CN216846124U

CN216846124U - Testing device for quantifying leveling of LED die bond primer

Info

Publication number: CN216846124U
Application number: CN202123449632.0U
Authority: CN
Inventors: 陈江聪; 罗庆荣; 曹锋
Original assignee: Ji'an Mulinsen New Material Technology Co ltd
Current assignee: Ji'an Mulinsen Precision Technology Co ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2022-06-28
Anticipated expiration: 2031-12-30

Abstract

The application provides a testing arrangement of quantization LED solid crystal primer levelling relates to glue test equipment technical field. The testing device for quantifying the leveling of the LED die bonding primer comprises a testing frame, wherein a testing disc for placing the die bonding primer to be tested and a detection mechanism for detecting the glue flow leveling condition of the die bonding primer to be tested in the testing disc are arranged on the testing frame in a rotating mode, and a plurality of testing grooves for placing the die bonding primer to be tested are sequentially arranged on the upper surface of the testing disc along the circumferential direction of the testing disc. Compared with the prior art, this application simple structure directly observes the collection through detection mechanism to the flat diffusion condition of the glue drip of the solid crystal base adhesive that awaits measuring in the test tray, realizes automated inspection, need not the visual observation, improves the degree of accuracy, and convenient and fast is provided with a plurality of test grooves on the test tray, can once test multiple solid crystal base adhesive or once measure the multiunit data of the solid crystal base adhesive of the same race, improves efficiency of software testing greatly.

Description

Testing device for quantifying leveling of LED die bond primer

[ technical field ] A method for producing a semiconductor device

The application relates to the technical field of glue testing equipment, in particular to a testing device for quantifying leveling of LED die bond primer.

[ background of the invention ]

With the continuous development and innovation of LED technology, LED products on the market are more and more abundant and more complex, so that higher requirements are put forward on materials for producing the LED products.

The die bond underfill is used as one of important materials for producing LED products, the types of the die bond underfill are more and more, and the flowability of the die bond underfill with different physical properties on a bonding pad is different, so the die bond underfill is tested before production.

[ summary of the invention ]

The application aims to provide a testing device for quantifying leveling of an LED die bond primer, which can conveniently measure the leveling degree of the LED die bond primer.

The application is realized by the following technical scheme:

the testing device comprises a testing frame, wherein a testing disc for placing to-be-tested die bond primer is rotatably arranged on the testing frame, and a detection mechanism for detecting the glue flow flat diffusion condition of the to-be-tested die bond primer in the testing disc is arranged on the testing frame in a rotating mode.

The testing device for quantifying the leveling of the die attach primer of the LED die attach comprises a collecting device and a display, wherein the collecting device is arranged on one side of the testing disc and used for acquiring the die attach primer to be tested in the testing disc to obtain the condition of the horizontal diffusion of the adhesive drops, and the display is arranged on one side of the collecting device and used for displaying the information acquired by the collecting device.

According to the testing device for quantifying the leveling of the die bonding primer of the LED, the upper surface of the testing disc is sequentially provided with the plurality of testing grooves for placing the die bonding primer to be tested along the circumferential direction.

According to the testing device for leveling the quantified LED die bonding primer, the testing frame is further provided with the base for supporting the testing disc, and the testing disc is rotatably arranged at the upper end of the base.

According to the testing device for quantifying the leveling of the LED die bonding primer, a limiting structure for limiting the rotation amplitude of the testing disc is arranged between the rotary groove and the base.

The testing device for quantifying the leveling of the LED die bonding primer comprises a limiting structure and a rotating groove, wherein the limiting structure comprises a plurality of limiting grooves which are sequentially arranged along the circumferential direction of the side wall of the base, and a limiting rod matched with the limiting grooves is arranged on the inner side wall of the rotating groove.

According to the testing device for leveling the quantified LED die bonding primer, the bottom of the testing disc is positioned on the inner side wall of the rotary groove and is also provided with the accommodating groove for accommodating the limiting rod, and the opening end of the accommodating groove is also provided with the stop block for preventing the limiting rod from disengaging.

According to the testing device for quantifying the leveling of the LED die bonding primer, an elastic buffer piece is arranged between the bottom of the limiting rod and the accommodating groove.

The test device for quantifying the leveling of the LED die bond primer comprises a collecting device and a measuring device, wherein the collecting device is an industrial electron microscope.

The testing device for quantifying the leveling of the die attach primer of the LED is characterized in that the testing frame is provided with a dispensing device for loading the die attach primer to be tested and injecting the die attach primer into the testing tray.

Compared with the prior art, the method has the following advantages:

1. the glue flow flat diffusion condition of the die bonding primer to be tested in the test disc is directly observed and collected through the detection mechanism, automatic detection is realized, visual observation is not needed, the accuracy is improved, and convenience and rapidness are realized.

2. The test tray is provided with a plurality of test grooves, so that a plurality of kinds of solid crystal primers can be tested at one time or a plurality of groups of data of the same kind of solid crystal primers can be measured at one time, and the test efficiency is greatly improved.

3. The die bonding base glue is injected into the test groove through the glue dispensing device, then the test disc is rotated to inject the die bonding base glue into the test groove respectively, manual moving addition is not needed, and convenience and rapidness are achieved.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a testing apparatus for quantifying leveling of an LED die bond primer according to an embodiment of the present application.

FIG. 2 is a schematic structural diagram of a test tray and a protruding rod of a base according to an embodiment of the present disclosure.

FIG. 3 is an exploded cross-sectional view of a test plate and a pedestal ledge according to an embodiment of the present disclosure.

[ detailed description ] embodiments

In order to make the technical problems, technical solutions and advantageous effects solved by the present application more clear and obvious, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

As shown in fig. 1 to fig. 3, an embodiment of the present application provides a testing apparatus for quantifying leveling of an LED die attach primer, which includes a testing jig 1, and is characterized in that the testing jig 1 is provided with a testing tray 2 for placing a die attach primer to be tested, and a detection mechanism 3 for detecting a condition of horizontal diffusion of a die attach primer to be tested in the testing tray 2. The glue flow flat diffusion condition of the die bonding primer to be tested in the test disc 2 is directly observed and collected through the detection mechanism 3, automatic detection is realized, visual observation is not needed, the accuracy is improved, and convenience and rapidness are realized.

Further, the detection mechanism 3 includes a collection device 31 disposed on one side of the test tray 2 for acquiring the glue flow horizontal diffusion condition of the die attach primer to be tested in the test tray 2, and a display 32 disposed on one side of the collection device 31 for displaying information acquired by the collection device 31. The test result can be directly obtained by looking at the display 32, which is convenient and efficient. Specifically, the collecting device 31 is an industrial electron microscope with a CCD ranging function, which improves the test accuracy.

Further, a plurality of test grooves 22 for placing the die attach primers to be tested are sequentially arranged on the upper surface of the test tray 2 along the circumferential direction. The method can test various die bond primers at one time or measure multiple groups of data of the same die bond primer at one time, and greatly improves the test efficiency.

Further, still be equipped with on the test jig 1 and be used for supporting the base 11 of test disc 2, the test disc 2 bottom be equipped with can with base 11 complex rotatory recess 22. Solid crystal base glue is respectively injected into the test grooves by rotating the test disc 2, so that personnel do not need to move, fixed-point addition is realized, convenience and rapidness are realized, and the labor intensity is reduced.

Furthermore, a limiting structure 5 for limiting the rotation amplitude of the test disc 2 is arranged between the rotation groove 22 and the base 11. Specifically, limit structure 5 includes along a plurality of spacing grooves 51 that base 11 lateral wall circumferencial direction arranged the setting in proper order, be equipped with on the rotatory recess 22 inside wall with spacing rod 52 of spacing groove 51 complex. In the process of rotating the test disc 2, the limiting rods 52 are sequentially and respectively clamped with the limiting grooves 51 to fix the rotation amplitude of the first rotation, so that automatic positioning is realized, and the die bonding primer is conveniently added dropwise.

Specifically, the bottom of the test disc 2 is located on the inner side wall of the rotating groove 22 and is further provided with an accommodating groove 53 for accommodating the limiting rod 52, and an opening end of the accommodating groove 53 is further provided with a stopper 54 for preventing the limiting rod 52 from coming off. The limiting rod 52 is located at one end of the accommodating groove 53 and is further provided with a flange 521 which can be matched with the stopper 54.

Further, an elastic buffer 55 is disposed between the bottom of the limiting rod 52 and the receiving groove 53. The limiting rod 52 can move elastically in the rotating process, so that the resistance of the test disc 2 in the rotating process is reduced, and the test disc 2 is convenient to rotate.

Further, a dispensing device 4 for loading the die attach primer to be tested and injecting the primer onto the test tray 2 is arranged on the test frame 1. The die bonding primer is injected into the test groove through the dispensing device, manual moving addition is not needed, and convenience and rapidness are achieved.

To better understand the technical solution of the present embodiment, the working principle is as follows:

the utility model provides a test device of quantization LED solid crystal primer levelling, includes test jig 1, its characterized in that, rotate on the test jig 1 and be equipped with the test panel 2 that is used for placing the solid crystal primer that awaits measuring to and be used for detecting the detection mechanism 3 of the glue flow level diffusion condition of the solid crystal primer that awaits measuring in the test panel 2. The glue flow flat diffusion condition of the die bonding primer to be tested in the test disc 2 is directly observed and collected through the detection mechanism 3, automatic detection is realized, visual observation is not needed, the accuracy is improved, and convenience and rapidness are realized.

By rotating the test disc 2, the die bond primers are respectively injected into the test grooves 21 by the glue dispensing device 4, and after the die bond primers are added, the diameters of the glue drops of the die bond primers in the test grooves 21 are measured by the industrial electron microscope and recorded (the industrial electron microscope is fixed, the test disc 2 is rotated, and the measurements are sequentially and respectively performed).

After being placed for 48H at normal temperature, the diameters of the glue drops of the solid crystal primers in the test grooves 21 are measured and recorded by the industrial electron microscope, and then the two times of data are compared to obtain a leveling difference value and other test results.

It should be understood that the terms "first", "second", etc. are used herein to describe various information, but the information should not be limited to these terms, and these terms are only used to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present application. Furthermore, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.

The foregoing is illustrative of one or more embodiments provided in connection with the detailed description and is not intended to limit the disclosure to the particular forms disclosed. Similar or identical methods, structures, etc. as used herein, or several technical inferences or substitutions made on the concept of the present application should be considered as the scope of the present application.

Claims

1. The utility model provides a test device that quantization LED solid crystal primer leveled, includes test jig (1), its characterized in that, rotate on test jig (1) and be equipped with test tray (2) that are used for placing the solid crystal primer that awaits measuring to and be used for detecting detection mechanism (3) of the flat diffusion condition of the glue flow of the solid crystal primer that awaits measuring in test tray (2).

2. The testing device for quantifying the leveling of the LED die attach adhesive according to claim 1, wherein the detecting mechanism (3) comprises a collecting device (31) disposed on one side of the testing tray (2) for acquiring the level diffusion of the adhesive flow of the die attach adhesive to be tested in the testing tray (2), and a display (32) disposed on one side of the collecting device (31) for displaying the information acquired by the collecting device (31).

3. The testing device for quantifying the leveling of the LED die bonding primer according to claim 1, wherein a plurality of testing grooves (21) for placing the die bonding primer to be tested are sequentially arranged on the upper surface of the testing disc (2) along the circumferential direction.

4. The device for testing the leveling of the LED die bonding primer according to claim 1, wherein a base (11) for supporting the test tray (2) is further arranged on the test frame (1), and a rotating groove (22) capable of being matched with the base (11) is formed in the bottom of the test tray (2).

5. The device for testing the LED die bond underfill leveling quantification according to claim 4, wherein a limiting structure (5) for limiting the rotation amplitude of the test tray (2) is arranged between the rotation groove (22) and the base (11).

6. The device for testing the leveling of the LED die bonding underfill according to claim 5, wherein the limiting structure (5) comprises a plurality of limiting grooves (51) sequentially arranged along the circumferential direction of the side wall of the base (11), and a limiting rod (52) matched with the limiting grooves (51) is arranged on the inner side wall of the rotary groove (22).

7. The device for testing the LED die bonding primer leveling quantity according to claim 6, wherein a containing groove (53) for containing the limiting rod (52) is further formed in the inner side wall of the rotating groove (22) at the bottom of the test disc (2), and a stop block (54) for preventing the limiting rod (52) from falling off is further arranged at the opening end of the containing groove (53).

8. The device for testing the leveling of the LED die bond underfill according to claim 7, wherein an elastic buffer (55) is disposed between the bottom of the limiting rod (52) and the accommodating groove (53).

9. The testing device for quantifying LED die bond primer leveling according to claim 2, wherein the collecting device (31) is an industrial electron microscope.

10. The device for testing the leveling of the LED die bonding primer according to claim 1, wherein a dispensing device (4) for loading the die bonding primer to be tested and injecting the die bonding primer into the test tray (2) is arranged on the test frame (1).