CN216849864U - Semiconductor electronic device encapsulation outward appearance removes gluey equipment - Google Patents
Semiconductor electronic device encapsulation outward appearance removes gluey equipment Download PDFInfo
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- CN216849864U CN216849864U CN202220182401.3U CN202220182401U CN216849864U CN 216849864 U CN216849864 U CN 216849864U CN 202220182401 U CN202220182401 U CN 202220182401U CN 216849864 U CN216849864 U CN 216849864U
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Abstract
The utility model relates to the technical field of electronic device processing, in particular to a glue removing device for the packaging appearance of a semiconductor electronic device, which comprises a machine body, the bottom of the machine body is provided with a supporting frame, the interior of the machine body is provided with a conveyor belt, the machine body is provided with a driving motor for driving the conveyor belt to rotate, a plurality of mounting seats are arranged on the outer surface of the driving conveyor belt at equal intervals, a fixing plate is arranged in a cavity of each mounting seat, the top of the fixing plate is provided with an electronic device placing groove, the inside of the mounting seat is also provided with a fixing component for fixing the position of the fixing plate, the machine body is provided with a glue removing mechanism, the scraper is close to the electronic device by driving the lifting plate to lift up and down through the arranged electric telescopic rod, redundant glue is scraped when the semiconductor electronic device appearance in the conveying process is packaged, and the glue removing efficiency is greatly improved.
Description
Technical Field
The utility model relates to an electron device processing technology field specifically is a semiconductor electron device encapsulation outward appearance removes gluey equipment.
Background
In the production of semiconductor electronic devices, many semiconductor electronic devices are packaged in a plastic package mode, the residue of packaging glue can appear in the packaging process, and the residual materials outside the semiconductor electronic devices are not beautiful and can affect the use of the semiconductor electronic devices to a certain extent.
At present, the glue removing effect of a plurality of glue removing devices is not ideal, or manual glue removing still exists, so that the working efficiency is low, the glue removing is not thorough, the time is greatly wasted, cooperation of a plurality of people is needed sometimes, manpower and material resources are wasted, and the problem is improved by the glue removing device for the packaging appearance of the semiconductor electronic device.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor electronic device encapsulation outward appearance removes gluey equipment to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the glue removing equipment for the packaging appearance of the semiconductor electronic device comprises a machine body, wherein a supporting frame is arranged at the bottom of the machine body, a conveyor belt is arranged inside the machine body, a driving motor for driving the conveyor belt to rotate is arranged on the machine body, a plurality of mounting seats are arranged on the outer surface of the driving conveyor belt at equal intervals, a fixing plate is arranged in a cavity of each mounting seat, an electronic device placing groove is formed in the top of each fixing plate, a fixing assembly for fixing the position of each fixing plate is further arranged inside each mounting seat, and a glue removing mechanism is arranged on the machine body;
remove gluey mechanism and include the type of falling U frame of fixed mounting in the organism outside, the inside of the type of falling U frame is provided with the lifter plate, install electric telescopic handle between the top center department of lifter plate and the inside top center department of the type of falling U frame, the bottom of lifter plate is connected with the mounting panel through buffering the subassembly, the scraper is installed to the bottom of mounting panel, mounting panel one side is provided with the clear subassembly of gluing that is used for clean scraper.
Preferably, perpendicular slide rails are installed on two sides of the interior of the inverted U-shaped frame, and slide blocks connected with the perpendicular slide rails in a sliding mode are installed at two ends of the lifting plate.
Preferably, the buffering component comprises fixing rods fixedly connected to two sides of the top of the mounting plate, the top end of each fixing rod penetrates through the lifting plate and is connected with a limiting plate, and a buffering spring is sleeved on the outer side, located between the mounting plate and the lifting plate, of each fixing rod.
Preferably, the clear subassembly of gluing includes horizontal electronic slide rail, electronic slider, clean board, clean logical groove and waste rubber collection box, one side at the mounting panel is installed to horizontal electronic slide rail, electronic slider sliding connection is on horizontal electronic slide rail, the bottom at electronic slider is installed to the clean board, set up on the clean board and correspond with clean scraper position and supply the clean logical groove that clean scraper passes through, the inner wall laminating in clean logical groove is on the outer wall of clean scraper when clean board and clean scraper contact, the waste rubber is collected the box and is installed the bottom at the clean board, the waste rubber is collected the box and is collected the activity joint between box and the clean board.
Preferably, the fixed subassembly includes movable plate, connecting rod, reset spring, arm-tie and bolt, the movable plate sets up in the cavity of mount pad, the connecting rod is all installed, two at the both ends that fixed plate one side was kept away from to the movable plate the one end that the fixed plate was kept away from to the connecting rod runs through the mount pad and is connected with the arm-tie jointly, just the outside cover that is located the connecting rod between the inner wall of movable plate and mount pad cavity is equipped with reset spring, the bolt is installed to the equidistant of movable plate opposite side, a plurality of confession bolt male jacks have been seted up to fixed plate one side.
Preferably, one side of the fixing plate, which is far away from the jack, is provided with a limiting block, and the inner wall of the mounting seat cavity is provided with a limiting groove for inserting the limiting block.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses in, the electric telescopic handle that drives the lifter plate oscilaltion through the setting is close to electron device department with the scraper, and unnecessary glue strikes off when the semiconductor electron device outward appearance encapsulation in the transportation process, improves greatly and removes gluey efficiency, closely laminates the scraper on semiconductor electron device through the buffering subassembly that sets up on the one hand, improves and removes gluey effect, and on the other hand avoids the too big damage that leads to of pressure of scraper to the effect of semiconductor electron device.
2. The utility model discloses in, through the clear subassembly of gluing that sets up, use one section use back at the scraper, can drive the cleaning plate through horizontal electronic slide rail and electronic slider and remove along scraper length direction, and the inner wall laminating of clean logical groove is on the outer wall of cleaning scraper to glue on the cleaning scraper is clear away, makes to glue and collects in the cull collection box, and the cull collects box and cleaning plate between activity joint, is convenient for pull down the cull collection box and change.
3. The utility model discloses in, through the fixed subassembly that sets up, the fixed plate of being convenient for quick dismantlement and fixed of fixed plate is convenient for change the fixed plate of other size electron device standing grooves for can place the semiconductor electron device of multiple size.
Drawings
Fig. 1 is a schematic view of the overall structure of the semiconductor electronic device package appearance glue removing device of the present invention;
FIG. 2 is a schematic structural view of a glue removing mechanism of the glue removing apparatus for the package appearance of the semiconductor electronic device according to the present invention;
FIG. 3 is a schematic structural view of a part of a glue removing mechanism of the glue removing device for the package appearance of the semiconductor electronic device according to the present invention;
fig. 4 is a sectional view of the mounting seat and the fixing plate of the appearance glue removing device for semiconductor electronic device package of the present invention.
In the figure: 1. a body; 2. a support frame; 3. a conveyor belt; 4. a drive motor; 5. a mounting seat; 501. a limiting groove; 6. a fixing plate; 601. an electronic device placement groove; 602. a jack; 603. a limiting block; 7. a fixing assembly; 701. moving the plate; 702. a connecting rod; 703. a return spring; 704. pulling a plate; 705. a bolt; 8. a glue removing mechanism; 801. an inverted U-shaped frame; 802. an electric telescopic rod; 803. a lifting plate; 804. a vertical slide rail; 805. a slider; 806. mounting a plate; 807. a scraper; 808. a buffer assembly; 8081. fixing the rod; 8082. a limiting plate; 8083. a buffer spring; 809. glue cleaning components; 8091. a horizontal electric slide rail; 8092. an electric slider; 8093. cleaning the plate; 8094. cleaning the through groove; 8095. and a waste glue collecting box.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the invention are given in the accompanying drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-4, the present invention provides a technical solution:
a semiconductor electronic device packaging appearance glue removing device comprises a machine body 1, wherein a supporting frame 2 is arranged at the bottom of the machine body 1, a conveyor belt 3 is arranged inside the machine body 1, a driving motor 4 for driving the conveyor belt 3 to rotate is arranged on the machine body 1, a plurality of mounting seats 5 are arranged on the outer surface of the driving conveyor belt 3 at equal intervals, a fixing plate 6 is arranged in a cavity of each mounting seat 5, an electronic device placing groove 601 is formed in the top of each fixing plate 6, a fixing assembly 7 for fixing the position of each fixing plate 6 is further arranged inside each mounting seat 5, and a glue removing mechanism 8 is arranged on the machine body 1; the glue removing mechanism 8 comprises an inverted U-shaped frame 801 fixedly arranged on the outer side of the machine body 1, a lifting plate 803 is arranged inside the inverted U-shaped frame 801, an electric telescopic rod 802 is arranged between the center of the top of the lifting plate 803 and the center of the top end of the inner part of the inverted U-shaped frame 801, the bottom of the lifting plate 803 is connected with a mounting plate 806 through a buffering component 808, a scraper 807 is arranged at the bottom of the mounting plate 806, a glue cleaning component 809 for cleaning the scraper 807 is arranged on one side of the mounting plate 806, when in use, the semiconductor electronic devices are placed in the electronic device placing grooves 601 on the fixing plate 6, the conveyor belt 3 is driven to rotate by the driving motor 4, the semiconductor electronic device is transported, the electric telescopic rod 802 drives the lifting plate 803 to lift up and down to enable the scraper 807 to be close to the electronic device, redundant glue is scraped when the semiconductor electronic device appearance in the conveying process is packaged, and the glue removing efficiency is greatly improved.
In this embodiment, referring to fig. 2, vertical sliding rails 804 are installed on two sides of the inside of the inverted U-shaped frame 801, and sliding blocks 805 slidably connected to the vertical sliding rails 804 are installed on two ends of the lifting plate 803, so that the vertical sliding rails 804 and the sliding blocks 805 are arranged to improve the stability of the lifting plate 803 in ascending and descending.
In this embodiment, referring to fig. 2, the buffering component 808 includes a fixing rod 8081 fixedly connected to two sides of the top of the mounting plate 806, the top end of the fixing rod 8081 penetrates through the lifting plate 803 and is connected to the limiting plate 8082, a buffering spring 8083 is sleeved on the outer side of the fixing rod 8081 between the mounting plate 806 and the lifting plate 803, when the scraper 807 is attached to the semiconductor electronic device, the scraper 807 is tightly attached to the semiconductor electronic device through the set buffering spring 8083, so that the glue removing effect is improved, and on the other hand, damage caused by too large pressure of the scraper 807 on the semiconductor electronic device is avoided.
In this embodiment, referring to fig. 3, the glue removing assembly 809 includes a horizontal electric slide rail 8091, an electric slide block 8092, a cleaning plate 8093, a cleaning through slot 8094 and a waste glue collecting box 8095, the horizontal electric slide rail 8091 is installed on one side of the installation plate 806, the electric slide block 8092 is connected to the horizontal electric slide rail 8091 in a sliding manner, the cleaning plate 8093 is installed at the bottom of the electric slide block 8092, the cleaning plate 8093 is provided with the cleaning through slot 8094 corresponding to the position of the cleaning blade 807 and allowing the cleaning blade 807 to pass through, when the cleaning plate 8093 contacts with the cleaning blade 807, the inner wall of the cleaning through slot 8094 is attached to the outer wall of the cleaning blade 807, the waste glue collecting box 8095 is installed at the bottom of the cleaning plate 8093, the waste glue collecting box 8095 is movably clamped with the cleaning plate 8093, after the cleaning blade 807 is used for a section, the cleaning plate 8093 can drive the cleaning plate 8093 to move along the length direction of the cleaning blade 807 by the horizontal electric slide rail 8091 and the electric slide block 8092, and the inner wall of the cleaning plate 8094 is attached to the outer wall of the cleaning through slot 8093, therefore, the glue on the cleaning scraper 807 is removed, the glue is collected in the waste glue collecting box 8095, the waste glue collecting box 8095 is movably clamped with the cleaning plate 8093, and the waste glue collecting box 8095 is convenient to detach and replace.
In this embodiment, referring to fig. 4, the fixing assembly 7 includes a moving plate 701, connecting rods 702, a return spring 703, a pulling plate 704 and a plug pin 705, the moving plate 701 is disposed in the cavity of the mounting seat 5, the connecting rods 702 are mounted at both ends of the moving plate 701 far away from one side of the fixing plate 6, one ends of the two connecting rods 702 far away from the fixing plate 6 penetrate through the mounting seat 5 and are commonly connected with the pulling plate 704, the return spring 703 is sleeved between the moving plate 701 and the inner wall of the cavity of the mounting seat 5 and located at the outer side of the connecting rods 702, the plug pin 705 is mounted at an equal interval on the other side of the moving plate 701, a plurality of insertion holes 602 for inserting the plug pin 705 are formed in one side of the fixing plate 6, the moving plate 701 is far away from the fixing plate 6 by pulling the pulling plate 704 outward, so that the plug pin 705 is separated from the insertion holes 602, the fixing effect on the fixing plate 6 is released, and the fixing plate 6 of the electronic device placing groove 601 of other size is convenient to replace, after a new fixing plate 6 is replaced, the pin 705 is quickly inserted into the insertion hole 602 by the elastic action of the return spring 703 to fix the position of the fixing plate 6, thereby facilitating the replacement of the fixing plate 6 and enabling the placement of semiconductor electronic devices of various sizes.
In this embodiment, please refer to fig. 4, a limiting block 603 is installed on one side of the fixing plate 6 away from the insertion hole 602, a limiting groove 501 for inserting the limiting block 603 is formed on the inner wall of the cavity of the mounting base 5, and when the fixing plate 6 is fixed in the mounting base 5, the limiting block 603 is inserted into the limiting groove 501, so as to improve the fixing effect of the fixing plate 6.
The utility model discloses the theory of operation: when the semiconductor electronic device cleaning device is used, a semiconductor electronic device is placed in the electronic device placing groove 601 on the fixing plate 6, the driving motor 4 drives the conveyor belt 3 to rotate, the semiconductor electronic device is conveyed, the electric telescopic rod 802 drives the lifting plate 803 to lift up and down to enable the scraper 807 to be close to the electronic device, the buffer assembly 808 is used for tightly attaching the scraper 807 to the semiconductor electronic device on one hand, the glue removing effect is improved, on the other hand, damage caused by overlarge pressure of the scraper 807 on the semiconductor electronic device is avoided, the scraper 807 scrapes off redundant glue during appearance packaging of the semiconductor electronic device in the conveying process, after the scraper 807 is used for a section, the horizontal electric slide rail 8091 and the electric slide block 8092 can drive the cleaning plate 8093 to move along the length direction of the scraper 807, and the inner wall of the cleaning through groove 8094 is attached to the outer wall of the cleaning scraper 807, so that the glue on the cleaning scraper 807 is removed, the glue is collected in the waste glue collecting box 8095, manual glue removal is not needed, and the glue removal efficiency is greatly improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a semiconductor electronic device encapsulation outward appearance removes gluey equipment, includes organism (1), its characterized in that: the machine body is characterized in that a supporting frame (2) is arranged at the bottom of the machine body (1), a conveyor belt (3) is arranged inside the machine body (1), a driving motor (4) for driving the conveyor belt (3) to rotate is arranged on the machine body (1), a plurality of mounting seats (5) are arranged on the outer surface of the driving conveyor belt (3) at equal intervals, a fixing plate (6) is arranged in a cavity of each mounting seat (5), an electronic device placing groove (601) is formed in the top of each fixing plate (6), a fixing assembly (7) for fixing the position of each fixing plate (6) is further arranged inside each mounting seat (5), and a glue removing mechanism (8) is arranged on the machine body (1);
remove gluey mechanism (8) including fixed mounting in organism (1) outside frame of falling the U type (801), the inside of frame of falling the U type (801) is provided with lifter plate (803), install electric telescopic handle (802) between the top center department of lifter plate (803) and the inside top center department of frame of falling the U type (801), the bottom of lifter plate (803) is connected with mounting panel (806) through buffering subassembly (808), scraper (807) are installed to the bottom of mounting panel (806), mounting panel (806) one side is provided with the clear subassembly (809) of gluing that are used for cleaning scraper (807).
2. The semiconductor electronic device package appearance de-gumming apparatus as claimed in claim 1, wherein: vertical sliding rails (804) are installed on two sides of the interior of the inverted U-shaped frame (801), and sliding blocks (805) connected with the vertical sliding rails (804) in a sliding mode are installed at two ends of the lifting plate (803).
3. The semiconductor electronic device package appearance de-gumming apparatus as claimed in claim 1, wherein: buffer assembly (808) are including fixed connection dead lever (8081) in mounting panel (806) top both sides, lifter plate (803) is run through and spacing board (8082) is connected to the top of dead lever (8081), the outside cover that is located dead lever (8081) between mounting panel (806) and lifter plate (803) is equipped with buffer spring (8083).
4. The semiconductor electronic device package appearance de-gumming apparatus as claimed in claim 1, wherein: the glue cleaning component (809) comprises a horizontal electric sliding rail (8091), an electric sliding block (8092), a cleaning plate (8093), a cleaning through groove (8094) and a waste glue collecting box (8095), the horizontal electric sliding rail (8091) is arranged on one side of the mounting plate (806), the electric sliding block (8092) is connected on the horizontal electric sliding rail (8091) in a sliding way, the cleaning plate (8093) is arranged at the bottom of the electric sliding block (8092), a cleaning through groove (8094) which corresponds to the position of the cleaning scraper (807) and is used for the cleaning scraper (807) to pass through is arranged on the cleaning plate (8093), when the cleaning plate (8093) is contacted with the cleaning scraper (807), the inner wall of the cleaning through groove (8094) is attached to the outer wall of the cleaning scraper (807), the waste glue collecting box (8095) is installed at the bottom of the cleaning plate (8093), and the waste glue collecting box (8095) is movably clamped with the cleaning plate (8093).
5. The semiconductor electronic device package appearance de-gumming apparatus as claimed in claim 1, wherein: fixed subassembly (7) are including movable plate (701), connecting rod (702), reset spring (703), arm-tie (704) and bolt (705), movable plate (701) set up in the cavity of mount pad (5), connecting rod (702) are all installed at the both ends that fixed plate (6) one side was kept away from in movable plate (701), two the one end that fixed plate (6) were kept away from in connecting rod (702) runs through mount pad (5) and is connected with arm-tie (704) jointly, the outside cover that just is located connecting rod (702) between the inner wall of movable plate (701) and mount pad (5) cavity is equipped with reset spring (703), bolt (705) are installed to movable plate (701) opposite side equidistant, a plurality of confession bolt (705) male jack (602) have been seted up to fixed plate (6) one side.
6. The semiconductor electronic device package appearance glue removing equipment as claimed in claim 5, wherein: one side of the fixing plate (6) far away from the jack (602) is provided with a limiting block (603), and the inner wall of the cavity of the mounting seat (5) is provided with a limiting groove (501) for inserting the limiting block (603).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220182401.3U CN216849864U (en) | 2022-01-21 | 2022-01-21 | Semiconductor electronic device encapsulation outward appearance removes gluey equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220182401.3U CN216849864U (en) | 2022-01-21 | 2022-01-21 | Semiconductor electronic device encapsulation outward appearance removes gluey equipment |
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| CN216849864U true CN216849864U (en) | 2022-06-28 |
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| CN202220182401.3U Active CN216849864U (en) | 2022-01-21 | 2022-01-21 | Semiconductor electronic device encapsulation outward appearance removes gluey equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116978796A (en) * | 2023-09-25 | 2023-10-31 | 深圳德芯微电技术有限公司 | Packaging structure and packaging method of semiconductor chip |
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2022
- 2022-01-21 CN CN202220182401.3U patent/CN216849864U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116978796A (en) * | 2023-09-25 | 2023-10-31 | 深圳德芯微电技术有限公司 | Packaging structure and packaging method of semiconductor chip |
| CN116978796B (en) * | 2023-09-25 | 2023-12-15 | 深圳德芯微电技术有限公司 | Packaging structure and packaging method of semiconductor chip |
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