film capacitor.
The combined thin film capacitor mainly comprises: the capacitor core, the inner electrode, the inner lead, the terminal, the shell and the organic packaging material, which belongs to the self-heat-dissipation electronic element. The heat generated by various losses of the capacitor under the action of current is generally less than 2.0W/mK due to the small heat conductivity coefficient of the organic packaging material, the heat conductivity coefficient of commonly used epoxy, silica gel or polyurethane is 0.6W/mK, the material with high heat conductivity coefficient is expensive, the voltage resistance of the material is obviously reduced, the internal temperature of the capacitor is higher than the temperature of the shell, and the highest temperature point exists in the middle of the capacitor core, so that the service life of the capacitor is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art and provide a heat conduction channel of a film capacitor, which leads out the high temperature point between capacitor cores of the capacitor, reduces the internal temperature gradient of the capacitor and prolongs the service life of the capacitor.
The purpose of the utility model is realized as follows: a heat conduction channel of a film capacitor comprises an insulating heat-resistant sleeve, wherein metal oxide is filled in the insulating heat-resistant sleeve, and two ends of the insulating heat-resistant sleeve are packaged by heat-conducting silica gel; the insulating heat-resistant sleeve is arranged in a gap between the containing cores.
By adopting the technical scheme, compared with the prior art, the utility model has the beneficial effects that: the heat conduction pipe is arranged between the capacitor cores, the heat conduction silica gel is in contact with the capacitor shell, the metal oxide is filled in the heat conduction silica gel to ensure the heat conduction effect, the high temperature point between the capacitor cores is led out, the temperature gradient in the capacitor is reduced, and the service life of the capacitor is prolonged.
In order to better contact with the containing core for heat conduction, the diameter range of the insulating heat-resistant sleeve is 4 mm-20 mm.
In order to enable the heat-conducting silica gel at the two ends of the heat-conducting channel to be in contact with the shell as much as possible, the length of the insulating heat-resisting sleeve is the same as that of the capacitor shell.
In order to improve and guarantee the heat conduction effect, the metal oxide is a granular material with a heat conduction coefficient larger than 10W/mK.
Drawings
Fig. 1 is a schematic view of a heat conduction channel installation structure of the present invention.
FIG. 2 is a schematic structural diagram of the present invention.
Wherein, 1 holds the core, 2 heat conduction channels, 2-1 insulating heat-resistant sleeve, 2-2 heat conduction silica gel, 2-3 metal oxide.
Detailed Description
As shown in FIG. 2, the heat conducting channel of the film capacitor comprises an insulating heat-resistant sleeve 2-1, wherein the working temperature of the insulating heat-resistant sleeve 2-1 is-80 DEGoC ~ 150 oC, filling 2-3 metal oxide into the insulating heat-resistant sleeve 2-1, wherein the 2-3 metal oxide is a granular material with a heat conductivity coefficient larger than 10W/mK, and quartz sand is adopted in the embodiment; two ends of the insulating heat-resistant sleeve 2-1 are packaged by heat-conducting silica gel 2-2, the heat conductivity coefficient of the heat-conducting silica gel 2-2 is greater than 2.0W/mK, the insulating heat-resistant sleeve 2-1 is arranged in a gap between the containing cores 1, and the diameter range of the insulating heat-resistant sleeve 2-1 is 4 mm-20 mm; the length of the insulating heat-resistant sleeve 2-1 is the same as that of the capacitor shell, so that the heat-conducting silica gel 2-3 at the two ends of the heat-conducting channel is in contact with the shell as much as possible.
When the utility model works, the heat conducting channel 2 is arranged at the position shown in figure 1 after the combination of the containing cores 1 is finished; the following table shows the measurement results of the temperature between the capacitor cores of the capacitor with or without the heat conducting channel according to the test method specified by the IEC16071 standard. As can be seen from the table, in the last 6 hours of the thermal stability test, the temperature between the capacitor capacity cores 4 with the heat conduction channels 2 is obviously lower than that between the capacity cores without the channels, the average temperature rise is reduced by 40 percent, and the heat dissipation capacity of the capacitor provided with the heat conduction channels is obviously improved.
The present invention is not limited to the above-mentioned embodiments, and based on the technical solutions disclosed in the present invention, those skilled in the art can make some substitutions and modifications to some technical features without creative efforts according to the disclosed technical contents, and these substitutions and modifications are all within the protection scope of the present invention.
Claims (4)
1. A heat conduction channel of a film capacitor is characterized by comprising an insulating heat-resistant sleeve, wherein metal oxide is filled in the insulating heat-resistant sleeve, and two ends of the insulating heat-resistant sleeve are packaged by heat-conducting silica gel; the insulating heat-resistant sleeve is arranged in a gap between the containing cores.
2. The film capacitor heat conduction channel as claimed in claim 1, wherein the diameter of the insulating heat-resistant sleeve is in the range of 4mm to 20 mm.
3. The film capacitor heat conduction channel of claim 1, wherein the insulating heat resistant sleeve has a length equal to a length of the capacitor case.
4. The film capacitor as claimed in claim 1, wherein the metal oxide is a granular material having a thermal conductivity greater than 10W/mK.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220047112.2U CN216871768U (en) | 2022-01-10 | 2022-01-10 | Film capacitor heat conduction channel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220047112.2U CN216871768U (en) | 2022-01-10 | 2022-01-10 | Film capacitor heat conduction channel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216871768U true CN216871768U (en) | 2022-07-01 |
Family
ID=82150156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220047112.2U Expired - Fee Related CN216871768U (en) | 2022-01-10 | 2022-01-10 | Film capacitor heat conduction channel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216871768U (en) |
-
2022
- 2022-01-10 CN CN202220047112.2U patent/CN216871768U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220701 |