CN216847903U - Probe module - Google Patents

Abstract

The utility model provides a probe module, it includes: a probe assembly and a base assembly; the probe assembly comprises a limiting sliding block and a plurality of probes, the probes are arranged on the base assembly, one ends of the probes, far away from the ends connected with the base assembly, are head ends, and the head ends are free ends; the probe assembly is provided with a reference axis, a plurality of probes are arranged in parallel along the reference axis, and the spacing between the adjacent probes is gradually reduced along the direction towards the head end; the limiting sliding block is provided with a plurality of limiting holes, and the limiting sliding block is movably sleeved on the probes through the limiting holes, wherein each limiting hole corresponds to one probe; when the limiting sliding block moves along the reference axis, the distance between the head ends of the adjacent probes is driven to change. Due to the configuration, the probe assembly can meet the test requirements of devices with different pad pitches, a plurality of probe assemblies do not need to be purchased, and the production cost is reduced.

Description

Probe module

Technical Field

The utility model belongs to the technical field of the semiconductor equipment and specifically relates to a probe module.

Background

The probe assembly is an important test tool for wafer-level reliability test, and has the functions of realizing the transmission of electric signals between a test instrument and a wafer device to be tested, and completing the measurement of relevant electric parameters by contacting the probe with a metal welding pad of the device to be tested on the wafer and matching with the test instrument and test software. Therefore, the pitch between adjacent probes needs to match the pitch of the metal pads in the wafer dut.

The probe spacing of the existing probe assembly is fixedly set, and needs to be customized with the relevant probe assembly manufacturer, and the corresponding probe assembly needs to be replaced for the device to be tested with different metal pad spacing. In addition, the existing wafer level test products have various types, and different device structures can have different metal pad pitches, so that corresponding probe assemblies are respectively arranged to meet the test requirements, and the production cost is increased.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a probe module to the probe interval that solves current probe subassembly is fixed setting, needs the problem of the test demand of multiple probe subassembly in order to satisfy the device under test of different weld pad intervals.

In order to achieve the above object, the present invention provides a probe module, including: a probe assembly and a base assembly;

the probe assembly comprises a limiting sliding block and a plurality of probes, the probes are arranged on the base assembly, one ends of the probes, far away from the ends connected with the base assembly, are head ends, and the head ends are free ends;

the probe assembly is provided with a reference axis, a plurality of probes are arranged in parallel along the reference axis, and the spacing between the adjacent probes is gradually reduced along the direction towards the head end;

the limiting sliding block is provided with a plurality of limiting holes, and the limiting sliding block is movably sleeved on the probes through the limiting holes, wherein each limiting hole corresponds to one probe; when the limiting sliding block moves along the reference axis, the distance between the head ends of the adjacent probes is driven to change.

Optionally, the base assembly includes a snap ring, the probe assembly further includes a fixing member, and the probe is connected to the snap ring through the fixing member.

Optionally, the fixing part divides the probe into a first area close to the head end and a second area far away from the head end; the first region includes a sliding region within which the spacing slide moves along the reference axis.

Optionally, the diameter of the probe within the sliding region remains constant.

Optionally, the sliding region has position marks along both ends of the reference axis.

Optionally, the diameter of the probe in the first region is smaller than the diameter of the probe in the second region.

Optionally, the probe assembly further includes a probe tip, the probe tip is connected to the head end, the plurality of probes are located on the same plane, and an angle formed between the probe tip and the probes is 95-105 °.

Optionally, the base assembly further includes a circuit board, the circuit board has a circuit channel thereon, and an end of the probe away from the head end is connected to the circuit channel.

Optionally, the base assembly further comprises a clamping ring, one end of the clamping ring in the axial direction of the clamping ring is connected with the probe, and the other end of the clamping ring is connected with the circuit board.

Optionally, the circuit channels are circumferentially arranged around the snap ring, the number of the circuit channels is not less than the number of the probes, and each circuit channel is used for being connected with one probe.

In summary, the present invention provides a probe module, which includes a probe assembly and a base assembly; the probe assembly comprises a limiting sliding block and a plurality of probes, the probes are arranged on the base assembly, one ends of the probes, far away from the ends connected with the base assembly, are head ends, and the head ends are free ends; the probe assembly is provided with a reference axis, a plurality of probes are arranged in parallel along the reference axis, and the spacing between the adjacent probes is gradually reduced along the direction towards the head end; the limiting sliding block is provided with a plurality of limiting holes, and the limiting sliding block is movably sleeved on the probes through the limiting holes, wherein each limiting hole corresponds to one probe; when the limiting sliding block moves along the reference axis, the distance between the head ends of the adjacent probes is driven to change.

So dispose, when spacing slider moved along the reference axis, can drive the interval between the head end of adjacent probe and change, make it under the condition that need not change the probe subassembly, reach the state with the interval looks adaptation between the metal pad of the device to be measured, do not need additionally to change corresponding probe subassembly, when having reduced the change step, also reduced manufacturing cost.

Drawings

FIG. 1 is a schematic view of a probe assembly according to an embodiment of the present invention;

fig. 2 is a top view of a probe module according to an embodiment of the present invention;

fig. 3 is a side view of a probe module according to an embodiment of the present invention.

Wherein the reference numerals are:

10-a probe assembly; 101-a probe; 102-a limiting slide block; 103-a head end; 104-a fixture; 105-a first region; 106-a second region; 107-sliding zone; 108-a needle tip; 109-location identification; 110-a reference axis; 20-a base component; 201-circuit path; 202-a snap ring; 203-circuit board.

Detailed Description

To make the objects, advantages and features of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be noted that the drawings are in simplified form and are not to scale, but rather are provided for the purpose of facilitating and distinctly claiming the embodiments of the present invention. Further, the structures illustrated in the drawings are often part of actual structures. In particular, the drawings may have different emphasis points and may sometimes be scaled differently.

As used in this specification, the singular forms "a", "an" and "the" include plural referents, the term "or" is generally employed in its sense including "and/or," the terms "a" and "an" are generally employed in their sense including "at least one," the terms "at least two" are generally employed in their sense including "two or more," and the terms "first", "second" and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second" and "third" may explicitly or implicitly include one or at least two of the features, "one end" and "the other end" and "proximal end" and "distal end" generally refer to the corresponding two parts, which include not only the end points, but also the terms "mounted", "connected" and "connected" should be understood broadly, e.g., as a fixed connection, as a detachable connection, or as an integral part; either directly or indirectly through intervening media, either internally or in any other relationship. Furthermore, as used in this specification, an element being disposed on another element generally only means that there is a connection, coupling, fit, or drive relationship between the two elements, and the connection, coupling, fit, or drive between the two elements may be direct or indirect through intermediate elements, and should not be understood as indicating or implying any spatial relationship between the two elements, i.e., an element may be in any orientation inside, outside, above, below, or to one side of another element, unless the content clearly dictates otherwise. The specific meanings of the above terms in the present specification can be understood by those of ordinary skill in the art as appropriate.

An object of the utility model is to provide a probe module to the probe interval of solving current probe subassembly is fixed setting, needs purchase corresponding probe subassembly respectively in order to satisfy the problem of the device under test's of different solder pad intervals test demand.

Referring to fig. 1, the present invention provides a probe module, which includes a probe assembly 10 and a base assembly 20; the probe assembly 10 comprises a limiting slide block 102 and a plurality of probes 101, the probes 101 are all arranged on the base assembly 20, one end of each probe 101, which is far away from the base assembly 20, is a head end 103, and the head end 103 is a free end; the probe assembly 10 has a reference axis 110, a plurality of the probes 101 are arranged in parallel along the reference axis 110, and the spacing between the adjacent probes 101 gradually decreases in the direction toward the head end 103; the limiting slide block 102 has a plurality of limiting holes, and the limiting slide block 102 is movably sleeved on the plurality of probes 101 through the plurality of limiting holes, wherein each limiting hole corresponds to one probe 101; when the limit slider 102 moves along the reference axis 110, the distance between the head ends 103 of the adjacent probes 101 is changed.

It should be noted that, in the example shown in fig. 1, the reference axis 110 may be a vertical straight line of the center of the limiting slider 102 in the direction toward the head end 103 and any parallel line thereof, and of course, in other embodiments, the reference axis 110 may also be a line along other directions, which is not limited by the present invention.

The plurality of probes 101 are juxtaposed along the reference axis 110, and as will be appreciated by those skilled in the art, the juxtaposition herein does not limit the probes 101 to all being disposed parallel to the reference axis 110, and the probes 101 may be offset from the reference axis 110 by an angle, for example, in the range of 0-15, with the understanding that the probes 101 are juxtaposed along the reference axis 110.

With the configuration, when the limiting sliding block 102 moves along the reference axis 110, the distance between the adjacent limiting holes is unchanged, so that the distance between the head ends 103 of the adjacent probes 101 can be driven to change, the test requirements of the to-be-tested devices with different pad distances are further met, the corresponding probe assembly 10 does not need to be additionally replaced, the replacement steps are reduced, and meanwhile, the production cost is also reduced.

Further, referring to fig. 3, the base assembly 20 includes a snap ring 202, the probe assembly 10 further includes a fixing member 104, and the probe 101 is connected to the snap ring 202 through the fixing member 104. It should be noted that, in the example shown in fig. 3, the fixing element 104 is connected to one side of the snap ring 202 along its axis, and in some other embodiments, the fixing element 104 may be symmetrically distributed around the center of the snap ring 202, which depends on the number of the probes 101, and those skilled in the art can configure it according to practical situations, which the present invention does not limit this.

As shown in fig. 1, the fixture 104 divides the probe 101 into a first region 105 near the head end 103 and a second region 106 far from the head end 103; the first region 105 comprises a sliding region 107, and the limit slider 102 moves along the reference axis 110 in the sliding region 107. When the limiting slide block 102 moves in the sliding area 107 arranged in the first area 105, the first area 105 is closer to the head end 103, so that the distance between the adjacent probe head ends 103 can be changed by moving for a short distance, and the action efficiency of the limiting slide block 102 is further improved.

Further, the diameter of the probe 101 in the sliding region 107 is kept constant, so that the probe 101 moves more smoothly in the sliding region 107, and the change of the distance between the adjacent probe tips 103 can be realized quickly. Optionally, the inner diameter of the limiting hole may be slightly larger than the diameter of the probe 101 in the sliding region 107, so that the limiting slider 102 can smoothly slide on the probe 101 without being stuck.

Further, the sliding region 107 has position marks 109 at both ends along the reference axis 110. For example, the metal pad pitches of the device to be tested on the wafer are respectively 90 μm, 100 μm and 110 μm, when the limiting slider 102 is at the position shown in fig. 1, the pitch between the adjacent probe tips 103 is 100 μm, and then when the limiting slider 102 moves to the position mark 109a close to the tip 103 along the reference axis 110, the pitch between the adjacent probe tips 103 will gradually increase from 100 μm until 110 μm; conversely, when the spacing slider 102 is moved along the reference axis 110 to the position mark 109b away from the probe tip 103, the spacing between adjacent probe tips 103 will gradually decrease from 100 μm to 90 μm.

With continued reference to fig. 1, the diameter of the probe 101 in the first region 105 is smaller than the diameter of the probe 101 in the second region 106. So configured, the larger diameter makes the probe 101 located in the second region 106 more convenient for the user to attach and detach when connecting with other devices; the smaller diameter makes the probe 101 located in the first region 105 adaptive to the small-sized metal pad pitch when the metal pads of the device under test are connected, and the specific testing principle can refer to the prior art, and the present invention is not further described herein.

As shown in fig. 3, the probe assembly 10 further includes a tip 108, the tip 108 is connected to the head 103, the probes 101 are located on the same plane, and an angle formed between the tip 108 and the probes 101 is 95-105 °. Of course, in some other embodiments, the angle between the tip 108 and the probe 101 may be larger or other types of probes 101 may be used, and those skilled in the art can configure the probe according to the actual situation, which is not limited by the present invention.

Referring to fig. 2 to fig. 3, the base assembly 20 further includes a circuit board 203, the circuit board 203 has a circuit channel 201, and an end of the probe 101 away from the head 103 is connected to the circuit channel 201. Optionally, the circuit board 203 is for the PCB board, as shown in fig. 2, the circuit board 203 and the circuit channel 201 are provided with a plurality of through holes convenient for circuit connection, the utility model discloses do not limit the material of circuit board, the position of seting up of through hole and the connected mode of through hole and probe 101, the technical personnel in the field can dispose according to actual conditions.

Further, one end of the snap ring 202 along its axial direction is connected to the probe 101, and the other end is connected to the circuit board 203. In the example shown in fig. 3, the retainer 202 is connected to the probe 101 through the fixing member 104, and in other embodiments, the retainer 202 may be directly connected to the probe 101 or connected to the probe 101 through another connector, which is not limited by the invention.

Further, the circuit channels 201 are circumferentially arranged around the retainer ring 202, the number of the circuit channels 201 is not less than the number of the probes 101, and each circuit channel 201 is used for being connected with one probe 101. With such a configuration, when the circuit channel 201 connected to the probe 101 is failed, other circuit channels 201 can be replaced in time, and it should be noted that each circuit channel 201 is used for being connected to one probe 101, which means that the circuit channel 201 can be connected to only one probe 101 at the same time, but the circuit channel 201 can be replaced to be connected to other probes 101.

The principle of use of the probe assembly 10 provided in the present embodiment will be further described with reference to fig. 1 to 3. In an alternative example, when the position limiting slider 102 is located at the center line of the sliding region 107, the extension lines of the head 103 of each probe 101 preferably intersect at a point, and each probe 101 keeps straight without twisting. This arrangement is advantageous in reducing torsional stress on the probe 101 when the limit slider 102 is moved. In the moving process of the limiting slide block 102, the distance between the adjacent probe head ends 103 is adjusted by observing the distance between the limiting slide block 102 and the position marks 109 at the two ends of the sliding region 107 until the distance is matched with the distance between the metal welding pads of the device to be tested, and as one end of the probe 101, which is far away from the head end 103, is connected to the corresponding circuit channel 201, the connection of a complete circuit is realized, and the probe is used for transmitting test electrical signals.

Preferably, the probe 101 should have a certain deformation capability, which can be deformed under the driving of the limit slider 102. The material of the probe 101 may be, for example, tungsten-rhenium alloy, and the like having good electrical properties and toughness, and the position-limiting slider 102 and the fixing member 104 may be, for example, epoxy resin, and the like having good electrical properties and heat resistance.

In summary, in the probe module provided by the present invention, the probe module includes a probe assembly and a base assembly; the probe assembly comprises a limiting sliding block and a plurality of probes, the probes are arranged on the base assembly, one ends of the probes, far away from the end connected with the base assembly, are head ends, and the head ends are free ends; the probe assembly is provided with a reference axis, a plurality of probes are arranged in parallel along the reference axis, and the spacing between the adjacent probes is gradually reduced along the direction towards the head end; the limiting sliding block is provided with a plurality of limiting holes, and the limiting sliding block is movably sleeved on the probes through the limiting holes, wherein each limiting hole corresponds to one probe; when the limiting sliding block moves along the reference axis, the distance between the head ends of the adjacent probes is driven to change.

So dispose, when spacing slider moved along the reference axis, can drive the interval between the head end of adjacent probe and change, make it under the condition that need not change the probe subassembly, reach the state with the interval looks adaptation between the metal pad of the device to be measured, do not need additionally to change corresponding probe subassembly, when having reduced the change step, also reduced manufacturing cost.

The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and any modification and modification made by those skilled in the art according to the above disclosure are all within the scope of the claims.

Claims (10)

1. A probe module, comprising: a probe assembly and a base assembly;

the probe assembly comprises a limiting sliding block and a plurality of probes, the probes are arranged on the base assembly, one ends of the probes, far away from the ends connected with the base assembly, are head ends, and the head ends are free ends;

the probe assembly is provided with a reference axis, a plurality of probes are arranged in parallel along the reference axis, and the spacing between the adjacent probes is gradually reduced along the direction towards the head end;

the limiting sliding block is provided with a plurality of limiting holes, and the limiting sliding block is movably sleeved on the probes through the limiting holes, wherein each limiting hole corresponds to one probe; when the limiting sliding block moves along the reference axis, the distance between the head ends of the adjacent probes is driven to change.

2. The probe module of claim 1, wherein the base assembly comprises a snap ring, the probe assembly further comprising a fixture, the probe being coupled to the snap ring via the fixture.

3. The probe module of claim 2, wherein the fixture divides the probe into a first region proximate the tip and a second region distal from the tip; the first region includes a sliding region within which the spacing slide moves along the reference axis.

4. The probe module of claim 3, wherein a diameter of the probe within the sliding region remains constant.

5. The probe module of claim 4, wherein the sliding region has location markings along both ends of the reference axis.

6. The probe module of claim 3, wherein a diameter of the probe in the first region is smaller than a diameter of the probe in the second region.

7. The probe module of claim 1, wherein the probe assembly further comprises a tip, the tip being coupled to the head, the plurality of probes being positioned in a common plane, the tip being angled between 95 ° and 105 ° with respect to the probes.

8. The probe module of claim 1, wherein the base assembly further comprises a circuit board having a circuit channel thereon, the probe being connected to the circuit channel at an end remote from the head end.

9. The probe module of claim 8, wherein the base assembly further comprises a snap ring, one end of the snap ring in the axial direction of the snap ring being connected to the probe, and the other end of the snap ring being connected to the circuit board.

10. The probe module of claim 9, wherein the circuit channels are arranged circumferentially around the collar, the number of circuit channels being not less than the number of probes, each of the circuit channels being adapted to connect to one of the probes.

Images