CN216871174U - Network card heat dissipation device and electronic device - Google Patents
Network card heat dissipation device and electronic device Download PDFInfo
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- CN216871174U CN216871174U CN202220644660.3U CN202220644660U CN216871174U CN 216871174 U CN216871174 U CN 216871174U CN 202220644660 U CN202220644660 U CN 202220644660U CN 216871174 U CN216871174 U CN 216871174U
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Abstract
The application provides a network card heat dissipation equipment and electronic equipment relates to heat dissipation technical field, and this network card heat dissipation equipment sets up on electronic equipment's mainboard, network card heat dissipation equipment includes: the air guide cover and the heat radiation fan; the heat radiation fan is connected with the mainboard through a fan terminal; the heat dissipation fan is configured to be started when the electronic equipment is in a preset state so as to form air flow; and the air guide cover is arranged between the cooling fan and the network card and used for guiding the airflow formed by the cooling fan to the network card so as to cool the network card. The network card heat dissipation device provided by the embodiment of the application is independently arranged on the mainboard to dissipate heat for the network card, heat dissipation airflow is provided through the heat dissipation fan, and the heat dissipation airflow is guided to the network card through the air guide cover to cool the network card, so that the heat dissipation power consumption can be reduced, the heat dissipation is provided for the network card, and meanwhile, the circuit design cost is saved.
Description
Technical Field
The application relates to the field of heat dissipation, in particular to network card heat dissipation equipment and electronic equipment.
Background
The higher the performance of the standard Network card is, the higher the corresponding power consumption is, so the heat dissipation requirement of the Network card is increased, especially when the Network card supports a Network Controller side band Interface (NCSI) function, the Network card is also in a working state in the S5 state, and at this time, a heat dissipation fan of a motherboard where the Network card is located is in a non-working state, so that the problem that the Network card generates heat seriously and cannot dissipate heat exists.
SUMMERY OF THE UTILITY MODEL
An object of the embodiments of the present application is to provide a network card heat dissipation device and an electronic device, so as to solve the problem of heat dissipation of a network card.
In a first aspect, an embodiment of the present application provides a network card heat dissipation device, where the network card heat dissipation device is disposed on a motherboard of an electronic device; the network card heat dissipation device comprises:
the air guide cover and the heat radiation fan;
the heat radiation fan is connected with the mainboard through a fan terminal;
the heat dissipation fan is configured to be started when the electronic equipment is in a preset state so as to form air flow;
the air guide cover is arranged between the cooling fan and the network card and used for guiding airflow formed by the cooling fan to the network card so as to cool the network card.
In the implementation process, the network card heat dissipation device for dissipating heat of the network card is independently arranged on the mainboard, the heat dissipation air flow is provided through the heat dissipation fan, and the heat dissipation air flow is guided to the network card through the air guide cover so as to cool the network card, so that the heat dissipation power consumption can be reduced, the heat dissipation is provided for the network card, and the circuit design cost is saved.
Optionally, the cooling fan is connected to the motherboard through the fan terminal, and the fan terminal includes a power supply pin, a rotational speed feedback pin, and a speed regulation pin;
the power supply pins are used for supplying power to the heat dissipation fan;
the rotating speed feedback pin is used for sending a signal representing the rotating speed of the cooling fan;
the speed regulating pin is used for receiving a signal for controlling the rotating speed of the cooling fan.
Optionally, the power supply pin comprises a positive electrode pin and a negative electrode pin, and the power supply pin supplies power to the heat dissipation fan based on the rated voltage in the S5 state.
In the implementation process, the heat radiation fan and the mainboard are connected through the fan terminal, so that the heat radiation fan can be powered and the rotating speed of the fan can be controlled, the current rotating speed information of the fan can be acquired in real time through the rotating speed feedback stitch, the current rotating speed information of the fan can be controlled according to the current rotating speed of the fan, and the working stability and the energy saving performance of the heat radiation fan can be improved.
Optionally, the preset state includes an S5 state in an advanced configuration and power management interface (ACPI), and the network card heat sink further includes a control module, where the control module performs signal interaction with the heat sink fan through a fan terminal, and is configured to start the heat sink fan when receiving a signal indicating that the electronic device is in the S5 state.
In the implementation process, the control module can control the electronic equipment to supply power to the cooling fan when the electronic equipment is in the S5 state, so that the problem that the network card cannot dissipate heat in the S5 state when supporting the NCSI function can be solved, and the reliability of the network card in operation can be improved. In addition, according to the embodiment of the application, the independent cooling fan is arranged for the network card, so that the cooling energy consumption can be reduced, and the cost is saved.
Optionally, the control module includes a substrate management controller, and the substrate management controller is configured to acquire the temperature of the network card, generate a control signal according to the temperature, and send the control signal to the cooling fan through the speed-adjusting pin to control the rotation speed of the cooling fan. And the cooling fan changes the rotating speed when receiving the control signal, and returns a feedback signal representing the current rotating speed through the rotating speed feedback pin.
In the implementation process, the rotating speed of the fan can be circularly and dynamically controlled according to the temperature of the network card through the substrate management controller, and the rotating speed of the fan can be adjusted according to different working conditions and environments, so that the energy conservation and the effective noise control of the fan are further realized.
Optionally, the wind scooper includes a wind scooper main body and a hook; one end of the clamping hook comprises a convex part, and the other end of the clamping hook is connected with the air guide cover main body; the bulge extends to the back of the main board through a through hole arranged on the main board and is limited by the through hole to move so as to fix the wind scooper on the main board.
In the implementation process, the air guide cover can be installed and detached without tools by arranging the clamping hook on the air guide cover, and limiting the movement of the clamping hook to fixedly install the air guide cover on the mainboard through the matching of the protruding part of the clamping hook and the through hole on the mainboard.
Alternatively, the heat dissipation fan may be a centrifugal fan.
Alternatively, the rated voltage may be the voltage of the electronic device in the S5 state in ACPI.
In a second aspect, an embodiment of the present application provides an electronic device, where the network card heat dissipation device of any one of the above implementation manners is disposed in the electronic device.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a network card heat dissipation device provided in an embodiment of the present application;
fig. 2 is a schematic installation diagram of a network card heat dissipation device provided in the embodiment of the present application;
fig. 3 is a schematic structural diagram of a fan terminal according to an embodiment of the present disclosure;
fig. 4 is a control logic diagram of the BMC controlling the cooling fan according to the embodiment of the present disclosure.
An icon: 10-network card heat dissipation equipment; 11-a heat dissipation fan; 12-a wind scooper; 110-fan terminals; 111-supply pin; 1111-positive electrode pin; 1112-a negative electrode pin; 112-speed feedback pin; 113-a speed regulating pin; 121-hook; 20-a main board; 21-a network card; 22-through hole.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. For example, the flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions. In addition, functional modules in the embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.
In the research process of the applicant, in order to solve the heat dissipation problem of the network card in the state of S5, a circuit design (an eFuse circuit) that a system heat dissipation fan switch is added on a main board circuit is mostly adopted, and when the system heat dissipation fan is in the state of S5, the power supply of the system fan is turned on, so that the fan normally works in the state of S5, and the heat dissipation of the network card is performed. However, the cost of the fan switch circuit added on the main board is very high, and the cost is seriously increased after the fan switch circuit is added, so that the market competitiveness of the product is reduced. On the other hand, in the S5 state, the system fan is enabled to normally work, and only the network card can be cooled by the forced fan, but since the fan of the motherboard is far away from the network card, the cooling efficiency is not high, and the cooling problem of the network card can be solved only by the high rotation speed of the fan or even the full-speed rotation of the fan, which may cause the noise of the fan to be increased, affect the user performance, and the power consumption of the fan is also large (up to 1-200W), which is not favorable for the energy saving requirement of the product.
Based on this, the embodiment of the present application provides a network card heat dissipation device 10 independently disposed on a motherboard and dedicated to dissipate heat of a network card, please refer to fig. 1, where fig. 1 is a schematic structural diagram of the network card heat dissipation device provided in the embodiment of the present application, and the network card heat dissipation device is disposed on a motherboard 20 of an electronic device; the network card heat dissipating device 10 may include:
a wind scooper 12 and a heat radiation fan 11 including a fan terminal 110;
the heat dissipation fan 11 is connected to the main board 20 through the fan terminal 110;
the heat dissipation fan 11 is configured to be started when the electronic device is in a preset state to form an air flow;
the air guiding cover 12 is disposed between the heat dissipating fan 11 and the network card 21, and is configured to guide the airflow formed by the heat dissipating fan 11 to the network card 21, so as to cool the network card 21.
Illustratively, the Network card 21 may be a Network card supporting a Network Controller Sideband Interface (NCSI), where the NCSI is an industry standard of a Sideband Interface Network Controller defined by a distributed management task group for supporting out-of-band management of a server, and specifically, the Network card 21 may be an ocp (open computer project) Network card having an NCSI function, or a pcie (peripheral Component Interface express) Network card having an NCSI function.
The preset state may be any one of states S0 to S5 in an Advanced Configuration and Power Interface (ACPI) of the electronic device, where the state S1 is referred to as pos (Power on suspend), and in the state S1, other components are still in a normal operating state except that the CPU is turned off by the CPU clock controller. The state S2 is a state in which the CPU is in a stop state, the bus clock is also turned off, and the rest of the devices are still operating. The state of S3 is str (suspend to ram), the current data is saved in the memory, and then the hard disk is closed, that is, suspended to the memory. The state of S4 is STD (suspend to disk), at this time, the main power source of the system is closed, and the hard disk stores the data information before the state of S4. The S5 state is a shutdown (shutdown) state in which all devices including the power supply are turned off, and the power consumption of the device is 0 in the S5 state.
The heat dissipation fan 11 may be directly fixed on the motherboard 20 by a screw, and the air outlet of the heat dissipation fan 11 faces the direction of the air guide cover, and the air guide cover 12 is connected to the air outlet of the heat dissipation fan 11 and the network card 21, so as to guide the airflow emitted by the heat dissipation fan 11 to the network card 21, so as to cool the network card 21.
In the embodiment of the present application, the cost of installing one heat dissipation fan is about 25 yuan, and the cost of designing the fan switch circuit is about 90 yuan, thereby reducing the circuit cost. In addition, since the power consumption of the heat dissipation fan 11 is about 5W, the power consumption for dissipating heat from the network card can be reduced in design.
Therefore, the network card heat dissipation device for dissipating heat of the network card is independently arranged on the mainboard, the heat dissipation air flow is provided through the heat dissipation fan, and the heat dissipation air flow is guided to the network card through the air guide cover so as to cool the network card, so that the heat dissipation power consumption can be reduced, the heat dissipation is provided for the network card, and the circuit design cost is saved.
In an optional embodiment, please refer to fig. 2 and fig. 3 in combination, where fig. 2 is a schematic installation diagram of a network card heat dissipation device provided in the embodiment of the present application; fig. 3 is a schematic structural diagram of a fan terminal provided in the embodiment of the present application, a fan terminal 110 is disposed on a heat dissipation fan 11, the heat dissipation fan 11 includes the fan terminal 110, the heat dissipation fan is connected to the motherboard through the fan terminal, and the fan terminal includes a power supply pin 111, a rotational speed feedback pin 112, and a speed regulation pin 113;
the power supply pin 111 is used for supplying power to the heat dissipation fan 11; the rotating speed feedback pin 112 is used for sending a signal representing the rotating speed of the cooling fan 11; the speed adjusting pin 113 is used for receiving a signal for controlling the rotation speed of the cooling fan 11.
In the above embodiment, the fan terminal is provided as a 4PIN interface, and the power supply PIN 111 may include a positive electrode PIN 1111 and a negative electrode PIN 1112, wherein the positive electrode PIN is connected to a power supply, and the negative electrode PIN is connected to ground, so that the power supply PIN 111 supplies power to the heat dissipation fan 11 based on the rated voltage in the S5 state.
In addition, the fan terminal 110 may be a 2PIN or 3PIN interface, besides the 4PIN interface in the present application, and when the fan terminal is a 2PIN, it only includes two power supply PINs, one power supply PIN is connected to the power supply, and the other power supply PIN is connected to the ground. When the fan terminal is 3PIN, two power supply PINs and a rotation speed feedback PIN 112 may be included, and the rotation speed of the fan may be measured through the rotation speed feedback PIN 112.
Therefore, the cooling fan and the mainboard are connected through the fan terminal in the embodiment of the application, so that the cooling fan can be powered and the rotating speed of the fan can be controlled, the current rotating speed information of the fan can be acquired in real time through the rotating speed feedback stitch, the current rotating speed information of the fan can be controlled according to the current rotating speed of the fan, and the working stability and the energy saving performance of the cooling fan can be improved.
In an optional embodiment, the preset state includes an S5 state in ACPI, and the network card heat sink further includes a control module (not shown in the figure), where the control module performs signal interaction with the heat sink fan through a fan terminal, and is configured to start the heat sink fan when receiving a signal indicating that the electronic device is in the S5 state.
In the embodiment of the present application, the control module may be a controller disposed on a motherboard, or may be a terminal device connected to the cooling fan 11 through a communication module, where the terminal device may be a configurator of an engineering device, a mobile phone, a tablet computer, a personal digital assistant, and the like.
Therefore, in the embodiment of the application, the control module can control the electronic device to supply power to the cooling fan when the electronic device is in the S5 state, so that the problem that the network card cannot dissipate heat in the S5 state when supporting the NCSI function can be solved, and the reliability of the network card operation can be improved. In addition, according to the embodiment of the application, the independent cooling fan is arranged for the network card, so that the cooling energy consumption can be reduced, and the cost is saved.
Optionally, in the control module in this embodiment of the present application, for example, a Baseboard Management Controller (BMC), the BMC is configured to obtain a temperature of the network card, generate a control signal according to the temperature, and send the control signal to the cooling fan through the speed adjusting pin to control a rotation speed of the cooling fan.
The cooling fan is configured to change the rotating speed when receiving the control signal, and return a feedback signal representing the current rotating speed through the rotating speed feedback pin.
The BMC in this embodiment of the application may be set on the motherboard, and in the S5 state, the BMC may first obtain the temperature of the network card 21 in real time, may start the cooling fan 11 when the network card temperature reaches a preset temperature threshold, or may start the cooling fan 11 as long as the electronic device is in the S5 state. The BMC may be connected to the speed adjusting pin 113 of the fan terminal to send a rotation speed control signal to the cooling fan 11, where the rotation speed control signal may be generated according to the network card temperature acquired by the BMC, and may generate a signal for increasing the rotation speed and send the signal to the cooling fan 11 when the network card temperature is higher, so as to control the increase of the rotation speed of the cooling fan 11, and may generate a signal for decreasing the rotation speed and send the signal to the cooling fan 11 when the network card temperature is detected to decrease, so as to control the decrease of the rotation speed of the cooling fan 11.
Referring to fig. 4, fig. 4 is a control logic diagram of the BMC controlling the cooling fan according to the embodiment of the present disclosure. The BMC can acquire the temperature of the network card in real time, send a fan rotating speed control signal PWM to the cooling fan, and can dynamically control the rotating speed of the cooling fan according to the temperature cycle of the network card by acquiring a fan rotating speed feedback signal FG sent by the cooling fan. When the network card temperature is detected to be at a higher level, the rotating speed of the cooling fan is controlled to be increased, the cooling capacity is improved, when the network card temperature is detected to be at a lower level, the rotating speed of the cooling fan is controlled to be reduced, and when the network card temperature is at a normal level, the rotating speed of the cooling fan can be controlled to return to a preset rotating speed.
In addition, the cooling fan 11 may also feed back the current rotation speed to the BMC through the rotation speed feedback pin 112, and a controller may monitor the current cooling fan rotation speed in real time through the BMC monitoring page.
Therefore, the rotating speed of the fan can be circularly and dynamically controlled through the substrate management controller according to the temperature of the network card, and the rotating speed of the fan can be adjusted according to different working conditions and environments, so that energy conservation and effective noise control of the fan are further realized.
In an alternative embodiment, please refer to fig. 2, the wind scooper 12 may include a wind scooper main body and a hook 121, one end of the hook 121 includes a protrusion, and the other end of the hook 121 is connected to the wind scooper main body; the protruding portion extends to the back of the main board 20 through a through hole 22 provided on the main board 20, and is limited by the through hole 22 to move, so as to fix the wind scooper 12 on the main board 20.
Therefore, in the embodiment of the application, the hook 121 is arranged on the wind scooper 12, and the protrusion of the hook is matched with the through hole 22 on the main board 20 to limit the movement of the hook 121, so that the wind scooper 12 is fixedly mounted on the main board 20, and tool-free mounting and dismounting of the wind scooper 12 can be realized.
In the embodiment of the present application, the heat dissipation fan 11 may be a centrifugal fan, the flow rate may be adjusted according to the load of the host, and the rated voltage in the S5 state may be 5V, 12V, or other voltages. The power supply pin 111 of the fan terminal supplies a voltage of 12V in the S5 state to the heat dissipation fan 11 to operate the heat dissipation fan 11.
Based on the same application concept, the embodiment of the present application further provides an electronic device, where the network card heat dissipation device 10 in any of the above embodiments is disposed in the electronic device.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus or device may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
In addition, units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
Furthermore, the functional modules in the embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.
Alternatively, all or part of the implementation may be in software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded and executed on a computer, cause the processes or functions described in accordance with the embodiments of the application to occur, in whole or in part.
In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A network card heat dissipation device is characterized in that the network card heat dissipation device is arranged on a mainboard of an electronic device; the network card heat dissipation device comprises:
the air guide cover and the heat radiation fan;
the heat radiation fan is connected with the mainboard through a fan terminal;
the heat dissipation fan is configured to be started when the electronic equipment is in a preset state so as to form air flow; and the air guide cover is arranged between the cooling fan and the network card and used for guiding the airflow formed by the cooling fan to the network card so as to cool the network card.
2. The network card heat sink device of claim 1, wherein the fan terminals comprise a power supply pin, a speed feedback pin, and a speed regulation pin;
the power supply pins are used for supplying power to the heat dissipation fan;
the rotating speed feedback pin is used for sending a signal representing the rotating speed of the cooling fan; and
the speed regulating pin is used for receiving a signal for controlling the rotating speed of the cooling fan.
3. The network card heat dissipation device according to claim 2, wherein the preset state includes an S5 state in ACPI;
the network card heat dissipation equipment also comprises a control module;
the control module performs signal interaction with the heat dissipation fan through the fan terminal, and starts the heat dissipation fan when the control module receives a signal representing that the electronic device is in the S5 state.
4. The network card heat sink device of claim 3 wherein the power pins comprise a positive electrode pin and a negative electrode pin, the power pins providing power to the heat sink fan based on a voltage rating of the S5 state.
5. The network card heat dissipation device according to claim 4, wherein the rated voltage is a voltage when the electronic device is in an S5 state in ACPI.
6. The network card heat sink device of claim 3, wherein the control module comprises a baseboard management controller; the substrate management controller is configured to obtain the temperature of the network card, generate a control signal according to the temperature, and send the control signal to the cooling fan through the speed regulating pins so as to control the rotating speed of the cooling fan.
7. The network card heat sink device of claim 6, wherein the heat sink fan is configured to change a rotational speed upon receiving the control signal and return a feedback signal indicative of a current rotational speed via the rotational speed feedback pins.
8. The network card heat dissipation device according to claim 1, wherein the air guide cover includes an air guide cover main body and a hook; one end of the clamping hook comprises a convex part, and the other end of the clamping hook is connected with the air guide cover main body;
the bulge extends to the back of the main board through a through hole arranged on the main board and is limited by the through hole to move so as to fix the wind scooper on the main board.
9. The network card heat sink device of claim 1, wherein the heat sink fan comprises a centrifugal fan.
10. An electronic device, characterized in that the network card heat dissipating device of any one of claims 1-9 is disposed in the electronic device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202220644660.3U CN216871174U (en) | 2022-03-23 | 2022-03-23 | Network card heat dissipation device and electronic device |
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| CN202220644660.3U CN216871174U (en) | 2022-03-23 | 2022-03-23 | Network card heat dissipation device and electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115993881A (en) * | 2023-03-20 | 2023-04-21 | 新华三信息技术有限公司 | Fan speed regulation strategy determining method and device, electronic equipment and storage medium |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115993881A (en) * | 2023-03-20 | 2023-04-21 | 新华三信息技术有限公司 | Fan speed regulation strategy determining method and device, electronic equipment and storage medium |
| CN115993881B (en) * | 2023-03-20 | 2023-06-27 | 新华三信息技术有限公司 | Fan speed regulation strategy determining method and device, electronic equipment and storage medium |
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