CN216847521U - Optical equipment for automatically detecting periphery of wafer - Google Patents

Optical equipment for automatically detecting periphery of wafer Download PDF

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Publication number
CN216847521U
CN216847521U CN202220158852.3U CN202220158852U CN216847521U CN 216847521 U CN216847521 U CN 216847521U CN 202220158852 U CN202220158852 U CN 202220158852U CN 216847521 U CN216847521 U CN 216847521U
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wafer
established
workstation
controller
wheel
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陈海龙
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Xinmao Jiaxing Semiconductor Technology Co ltd
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Xinmao Jiaxing Semiconductor Technology Co ltd
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Abstract

The utility model relates to the technical field of semiconductor detection, in particular to an optical device for automatically detecting the periphery of a wafer, which comprises a workbench and a controller, wherein the controller is fixedly arranged at the top of the workbench, and also comprises a rotating mechanism and an imaging mechanism, the rotating mechanism is arranged at the top of the workbench to drive the wafer to rotate, the rotating mechanism comprises a turntable and a driving component, the turntable is rotatably arranged at the top of the workbench through a rotating shaft, the driving component is arranged at the top of the workbench, the rotating shaft is in transmission connection with the driving component, the imaging mechanism is arranged at the side of the turntable to detect the edge of the wafer, the imaging mechanism comprises two image capturing components, the top of the workbench is vertically provided with a vertical plate, the two image capturing components are symmetrically arranged on the outer wall of the vertical plate, and the driving component and each image capturing component are electrically connected with the controller, the edge slight damage detection of the wafer substrate can be carried out in place of manual work, and the efficiency is higher.

Description

Optical equipment for automatically detecting periphery of wafer
Technical Field
The utility model relates to a semiconductor inspection technical field, concretely relates to optical equipment of automated inspection wafer periphery.
Background
Before entering the semiconductor process, only the semiconductor substrate wafer having no defects is supplied to the subsequent semiconductor process by mechanically inspecting in advance the existence of minute defects such as chipping of the outer peripheral surface and the ground surface of the edge of the semiconductor substrate.
After chamfer grinding of the peripheral surface and the edge, the operator visually checks the ground surface, checks whether there is a defect on the ground surface, and selects only a good product if there is a defect. In the existing apparatus, when the defect is minute and is, for example, about 50 to 100 μm, it is difficult to find the defect by visual inspection, and there is a limitation.
When the wafer substrate is manually held for visual detection, because the outer edge of the wafer is circular, detection personnel need to hold the wafer for rotary detection, the wafer is manually rotated, the angle is not well adjusted, the omission of a slight damaged part is easily caused, and the detection dead angle cannot be avoided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an optical equipment of automated inspection wafer periphery.
To achieve the purpose, the utility model adopts the following technical proposal:
provides an optical device for automatically detecting the periphery of a wafer, which comprises a workbench and a controller, wherein the controller is fixedly arranged at the top of the workbench,
still include rotary mechanism and imaging mechanism, rotary mechanism establishes at the top of workstation in order to drive the wafer rotatory, rotary mechanism includes carousel and drive assembly, the carousel passes through the rotatable setting of rotation axis at the top of workstation, drive assembly establishes the top at the workstation, the rotation axis is connected with the drive assembly transmission, imaging mechanism establishes the edge in order to detect the wafer at the side of carousel, imaging mechanism includes two image capture components, the top of workstation is vertical and is equipped with the riser, two image capture components are the symmetry and set up on the outer wall of riser, drive assembly and every image capture component are electric connection with the controller.
Preferably, drive assembly includes driving motor, action wheel, follows driving wheel and belt, and driving motor fixes the top of establishing at the workstation, and the action wheel cover is established on its output, and the top of workstation is the symmetry and is provided with two upright pieces, inserts between two upright pieces and is equipped with the articulated shaft, establishes on the articulated shaft from the driving wheel cover, and the belt cover is established between action wheel and follow driving wheel, and the action wheel is less than from the driving wheel, and driving motor is connected with the controller electricity.
Preferably, the outer wall of the articulated shaft is sleeved with a worm wheel, the outer wall of the rotating shaft is fixedly provided with a worm, and the worm wheel is meshed with the worm.
Preferably, every image capture subassembly all includes sleeve, formation of image camera, transparent glass, conical prism and laser emitter, and the sleeve slope sets up on the riser is close to the one end outer wall of carousel, and the formation of image camera is fixed to be established at telescopic inboard top, and transparent glass is fixed to be established in the below of formation of image camera, and conical prism is fixed to be established in transparent glass's bottom, and laser emitter establishes in telescopic inboard bottom, and formation of image camera and laser emitter all are connected with the controller electricity.
Preferably, the bottom of workstation is equipped with the storeroom, and the articulated two guard doors that are provided with are served to the opening of storeroom, all fixedly on the outer wall of every guard door be equipped with the handle.
Preferably, the bottom of the outer side of the storage chamber is symmetrically provided with four telescopic legs, and the side of each telescopic leg is provided with a universal wheel.
Preferably, two displays are fixedly arranged beside the controller, and each display is electrically connected with one imaging camera.
Preferably, three rubber pads are arranged on the top of the rotary table at equal intervals.
The utility model has the advantages that:
1. the utility model discloses a design rotary mechanism, carousel and drive assembly promptly, can drive the carousel at rotation axis and top and the wafer small-amplitude rotation at carousel top, the convenience is shot the detection to wafer edge undetected portion, compare in prior art, need not artifical handheld wafer rotation detection, single rotation angle can be accurate to the degree simultaneously, and then realize that the degree at wafer edge does not have the dead angle and detects, the detection precision has been promoted, reduce the erroneous judgement rate of yields and defective products, and the worm wheel has certain self-locking function with the worm, the unidirectional rotation can only be realized to the wafer promptly, can not revolve, the emergence of error has been avoided, the rationality of detection has been promoted, science and intelligence.
2. The utility model discloses a design imaging mechanism, two image capture components, after the wafer to the carousel, start imaging camera and laser emitter through the controller, laser emitter jets out parallel light source, illuminate the wafer edge, prevent that light is darker, imaging camera passes transparent glass and toper prism in proper order after, can fully enlarge the slight damage department of wafer edge part, can enlarge and take a picture to the slight damage of-micron, two sleeves are used for installing two imaging cameras, therefore can enlarge and take a picture to the slight damage of the upper and lower surface department of wafer edge simultaneously, then respectively transmit two photos to the inside of two displays in real time, on the one hand, the inspection personnel of conveniently looking over in time, learn the wafer error data, the inside of simultaneous control ware presets the edge value of wafer good product, through comparing the image data on two displays with the data that two imaging cameras arranged, if the data is consistent, the detected wafer is good, and if the data is inconsistent, the wafer is not good, and rework or scrap processing is required.
3. The utility model discloses a flexible foot of design and four universal wheels, when this equipment is passed to needs, adjust four flexible feet than four universal wheels weak point, this moment, only four universal wheels and ground laminating, then directly pass this equipment can, when this equipment is stood to needs, directly adjust four flexible feet to with the ground laminating, this moment, four flexible feet and four universal wheels all laminate with ground, because the frictional force effect of flexible foot, equipment can not produce the removal, and then the steadiness and the lapse that are favorable to promoting when this equipment is stood make the portability.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings in the embodiments of the present invention are briefly described below.
Fig. 1 is a schematic perspective view of the present invention;
FIG. 2 is an enlarged view taken at A in FIG. 1;
fig. 3 is a schematic perspective view of the second embodiment of the present invention;
FIG. 4 is an enlarged view of FIG. 3 at B;
fig. 5 is an opening schematic view of two protective doors according to the present invention;
fig. 6 is a plan sectional view of the sleeve of the present invention;
in the figure: the device comprises a workbench 1, a controller 2, a rotating mechanism 3, an imaging mechanism 4, a turntable 5, a driving assembly 6, a rotating shaft 7, an image capturing assembly 8, a driving motor 9, a driving wheel 10, a driven wheel 11, a belt 12, a worm wheel 13, a worm 14, a sleeve 15, an imaging camera 16, transparent glass 17, a conical prism 18, a laser emitter 19, a storage chamber 20, a protective door 21, a telescopic foot 22, a universal wheel 23, a display 24 and a rubber pad 25.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; to better illustrate the embodiments of the present invention, some components of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product.
Referring to fig. 1 to 6, an optical apparatus for automatically inspecting the outer periphery of a wafer includes a table 1 and a controller 2, the controller 2 is fixedly disposed on the top of the table 1,
still include rotary mechanism 3 and imaging mechanism 4, rotary mechanism 3 establishes at the top of workstation 1 in order to drive the wafer rotatory, rotary mechanism 3 includes carousel 5 and drive assembly 6, carousel 5 passes through the rotatable setting of rotation axis 7 at the top of workstation 1, drive assembly 6 is established at the top of workstation 1, rotation axis 7 is connected with drive assembly 6 transmission, imaging mechanism 4 establishes the edge in order to detect the wafer at the side of carousel 5, imaging mechanism 4 includes two image capture components 8, the top of workstation 1 is vertical and is equipped with the riser, two image capture components 8 are the symmetry and set up on the outer wall of riser, drive assembly 6 and every image capture component 8 are electric connection with controller 2.
Drive assembly 6 includes driving motor 9, action wheel 10, from driving wheel 11 and belt 12, driving motor 9 is fixed to be established at the top of workstation 1, action wheel 10 cover is established on its output, the top of workstation 1 is the symmetry and is provided with two and stands the piece, it is equipped with the articulated shaft to insert between two and stands the piece, from the articulated shaft of 11 covers of driving wheel, belt 12 cover is established at action wheel 10 and from between driving wheel 11, action wheel 10 is less than from driving wheel 11, driving motor 9 is connected with controller 2 electricity, in the testing process, edge one end when the wafer detects the end, start driving motor 9 through controller 2, thereby it is rotatory to drive action wheel 10 on its output, because action wheel 10 cup joints through belt 12 with from driving wheel 11, from driving wheel 11 cup joint with the articulated shaft, because action wheel 10 is little and from driving wheel 11, therefore drive slow rotation.
The outer wall of the articulated shaft is sleeved with a worm wheel 13, the outer wall of the rotating shaft 7 is fixedly provided with a worm 14, the worm wheel 13 is meshed with the worm 14, when the articulated shaft rotates slowly, as the worm 14 is fixedly connected with the rotating shaft 7, the bottom of the rotating shaft 7 is rotatably connected with the workbench 1, the top of the rotating shaft 7 is fixedly connected with the turntable 5, and as the worm wheel 13 is sleeved with the articulated shaft, the worm wheel 13 is meshed with the worm 14, so as to drive the rotating shaft 7, the turntable 5 at the top of the rotating shaft and the wafer at the top of the turntable 5 to rotate in a small range, so that the photo detection of the undetected part at the edge of the wafer is convenient, compared with the prior art, the wafer rotation detection does not need to be manually held, meanwhile, the single rotation angle can be accurate to 1 degree, further 360-degree dead angle detection of the edge of the wafer is realized, the detection precision is improved, the false judgment rate of good products and defective products is reduced, and the worm wheel 13 and the worm 14 have a certain self-locking function, the wafer can only realize unidirectional rotation and can not rotate, so that the error is avoided, and the detection reasonability, scientificity and intelligence are improved.
Each image capturing component 8 comprises a sleeve 15, an imaging camera 16, transparent glass 17, a conical prism 18 and a laser emitter 19, wherein the sleeve 15 is obliquely arranged on the outer wall of one end of the vertical plate close to the turntable 5, the imaging camera 16 is fixedly arranged at the top of the inner side of the sleeve 15, the transparent glass 17 is fixedly arranged below the imaging camera 16, the conical prism 18 is fixedly arranged at the bottom of the transparent glass 17, the laser emitter 19 is arranged at the bottom of the inner side of the sleeve 15, the imaging camera 16 and the laser emitter 19 are electrically connected with the controller 2, after a wafer is placed on the turntable 5, the imaging camera 16 and the laser emitter 19 are started through the controller 2, the laser emitter 19 emits a parallel light source to illuminate the edge of the wafer to prevent the light from being dark, and after the imaging camera 16 sequentially penetrates through the transparent glass 17 and the conical prism 18, the slightly damaged part of the edge of the wafer can be fully amplified, a slight breakage of 50-100 microns can be magnified and photographed.
The bottom of workstation 1 is equipped with storeroom 20, and the articulated two guard gate 21 that are provided with on the open end of storeroom 20, all fixed being equipped with the handle on the outer wall of every guard gate 21, storeroom 20 is used for placing article such as detection appurtenance, and guard gate 21 plays the dustproof effect of protection, and the handle is conveniently opened and close guard gate 21.
The outside bottom of storeroom 20 is the symmetry and is provided with four flexible feet 22, the side of every flexible foot 22 all is equipped with universal wheel 23, flexible foot 22 is the screw rod and adjusts the structure, when this equipment is passed to needs, adjust four flexible feet 22 than four universal wheels 23 weak points, this moment, only four universal wheels 23 and ground laminating, then directly pass this equipment can, when this equipment is stood to needs, directly adjust four flexible feet 22 to with the ground laminating, this moment, four flexible feet 22 and four universal wheels 23 all laminate with ground, because the frictional force effect of flexible foot 22, equipment can not produce the removal.
Two displays 24 are fixedly arranged on the side of the controller 2, each display 24 is electrically connected with one imaging camera 16, two sleeves 15 are used for installing the two imaging cameras 16, so that slight damage of the upper surface and the lower surface of the edge of the wafer can be amplified and photographed at the same time, then two photos are transmitted to the insides of the two displays 24 in real time respectively, on one hand, inspectors can conveniently check the photos in time, and error data can be obtained, meanwhile, edge values of good wafers are preset in the controller 2, the data are consistent by comparing the image data on the two displays 24 with the data arranged by the two imaging cameras 16, namely, the detected wafer is represented as a good product, the data are inconsistent, the detected wafer is represented as a defective product, and rework or scrapping processing is needed.
The top of carousel 5 is equidistant to be provided with three rubber pad 25, and the during operation at first puts the top of three rubber pad 25 with the wafer level, and three rubber pad 25 plays the effect of supporting the wafer, and simultaneously, three rubber pad 25 material is soft, plays the effect of protection wafer.
The utility model discloses a theory of operation: during operation, at first put the wafer level on the top of three rubber pads 25, three rubber pads 25 play the effect of supporting the wafer, and simultaneously, three rubber pads 25 material is soft, plays the effect of protection wafer.
After the wafer is placed on the turntable 5, the imaging camera 16 and the laser emitter 19 are started through the controller 2, the laser emitter 19 emits a parallel light source to illuminate the edge of the wafer, the light is prevented from being dark, the imaging camera 16 can fully amplify the slightly damaged part of the edge of the wafer after sequentially penetrating through the transparent glass 17 and the conical prism 18, and the slightly damaged part of 50-100 micrometers can be amplified and photographed.
The two sleeves 15 are used for installing the two imaging cameras 16, so that slight damage of the upper surface and the lower surface of the edge of the wafer can be amplified and photographed at the same time, then the two photographs are transmitted to the insides of the two displays 24 in real time respectively, on one hand, inspectors can check the photographs conveniently and timely, error data can be obtained, edge values of good wafers are preset inside the controller 2, the image data on the two displays 24 and the data arranged by the two imaging cameras 16 are compared, the data are consistent, namely, the detected wafer is a good wafer, the data are inconsistent, the detected wafer is a bad wafer and needs to be reworked or scrapped.
In the detection process, when the edge one end of the wafer is detected to be finished, the driving motor 9 is started through the controller 2, so that the driving wheel 10 on the output end of the driving wheel is driven to rotate, the driving wheel 10 and the driven wheel 11 are sleeved through the belt 12, the driven wheel 11 is sleeved with the hinged shaft, and the driving wheel 10 is small and the driven wheel 11 drives the hinged shaft to rotate slowly.
When the hinged shaft rotates slowly, because the worm 14 is fixedly connected with the rotating shaft 7, the bottom of the rotating shaft 7 is rotatably connected with the workbench 1, the top of the rotating shaft 7 is fixedly connected with the turntable 5, and because the worm wheel 13 is sleeved with the hinged shaft, the worm wheel 13 is meshed with the worm 14 to be connected, so that the rotating shaft 7, the turntable 5 at the top of the rotating shaft and the wafer at the top of the turntable 5 are driven to rotate in a small range, the undetected part at the edge of the wafer can be conveniently photographed and detected, compared with the prior art, the wafer rotation detection is not required to be manually held, meanwhile, the single rotation angle can be accurate to 1 degree, the 360-degree dead angle detection at the edge of the wafer is further realized, the detection precision is improved, the misjudgment rate of good products and defective products is reduced, and the worm wheel 13 and the worm 14 have certain self-locking function, namely, the wafer can only realize unidirectional rotation and can not rotate, the occurrence of errors is avoided, and the detection rationality is improved, Scientific and intelligent.
When this equipment is passed to needs, adjust four flexible feet 22 than four universal wheels 23 short, at this moment, only four universal wheels 23 and ground laminating, then directly pass this equipment can, when this equipment of needs stewing, directly adjust four flexible feet 22 to with the ground laminating, at this moment, four flexible feet 22 and four universal wheels 23 all laminate with ground, because the frictional force effect of flexible foot 22, equipment can not produce the removal.

Claims (8)

1. The utility model provides an optical equipment of automated inspection wafer periphery, includes workstation (1) and controller (2), and controller (2) are fixed to be established at the top of workstation (1), its characterized in that:
still include rotary mechanism (3) and imaging mechanism (4), rotary mechanism (3) are established at the top of workstation (1) in order to drive the wafer rotatory, rotary mechanism (3) are including carousel (5) and drive assembly (6), carousel (5) are through the rotatable top that sets up in workstation (1) of rotation axis (7), the top in workstation (1) is established in drive assembly (6), rotation axis (7) are connected with drive assembly (6) transmission, imaging mechanism (4) are established at the edge of the side in order to detect the wafer of carousel (5), imaging mechanism (4) include two image capture assembly (8), the top of workstation (1) is vertical and is equipped with the riser, two image capture assembly (8) are the symmetry and set up on the outer wall of riser, drive assembly (6) and every image capture assembly (8) are electric connection with controller (2).
2. The optical apparatus of claim 1, wherein: drive assembly (6) are including driving motor (9), action wheel (10), from driving wheel (11) and belt (12), driving motor (9) are fixed to be established at the top of workstation (1), action wheel (10) cover is established on its output, the top of workstation (1) is the symmetry and is provided with two and stands the piece, it is equipped with the articulated shaft to insert between two pieces to stand, establish on the articulated shaft from driving wheel (11) cover, belt (12) cover is established between action wheel (10) and driven wheel (11), action wheel (10) are less than from driving wheel (11), driving motor (9) are connected with controller (2) electricity.
3. The optical apparatus of claim 2, wherein: the outer wall of the articulated shaft is sleeved with a worm wheel (13), the outer wall of the rotating shaft (7) is fixedly provided with a worm (14), and the worm wheel (13) is meshed and connected with the worm (14).
4. The optical apparatus of claim 3, wherein: every image capture subassembly (8) all includes sleeve (15), formation of image camera (16), transparent glass (17), conical prism (18) and laser emitter (19), sleeve (15) slope sets up on the riser is close to the one end outer wall of carousel (5), the fixed inboard top of establishing in sleeve (15) of formation of image camera (16), transparent glass (17) are fixed to be established in the below of formation of image camera (16), conical prism (18) are fixed to be established in the bottom of transparent glass (17), the inboard bottom at sleeve (15) is established in laser emitter (19), formation of image camera (16) and laser emitter (19) all are connected with controller (2) electricity.
5. The optical apparatus of claim 4, wherein: the bottom of workstation (1) is equipped with storeroom (20), and the articulated two guard gate (21) that are provided with on the open end of storeroom (20), all fixed the handle that is equipped with on the outer wall of every guard gate (21).
6. The optical apparatus of claim 5, wherein: the bottom of the outer side of the storage chamber (20) is symmetrically provided with four telescopic legs (22), and the side of each telescopic leg (22) is provided with a universal wheel (23).
7. The optical apparatus of claim 6, wherein: two displays (24) are fixedly arranged beside the controller (2), and each display (24) is electrically connected with one imaging camera (16).
8. The optical apparatus of claim 7, wherein: three rubber pads (25) are arranged at the top of the rotary table (5) at equal intervals.
CN202220158852.3U 2022-01-20 2022-01-20 Optical equipment for automatically detecting periphery of wafer Active CN216847521U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220158852.3U CN216847521U (en) 2022-01-20 2022-01-20 Optical equipment for automatically detecting periphery of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220158852.3U CN216847521U (en) 2022-01-20 2022-01-20 Optical equipment for automatically detecting periphery of wafer

Publications (1)

Publication Number Publication Date
CN216847521U true CN216847521U (en) 2022-06-28

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ID=82085787

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220158852.3U Active CN216847521U (en) 2022-01-20 2022-01-20 Optical equipment for automatically detecting periphery of wafer

Country Status (1)

Country Link
CN (1) CN216847521U (en)

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