CN216822921U - Heating plate heat conduction structure, heating base and heating pan assembly - Google Patents
Heating plate heat conduction structure, heating base and heating pan assembly Download PDFInfo
- Publication number
- CN216822921U CN216822921U CN202120975290.7U CN202120975290U CN216822921U CN 216822921 U CN216822921 U CN 216822921U CN 202120975290 U CN202120975290 U CN 202120975290U CN 216822921 U CN216822921 U CN 216822921U
- Authority
- CN
- China
- Prior art keywords
- heat
- heating
- conducting
- plate
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cookers (AREA)
Abstract
The utility model discloses a dish heat conduction structure, heating base and heating pot subassembly generate heat. Heating disc heat-conducting structure includes: a heating plate; the heat conduction layer covers the surface of the heating plate; the heat-conducting plate, the heat-conducting plate set up in on the heat-conducting layer. The heating base comprises the heating disc heat-conducting structure. The heating pot component comprises a pot body and a heating plate heat conduction structure, wherein the pot body can be placed on the heat conduction plate. The utility model discloses a set up heat-conducting layer and heat-conducting plate on the dish that generates heat, because the heat-conducting layer belongs to flexible structure, avoid using the heat conduction rigidity cooperation of prior art, thereby eliminate the bad problem of cooperation because of manufacturing tolerance etc. lead to, provide the heat transfer efficiency of the dish through heat-conducting layer to the heat-conducting plate that generates heat certainly, thereby can do the power height, reduce the heating latency by a wide margin, solved prior art's heat conduction structure heat conduction effect poor, heat conduction power is low, the heat conduction is difficult in time aggravates the deformation scheduling problem.
Description
Technical Field
The utility model relates to a kitchen utensils and appliances field especially relates to a set heat conduction structure, heating base and heating pot subassembly generate heat.
Background
The electric chafing dish power all is low on the market, it is less than below 1500W basically, it is more than 1800W or higher very seldom, the main reason is that the dish that generates heat is rigid contact with the pot cooperation, it is difficult to guarantee the uniformity of cooperation, tolerance in having slightly made will lead to cooperating badly, thereby it is too high to lead to the heat to in time derive to appear the dish temperature that generates heat like this, and the dish that generates heat high temperature aggravates the deformation again and aggravates the bad of cooperation, get into a vicious circle that the heat can not in time derive soon, so the heat load of multi-functional pot unit area on the market at present all does on the low side, thereby lead to consumer latency on the right side, influence experience.
Chinese utility model patent that grant publication number is CN210902572U discloses a dish assembly subassembly generates heat, including dish, base and the support ring generates heat, the dish that generates heat includes the disk body, the disk body is opening bowl structure up, bowl structure includes the bottom surface and encircles the outer arc wall that upwards extends at the bottom surface, the outer arc wall of dish that generates heat extends to support ring tip and support ring fixed connection, support ring and base can be dismantled the connection. The dish that generates heat among the dish assembly that generates heat that this technical scheme provided still is rigid contact with the pot, leads to having the tolerance of manufacturing to lead to cooperating bad slightly, thereby leads to the heat to derive in time the dish temperature that generates heat too high so appearing, and the dish temperature that generates heat too high aggravates again and warp aggravates the cooperation bad.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects existing in the prior art, the utility model provides a heating plate heat conduction structure, a heating base and a heating pot component.
The utility model discloses a realize through following technical scheme:
the utility model discloses a dish heat conduction structure generates heat, include:
a heating plate;
the heat conduction layer covers the surface of the heating plate;
the heat-conducting plate, the heat-conducting plate set up in on the heat-conducting layer.
The utility model discloses a dish heat-conducting structure generates heat is through setting up heat-conducting layer and heat-conducting plate on the dish that generates heat, because the heat-conducting layer belongs to flexible structure, avoid using the heat conduction rigidity cooperation of prior art, thereby eliminate the bad problem of cooperation because of manufacturing tolerance etc. lead to, provide the heat transfer efficiency of dish through heat-conducting layer heat-conducting plate that generates heat certainly, thereby can do the height with power, reduce the heating latency by a wide margin, it is poor to have solved prior art's heat conduction structure heat conduction effect, heat conduction power is low, the heat conduction is difficult in time easily aggravates the deformation scheduling problem.
In one embodiment of the above technical solution, a heating tube is embedded in the heating plate. Through will the heating tube inlays to be located in the dish that generates heat, improve the heat transfer efficiency between the two, just the dish that generates heat is to the heating tube has certain heat preservation effect, the energy saving.
In one embodiment of the above technical solution, the heating plate is provided with a mounting hole, and the heating tube is embedded in the mounting hole. The heating tube is embedded in a mode of arranging the mounting hole, so that the heating tube is convenient to mount and stable in structure.
In one embodiment of the above technical solution, the heat conduction layer covers and covers the surface of the heat generating tray and extends to the side surface of the heat generating tray. So set up, make the heat-conducting layer can cover the side surface of dish generates heat, can utilize the heat-conducting layer will the heat on the side surface of dish generates heat to the heat-conducting plate is derived, improves energy utilization.
In one embodiment of the above technical solution, the heat conducting plate is disposed on the heat conducting layer, and an end portion of the heat conducting plate extends and covers the heat conducting layer covering a side surface of the heat generating plate. The heat on the side surface of the heating plate is directly guided to the heat conducting plate through the heat conducting layer, so that the heat on the side surface of the heating plate is prevented from being dissipated, and the energy utilization rate is improved; in addition, the coating mode can also improve the stability of the whole structure and prevent the heat conduction plate and the heat conduction layer from being separated from the heating plate.
In one embodiment of the above technical solution, the height of the center of the heating plate is higher than the height of the periphery thereof;
the height of the center of the heat conduction layer is higher than that of the periphery of the heat conduction layer;
the height of the center of the heat conducting plate is higher than that of the periphery of the heat conducting plate.
So set up for the center of dish that generates heat, the center of heat-conducting layer and the center of heat-conducting plate are equallyd divide and are higher than respective periphery, form the structure that middle height, periphery are low, are convenient for laminate comprehensively with the bottom of a boiler to improve the heat transfer efficiency to the bottom of a boiler.
In one embodiment of the above technical solution, the heat conducting layer is a heat conducting silicone layer or a heat conducting adhesive layer. The heat-conducting silicone grease layer and the heat-conducting adhesive layer both have excellent heat resistance and heat conduction performance, and are suitable for being used as the heat-conducting layer.
In one embodiment of the above technical solution, the heat conducting plate is a heat conducting aluminum plate. The aluminum material is soft and low in rigidity, can avoid rigid matching with the heating plate and the pan bottom, eliminates the problem of poor matching caused by manufacturing tolerance, greatly improves the efficiency of leading the heat of the heating plate out of the pan bottom, and achieves the purpose of quickly heating food with high power.
The utility model discloses a dish heat conduction structure generates heat's beneficial effect:
the utility model discloses a dish heat-conducting structure generates heat is through setting up heat-conducting layer and heat-conducting plate on the dish that generates heat, because the heat-conducting layer belongs to flexible structure, avoid using the heat conduction rigidity cooperation of prior art, thereby eliminate the bad problem of cooperation because of manufacturing tolerance etc. lead to, provide the heat transfer efficiency of dish through heat-conducting layer heat-conducting plate that generates heat certainly, thereby can do the height with power, reduce the heating latency by a wide margin, it is poor to have solved prior art's heat conduction structure heat conduction effect, heat conduction power is low, the heat conduction is difficult in time easily aggravates the deformation scheduling problem. The utility model discloses a dish heat conduction structure generates heat has simple structure, heat transfer efficiency height, power height, characteristics such as heat time weak point.
The utility model also provides a heating base, including above-mentioned arbitrary item the dish heat conduction structure that generates heat.
The utility model discloses a beneficial effect of heating base:
the utility model discloses a heating base is through setting up heat-conducting layer and heat-conducting plate on the dish that generates heat, because the heat-conducting layer belongs to flexible structure, avoid using the heat conduction rigid fit of prior art, thereby eliminate the bad problem of cooperation because of manufacturing tolerance etc. lead to, provide the heat transfer efficiency of the dish through heat-conducting layer heat-conducting plate that generates heat certainly, thereby can do the power height, reduce the heating latency by a wide margin, it is poor to have solved prior art's heat conduction structure heat conduction effect, heat conduction power is low, the heat conduction is difficult in time aggravate the deformation scheduling problem. The utility model discloses a heating base has characteristics such as simple structure, heat transfer efficiency height, power height, heat time are short.
The utility model also further provides a heating pot subassembly, including the pot body and above-mentioned arbitrary any the heating base, the pot body can place in on the heat-conducting plate.
The utility model discloses a beneficial effect of heating pot subassembly:
the utility model discloses a heating pot subassembly is through setting up heat-conducting layer and heat-conducting plate on the dish that generates heat, because the heat-conducting layer belongs to flexible structure, avoid using the heat conduction rigid fit of prior art, thereby eliminate the bad problem of cooperation because of manufacturing tolerance etc. lead to, provide the heat transfer efficiency of the dish through heat-conducting layer heat-conducting plate that generates heat certainly, thereby can do the power height, reduce the heating latency by a wide margin, it is poor to have solved prior art's heat conduction structure heat conduction effect, heat conduction power is low, the heat conduction is difficult in time aggravates the deformation scheduling problem. The heating pot component of the utility model has the characteristics of simple structure, high heat transfer efficiency, high power, short heating time and the like.
Drawings
Fig. 1 is a sectional view of the preferred structure of the heat conducting structure of the heating plate of the present invention.
Fig. 2 is a schematic structural view of a preferred structure of the heating pan assembly of the present invention.
Detailed Description
The terms of orientation of up, down, left, right, front, back, top, bottom, and the like referred to or may be referred to in this specification are defined relative to the configuration shown in the drawings, and are relative terms, and thus may be changed correspondingly according to the position and the use state thereof. Therefore, these and other directional terms should not be construed as limiting terms.
Referring to fig. 1, fig. 1 is a sectional view of a preferred structure of a heat conducting structure of a heating plate according to the present invention.
The utility model discloses a dish heat conduction structure generates heat, including dish 1, heat-conducting layer 2 and the heat-conducting plate 3 that generates heat.
The heat conduction layer 2 covers the surface of the heating plate 1.
The heat conducting plate 3 is disposed on the heat conducting layer 2.
Through set up heat-conducting layer 2 and heat-conducting plate 3 on dish 1 generates heat, because heat-conducting layer 2 belongs to flexible structure, avoid using the heat conduction rigid fit of prior art, thereby eliminate the bad problem of cooperation because of manufacturing tolerance etc. lead to, provide from dish 1 that generates heat through heat-conducting layer 2 to heat-conducting plate 3's heat transfer efficiency, thereby can do the height with power, reduce the heating latency by a wide margin, it is poor to have solved prior art's heat conduction structure heat conduction effect, heat conduction power is low, the heat conduction is difficult in time aggravate the deformation scheduling problem.
Specifically, a heating tube 4 is embedded in the heating plate 1. Through will heating tube 4 inlays to be located in the dish 1 that generates heat, improve the heat transfer efficiency between the two, just dish 1 that generates heat is right heating tube 4 has certain heat preservation effect, the energy saving.
Preferably, the heating plate 1 is provided with a mounting hole, and the heating tube 4 is embedded in the mounting hole. The heating tube 4 is embedded in a mode of arranging the mounting hole, so that the installation is convenient, and the structure is stable.
Further, the heat conduction layer 2 covers and spreads over the surface of the heat generating tray 1 and extends to cover the side surface of the heat generating tray 1. So set up, make heat-conducting layer 2 can cover the side surface of dish 1 generates heat, can utilize heat-conducting layer 2 will the heat on the side surface of dish 1 generates heat to heat-conducting plate 3 exports, improves energy utilization.
Preferably, the heat conductive plate 3 is disposed on the heat conductive layer 2, and an end portion thereof extends over the heat conductive layer 2 covering the side surface 11 of the heat generating pan 1. The heat of the side surface 11 of the heating plate 1 is directly guided to the heat conducting plate 3 through the heat conducting layer 2, so that the heat of the side surface 11 of the heating plate 1 is prevented from being dissipated, and the energy utilization rate is improved; in addition, this coating form can also improve the stability of the entire structure and prevent the heat conductive plate 3 and the heat conductive layer 2 from being separated from the heat generating plate 1.
Further, the height of the center of the heating plate 1 is higher than that of the periphery thereof;
the height of the center of the heat conduction layer 2 is higher than that of the periphery thereof;
the height of the center of the heat-conducting plate 3 is higher than the height of the periphery thereof.
So set up for the center of dish 1 that generates heat, the center of heat-conducting layer 2 and the center of heat-conducting plate 3 are equallyd divide and are higher than respective periphery, form the structure that middle height, periphery are low, are convenient for laminate with the bottom of a boiler comprehensively to improve the heat transfer efficiency to the bottom of a boiler.
Preferably, the heat conduction layer 2 is a heat conduction silicone layer or a heat conduction adhesive layer. The heat-conducting silicone layer and the heat-conducting adhesive layer both have excellent heat resistance and heat conductivity, and are suitable for use as the heat-conducting layer 2.
It should be noted that the heat conducting layer 2 is not limited to use of a heat conducting silicone layer or a heat conducting adhesive layer, and other materials with excellent heat resistance and heat conductivity can also be used as alternative materials, and the heat conducting structure made of these alternative materials belongs to a direct replacement for the heat conducting silicone layer or the heat conducting adhesive layer in the present application, and also falls into the scope of protection of the present application.
Further, the heat conducting plate 3 is a heat conducting aluminum plate. The heat conductive aluminum plate may preferably be a thin aluminum plate. The aluminum material is soft and low in rigidity, can avoid rigid matching with the heating plate 1 and the pan bottom, eliminates the problem of poor matching caused by manufacturing tolerance, greatly improves the efficiency of leading the heat of the heating plate 1 out of the pan bottom, and achieves the purpose of quickly heating food with high power.
It should be noted that the heat conducting plate 3 is not limited to the form of the heat conducting aluminum plate, and may also be made of other similar materials with good heat conducting effect and low rigidity, and the heat conducting structure made of these materials belongs to the direct replacement of the heat conducting aluminum plate in the present application, and also falls into the protection scope of the present application.
The utility model also provides a heating base, include heating plate heat-conducting structure.
Referring to fig. 2, fig. 2 is a schematic structural view of a preferred structure of the heating pan assembly of the present invention.
The utility model also further provides a heating pot subassembly, reach including the pot body 5 the heating base, the pot body 5 can place in on the heat-conducting plate 3.
The pot body 5 with the heating base can be dismantled, the pot body 5 can be the pan or the overware of multiple different functions, is not single chafing dish function, can realize function such as evaporate, fry in shallow oil, promotes to use and experiences.
The utility model discloses a dish heat conduction structure generates heat, heating base and heating pot subassembly's beneficial effect:
the utility model discloses a dish heat conduction structure generates heat, heating base and heating pot subassembly are through setting up heat-conducting layer 2 and heat-conducting plate 3 on dish 1 generates heat, because heat-conducting layer 2 belongs to flexible structure, avoid using the heat conduction rigid fit of prior art, thereby eliminate the bad problem of cooperation because of manufacturing tolerance etc. lead to, provide from dish 1 that generates heat through heat-conducting layer 2 to heat-conducting plate 3's heat transfer efficiency, thereby can do high power, reduce the heating latency by a wide margin, it is poor to have solved prior art's heat conduction structure heat conduction effect, heat conduction power is low, the heat conduction is difficult in time aggravates the deformation scheduling problem. The utility model discloses a dish heat-conducting structure, heating base and heating pot subassembly generate heat has characteristics such as simple structure, heat transfer efficiency height, power height, heat time weak point.
The present invention is not limited to the above embodiment, and if various modifications or variations of the present invention do not depart from the spirit and scope of the present invention, they are intended to be covered if they fall within the scope of the claims and the equivalent technology of the present invention.
Claims (8)
1. A heat conduction structure of a heating plate, comprising:
the heating plate is internally embedded with a heating tube, the heating plate is provided with a mounting hole, and the heating tube is embedded in the mounting hole;
the heat conduction layer covers the surface of the heating plate, and is of a flexible structure;
the heat-conducting plate, the heat-conducting plate set up in on the heat-conducting layer.
2. A heat transfer plate heat transfer structure according to claim 1, wherein: the heat conduction layer covers and is paved on the surface of the heating plate and extends to cover the side surface of the heating plate.
3. A heat generating pan heat conducting structure according to claim 2, characterized in that: the heat conducting plate is arranged on the heat conducting layer, and the end part of the heat conducting plate extends and covers the heat conducting layer covering the side surface of the heating plate.
4. A heat transfer plate heat transfer structure according to claim 1, wherein: the height of the center of the heating plate is higher than that of the periphery of the heating plate;
the height of the center of the heat conduction layer is higher than that of the periphery of the heat conduction layer;
the height of the center of the heat conducting plate is higher than that of the periphery of the heat conducting plate.
5. A heat emitting disc heat conducting structure according to any one of claims 1 to 4, characterized in that: the heat conduction layer is a heat conduction silicone layer or a heat conduction adhesive layer.
6. A heat emitting disc heat conducting structure according to any one of claims 1 to 4, characterized in that: the heat-conducting plate is a heat-conducting aluminum plate.
7. A heating base comprising the heat-generating disk heat-conducting structure of any one of claims 1 to 6.
8. A heating pan assembly, comprising a pan body and the heating base of claim 7, the pan body being positionable on the thermally conductive plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120975290.7U CN216822921U (en) | 2021-05-06 | 2021-05-06 | Heating plate heat conduction structure, heating base and heating pan assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120975290.7U CN216822921U (en) | 2021-05-06 | 2021-05-06 | Heating plate heat conduction structure, heating base and heating pan assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216822921U true CN216822921U (en) | 2022-06-28 |
Family
ID=82081563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120975290.7U Active CN216822921U (en) | 2021-05-06 | 2021-05-06 | Heating plate heat conduction structure, heating base and heating pan assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216822921U (en) |
-
2021
- 2021-05-06 CN CN202120975290.7U patent/CN216822921U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN216822921U (en) | Heating plate heat conduction structure, heating base and heating pan assembly | |
| CN204764977U (en) | Take mini rice cooker of cellular heat conduction tray | |
| CN208973296U (en) | A kind of juice extractor of good heat dissipation effect | |
| CN211424476U (en) | Take cooking utensils of thermoelectric generation module | |
| CN203106222U (en) | Warm-keeping dining table convenient to use | |
| CN201575524U (en) | Electric heater with metal radiator and glass panel | |
| CN221180224U (en) | Heat preservation device and sharing heat preservation equipment | |
| CN219206547U (en) | High-thermal-conductivity electromagnetic kettle | |
| CN201005527Y (en) | Thermostat special for conference | |
| CN221153763U (en) | Energy-saving electric cooker | |
| CN215808663U (en) | Novel electric ceramic stove | |
| CN210408130U (en) | Heating sheet heating type cooker | |
| CN114246495B (en) | Food processor | |
| CN213850288U (en) | Food processing machine | |
| CN216702305U (en) | Multifunctional cooking device with heat dissipation structure | |
| CN218064998U (en) | Fan-free electric ceramic stove | |
| CN214341692U (en) | Pot is stewed to bird's nest | |
| CN213129190U (en) | Electric baking pan | |
| CN214317684U (en) | Ceramic cup cools off fast that heat-conduction efficiency is high | |
| CN210611769U (en) | Electric heating refrigeration cup cover | |
| CN211432548U (en) | Heat-preservation food processing machine | |
| CN215190788U (en) | Heating cup mat | |
| CN219889599U (en) | Electric heating furnace | |
| CN211862579U (en) | Constant temperature disc | |
| CN221060358U (en) | Pot tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |